JP2023159926A - Method for joining metal or conductive ultra-small columnar pin to electrode pad portion of workpiece - Google Patents

Method for joining metal or conductive ultra-small columnar pin to electrode pad portion of workpiece Download PDF

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JP2023159926A
JP2023159926A JP2022069859A JP2022069859A JP2023159926A JP 2023159926 A JP2023159926 A JP 2023159926A JP 2022069859 A JP2022069859 A JP 2022069859A JP 2022069859 A JP2022069859 A JP 2022069859A JP 2023159926 A JP2023159926 A JP 2023159926A
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metal
electrode pad
workpiece
pad portion
conductive
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JP7271761B1 (en
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一典 高野
Kazunori Takano
友之 塚本
Tomoyuki Tsukamoto
浩二 吉住
Koji Yoshizumi
美昭 行森
Yoshiaki Yukimori
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Minami Co Ltd
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Abstract

To enable a metal or conductive ultra-small columnar pin to be vertically joined to the center position of an electrode pad portion without tilting when bonding a metal or conductive ultra-small columnar pin to the electrode pad portion of a printed circuit board using a bonding paste applied to it by printing.SOLUTION: In a state in which a metal or conductive ultra-small columnar pin 4 is placed on a bonding paste 3 applied to an electrode pad portion 2, before the bonding paste 3 melted by a hot plate 5 as heating means is solidified, a printed circuit board 1 is inverted. The inverted printed circuit board 1 is held above the hot plate 5 via a spacer 6.SELECTED DRAWING: Figure 1

Description

本発明は、Ｃｕ－Ｐｉｎ（銅ピン）、Ｃｕ－Ｐｉｌｌａｒ（銅ピラー）、Ｃｕ－Ｐｏｓｔ（銅ポスト）、Ｃｕ－Ｃｏｌｕｍｎ（銅カラム）等と呼ばれる金属若しくは導電性の極小柱状ピンの、半導体ウェハやプリント基板等のワークの電極パッド部への接合方法に関し、更に詳細には、Ｐａｃｋａｇｅ－ｏｎ－Ｐａｃｋａｇｅ（ＰＯＰ）などの半導体製品の製作にあたり、ウェハやプリント基板等のワークの電極パッド部に、それに印刷により塗布した接合用ペーストをもってＣｕ－Ｐｉｎ等の金属若しくは導電性の極小柱状ピンを接合するとき、Ｃｕ－Ｐｉｎ等の金属若しくは導電性の極小柱状ピンを、電極パッド部の中心位置に、傾くことなく垂直に接合することができるようになしたことを特徴とする接合方法に係る。 The present invention relates to semiconductor wafers of metal or conductive ultra-small columnar pins called Cu-Pins, Cu-Pillars, Cu-Posts, Cu-Columns, etc. Regarding the method of bonding workpieces such as wafers and printed circuit boards to electrode pads, more specifically, in the production of semiconductor products such as Package-on-Package (POP), bonding methods to electrode pads of workpieces such as wafers and printed circuit boards, When bonding a metal such as Cu-Pin or a conductive ultra-small columnar pin with a bonding paste applied by printing, place the metal such as Cu-Pin or conductive ultra-small columnar pin at the center of the electrode pad part. The present invention relates to a joining method characterized in that vertical joining can be performed without tilting.

Ｐａｃｋａｇｅ－ｏｎ－Ｐａｃｋａｇｅ（ＰＯＰ）などの半導体製品の製作にあたり、ウェハやプリント基板等のワークの電極パッド部に、Ｃｕ－Ｐｉｎ等の金属若しくは導電性の極小柱状ピンを搭載するときには、従来、一般的に次の工程によって行われる。 When manufacturing semiconductor products such as Package-on-Package (POP), when mounting metal or conductive micro-column pins such as Cu-Pin on the electrode pads of workpieces such as wafers and printed circuit boards, conventionally, general This is typically done through the following steps:

先ず、ウェハやプリント基板等のワークの電極パッド部に、スクリーン印刷装置のスキージとメタルマスクをもって接合用ペーストを塗布（印刷）し、その後この塗布した接合用ペーストに、マウント装置によってＣｕ－Ｐｉｎ等の金属若しくは導電性の極小柱状ピンを載せ、更にこの状態において加熱手段であるリフロー装置によって加熱して接合用ペーストを溶融させた後に固化させ、もってワークの電極パッド部への金属若しくは導電性の極小柱状ピンの接合を行う。 First, a bonding paste is applied (printed) to the electrode pad portion of a workpiece such as a wafer or a printed circuit board using a squeegee and a metal mask of a screen printing device, and then Cu-Pin, etc. is applied to the applied bonding paste using a mounting device. A metal or conductive ultra-small columnar pin is placed on the pin, and in this state, the bonding paste is heated by a reflow device, which is a heating means, to melt and solidify the metal or conductive paste to the electrode pad portion of the workpiece. Joins extremely small columnar pins.

これを図３及び図４をもって説明すると、図３はワークであるプリント基板１００の複数の電極パッド部１０１に接合用ペースト１０２を印刷により塗布し、該接合用ペースト１０２の夫々にＣｕ－Ｐｉｎ等の金属若しくは導電性の極小柱状ピン１０３を載せ、更に、この状態において加熱した状態を示すものである。尚、金属若しくは導電性の極小柱状ピン１０３は、いずれも立てた状態で載せられており、そして加熱は、図示した例においてはリフロー装置（加熱手段）としてのホットプレート１０４によって行われている。 To explain this with reference to FIGS. 3 and 4, in FIG. 3, a bonding paste 102 is applied by printing to a plurality of electrode pads 101 of a printed circuit board 100, which is a workpiece, and each of the bonding pastes 102 is coated with Cu-Pin, etc. The figure shows a state in which a metal or conductive micro-column pin 103 is mounted and further heated in this state. The metal or conductive microscopic columnar pins 103 are all mounted in an upright state, and heating is performed by a hot plate 104 as a reflow device (heating means) in the illustrated example.

ところで、半導体製品の製作にあたり、搭載する部品が微細になるほど金属若しくは導電性の極小柱状ピンを載せる間隔は狭く且つ金属若しくは導電性の極小柱状ピンの高さは高くなっていく。そして、金属若しくは導電性の極小柱状ピンは、その長さが直径に対して高比率になると、立てたときに傾きが発生し易くなる。 By the way, when manufacturing semiconductor products, the smaller the parts to be mounted, the narrower the intervals between the metal or conductive ultra-small columnar pins, and the higher the height of the metal or conductive ultra-small columnar pins. When a metal or conductive micro-column pin has a high ratio of its length to its diameter, it tends to tilt when it is erected.

然るに、図３に示す如く、プリント基板１００を、その金属若しくは導電性の極小柱状ピン１０３が上面側になるようにしてホットプレート１０４をもって加熱すると、加熱によって溶融した接合用ペースト１０２が流動して、その上面に載せた金属若しくは導電性の極小柱状ピン１０３が傾きを起こしたり、倒れたり、或いは電極パッド部の中心からずれたり、高さが不揃いになる等し、最終的に図４に示す如き接合状態となって不良品となる事態が頻発した。 However, as shown in FIG. 3, when a printed circuit board 100 is heated with a hot plate 104 with its metal or conductive microscopic columnar pins 103 facing upward, the bonding paste 102 melted by the heating flows. , the metal or conductive micro-column pin 103 placed on the top surface may tilt or fall, or may be deviated from the center of the electrode pad section, or the height may become uneven, and the final result is as shown in FIG. 4. Situations such as this have frequently occurred, resulting in defective products.

本発明は上記の点に鑑みなされたものであって、電極パッド部に塗布した接合用ペーストに金属若しくは導電性の極小柱状ピンを載せた状態において、且つ加熱手段によって溶融した接合用ペーストが固化する前にワークを反転させ、もって反転したワークから垂下した金属若しくは導電性の極小柱状ピン自体の重力と溶融した接合用ペーストの表面張力によって、金属若しくは導電性の極小柱状ピンを、ワークの電極パッド部の中心位置に、傾くことなく垂直に接合することができるようになした金属若しくは導電性の極小柱状ピンのワークの電極パッド部への接合方法を提供しようとするものである。 The present invention has been made in view of the above points, and the present invention has been made in a state where a metal or conductive ultra-small columnar pin is placed on the bonding paste applied to the electrode pad portion, and the bonding paste is melted by heating means and solidified. The workpiece is turned over before the workpiece is turned over, and by the gravity of the metal or conductive ultra-small columnar pin itself hanging from the inverted workpiece and the surface tension of the molten bonding paste, the metal or conductive ultra-small columnar pin is connected to the electrode of the workpiece. The object of the present invention is to provide a method for joining a work piece to an electrode pad part of a metal or conductive ultra-small columnar pin that can be joined vertically to the center position of the pad part without tilting.

而して、本発明は、ウェハ、プリント基板等のワークの電極パッド部に、それに印刷により塗布した接合用ペーストをもって金属若しくは導電性の極小柱状ピンを接合するときにおいて、電極パッド部に塗布した接合用ペーストに金属若しくは導電性の極小柱状ピンを載せた状態において、且つ加熱手段によって溶融した接合用ペーストが固化する前に、ワークを反転させることを特徴とする金属若しくは導電性の極小柱状ピンのワークの電極パッド部への接合方法を要旨とするものである。 Therefore, the present invention provides a bonding paste applied to the electrode pad portion of a workpiece such as a wafer or a printed circuit board when bonding a metal or conductive micro columnar pin using a bonding paste applied to the electrode pad portion by printing. A metal or conductive ultra-small columnar pin, characterized in that the workpiece is turned over in a state where the metal or conductive ultra-small columnar pin is placed on a bonding paste and before the bonding paste melted by a heating means is solidified. The gist of this paper is a method for joining a workpiece to an electrode pad portion.

また、本発明は、上記構成において、加熱手段としてホットプレートを用い、そして、反転させたワークをスペーサーを介してホットプレートの上方に保持するようにしてもよい。尚、本明細書において使用する「接合用ペースト」の語には、半田ペーストに限らず、フラック材、銀ペースト等本発明の趣旨を逸脱しない範囲で適宜の材料を含むものである。 Further, in the present invention, in the above configuration, a hot plate may be used as the heating means, and the inverted workpiece may be held above the hot plate via a spacer. Note that the term "bonding paste" used in this specification includes not only solder paste but also appropriate materials such as flak material and silver paste within the scope of the present invention.

本発明は、上記の如き構成であるから、反転したワークから垂下した金属若しくは導電性の極小柱状ピン自体の重力と溶融した接合用ペーストの表面張力によって、金属若しくは導電性の極小柱状ピンを、ワークの電極パッド部の中心位置に、傾くことなく垂直に接合することができるものである。 Since the present invention has the above-mentioned configuration, the metal or conductive ultra-small columnar pin is moved by the gravity of the metal or conductive ultra-small columnar pin itself hanging from the inverted workpiece and the surface tension of the molten bonding paste. It can be joined vertically to the center position of the electrode pad portion of the workpiece without tilting.

本発明の実施形態に係る金属若しくは導電性の極小柱状ピンのワークの電極パッド部への接合方法の説明図であり、金属若しくは導電性の極小柱状ピンを電極パッド部に載せたワークを反転させて加熱する状態を示すものである。FIG. 2 is an explanatory diagram of a method of joining a metal or conductive ultra-small columnar pin to an electrode pad portion of a workpiece according to an embodiment of the present invention, in which a workpiece with a metal or conductive ultra-small columnar pin placed on an electrode pad portion is inverted; This shows the state of heating. 同接合用ペーストが固化した状態を示すものである。This figure shows the state in which the bonding paste has solidified. 従来の金属若しくは導電性の極小柱状ピンのワークの電極パッド部への接合方法の説明図であり、金属若しくは導電性の極小柱状ピンを電極パッド部に載せたワークを加熱する状態を示すものである。It is an explanatory diagram of a conventional method of joining a metal or conductive ultra-small columnar pin to an electrode pad portion of a workpiece, and shows a state in which a workpiece with a metal or conductive ultra-small columnar pin placed on an electrode pad portion is heated. be. 同接合用ペーストが固化した状態を示すものであるThis shows the solidified state of the bonding paste.

以下、本発明を実施するための形態について、図面を参照して説明する。 EMBODIMENT OF THE INVENTION Hereinafter, the form for implementing this invention is demonstrated with reference to drawings.

図１及び図２において、１はワークであり、本実施例においてはプリント基板である。また、２は前記プリント基板１における電極パッド部であり、３は前記電極パッド部２の夫々に、印刷により塗布した接合用ペーストである。４は前記接合用ペースト３の夫々に載せたＣｕ－Ｐｉｎ等の金属若しくは導電性の極小柱状ピンである。 In FIGS. 1 and 2, 1 is a workpiece, which in this embodiment is a printed circuit board. Further, 2 is an electrode pad portion on the printed circuit board 1, and 3 is a bonding paste applied to each of the electrode pad portions 2 by printing. Reference numeral 4 denotes a metal or conductive ultra-small columnar pin, such as Cu-Pin, placed on each of the bonding pastes 3.

また、５は加熱手段であるリフロー装置としてのホットプレートである。６は反転させたプリント基板をホットプレートの上方に保持するためのスペーサーである。 Moreover, 5 is a hot plate as a reflow device which is a heating means. 6 is a spacer for holding the inverted printed circuit board above the hot plate.

而して、本実施形態においては、プリント基板１の電極パッド部２に、それに金属若しくは導電性の極小柱状ピン４を接合するときにおいて、電極パッド部２に塗布した接合用ペースト３に金属若しくは導電性の極小柱状ピン４を載せた状態において、且つ加熱手段としてのホットプレート５によって溶融した接合用ペースト３が固化する前に、プリント基板１を反転させるものである。そして、反転させたプリント基板１を、本実施形態においてはスペーサー６を介してホットプレート５の上方に保持するものである。また、スペーサー６は、例えば、平面形状が方形の枠のようなものであれば、ホットプレート５に載せることができ、着脱が容易である。尚、前記の他、固定するようにしてもよい。 In this embodiment, when bonding the metal or conductive ultra-small columnar pins 4 to the electrode pad portion 2 of the printed circuit board 1, the bonding paste 3 applied to the electrode pad portion 2 is coated with metal or conductive. The printed circuit board 1 is turned over with the conductive ultra-small columnar pins 4 placed thereon, and before the bonding paste 3 melted by the hot plate 5 as a heating means is solidified. The inverted printed circuit board 1 is then held above the hot plate 5 via a spacer 6 in this embodiment. Furthermore, if the spacer 6 has a rectangular frame-like planar shape, for example, it can be placed on the hot plate 5 and can be easily attached and detached. In addition to the above, it may be fixed.

また、プリント基板１の反転は適宜の手段をもって行い、そして反転させたプリント基板１は、垂下した金属若しくは導電性の極小柱状ピン４の先端がホットプレート５に接触しない状態に保持される。また、スペーサー６は熱伝導の良好な材料からなり、該スペーサー６をもってホットプレート５の熱が伝達される。尚、加熱にあたり充分な熱量が得られない場合には、他の加熱手段、例えば、ヒータ等を併用するようにしてもよい。 Further, the printed circuit board 1 is reversed by an appropriate means, and the reversed printed circuit board 1 is held in such a state that the tips of the hanging metal or conductive micro-column pins 4 do not come into contact with the hot plate 5. Further, the spacer 6 is made of a material with good thermal conductivity, and the heat of the hot plate 5 is transferred through the spacer 6. Note that if a sufficient amount of heat cannot be obtained for heating, other heating means, such as a heater, may be used in combination.

また、加熱手段として、本実施形態においてはホットプレートを用いているが、これ以外の従来公知のリフロー装置を用いるようにしてもよい。尚、その場合において、反転させたワークの保持は、適宜の手段を用いて行えばよい。 Furthermore, although a hot plate is used as the heating means in this embodiment, any other conventionally known reflow apparatus may be used. In this case, the inverted workpiece may be held using any suitable means.

上記本実施形態によれば、反転したプリント基板１から垂下した金属若しくは導電性の極小柱状ピン４自体の重力と溶融した接合用ペースト３の表面張力によって、金属若しくは導電性の極小柱状ピン４を、プリント基板１の電極パッド部２の中心位置に、傾くことなく垂直に接合することができるものである。 According to the present embodiment, the metal or conductive ultra-small columnar pins 4 are moved by the gravity of the metal or conductive ultra-small columnar pins 4 themselves hanging from the inverted printed circuit board 1 and the surface tension of the molten bonding paste 3. , which can be vertically bonded to the center position of the electrode pad portion 2 of the printed circuit board 1 without tilting.

１ プリント基板
２ 電極パッド部
３ 接合用ペースト
４ 金属若しくは導電性の極小柱状ピン
５ ホットプレート
６ スペーサー
1 Printed circuit board 2 Electrode pad portion 3 Bonding paste 4 Metal or conductive ultra-small columnar pin 5 Hot plate 6 Spacer

本発明は上記の点に鑑みなされたものであって、ウェハ、プリント基板等のワークの電極パッド部に塗布した接合用ペーストに、長さ方向全体において同一直径の金属若しくは導電性の極小柱状ピンを載せ、該接合用ペーストの粘着力によって極小柱状ピンを載せ、該接合用ペーストの粘着力によって極小柱状ピンを載せた状態を維持してワークを反転させ、この状態において加熱手段によって前記接合用ペーストを溶融し、固化させ、もって反転したワークから垂下した金属若しくは導電性の極小柱状ピン自体の重力と溶融した接合用ペーストの表面張力によって、金属若しくは導電性の極小柱状ピンを、ワークの電極パッド部の中心位置に、傾くことなく垂直に接合することができるようになした金属若しくは導電性の極小柱状ピンのワークの電極パッド部への接合方法を提供しようとするものである。
The present invention has been made in view of the above-mentioned points, and includes a bonding paste applied to the electrode pad portion of a workpiece such as a wafer or a printed circuit board , and a metal or conductive ultra-small columnar pin having the same diameter in the entire length direction. is placed on the workpiece, a very small columnar pin is placed on it by the adhesive force of the bonding paste, the workpiece is inverted while maintaining the state in which the very small columnar pin is placed by the adhesive force of the bonding paste, and in this state, the bonding The paste is melted and solidified , and by the gravity of the metal or conductive micro-column pin itself hanging from the inverted workpiece and the surface tension of the molten bonding paste, the metal or conductive micro-column pin is connected to the electrode of the workpiece. The object of the present invention is to provide a method for joining a work piece to an electrode pad part of a metal or conductive ultra-small columnar pin that can be joined vertically to the center position of the pad part without tilting.

而して、本発明は、ウェハ、プリント基板等のワークの電極パッド部に、それに印刷により塗布した接合用ペーストをもって、長さ方向全体において同一直径の金属若しくは導電性の極小柱状ピンを接合するときにおいて、電極パッド部に塗布した接合用ペーストに前記金属若しくは導電性の極小柱状ピンを載せ、前記接合用ペーストの粘着力によって前記金属若しくは導電性の極小柱状ピンを載せた状態を維持してワークを反転させ、この状態において加熱手段によって前記接合用ペーストを溶融し、固化させることを特徴とする金属若しくは導電性の極小柱状ピンのワークの電極パッド部への接合方法を要旨とするものである。
Accordingly, the present invention connects a metal or conductive ultra-small columnar pin having the same diameter along the entire length direction to the electrode pad portion of a workpiece such as a wafer or a printed circuit board using a bonding paste applied by printing thereto. At times, the metal or conductive ultra-small columnar pin is placed on a bonding paste applied to the electrode pad portion , and the state in which the metal or conductive ultra-small columnar pin is maintained by the adhesive force of the bonding paste is maintained. The gist of the present invention is to provide a method for joining a metal or conductive ultra-small columnar pin to an electrode pad portion of a work, which method is characterized by inverting the work and melting and solidifying the joining paste using heating means in this state. be.

また、本発明は、上記構成において、加熱手段としてホットプレートを用い、そして、反転させたワークを、熱伝導の良好な材料からなり、平面形状が方形の枠状をなすスペーサーを介してホットプレートの上方に保持するようにしてもよい。尚、本明細書において使用する「接合用ペースト」の語には、半田ペーストに限らず、フラック材、銀ペースト等本発明の趣旨を逸脱しない範囲で適宜の材料を含むものである。
Further, in the above configuration, the present invention uses a hot plate as a heating means, and the inverted workpiece is placed on the hot plate through a spacer made of a material with good thermal conductivity and having a rectangular frame shape. It may also be held above. Note that the term "bonding paste" used in this specification includes not only solder paste but also appropriate materials such as flak material and silver paste within the scope of the present invention.

図１及び図２において、１はワークであり、本実施形態においては、プリント基板である。また、２は前記プリント基板１における電極パッド部であり、３は前記電極パッド部２の夫々に、印刷により塗布した接合用ペーストである。４は前記接合用ペースト３の夫々に載せた、長さ方向全体において同一直径のＣｕ－Ｐｉｎ等の金属若しくは導電性の極小柱状ピンである。
In FIGS. 1 and 2, 1 is a workpiece, which in this embodiment is a printed circuit board. Further, 2 is an electrode pad portion on the printed circuit board 1, and 3 is a bonding paste applied to each of the electrode pad portions 2 by printing. Reference numeral 4 denotes a metal or conductive extremely small columnar pin such as Cu-Pin , which has the same diameter in the entire length direction and is placed on each of the bonding pastes 3.

而して、本実施形態においては、プリント基板１の電極パッド部２に、それに印刷により塗布した接合用ペースト３をもって、長さ方向全体において同一直径の金属若しくは導電性の極小柱状ピン４を接合するときにおいて、電極パッド部２に塗布した接合用ペースト３に前記金属若しくは導電性の極小柱状ピン４を載せ、前記接合用ペースト３の粘着力によって前記金属若しくは導電性の極小柱状ピン４を載せた状態を維持してプリント基板１を反転させるものである。そして、反転させたプリント基板１を、本実施形態においてはスペーサー６を介してホットプレート５の上方に保持し、この状態においてホットプレート５による熱によって前記接合用ペースト３を溶融するものである。また、スペーサー６は、例えば、平面形状が方形の枠のようなものであれば、ホットプレート５に載せることができ、着脱が容易である。尚、前記の他、固定するようにしてもよい。
In this embodiment, a metal or conductive micro-column pin 4 having the same diameter in the entire length direction is bonded to the electrode pad portion 2 of the printed circuit board 1 using a bonding paste 3 applied by printing. At this time, the metal or conductive ultra-small columnar pin 4 is placed on the bonding paste 3 applied to the electrode pad portion 2, and the metal or conductive ultra-small columnar pin 4 is placed on the bonding paste 3 by the adhesive force of the bonding paste 3. This is to invert the printed circuit board 1 while maintaining the same state . In this embodiment, the inverted printed circuit board 1 is held above a hot plate 5 via a spacer 6 , and in this state, the bonding paste 3 is melted by heat from the hot plate 5 . Furthermore, if the spacer 6 has a rectangular frame-like planar shape, for example, it can be placed on the hot plate 5 and can be easily attached and detached. In addition to the above, it may be fixed.

Claims (3)

ウェハ、プリント基板等のワークの電極パッド部に、それに印刷により塗布した接合用ペーストをもって金属若しくは導電性の極小柱状ピンを接合するときにおいて、電極パッド部に塗布した接合用ペーストに金属若しくは導電性の極小柱状ピンを載せた状態において、且つ加熱手段によって溶融した接合用ペーストが固化する前に、ワークを反転させることを特徴とする金属若しくは導電性の極小柱状ピンのワークの電極パッド部への接合方法。 When bonding a metal or conductive ultra-small columnar pin to the electrode pad part of a workpiece such as a wafer or printed circuit board using a bonding paste applied by printing, the metal or conductive A method of applying a metal or conductive ultra-small columnar pin to an electrode pad portion of a workpiece, characterized in that the workpiece is turned over while the ultra-small columnar pin is placed thereon, and before the bonding paste melted by the heating means is solidified. Joining method. 加熱手段がホットプレートである請求項１記載の金属若しくは導電性の極小柱状ピンのワークの電極パッド部への接合方法。 2. The method of joining a metal or conductive micro-columnar pin to an electrode pad portion of a workpiece according to claim 1, wherein the heating means is a hot plate. 加熱手段がホットプレートであり、反転させたワークをスペーサーを介してホットプレートの上方に保持してなる請求項２記載の金属若しくは導電性の極小柱状ピンのワークの電極パッド部への接合方法。
3. The method of joining a metal or conductive micro-column pin to an electrode pad portion of a work according to claim 2, wherein the heating means is a hot plate and the inverted work is held above the hot plate via a spacer.
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JP2001223290A (en) * 2000-02-08 2001-08-17 Ibiden Co Ltd Method for manufacturing printed wiring board
WO2008050376A1 (en) * 2006-09-29 2008-05-02 Fujitsu Limited Process for producing semiconductor device and apparatus therefor
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