JP2023136251A5 - - Google Patents

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Publication number
JP2023136251A5
JP2023136251A5 JP2022041769A JP2022041769A JP2023136251A5 JP 2023136251 A5 JP2023136251 A5 JP 2023136251A5 JP 2022041769 A JP2022041769 A JP 2022041769A JP 2022041769 A JP2022041769 A JP 2022041769A JP 2023136251 A5 JP2023136251 A5 JP 2023136251A5
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JP
Japan
Prior art keywords
layer
insulating layer
connection terminal
external connection
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022041769A
Other languages
English (en)
Japanese (ja)
Other versions
JP7469348B2 (ja
JP2023136251A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2022041769A external-priority patent/JP7469348B2/ja
Priority to JP2022041769A priority Critical patent/JP7469348B2/ja
Priority to DE112023001427.2T priority patent/DE112023001427T5/de
Priority to CN202380027575.XA priority patent/CN118872046A/zh
Priority to PCT/JP2023/001894 priority patent/WO2023176148A1/ja
Priority to US18/845,879 priority patent/US20250185165A1/en
Publication of JP2023136251A publication Critical patent/JP2023136251A/ja
Publication of JP2023136251A5 publication Critical patent/JP2023136251A5/ja
Publication of JP7469348B2 publication Critical patent/JP7469348B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2022041769A 2022-03-16 2022-03-16 配線基板および配線基板の製造方法 Active JP7469348B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2022041769A JP7469348B2 (ja) 2022-03-16 2022-03-16 配線基板および配線基板の製造方法
US18/845,879 US20250185165A1 (en) 2022-03-16 2023-01-23 Wiring board and method for manufacturing wiring board
CN202380027575.XA CN118872046A (zh) 2022-03-16 2023-01-23 布线基板及布线基板的制造方法
PCT/JP2023/001894 WO2023176148A1 (ja) 2022-03-16 2023-01-23 配線基板および配線基板の製造方法
DE112023001427.2T DE112023001427T5 (de) 2022-03-16 2023-01-23 Leiterplatte und Verfahren zur Herstellung einer Leiterplatte

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022041769A JP7469348B2 (ja) 2022-03-16 2022-03-16 配線基板および配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2023136251A JP2023136251A (ja) 2023-09-29
JP2023136251A5 true JP2023136251A5 (https=) 2024-02-06
JP7469348B2 JP7469348B2 (ja) 2024-04-16

Family

ID=88022687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022041769A Active JP7469348B2 (ja) 2022-03-16 2022-03-16 配線基板および配線基板の製造方法

Country Status (5)

Country Link
US (1) US20250185165A1 (https=)
JP (1) JP7469348B2 (https=)
CN (1) CN118872046A (https=)
DE (1) DE112023001427T5 (https=)
WO (1) WO2023176148A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3580688B2 (ja) * 1997-12-25 2004-10-27 京セラ株式会社 積層セラミック回路基板の製造方法
JP4445777B2 (ja) 2004-02-27 2010-04-07 日本特殊陶業株式会社 配線基板、及び配線基板の製造方法
JP5154819B2 (ja) 2007-04-03 2013-02-27 新光電気工業株式会社 基板及びその製造方法
KR20170011366A (ko) 2015-07-22 2017-02-02 삼성전자주식회사 반도체 칩 및 이를 가지는 반도체 패키지
JP2020024077A (ja) 2018-08-08 2020-02-13 株式会社東芝 復水器及び発電プラント

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