JP2023101482A5 - - Google Patents
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- JP2023101482A5 JP2023101482A5 JP2023069298A JP2023069298A JP2023101482A5 JP 2023101482 A5 JP2023101482 A5 JP 2023101482A5 JP 2023069298 A JP2023069298 A JP 2023069298A JP 2023069298 A JP2023069298 A JP 2023069298A JP 2023101482 A5 JP2023101482 A5 JP 2023101482A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing liquid
- liquid according
- polishing
- group
- content
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023069298A JP2023101482A (ja) | 2019-06-06 | 2023-04-20 | 研磨液及び研磨方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021524614A JP7518824B2 (ja) | 2019-06-06 | 2019-06-06 | 研磨液及び研磨方法 |
| PCT/JP2019/022612 WO2020245994A1 (ja) | 2019-06-06 | 2019-06-06 | 研磨液及び研磨方法 |
| JP2023069298A JP2023101482A (ja) | 2019-06-06 | 2023-04-20 | 研磨液及び研磨方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021524614A Division JP7518824B2 (ja) | 2019-06-06 | 2019-06-06 | 研磨液及び研磨方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023101482A JP2023101482A (ja) | 2023-07-21 |
| JP2023101482A5 true JP2023101482A5 (enExample) | 2024-09-27 |
Family
ID=73653060
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021524614A Active JP7518824B2 (ja) | 2019-06-06 | 2019-06-06 | 研磨液及び研磨方法 |
| JP2023069298A Pending JP2023101482A (ja) | 2019-06-06 | 2023-04-20 | 研磨液及び研磨方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021524614A Active JP7518824B2 (ja) | 2019-06-06 | 2019-06-06 | 研磨液及び研磨方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11999875B2 (enExample) |
| JP (2) | JP7518824B2 (enExample) |
| KR (1) | KR102714939B1 (enExample) |
| CN (1) | CN113632205B (enExample) |
| SG (1) | SG11202109380YA (enExample) |
| WO (1) | WO2020245994A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12258491B2 (en) | 2021-01-06 | 2025-03-25 | Resonac Corporation | Polishing liquid, polishing liquid set, and polishing method |
| KR20250066153A (ko) * | 2023-11-06 | 2025-05-13 | 에스케이엔펄스 주식회사 | 반도체 공정용 연마 조성물 및 이를 이용한 기판의 제조방법 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4944836A (en) | 1985-10-28 | 1990-07-31 | International Business Machines Corporation | Chem-mech polishing method for producing coplanar metal/insulator films on a substrate |
| JPH11181403A (ja) | 1997-12-18 | 1999-07-06 | Hitachi Chem Co Ltd | 酸化セリウム研磨剤及び基板の研磨法 |
| JP2000063805A (ja) * | 1998-08-18 | 2000-02-29 | Showa Denko Kk | 磁気ディスク基板研磨用組成物 |
| US7071105B2 (en) * | 2003-02-03 | 2006-07-04 | Cabot Microelectronics Corporation | Method of polishing a silicon-containing dielectric |
| US20060124026A1 (en) * | 2004-12-10 | 2006-06-15 | 3M Innovative Properties Company | Polishing solutions |
| JP2007053213A (ja) * | 2005-08-17 | 2007-03-01 | Sumitomo Bakelite Co Ltd | 研磨用組成物 |
| US20070209287A1 (en) * | 2006-03-13 | 2007-09-13 | Cabot Microelectronics Corporation | Composition and method to polish silicon nitride |
| KR20140109392A (ko) * | 2011-12-27 | 2014-09-15 | 아사히 가라스 가부시키가이샤 | 연마제용 첨가제 및 연마 방법 |
| KR101761789B1 (ko) * | 2015-12-24 | 2017-07-26 | 주식회사 케이씨텍 | 첨가제 조성물 및 이를 포함하는 포지티브 연마 슬러리 조성물 |
| KR101935965B1 (ko) * | 2016-12-30 | 2019-01-08 | 주식회사 케이씨텍 | Ild 연마 공정용 슬러리 조성물 |
| JP6901297B2 (ja) * | 2017-03-22 | 2021-07-14 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| WO2018179061A1 (ja) * | 2017-03-27 | 2018-10-04 | 日立化成株式会社 | 研磨液、研磨液セット及び研磨方法 |
| TWI827126B (zh) * | 2017-09-26 | 2023-12-21 | 日商福吉米股份有限公司 | 表面處理組合物、其製造方法以及使用此組合物的表面處理方法 |
| KR102634300B1 (ko) * | 2017-11-30 | 2024-02-07 | 솔브레인 주식회사 | 연마용 슬러리 조성물 및 고단차 반도체 박막의 연마 방법 |
| JP6973620B2 (ja) * | 2018-03-22 | 2021-12-01 | 昭和電工マテリアルズ株式会社 | 研磨液、研磨液セット及び研磨方法 |
-
2019
- 2019-06-06 US US17/438,808 patent/US11999875B2/en active Active
- 2019-06-06 JP JP2021524614A patent/JP7518824B2/ja active Active
- 2019-06-06 KR KR1020217031902A patent/KR102714939B1/ko active Active
- 2019-06-06 WO PCT/JP2019/022612 patent/WO2020245994A1/ja not_active Ceased
- 2019-06-06 SG SG11202109380YA patent/SG11202109380YA/en unknown
- 2019-06-06 CN CN201980094671.XA patent/CN113632205B/zh active Active
-
2023
- 2023-04-20 JP JP2023069298A patent/JP2023101482A/ja active Pending
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