JP2023175188A - Method of producing electrocast member, method of producing electrocast pipe, and electrocasting device - Google Patents

Abstract

To improve the productivity of an electrocast member and an electrocast pipe.SOLUTION: The method of producing an electrocast member, comprises a step of forming an electrocast layer on the circumference of the wire in an electrocasting tank disposed in the route through which the wire is transferred, a step of inspecting the state of the electrocast layer using an inspection unit disposed in the route, and a step of changing the condition for forming the electrocast layer in the electrocasting tank, according to the state of the electrocast layer.SELECTED DRAWING: Figure 2

Description

The present invention relates to a method for manufacturing an electroformed member, a method for manufacturing an electroformed tube, and an electroforming apparatus.

In recent years, various methods for manufacturing electroformed parts and tubes have been developed. By forming an electroformed layer around the wire, an electroformed member including the wire and the electroformed layer is manufactured. An electroformed tube is manufactured by removing the wire from the electroformed member. Electroformed tubes are used, for example, as probes for testing objects to be tested, such as integrated circuits (ICs). For example, in the method described in Patent Document 1, a nickel layer is formed by electroforming around a stainless steel wire coated with gold plating. Next, by pulling at least one end of the wire, the cross-sectional area of the wire is reduced. As a result, a gap is formed between the outer circumferential surface of the wire and the inner circumferential surface of the nickel layer. Next, the wire is removed by pulling the wire with the gap formed.

Japanese Patent Application Publication No. 2004-115838

In the production of electroformed members and electroformed pipes, the state of the electroformed layer, such as the thickness of the electroformed layer, may change depending on the conditions for forming the electroformed layer around the wire rod. For example, a portion of the wire may be cut out to inspect the state of the electroformed layer. In this case, the conditions for forming the electroformed layer are changed depending on the inspection result of the state of the electroformed layer. However, when a portion of the wire is cut out, it is necessary to interrupt the formation of the electroformed layer. For this reason, it may become difficult to improve the productivity of electroformed members and electroformed pipes.

One example of the object of the present invention is to improve the productivity of electroformed members and electroformed pipes. Other objects of the invention will become apparent from the description herein.

One aspect of the present invention is
forming an electroforming layer around the wire in an electroforming tank disposed on a route through which the wire is conveyed;
Inspecting the state of the electroformed layer by an inspection unit disposed in the path;
changing conditions for forming the electroformed layer in the electroforming tank according to the state of the electroformed layer;
A method for manufacturing an electroformed member, comprising:

One aspect of the present invention is
A method for manufacturing the above-mentioned electroformed member,
removing the wire from the electroformed layer;
A method for manufacturing an electroformed tube, comprising:

One aspect of the present invention is
The route along which the wire rod is transported,
an electroforming tank disposed in the path and forming an electroforming layer around the wire;
an inspection section disposed on the path and inspecting the state of the electroformed layer;
a control unit that changes conditions for forming the electroformed layer in the electroforming tank according to the state of the electroformed layer;
This is an electroforming device equipped with.

According to the above aspect of the present invention, productivity of electroformed members and electroformed pipes can be improved.

1 is a flowchart showing a method for manufacturing an electroformed pipe according to Embodiment 1. FIG. 1 is a front view of an electroforming apparatus according to Embodiment 1. FIG. 1 is a diagram for explaining a method for manufacturing an electroformed pipe according to Embodiment 1. FIG. 1 is a diagram for explaining a method for manufacturing an electroformed pipe according to Embodiment 1. FIG. 1 is a diagram for explaining a method for manufacturing an electroformed pipe according to Embodiment 1. FIG. It is a figure for explaining arrangement of four film thickness gauges concerning a modification. It is a figure for explaining arrangement of four film thickness gauges concerning a modification. 7 is a flowchart showing a method for manufacturing an electroformed pipe according to Embodiment 2. FIG. FIG. 3 is a front view of an electroforming apparatus according to a second embodiment.

Embodiments and modifications of the present invention will be described below with reference to the drawings. In all the drawings, similar components are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

FIG. 1 is a flowchart showing a method for manufacturing an electroformed tube according to a first embodiment. FIG. 2 is a front view of the electroforming apparatus 1A according to the first embodiment. 3 to 5 are diagrams for explaining the method for manufacturing an electroformed tube according to the first embodiment.

The electroformed tube according to the embodiment can be used, for example, as a probe for testing an object to be tested such as an IC. Hereinafter, the method for manufacturing an electroformed tube according to Embodiment 1 will be simply referred to as the method according to Embodiment 1.

To explain the directions, an X direction, a Y direction, and a Z direction will be defined. The Z direction is a direction parallel to the vertical direction. The X direction is one of the horizontal directions perpendicular to the Z direction. The Y direction is one of the horizontal directions perpendicular to the Z direction and the X direction. The direction indicated by the arrow in the X direction is defined as the right direction of the electroforming apparatus 1A. The direction indicated by the Y-direction arrow is defined as the rear direction of the electroforming apparatus 1A. The direction indicated by the Z-direction arrow is defined as the upward direction of the electroforming apparatus 1A. A white circle with an X indicating the X direction, Y direction, or Z direction indicates that the direction indicated by the arrow in the direction indicated by the white circle is the direction from the front to the back of the page.

The method according to the first embodiment will be described with reference to FIGS. 1 and 2 and, if necessary, FIGS. 3 to 5. In the method according to the first embodiment, first, an electroformed member 300A is manufactured in an electroforming apparatus 1A through a degreasing step S1A to an abnormal part removal step S8A. Next, an electroformed pipe is manufactured from the electroformed member 300A through a wire rod removal step S9A and an electroformed layer cutting step S10A.

The electroforming apparatus 1A according to the first embodiment includes a control section 5A, a delivery reel 12A, a tension jig 14A, a conveyance roller 16A, a pair of auxiliary rollers 18A, a degreasing tank 21A, a first cleaning tank 22A, an electroforming tank 23A, It includes a second cleaning tank 24A, a drying tank 25A, an imaging section 30A, a film thickness meter 40A, a pair of centering rollers 42A, and a marker 50A. The electroforming apparatus 1A according to the first embodiment includes a path 2A along which the wire 100A is conveyed. Path 2A is located between delivery reel 12A and tension jig 14A. Conveyance roller 16A, pair of auxiliary rollers 18A, degreasing tank 21A, first cleaning tank 22A, electroforming tank 23A, second cleaning tank 24A, drying tank 25A, imaging section 30A, film thickness gauge 40A, pair of centering rollers 42A And the marker 50A is placed on the route 2A.

The control unit 5A is, for example, a computer such as a personal computer or a microcomputer. The control unit 5A controls the operation of the electroforming device 1A. For example, a program that executes the operation of at least one step in the flowchart shown in FIG. 1 is stored in a storage unit (not shown). The operation of the electroforming apparatus 1A is controlled by the control unit 5A executing the program as a computer.

In the method according to the first embodiment, the wire rod 100A is sent from the delivery reel 12A toward the tensioning jig 14A. The left end portion of the wire 100A is wound around a delivery reel 12A. The right end portion of the wire 100A is stretched by a tensioning jig 14A. The wire 100A has conductivity. The wire 100A is made of stainless steel, for example. However, the wire 100A may be made of a material different from stainless steel. For example, the wire 100A may be made of iron, copper, gold, silver, brass, nickel, aluminum, carbon, plastic, resin, or the like. In the route 2A, the axial direction of the wire 100A is substantially parallel to the X direction. The cross section of the wire 100A perpendicular to the X direction has a substantially circular shape. The diameter of the wire 100A perpendicular to the X direction is, for example, 10 μm or more and 500 μm or less. When viewed from the X direction, the outer peripheral surface of the wire 100A may be covered with metal.

In the method according to the first embodiment, first, a degreasing step S1A is performed. In the degreasing step S1A, the wire rod 100A is sent out from the delivery reel 12A and then sent to the degreasing tank 21A. A degreasing liquid 21A1 is stored in the degreasing tank 21A. The wire 100A passes through the inside of the degreasing tank 21A while being impregnated with the degreasing liquid 21A1. Thereby, deposits such as oil and dirt present on the outer peripheral surface of the wire 100A can be removed. Therefore, in a state where deposits are present on the outer peripheral surface of the wire 100A, it may be difficult to form the electroformed layer 200A shown in FIG. 3 on the outer peripheral surface of the wire 100A in the electroforming bath 23A. Therefore, by removing the deposit from the outer peripheral surface of the wire 100A, a homogeneous electroformed layer 200A can be formed on the outer peripheral surface of the wire 100A.

Next, a first cleaning step S2A is performed. In the first cleaning step S2A, the wire 100A is sent to the first cleaning tank 22A after passing through the degreasing tank 21A. A first cleaning liquid 22A1 is stored in the first cleaning tank 22A. The wire 100A passes through the first cleaning tank 22A while being impregnated with the first cleaning liquid 22A1. As a result, the outer peripheral surface of the wire 100A is cleaned by the first cleaning liquid 22A1.

Next, electroforming step S3A is performed. In the electroforming step S3A, the wire rod 100A passes through the first cleaning tank 22A, and then is sent to the electroforming tank 23A. An electroforming liquid 23A1 is stored in the electroforming tank 23A. The wire 100A passes through the electroforming tank 23A while being impregnated with the electroforming liquid 23A1. The electroforming liquid 23A1 is impregnated with an anode (not shown). The wire 100A and the electroforming liquid 23A1 are electrically connected to a power source (not shown). This allows the wire 100A to operate as a cathode. By operating the wire 100A as a cathode, as shown in FIG. 3, an electroformed layer 200A is formed on the outer peripheral surface of the wire 100A. The electroformed layer 200A is made of, for example, metals such as nickel, gold, copper, palladium, rhodium, platinum, and silver, or alloys thereof. The thickness of the electroformed layer 200A perpendicular to the X direction is, for example, 5 μm or more and 100 μm or less. The type of electroforming liquid 23A1 is determined by predetermined conditions such as the material of the electroforming layer 200A. The electroforming liquid 23A1 contains, for example, a nickel sulfate solution or a nickel sulfamate solution, and also contains a brightening agent and a bit prevention agent as necessary.

Next, a second cleaning step S4A is performed. In the second cleaning step S4A, the wire rod 100A is sent to the second cleaning tank 24A after passing through the electroforming tank 23A. A second cleaning liquid 24A1 is stored in the second cleaning tank 24A. The wire 100A passes through the second cleaning tank 24A while being impregnated with the second cleaning liquid 24A1. As a result, the electroformed layer 200A formed on the outer peripheral surface of the wire 100A is cleaned.

In the first embodiment, one electroforming tank 23A and one second cleaning tank 24A are provided. As a result, a single electroformed layer 200A is formed. However, the electroformed layer 200A may have multiple layers. Further, the number of electroforming tanks 23A and second cleaning tanks 24A may vary depending on the number of layers included in the electroforming layer 200A. For example, when the electroformed layer 200A includes two layers of different materials, the two electroforming tanks 23A and the two second cleaning tanks 24A may be arranged alternately in the X direction. In this example, a plurality of electroforming processes S3A and a plurality of second cleaning processes S4A are performed alternately.

A predetermined sacrificial layer may be provided between the outer peripheral surface of the wire 100A and the inner peripheral surface of the electroformed layer 200A. The sacrificial layer is removed, for example, by etching before removing the wire 100A from the electroformed layer 200A. Thereby, a gap can be formed between the outer peripheral surface of the wire 100A and the inner peripheral surface of the electroformed layer 200A. Therefore, the wire 100A can be more easily removed from the electroformed layer 200A than in the case where the gap does not exist.

Next, a drying step S5A is performed. In the drying step S5A, the wire 100A and the electroformed layer 200A are sent to the drying tank 25A after passing through the second cleaning tank 24A. The wire 100A and the electroformed layer 200A are dried in the drying tank 25A. This makes it possible to remove the second cleaning liquid 24A1 that adheres to the outer peripheral surface of the electroformed layer 200A when the wire 100A and the electroformed layer 200A pass through the second cleaning tank 24A.

Next, an inspection step S6A is performed. In the inspection step S6A, the wire 100A passes through the drying tank 25A, and then passes below the imaging section 30A via a conveyance roller 16A and a pair of auxiliary rollers 18A. Next, the wire 100A passes below the imaging section 30A, and then passes below the film thickness meter 40A. A pair of centering rollers 42A are arranged on both sides of the film thickness meter 40A in the X direction.

The imaging unit 30A includes an image sensor such as a CCD (charge coupled device) image sensor, a CMOS (complementary metal oxide semiconductor) image sensor, etc., for example. The imaging unit 30A images a portion of the wire 100A passing below the imaging unit 30A. The control unit 5A recognizes the position of the wire 100A from the image captured by the imaging unit 30A through object recognition. Thereby, the control unit 5A uses the centering roller 42A to align the wire 100A with the film thickness meter 40A based on the recognition result of the position of the wire 100A.

The film thickness meter 40A inspects the thickness of the electroformed layer 200A by X-ray fluorescence (XRF) analysis. In the XRF analysis in the first embodiment, the portion of the electroformed layer 200A located above the wire 100A when viewed from the X direction is irradiated with X-rays. Therefore, the film thickness meter 40A can measure the thickness in the Z direction of the portion of the electroformed layer 200A located above the wire 100A when viewed from the X direction. If XRF analysis is used, the thickness of electroformed layer 200A can be inspected by non-destructive testing. In this case, even the portion where the thickness of the electroformed layer 200A has been tested can be used as an electroformed pipe. Therefore, productivity of the electroformed member 300A and the electroformed pipe can be improved. Note that the method for inspecting the thickness of the electroformed layer 200A is not limited to XRF analysis. For example, the thickness of the electroformed layer 200A may be inspected by non-destructive testing other than XRF analysis.

The position where the film thickness meter 40A is arranged is not limited to the example shown in FIG. 2. The position where the film thickness meter 40A is arranged can be changed depending on the part where the thickness of the electroformed layer 200A is inspected. For example, the film thickness gauge 40A may be placed below the wire 100A. In this case, the film thickness meter 40A can inspect the thickness in the Z direction of the portion of the electroformed layer 200A located below the wire 100A when viewed from the X direction.

The control unit 5A changes the conditions for forming the electroformed layer 200A in the electroforming tank 23A according to the test results of the film thickness meter 40A. Specifically, the control unit 5A determines that the thickness in the Z direction of the portion of the electroformed layer 200A located above the wire 100A when viewed from the X direction is a predetermined reference value by referring to the test results of the film thickness meter 40A. It is determined whether or not there is a deviation from the actual value. The control unit 5A can determine a portion where the thickness of the electroformed layer 200A deviates from the predetermined reference value as an abnormal portion of the electroformed layer 200A. That is, the control unit 5A and the film thickness meter 40A are capable of detecting an abnormal portion of the electroformed layer 200A. The control unit 5A can change the conditions for forming the electroformed layer 200A in the electroforming tank 23A when an abnormal part exists in the electroformed layer 200A. Therefore, the thickness of the electroformed layer 200A can be made substantially uniform in the X direction by feedback control of the control unit 5A. For example, the control unit 5A may change the moving speed of the wire 100A in the electroforming tank 23A depending on the test result of the film thickness meter 40A. However, the conditions changed by the feedback control of the control unit 5A are not limited to the moving speed of the wire 100A in the electroforming tank 23A.

The film thickness meter 40A is movable substantially parallel to the X direction. For this reason, the control unit 5A may move the film thickness meter 40A to the right at substantially the same moving speed as the rightward moving speed of the wire 100A. In the XRF analysis using the film thickness meter 40A, it is necessary to irradiate the same portion of the wire 100A with X-rays for a certain period of time or more in order to obtain sufficient X-ray intensity. Therefore, by moving the film thickness meter 40A in approximately synchronization with the wire 100A, sufficient X-ray intensity can be obtained in the XRF analysis using the film thickness meter 40A. The control unit 5A can move the film thickness meter 40A toward the right to inspect the thickness of the electroformed layer 200A of a portion of the wire 100A, and then return the thickness meter 40A toward the left. Thereby, the film thickness meter 40A can continue to inspect the thickness of the electroformed layer 200A on other parts of the wire 100A. Even in an inspection different from the XRF analysis using the film thickness meter 40A, the control unit 5A may move the film thickness meter 40A approximately in synchronization with the wire 100A. Also in this case, the thickness of the electroformed layer 200A can be tested more accurately than when the film thickness meter 40A is fixed without moving. However, the control unit 5A may fix the film thickness meter 40A without moving it.

In the method according to the first embodiment, when inspecting the state of the thickness of the electroformed layer 200A, there is no need to cut out a portion of the wire 100A. Therefore, when inspecting the state of the thickness of the electroformed layer 200A, there is no need to interrupt the formation of the electroformed layer 200A in the electroforming tank 23A. Specifically, the electroformed layer 200A can be formed in the electroforming tank 23A while inspecting the thickness of the electroformed layer 200A using the film thickness gauge 40A. Thereby, the electroformed layer 200A can be formed continuously over time while performing feedback control of the control section 5A. Therefore, in the method according to the first embodiment, productivity of the electroformed member 300A and the electroformed pipe can be improved.

Next, an identifier assigning step S7A is performed. In the identifier provision step S7A, the wire 100A passes below the film thickness meter 40A and then passes below the marker 50A. The marker 50A gives an identifier to the abnormal part of the electroformed layer 200A by referring to the determination result of the abnormal part of the electroformed layer 200A by the control unit 5A. Therefore, the user of the electroforming apparatus 1A obtains information about the abnormal part of the electroformed layer 200A, such as the presence or absence, position, size, and range of the abnormal part of the electroformed layer 200A, from the identifier given to the electroformed layer 200A. can be obtained. Therefore, the quality of the electroformed member 300A and the electroformed pipe can be improved. Moreover, the productivity of the electroformed member 300A and the electroformed pipe can be improved. Examples of methods for providing the identifier include laser irradiation, paint application, and the like. In this example, the identifier is, for example, a portion of the electroformed layer 200A that is irradiated with a laser or a portion that is coated with paint.

Next, an abnormal part removal step S8A is performed. In the abnormal part removal step S8A, the portion of the electroformed member 300A including the wire 100A and the electroformed layer 200A to which the identifier is attached is removed. Specifically, the portion of the electroformed member 300A that has passed below the marker 50A is pulled by the tension jig 14A, and the portion of the electroformed member 300A is removed. As a result, abnormal portions of the electroformed layer 200A are removed. Therefore, the quality of the electroformed member 300A and the electroformed pipe can be improved. Moreover, the productivity of the electroformed member 300A and the electroformed pipe can be improved. The method for removing the abnormal portion of the electroformed layer 200A is not particularly limited. For example, the wire 100A and the electroformed layer 200A may be cut so that the abnormal part of the electroformed layer 200A is separated from the periphery of the abnormal part of the electroformed layer 200A.

Note that the abnormal portion removal step S8A may be performed at a location different from the electroforming apparatus 1A. In this case, for example, in the electroforming apparatus 1A, a predetermined length of the right end of the electroformed member 300A is cut out while the right end of the electroformed member 300A is pulled by the tension jig 14A. Next, at a location different from the electroforming device 1A, the portion to which the identifier of the cut-out portion of the electroforming member 300A is attached is removed.

Next, a wire removal step S9A is performed. In the wire rod removal step S9A, as shown in FIG. 4, the wire rod 100A is removed from the electroformed member 300A. For example, the wire 100A may be pulled out from the electroformed layer 200A by pulling at least one of both ends of the wire 100A. However, the method for removing the wire 100A is not limited to this example.

Next, an electroformed layer cutting step S10A is performed. In the electroformed layer cutting step S10A, as shown in FIG. 5, the electroformed layer 200A is cut into a plurality of pieces P. Each cut out P piece becomes an electroformed pipe. In this way, the electroformed tube according to the embodiment is manufactured.

The method for manufacturing an electroformed pipe is not limited to the method according to the first embodiment.

In the method according to the first embodiment, the control unit 5A changes the conditions for forming the electroformed layer 200A in the electroforming tank 23A depending on the thickness of the electroformed layer 200A. However, the control unit 5A may change the conditions for forming the electroformed layer 200A depending on the thickness of the electroformed layer 200A and the state of different characteristics. For example, the control unit 5A may refer to the composition state of the material included in the electroformed layer 200A. The composition of the material included in the electroformed layer 200A is inspected, for example, by non-destructive testing such as XRF analysis. Also in this example, when inspecting the state of the electroformed layer 200A, there is no need to interrupt the formation of the electroformed layer 200A. Therefore, productivity of the electroformed member 300A and the electroformed pipe can be improved.

In the method according to the first embodiment, adding an identifier to the abnormal portion of the electroformed layer 200A and removing the abnormal portion of the electroformed layer 200A are performed as treatments for the abnormal portion of the electroformed layer 200A. However, the treatment applied to the abnormal portion of the electroformed layer 200A is not limited to these. Moreover, the process performed on the abnormal part of the electroformed layer 200A may be only one of adding an identifier to the abnormal part of the electroformed layer 200A and removing the abnormal part of the electroformed layer 200A.

6 and 7 are diagrams for explaining the arrangement of four film thickness gauges 40A1 according to a modification. Hereinafter, the method for manufacturing an electroformed pipe according to the modification will be simply referred to as the method according to the modification. The method according to the modification is the same as the method according to the first embodiment except for the following points.

In the method according to the modified example, an electroformed layer 200A1 is formed around the wire 100A1 in the electroforming tank 23A in the same manner as the method according to the first embodiment. After passing through the electroforming tank 23A, the wire rod 100A1 is sent to a position where four film thickness gauges 40A1 are arranged.

As shown in FIG. 7, the four film thickness gauges 40A1 are arranged at approximately equal intervals around the wire 100A1 when viewed from the X direction. Specifically, when viewed from the X direction, the four film thickness gauges 40A1 are arranged above, below, in front of, and behind the wire 100A1. Each film thickness meter 40A1 inspects the thickness of the electroformed layer 200A1 by XRF analysis. Therefore, the film thickness meter 40A1 disposed above the wire 100A1 can inspect the thickness in the Z direction of the portion of the electroformed layer 200A1 located above the wire 100A1 when viewed from the X direction. The film thickness meter 40A1 disposed below the wire 100A1 can inspect the thickness in the Z direction of the portion of the electroformed layer 200A1 located below the wire 100A1 when viewed from the X direction. The film thickness meter 40A1 disposed in front of the wire 100A1 can inspect the thickness in the Y direction of the portion of the electroformed layer 200A1 located in front of the wire 100A1 when viewed from the X direction. The film thickness gauge 40A1 placed behind the wire 100A1 can inspect the thickness in the Y direction of the portion of the electroformed layer 200A1 located behind the wire 100A1 when viewed from the X direction.

In the method according to the modification, the control unit 5A controls the operation of the four film thickness gauges 40A1 in the same manner as the method according to the first embodiment. The control unit 5A changes the conditions for forming the electroformed layer 200A1 in the electroforming tank 23A according to the test results of the four film thickness gauges 40A1. Specifically, by referring to the test results of the four film thickness gauges 40A1, it is possible to test the uniformity of the thickness of the electroformed layer 200A1 in the circumferential direction of the wire rod 100A1 when viewed from the X direction. The control unit 5A can determine a portion where the uniformity of the thickness of the electroformed layer 200A1 deviates from a predetermined standard as an abnormal portion of the electroformed layer 200A1. The control unit 5A can change the conditions for forming the electroformed layer 200A1 in the electroforming tank 23A when an abnormal portion of the electroformed layer 200A1 exists. Therefore, the uniformity of the thickness of the electroformed layer 200A1 can be maintained in the X direction by feedback control of the control unit 5A. For example, the control unit 5A may change the moving speed of the wire rod 100A1 in the electroforming tank 23A according to the inspection results of the four film thickness gauges 40A1. However, the conditions changed by the feedback control of the control unit 5A are not limited to the moving speed of the wire rod 100A1 in the electroforming tank 23A.

As shown in FIG. 6, the four film thickness gauges 40A1 are arranged offset from each other in the X direction. Therefore, compared to the case where the four film thickness gauges 40A1 are aligned with each other in the X direction, mutual interference of X-rays irradiated in the XRF analysis of each film thickness gauge 40A1 can be suppressed. Even in an inspection different from the XRF analysis using each film thickness gauge 40A1, the four film thickness gauges 40A1 may be arranged offset from each other in the X direction. Also in this case, mutual interference between inspections of the film thickness gauges 40A1 can be suppressed compared to the case where the four film thickness gauges 40A1 are aligned with each other in the X direction. Further, some of the four film thickness gauges 40A1 may be aligned with each other in the X direction.

Similar to the film thickness gauge 40A according to the first embodiment, the four film thickness gauges 40A1 according to the modification are movable substantially parallel to the X direction. Therefore, by moving the four film thickness gauges 40A1 approximately in synchronization with the wire rod 100A1 in the same manner as the method according to the first embodiment, sufficient X-ray intensity can be obtained in the XRF analysis using the four film thickness gauges 40A1. Obtainable.

Note that the number of film thickness gauges 40A1 arranged around the wire 100A1 is not limited to the examples shown in FIGS. 6 and 7. For example, only two, only three, or five or more film thickness gauges 40A1 may be arranged around the wire 100A1.

Also in the method according to the modified example, the abnormal portion of the electroformed layer 200A1 may be subjected to a predetermined treatment in the same manner as the method according to the first embodiment. In this case, the quality of the electroformed member and the electroformed pipe can be improved in the same manner as the method according to the first embodiment. Moreover, productivity of electroformed members and electroformed pipes can be improved.

FIG. 8 is a flowchart showing a method for manufacturing an electroformed tube according to the second embodiment. FIG. 9 is a front view of an electroforming apparatus 1B according to the second embodiment. The electroforming apparatus 1B according to the second embodiment is the same as the electroforming apparatus 1A according to the first embodiment except for the following points. Hereinafter, the method for manufacturing an electroformed tube according to the second embodiment will be simply referred to as the method according to the second embodiment.

The electroforming apparatus 1B according to the second embodiment includes a control section 5B, a delivery reel 12B, a tension jig 14B, a conveyance roller 16B, a degreasing tank 21B, a first cleaning tank 22B, an electroforming tank 23B, a second cleaning tank 24B, It includes a drying tank 25B, a first displacement gauge 42B, a second displacement gauge 44B, and a marker 50B. A degreasing liquid 21B1 is stored in the degreasing tank 21B. A first cleaning liquid 22B1 is stored in the first cleaning tank 22B. An electroforming liquid 23B1 is stored in the electroforming tank 23B. A second cleaning liquid 24B1 is stored in the second cleaning tank 24B. The electroforming apparatus 1B according to the second embodiment includes a path 2B along which the wire rod 100B is conveyed. Path 2B is located between delivery reel 12B and tension jig 14B. The degreasing tank 21B, the first cleaning tank 22B, the electroforming tank 23B, the second cleaning tank 24B, the drying tank 25B, the first displacement meter 42B, the second displacement meter 44B, and the marker 50B are arranged on the path 2B.

In the method according to the second embodiment, first, a first inspection step S6B1 is performed. In the first inspection step S6B1, the wire rod 100B is sent out from the delivery reel 12B and then passes below the first displacement meter 42B. Details of the first inspection step S6B1 will be described later.

Next, the wire 100B passes through a degreasing tank 21B, a first cleaning tank 22B, an electroforming tank 23B, a second cleaning tank 24B, and a drying tank 25B. In the method according to the second embodiment, in the same manner as the method according to the first embodiment, the degreasing step S1B is performed in the degreasing tank 21B, first cleaning tank 22B, electroforming tank 23B, second cleaning tank 24B, and drying tank 25B, respectively. , a first cleaning process S2B, an electroforming process S3B, a second cleaning process S4B, and a drying process S5B. Further, in the electroforming tank 23B according to the second embodiment, an electroforming layer 200B is formed on the outer circumferential surface of the wire 100B in the same manner as the electroforming tank 23A according to the first embodiment.

Next, a second inspection step S6B2 is performed. In the second inspection step S6B2, the wire rod 100B passes below the second displacement meter 44B via the conveyance roller 16B. Details of the second inspection step S6B2 will be described later.

Next, the wire rod 100B passes below the marker 50B. As a result, in the method according to the second embodiment, the identifier assigning step S7B is performed in the same manner as the method according to the first embodiment. Next, in the method according to the second embodiment, an abnormal part removing step S8B is performed in the same manner as the method according to the first embodiment. As a result, the abnormal portion of the electroformed member 300B is removed. Next, in the method according to the second embodiment, a wire rod removal step S9B and an electroformed layer cutting step S10B are performed in the same manner as the method according to the first embodiment. In this way, an electroformed tube is manufactured from the electroformed member 300B.

The details of the first inspection step S6B1 and the second inspection step S6B2 will be explained.

The first displacement meter 42B and the second displacement meter 44B are laser displacement meters. The first displacement meter 42B inspects the state of the wire 100B before the electroformed layer 200B is formed. Specifically, the first displacement meter 42B measures the distance in the Z direction from the first displacement meter 42B to the upper surface of the wire 100B before the electroformed layer 200B is formed. The second displacement meter 44B inspects the state of the electroformed layer 200B after the electroformed layer 200B is formed. Specifically, the second displacement meter 44B measures the distance in the Z direction from the second displacement meter 44B to the top surface of the electroformed layer 200B around the wire 100B after the electroformed layer 200B is formed. There is. Therefore, by referring to the test results of the first displacement meter 42B and the second displacement meter 44B, the thickness in the Z direction of the portion of the electroformed layer 200B located above the wire rod 100B when viewed from the X direction can be determined. Can be inspected. Therefore, the control unit 5B forms the electroformed layer 200B in the electroforming tank 23B in the same manner as the method according to the first embodiment, according to the inspection results of the first displacement meter 42B and the second displacement meter 44B. conditions can be changed. Therefore, in the same manner as the method according to the first embodiment, productivity of the electroformed member 300B and the electroformed pipe can be improved.

In the method according to the second embodiment, compared to the method according to the first embodiment, there is no need to use radiation such as X-rays when inspecting the thickness state of the electroformed layer 200B. Therefore, in the method according to the second embodiment, the state of the thickness of the electroformed layer 200B can be inspected at a lower cost than the method according to the first embodiment.

The positions where the first displacement gauge 42B and the second displacement gauge 44B are arranged are not limited to the example shown in FIG. 9. For example, the first displacement meter 42B and the second displacement meter 44B may be arranged below the wire rod 100B. In this case, the first displacement meter 42B and the second displacement meter 44B can inspect the thickness in the Z direction of the portion of the electroformed layer 200B located below the wire rod 100B when viewed from the X direction.

Similar to the method according to the modification, a plurality of pairs of displacement gauges, the first displacement gauge 42B and the second displacement gauge 44B, may be arranged around the wire 100B when viewed from the X direction. In this case, the uniformity of the thickness of the electroformed layer 200B in the circumferential direction of the wire rod 100B when viewed from the X direction can be inspected in the same manner as the method according to the modification.

Although the embodiments and modified examples of the present invention have been described above with reference to the drawings, these are merely examples of the present invention, and various configurations other than those described above may also be adopted.

For example, the electroforming apparatus according to each embodiment includes a marker. However, the electroforming device does not need to be equipped with a marker. In this case, the electroforming device can change the conditions for forming the electroformed layer in the electroforming bath according to the state of the electroformed layer without assigning an identifier to the abnormal part of the electroformed layer. .

According to the present specification, a method for manufacturing an electroformed member, a method for manufacturing an electroformed pipe, and an electroforming apparatus according to the following aspects are provided.
(Aspect 1)
In aspect 1, the method for manufacturing an electroformed member includes the steps of: forming an electroforming layer around the wire in an electroforming tank disposed on a route through which the wire is conveyed; The method includes a step of inspecting the state of the electroformed layer, and a step of changing conditions for forming the electroformed layer in the electroforming tank depending on the state of the electroformed layer.

The "inspection section" corresponds to the "film thickness meter", "first displacement meter", and "second displacement meter" in the above-described embodiment or modified example.

According to the above aspect, when inspecting the state of the electroformed layer in the inspection section, there is no need to interrupt the formation of the electroformed layer. Therefore, in the above-described aspect, productivity of electroformed members and electroformed pipes can be improved.

(Aspect 2)
In aspect 2, the step of inspecting the state of the electroformed layer is performed by the inspection section that is movable at substantially the same moving speed as the moving speed of the wire along the route.

According to the above-mentioned aspect, the thickness of the electroformed layer can be accurately inspected compared to the case where the wire is fixed without moving.

(Aspect 3)
In aspect 3, the step of inspecting the state of the electroformed layer is performed by the plurality of inspection sections arranged at approximately equal intervals around the wire when viewed from the axial direction of the wire.

According to the above aspect, by referring to the test results of the plurality of test sections, it is possible to test the uniformity of the state of the electroformed layer, such as the thickness, in the circumferential direction of the wire.

(Aspect 4)
In aspect 4, the step of inspecting the state of the electroformed layer is performed by at least some of the plurality of inspection units that are arranged substantially parallel to and offset from each other in the axial direction of the wire rod. There is.

According to the above aspect, mutual interference between the inspections of the respective inspection sections can be suppressed compared to the case where at least some of the inspection sections are aligned substantially parallel to each other in the axial direction of the wire rod.

(Aspect 5)
In aspect 5, the step of inspecting the state of the electroformed layer includes the inspection results of the wire before the electroformed layer is formed around the wire and the electroformed layer formed around the wire. The inspection is performed by the inspection section with reference to the inspection results of the electroformed layer after the electroforming.

According to the above aspect, there is no need to use radiation such as X-rays when inspecting the state of the electroformed layer. Therefore, according to the above aspect, the state of the electroformed layer can be inspected at a lower cost than when radiation is used.

(Aspect 6)
In a sixth aspect, the method for manufacturing an electroformed member further includes a step of performing a predetermined treatment on an abnormal portion of the electroformed layer detected by inspecting the state of the electroformed layer.

According to the above aspect, the quality of the electroformed member and the electroformed pipe can be improved by subjecting the abnormal part to appropriate processing such as adding an identifier to the abnormal part and removing the abnormal part. Further, by applying the appropriate treatment to the abnormal portion, it is possible to improve the productivity of electroformed members and electroformed pipes.

(Aspect 7)
In aspect 7, the step of subjecting the abnormal portion of the electroformed layer to the predetermined treatment includes at least one of adding an identifier to the abnormal portion and removing the abnormal portion.

According to the above-mentioned aspect, the quality of the electroformed member and the electroformed pipe can be improved. Moreover, productivity of electroformed members and electroformed pipes can be improved.

(Aspect 8)
In aspect 8, a method for manufacturing an electroformed pipe includes the above-described method for manufacturing an electroformed member, and a step of removing the wire from the electroformed layer.

According to the above-mentioned aspect, the productivity of electroformed members and electroformed pipes can be improved in the same manner as in aspect 1.

(Aspect 9)
In aspect 9, the electroforming device includes a path along which the wire is conveyed, an electroforming tank disposed on the path and forming an electroformed layer around the wire, and an electroforming tank disposed on the path and configured to form an electroformed layer around the wire. and a control section that changes conditions for forming the electroformed layer in the electroforming tank depending on the state of the electroformed layer.

The "inspection section" corresponds to the "film thickness meter", "first displacement meter", and "second displacement meter" in the above-described embodiment or modified example.

(Aspect 10)
In aspect 10, the inspection section is movable at substantially the same moving speed as the moving speed of the wire along the route.

According to the above aspect, as in the second aspect, the thickness of the electroformed layer can be accurately inspected compared to the case where the wire is fixed without moving.

(Aspect 11)
In aspect 11, the plurality of inspection parts that inspect the state of the electroformed layer are arranged at approximately equal intervals around the wire when viewed from the axial direction of the wire.

According to the above-mentioned aspect, similarly to the third aspect, the uniformity of the state of the electroformed layer, such as the thickness, in the circumferential direction of the wire can be inspected.

(Aspect 12)
In aspect 12, at least some of the plurality of inspection sections are arranged substantially parallel to the axial direction of the wire and shifted from each other.

According to the above aspect, similar to aspect 4, mutual interference between inspections of each inspection section is suppressed compared to the case where at least some of the inspection sections are aligned substantially parallel to each other in the axial direction of the wire rod. can do.

(Aspect 13)
In aspect 13, the inspection unit includes an inspection result of the wire before the electroformed layer is formed around the wire, and an inspection result of the electroformed layer after the electroformed layer is formed around the wire. The state of the electroformed layer is inspected with reference to the inspection results.

According to the above aspect, similarly to aspect 5, the state of the electroformed layer can be inspected at a lower cost than when radiation is used.

(Aspect 14)
In aspect 14, the electroforming apparatus further includes a processing section that performs predetermined processing on an abnormal portion of the electroformed layer detected by inspecting the state of the electroformed layer.

The "processing unit" corresponds to the "marker" in the above-described embodiment or modification.

According to the above-mentioned aspect, the quality of the electroformed member and the electroformed pipe can be improved similarly to the sixth aspect. Moreover, productivity of electroformed members and electroformed pipes can be improved.

(Aspect 15)
In aspect 15, the predetermined process includes at least one of assigning an identifier to the abnormal portion and removing the abnormal portion.

According to the above-mentioned aspect, the quality of the electroformed member and the electroformed pipe can be improved in the same way as the seventh aspect. Moreover, productivity of electroformed members and electroformed pipes can be improved.

1A, 1B Electroforming device 2A, 2B Path 5A, 5B Control section 12A, 12B Delivery reel 14A, 14B Tension jig 16A, 16B Conveyance roller 18A Auxiliary roller 21A, 21B Degreasing tank 21A1, 21B1 Degreasing liquid 22A, 22B 1st Cleaning tank 22A1, 22B1 First cleaning liquid 23A, 23B Electroforming tank 23A1, 23B1 Electroforming liquid 24A, 24B Second cleaning tank 24A1, 24B1 Second cleaning liquid 25A, 25B Drying tank 30A Imaging section 40A, 40A1 Film thickness meter 42A Centering Roller 42B First displacement gauge 44B Second displacement gauge 50A, 50B Marker 100A, 100A1, 100B Wire 200A, 200A1, 200B Electroformed layer 300A, 300B Electroformed member S1A, S1B Degreasing process S2A, S2B First cleaning process S3A, S3B Electroforming process S4A, S4B Second cleaning process S5A, S5B Drying process S6A Inspection process S6B1 First inspection process S6B2 Second inspection process S7A, S7B Identifier provision process S8A, S8B Abnormal part removal process S9A, S9B Wire rod removal process S10A, S10B Electroformed layer cutting process P piece

Claims (15)

forming an electroforming layer around the wire in an electroforming tank disposed on a route through which the wire is conveyed;
Inspecting the state of the electroformed layer by an inspection unit disposed in the path;
changing conditions for forming the electroformed layer in the electroforming tank according to the state of the electroformed layer;
A method for manufacturing an electroformed member, comprising: The manufacturing of an electroformed member according to claim 1, wherein the step of inspecting the state of the electroformed layer is performed by the inspection section movable at substantially the same speed as the speed of movement of the wire along the path. Method. The electroforming according to claim 1, wherein the step of inspecting the state of the electroformed layer is performed by a plurality of the inspection sections arranged at approximately equal intervals around the wire when viewed from the axial direction of the wire. Method of manufacturing parts. According to claim 3, the step of inspecting the state of the electroformed layer is performed by at least some of the plurality of inspection units that are arranged substantially parallel to and offset from each other in the axial direction of the wire rod. The method for manufacturing the electroformed member described above. The step of inspecting the state of the electroformed layer includes an inspection result of the wire before the electroformed layer is formed around the wire, and an inspection result of the wire after the electroformed layer is formed around the wire. The method for manufacturing an electroformed member according to claim 1, wherein the test is performed by referring to the test result of the electroformed layer by the test section. The method for manufacturing an electroformed member according to claim 1, further comprising the step of subjecting an abnormal portion of the electroformed layer detected by the inspection of the state of the electroformed layer to a predetermined treatment. 7. The method according to claim 6, wherein the step of subjecting the abnormal portion of the electroformed layer to the predetermined treatment includes at least one of adding an identifier to the abnormal portion and removing the abnormal portion. Method for manufacturing electroformed parts. A method for manufacturing an electroformed member according to any one of claims 1 to 7,
removing the wire from the electroformed layer;
A method for manufacturing an electroformed pipe, comprising: The route along which the wire rod is transported,
an electroforming tank disposed in the path and forming an electroforming layer around the wire;
an inspection section disposed on the path and inspecting the state of the electroformed layer;
a control unit that changes conditions for forming the electroformed layer in the electroforming tank according to the state of the electroformed layer;
An electroforming device equipped with. The electroforming apparatus according to claim 9, wherein the inspection section is movable at substantially the same moving speed as the moving speed of the wire along the path. The electroforming apparatus according to claim 9, wherein the plurality of inspection parts that inspect the state of the electroformed layer are arranged at approximately equal intervals around the wire rod when viewed from the axial direction of the wire rod. The electroforming apparatus according to claim 11, wherein at least some of the plurality of inspection sections are arranged offset from each other in substantially parallel to the axial direction of the wire. The inspection unit includes an inspection result of the wire before the electroformed layer is formed around the wire, and an inspection result of the electroformed layer after the electroformed layer is formed around the wire. The electroforming apparatus according to claim 9, wherein the state of the electroformed layer is inspected with reference to . The electroforming apparatus according to claim 9, further comprising a processing section that performs predetermined processing on an abnormal portion of the electroformed layer detected by inspecting the state of the electroformed layer. The electroforming apparatus according to claim 14, wherein the predetermined process includes at least one of adding an identifier to the abnormal portion and removing the abnormal portion.

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