JP2023171277A - プラズマ処理方法及びプラズマ処理装置 - Google Patents

プラズマ処理方法及びプラズマ処理装置 Download PDF

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Publication number
JP2023171277A
JP2023171277A JP2023074798A JP2023074798A JP2023171277A JP 2023171277 A JP2023171277 A JP 2023171277A JP 2023074798 A JP2023074798 A JP 2023074798A JP 2023074798 A JP2023074798 A JP 2023074798A JP 2023171277 A JP2023171277 A JP 2023171277A
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film
gas
silicon
plasma processing
chamber
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Pending
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JP2023074798A
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English (en)
Japanese (ja)
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JP2023171277A5 (https=
Inventor
隆宏 米澤
Takahiro Yonezawa
裕輔 瀧野
Yusuke Takino
健太 小野
Kenta Ono
哲也 西塚
Tetsuya Nishizuka
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to CN202310564019.8A priority Critical patent/CN117096027A/zh
Priority to KR1020230064244A priority patent/KR20230162551A/ko
Priority to US18/199,734 priority patent/US20230377899A1/en
Priority to TW112118687A priority patent/TW202412058A/zh
Publication of JP2023171277A publication Critical patent/JP2023171277A/ja
Publication of JP2023171277A5 publication Critical patent/JP2023171277A5/ja
Pending legal-status Critical Current

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JP2023074798A 2022-05-20 2023-04-28 プラズマ処理方法及びプラズマ処理装置 Pending JP2023171277A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN202310564019.8A CN117096027A (zh) 2022-05-20 2023-05-18 等离子体处理方法以及等离子体处理系统
KR1020230064244A KR20230162551A (ko) 2022-05-20 2023-05-18 플라즈마 처리 방법 및 플라즈마 처리 시스템
US18/199,734 US20230377899A1 (en) 2022-05-20 2023-05-19 Plasma processing method and plasma processing apparatus
TW112118687A TW202412058A (zh) 2022-05-20 2023-05-19 電漿處理方法及電漿處理系統

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022082706 2022-05-20
JP2022082706 2022-05-20

Publications (2)

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JP2023171277A true JP2023171277A (ja) 2023-12-01
JP2023171277A5 JP2023171277A5 (https=) 2026-02-12

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JP2023074798A Pending JP2023171277A (ja) 2022-05-20 2023-04-28 プラズマ処理方法及びプラズマ処理装置

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JP (1) JP2023171277A (https=)

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