JP2023066615A - Manufacturing method of radio-bound book with rfid label, rfid label, and radio-bound book - Google Patents

Abstract

To provide a manufacturing method of a radio-bound book with an RFID label that enhances the heat resistance of the RFID tag (inlet) and maintains the efficiency of the binding process.SOLUTION: The manufacturing method of a radio-bound book with an RFID label includes: front cover formation step S02 of providing an inlet 11 inside, providing a heat-resistant layer 17 on one side of the inlet 11, adhering an adhesive layer 16 of an RFID label 10 with an adhesive layer 16 on the opposite side to the heat-resistant layer 17 onto the inside of a spine 21, and forming the front cover; and adhesion step S03 of wrapping a collated book 24 with the front cover formed at the front cover formation step S02 and adhering the inside of the spine 21 and the surface of the heat-resistant layer 17 onto the spine of the collated book 24 using adhesive 23.SELECTED DRAWING: Figure 9

Description

TECHNICAL FIELD The present disclosure relates to a method for manufacturing an RFID-labeled perfect bound book, an RFID label, and a perfect bound book.

Conventionally, in order to obtain accurate information for book management (inventory management, sales results, etc.), for example, it was necessary for workers to visually check the actual product or to check the binding bar code information.

In order to reduce such work load, Patent Document 1 describes a configuration in which an RFID tag is affixed to the inside of the front cover or the like in advance at the time of bookbinding.

Japanese Patent Application Laid-Open No. 2002-326474

However, in the conventional method described in Patent Document 1, the IC chip used for the RFID tag needs to be heat-resistant, and the RFID tag needs to be protected by a shielding member or the like. There was a problem that the number of man-hours for the bookbinding process increased significantly, and the efficiency of the bookbinding process decreased.

An object of the present disclosure is to provide a method for manufacturing a perfect binding book with an RFID label, an RFID label, and a perfect binding book that can improve the heat resistance of the RFID tag (inlet) and maintain the efficiency of the bookbinding process. do.

A method for manufacturing a perfect bound book with an RFID label according to one aspect of an embodiment of the present invention includes an inlet disposed inside, a heat-resistant layer provided on one side of the inlet, and a side opposite to the heat-resistant layer. A cover creation step of attaching the adhesive layer of the RFID label having an adhesive layer on the side to the inside of the spine to create a cover, and wrapping the collated book with the cover created in the cover creation step, and a bonding step of bonding the inner surface of the spine and the surface of the heat-resistant layer to the spine of the collated book using a bonding agent.

According to this aspect, in the cover making process, the RFID label having an integral structure in which the inlet, the heat-resistant layer, and the adhesive layer are laminated is attached to the back cover. As a result, when installing the RFID tag (inlet) on the cover material of the object to be affixed, the inlet and the heat-resistant layer can be attached simply by arranging the RFID label at the desired position and adhering the adhesive layer to the surface of the back cover. The laminated structure with the adhesive layer can be easily installed on the cover material. Therefore, procedures such as application of an adhesive layer, placement of an inlet (RFID tag), lamination of a heat-resistant layer, and the like, which are required for conventional RFID tags, can be omitted, and the attachment work can be facilitated.

In addition, since the adhesive layer of the RFID label is adhered to the spine in the adhesion step, the heat-resistant layer on the opposite side is located on the innermost front side of the spine. For this reason, when bonding the collated book and the back cover 21 using a bonding agent such as hot melt, a heat-resistant layer is interposed between the inlet of the RFID label and the bonding agent. The heat-resistant layer suppresses the heat transfer to the inlet side. As a result, failure of the inlet due to high heat in the bonding process can be suitably prevented. As a result, in this aspect, the heat resistance of the RFID tag (inlet) can be improved, and the efficiency of the bookbinding process can be maintained.

In addition, the RFID label is placed inside the back cover in the cover making process, so that the RFID label is built in without being exposed on the surface of the book in the perfect bound book after being bound in the bonding process. As a result, it is possible to prevent the RFID label from being detached from the bound book or the RFID label from malfunctioning due to the application of an external force, such as when the bound bound book collides with an external object.

According to another aspect of the present invention, in the method for manufacturing an RFID labeled perfect binding book, in the cover creating step, the cover material is conveyed along a predetermined conveying direction, and the RFID label is conveyed along the conveying direction. It may be pasted on the back cover while being moved by the hand.

According to this aspect, since the relative speed between the spine and the RFID label being conveyed in a predetermined conveying direction during the pasting operation can be reduced, the positioning of the RFID label pasting position in the longitudinal direction of the spine can be facilitated. In addition, since the position of the RFID label can be superimposed on the position directly above the back cover in the short direction of the back cover, the positioning of the RFID label pasting position in the short direction of the back cover can be easily performed. Therefore, by attaching the RFID label to the back cover while moving it along the transport direction of the cover material, it is possible to improve the positioning accuracy of the location where the RFID label is attached to the back cover.

According to another aspect of the present invention, a method for manufacturing an RFID-labeled perfect bound book may include forming a second heat-resistant layer between the inlet and the adhesive layer in the RFID label-making step.

According to this aspect, it is possible to further suppress direct contact of the inlet of the RFID label with a bonding agent such as hot melt in the bookbinding process, and to further suppress the occurrence of failures in the RFID label.

An RFID label according to an aspect of an embodiment of the present invention includes an inlet having an IC chip on which identification information is recorded, an antenna unit connected to the IC chip, and laminated on one side of the inlet. and an adhesive layer laminated on the other side of the inlet.

According to this aspect, the heat-resistant layer can suppress the transmission of heat from the outside of the inlet, and can suppress failure of the inlet due to heat. In addition, since the RFID label is integrally formed with a laminate structure of the inlet, the heat-resistant layer, and the adhesive layer, when it is attached to an object to be attached, the adhesive layer is placed at a desired position and the adhesive layer is attached to the object to be attached. Since it can be installed simply by adhering it to the surface, it is possible to omit procedures such as the application of an adhesive layer, placement of an inlet (RFID tag), and lamination of a heat-resistant layer, which are required for conventional RFID tags, making the attachment work easier. .

An RFID label according to another aspect of the embodiment of the present invention may have a second heat resistant layer provided between the inlet and the adhesive layer.

According to this aspect, it is possible to further suppress direct contact of the inlet of the RFID label with a bonding agent such as hot melt in the bookbinding process, and to further suppress the occurrence of failures in the RFID label.

A perfect bound book according to one aspect of the embodiment of the present invention has the RFID label described above attached to the inside of the spine.

According to this aspect, in the bookbinding process, when the collated book is adhered to the back cover to which the RFID label is attached by a bonding agent such as a hot melt, the heat of the bonding agent is transferred to the inlet side. Since the heat resistance is suppressed by the layer, by providing the heat-resistant layer on the surface of the RFID label, the failure of the inlet due to high heat in the bookbinding process can be preferably prevented. In addition, since the RFID label is placed inside the back cover, the RFID label is not exposed on the front surface of the book but is incorporated in the perfect bound book after binding. As a result, it is possible to prevent the RFID label from being detached from the bound book or the RFID label from malfunctioning due to the application of an external force, such as when the bound bound book collides with an external object.

According to the present disclosure, it is possible to provide a method for manufacturing a perfect binding book with an RFID label, an RFID label, and a perfect binding book that can improve the heat resistance of the RFID tag (inlet) and maintain the efficiency of the bookbinding process. can.

1 is a cross-sectional view showing a schematic configuration of an RFID label according to this embodiment; FIG. FIG. 2 is a plan view showing an example of the configuration of the inlet in FIG. 1; FIG. 3 is a diagram showing an example of a state of attaching the RFID label shown in FIGS. 1 and 2 to a cover material; FIG. 4 is an enlarged cross-sectional view of the periphery of the RFID label of the RFID-labeled adhesive book; 1 is a schematic configuration diagram of an RFID-labeled perfect bound book manufacturing system according to the present embodiment; FIG. FIG. 6 is a diagram showing an example of a configuration of a cover creating unit in FIG. 5; 6 is a diagram showing an example of a configuration of an inspection system including an inspection section, a sorting section, and a transport section in FIG. 5; FIG. 4 is a flow chart showing a procedure for manufacturing a perfect bound book with an RFID label according to this embodiment. FIG. 9 is a schematic diagram for explaining the operations of steps S02 and S03 in FIG. 8; FIG. 9 is a flow chart showing an example of a specific procedure of RFID label inspection processing in steps S04 to S06 in FIG. 8; FIG. FIG. 11 is a cross-sectional view showing a schematic configuration of an RFID label according to a modification; It is a top view which shows schematic structure of the test|inspection part which concerns on a modification. FIG. 11 is a plan view showing a modified example of a method of sticking an RFID label; FIG. 4 is a diagram showing frequency characteristics of RFID labels of Examples and Comparative Examples;

Embodiments will be described below with reference to the accompanying drawings. In order to facilitate understanding of the description, the same constituent elements in each drawing are denoted by the same reference numerals as much as possible, and overlapping descriptions are omitted.

In the following description, the X direction, Y direction, and Z direction are directions perpendicular to each other. The X direction is the extending direction of a pair of conductor portions 13B of the antenna portion 13 described later, the arrangement direction of the loop coil 13A and the pair of conductor portions 13B of the antenna portion 13, and the longitudinal direction of the RFID label 10. FIG. The Y direction is the short side direction of the RFID label 10 . The Z direction is the stacking direction of the inlet 11 of the RFID label 10, the heat-resistant layer 17, and the adhesive layer 16. FIG. In the following, for convenience of explanation, the Z positive direction side may also be referred to as the upper side or the front side, and the Z negative direction side may be referred to as the lower side or the rear side.

[Configuration of perfect binding book 30 with RFID label]
1 to 4, the configuration of the RFID-labeled perfect binding book 30 according to the present embodiment will be described.

FIG. 1 is a cross-sectional view showing a schematic configuration of an RFID label 10 according to this embodiment. FIG. 2 is a plan view showing an example of the configuration of the inlet 11 in FIG. 1. As shown in FIG.

The RFID label 10 is a substantially planar device that is attached to an object to be attached, and the object to be attached is a perfectly bound book 30 in this embodiment. Here, a perfect bound book refers to a book manufactured by a bookbinding method in which the spine of a bundle of texts (signatures) is fixed with a special glue for bookbinding, wrapped with a cover sheet and bound. A perfectly bound book has a rectangular parallelepiped shape with a back cover, so it has greater durability than books manufactured by other bookbinding methods such as saddle-stitched books. Perfectly bound books are widely used, for example, as educational materials, reports, paperbacks, commemorative magazines, commercial magazines, catalogs, and books. In addition, perfect binding is sometimes called "wrap binding" because it is bound by a cover sheet.

As shown in FIG. 1, the RFID label 10 includes an inlet 11, a heat resistant layer 17, and an adhesive layer 16. As shown in FIG.

The inlet 11 is a portion including elements related to the function of the RFID label 10 and has an IC chip 12 on which identification information is recorded and an antenna section 13 connected to the IC chip 12 . As shown in FIGS. 1 and 2, the inlet 11 has an antenna portion 13 formed by dry laminating an aluminum sheet on a base material 14 made of synthetic resin such as a PET film, and an IC is placed at a prescribed position. A chip 12 is mounted.

Although not shown in FIG. 1, the IC chip 12 can be adhered to the antenna section 13 and the base material 14 using, for example, ACP (anisotropic conductive adhesive).

As shown in FIG. 2, the antenna section 13 has a loop coil 13A connected to the IC chip 12 and a pair of conductor sections 13B connected to the loop coil 12A.

The loop coil 13A is a loop-shaped (annular) conductive wiring pattern having one turn or less when viewed from above as shown in FIG.

The loop coil 13A is electrically connected to the IC chip 12 and the conductor portion 13B. When the identification information recorded in the IC chip 12 is read by a communication device such as a reader (for example, a reader/writer 144 shown in FIG. 7, which will be described later), when the conductor portion 13B receives a radio wave in the UHF band, for example, a radio wave near 920 MHz, A current flows through the loop coil 13A due to the resonance action. As a result, an electromotive force for operating the IC chip 12 is generated. When the IC chip 12 operates, the identification information recorded in the IC chip 12 is encoded by the IC chip 12, and the encoded data is wirelessly transmitted to a communication device such as a reader using radio waves around 920 MHz as carrier waves. be. A reader that receives this signal decodes the signal and transfers it to an external device. As described above, the RFID label 10 of this embodiment is a passive radio wave type wireless tag that does not have a power source (battery) for holding or transmitting identification information. Therefore, compared to an active wireless tag having a battery, it is possible to realize a reduction in size and cost because it does not have a battery.

The pair of conductor portions 13B are dipole antennas configured to exhibit resonance characteristics with the IC chip 12 with respect to the frequency of radio waves for wireless communication (for example, the frequency of the UHF band). The conductor portion 13B has an electrical length equivalent to approximately λ/2 (λ is the communication wavelength) as a whole.

The pair of conductor portions 13B is an example of a structure that achieves impedance conjugate matching with the IC chip 12 for radio waves with a frequency of, for example, around 920 MHz (eg, 860 MHz to 960 MHz, more preferably 915 MHz to 935 MHz). The pair of conductor portions 13B are conductive wiring patterns that are connected to the loop coil 13A and extend in directions away from the loop coil 13A. Conductive wiring patterns can be formed by existing methods such as pressing or etching copper foil or aluminum foil, forming by plating, silk screen printing of metal paste, metal wires, etc. Here, etching of aluminum is used. formed.

The pair of conductor portions 13B are formed line-symmetrically with respect to a virtual line VL passing through substantially the center of the IC chip 12, as shown in FIG. The virtual line VL is a line parallel to the XY plane (main surface of the base material 14) and extending in the Y-axis direction. The virtual line VL is also a line that substantially bisects the RFID label 10 into regions in the X-axis direction.

Note that the patterns of the loop coil 13A and the conductor portion 13B of the antenna portion 13 are not limited to the example shown in FIG. 2 shows an example in which the IC chip 12 is arranged at the center position of the RFID label 10 in the X direction. It may be arranged at any position in the X direction or the Y direction so as to improve reading accuracy by a reader/writer 144 shown in FIG. 7, which will be described later.

The heat-resistant layer 17 is laminated on the main surface (one surface) of the inlet 11 in the positive Z direction. The heat-resistant layer 17 is a sheet-like member formed so as to cover the entire surfaces of the IC chip 12 of the inlet, the antenna section 13, and the substrate 14. As shown in FIG. The heat-resistant layer 17 is formed to have the same shape as the outer shape of the inlet 11 or a shape larger than the outer shape in plan view in the Z direction.

An adhesive layer 15 is arranged between the heat-resistant layer 17 and the inlet 11 . At the time of lamination, the adhesive layer 15 can enter and fill the gap formed by the lower surface of the heat-resistant layer 17 and the IC chip 12, the antenna section 13, or the base material 14 of the inlet 11 therebelow. . The adhesive layer 15 is formed of a material such as an acrylic adhesive, which has a higher heat resistance than a hot melt as an example of a bonding agent 23 (see FIG. 4) that bonds the later-described collated book 24 and the back cover. preferably

The heat-resistant layer 17 has properties such as heat resistance, heat insulation, and noncombustibility. It can suppress the transfer of heat. The heat-resistant layer 17 is made of a structural material that can withstand high temperatures, such as ceramic fiber paper, fiber board, NA mill board, hemisal, silicone rubber sheet, silicone rubber sponge, rigid laminated mica plate, fiber blanket, and the like. The heat-resistant layer 17 is preferably made of a material that can withstand high heat of about 150-180.degree.

Moreover, the heat-resistant layer 17 is preferably made of a material that can reduce the influence on the communication performance of the inlet 11 . Moreover, the heat-resistant layer 17 is preferably made of a material capable of suppressing thermal deformation of the base material 14 .

The thickness of the heat-resistant layer 17 in the stacking direction (Z direction) is preferably about 0.5 to 2.0 mm, more preferably about 0.7 to 1.3 mm.

The adhesive layer 16 is laminated on the main surface (the other surface) of the inlet 11 in the negative Z direction.
The adhesive layer 16 is formed by coating the entire lower surface of the base material 14 of the inlet 11 or at least a part of the lower surface. The adhesive layer 16 is made of, for example, an acrylic adhesive.

In order to prevent the adhesive layer 16 from adhering to anything other than the object to be attached and to maintain the adhesive strength of the adhesive layer 16, the entire lower surface of the adhesive layer 16 is attached to the RFID label 10 before use at the time of manufacture. A sheet-like release material 18 is adhered and laminated so as to cover the . The release material 18 is formed to have the same shape as the outer shape of the adhesive layer 16 or a shape larger than the outer shape in plan view in the Z direction. The release material 18 is formed of, for example, paper or synthetic resin film.

When using the RFID label 10, the peeling material 18 is peeled off from the RFID label 10, and the RFID label 10 is adhered to the object to be adhered by the adhesive layer 16 thus exposed.

Also, the release material 18 is formed larger than the one illustrated in FIG. 1. For example, a long release material 122 (see FIG. 6) extending in one direction is provided with a plurality of RFID labels. 10 may be arranged. As a result, manufacturing efficiency and transport efficiency can be improved.

In the example of FIG. 2, the outer shape of the inlet 11 (that is, the RFID label 10) in a plan view is rectangular, and the dimensions (unit: mm) of the long and short sides of the rectangular shape are shown. The RFID label 10 is not limited to the example shown in FIG. 2, and may have other arbitrary shapes and dimensions depending on the application of the RFID label 10 and the like. Similarly, FIG. 2 shows the dimensions (unit: mm) of each part of the antenna section 13 of the inlet 11, but the dimensions are not limited to those shown in FIG. 2, and other shapes and dimensions may be used.

As described above, the RFID label 10 of the present embodiment includes an inlet 11 having an IC chip 12 on which identification information is recorded, an antenna section 13 connected to the IC chip 12, and an inlet 11 on one side of the inlet 11. It has a laminated heat-resistant layer 17 and an adhesive layer 16 laminated on the other side of the inlet 11 . With this configuration, heat transfer from the outside of the inlet 11 can be suppressed by the heat-resistant layer 17, and failure of the inlet 11 due to heat can be suppressed. In addition, since the RFID label 10 is formed integrally with the inlet 11, the heat-resistant layer 17, and the adhesive layer 16 in a laminated structure, when the RFID label 10 is attached to an object to be attached, the release material 18 is peeled off and the RFID label 10 is attached to the desired position. Since it can be easily installed by simply placing it and adhering the adhesive layer 16 to the surface of the object to be attached, it can be easily installed by applying an adhesive layer, arranging an inlet (RFID tag), laminating a heat-resistant layer, etc. like a conventional RFID tag. The procedure can be omitted, and the pasting work can be facilitated.

FIG. 3 is a diagram showing an example of a state of attaching the RFID label 10 shown in FIGS. 1 and 2 to the cover material 20. As shown in FIG. FIG. 4 is an enlarged cross-sectional view of the periphery of the RFID label 10 of the RFID-labeled adhesive book 30. As shown in FIG.

As shown in FIG. 3, the cover material 20 used for the perfect bound book 30 has a spine 21 arranged in the center, and the spine 21 is sandwiched between the front and back covers (hereinafter collectively referred to as the "cover 22"). is placed. In this embodiment, the RFID label 10 is affixed to the inner side of the spine 21 of the cover material 20 at the time of bookbinding. At this time, since the adhesive layer 16 of the RFID label 10 is adhered to the back cover 21, the heat-resistant layer 17 on the opposite side is positioned on the innermost front side of the back cover 21 (the Z positive direction side in FIG. 3). will do.

As shown in FIG. 4, after the bookbinding process, a collated book 24 is adhered to the cover material 20 with a bonding agent 23, and a pair of cover sheets 22 on both sides of the spine cover 21 are folded toward the collated book 24 side and perfectly bound. Book 30 is completed. As the bonding agent 23 for bonding the collated book 24 and the back cover, hot melt, for example, is applied. In the following description, the bonding agent 23 may also be referred to as "hot melt 23". By arranging the heat-resistant layer 17 on the frontmost side of the inner surface of the back cover 21 as described above, the inlet 11 of the RFID label 10 and the hot melt 23 are separated from each other when the perfect binding book 30 shown in FIG. 4 is completed. The heat-resistant layer 17 is arranged between them.

Therefore, in the bookbinding process, when the collated book 24 is adhered to the spine 21 to which the RFID label 10 is attached by the hot melt 23, the heat of the hot melt 23 is transferred to the inlet 11 side. 17. Thus, in the RFID-labeled perfect binding book manufactured in this embodiment, the heat-resistant layer 17 provided on the surface of the RFID label 10 can suitably prevent the inlet 11 from malfunctioning due to high heat in the bookbinding process.

Further, in this embodiment, as shown in FIGS. 2 and 3, the RFID label 10 is formed in a longitudinal shape with the X direction as the longitudinal direction. When attached to the spine 21, it is preferable that the longitudinal direction of the spine and the longitudinal direction of the RFID label 10 are aligned in the same direction. As a result, it is possible to easily arrange the long RFID label 10 so as to fit within the area of the back cover 21 , thereby suppressing the protrusion of the RFID label 10 from the back cover 21 . As a result, the RFID label 10 of the same size can be attached to the back cover 21 of various sizes, so that the versatility of the RFID label 10 can be improved.

In the RFID-labeled perfect binding book 30 , the RFID label 10 may be attached to a portion of the cover material 20 other than the back cover 21 . For example, the RFID label 10 may be attached to the front or back surface of the cover 22 as indicated by the dotted line in FIG. For example, if the RFID label 10 is made of a transparent material, even if it is attached to the surface of the cover 22, the characters and pictures printed on the cover 22 will not be hidden.

[Production system for perfect binding with RFID label]
5 to 10, a manufacturing system 100 and a manufacturing method for manufacturing a perfect binding book with an RFID label according to this embodiment will be described.

FIG. 5 is a schematic configuration diagram of a manufacturing system 100 for the RFID-labeled perfect bound book 30 according to this embodiment.

As shown in FIG. 5 , the manufacturing system 100 includes an RFID label creating section 110 , a cover creating section 120 , a binding section 130 , an inspection section 140 , a sorting section 150 and a conveying section 160 .

The RFID label producing unit 110 is the RFID label 10 having the inlet 11 inside, the heat-resistant layer 17 provided on the surface, and the adhesive layer 16 on the opposite side of the heat-resistant layer 17, as described with reference to FIGS. to create

The cover creating unit 120 creates a cover by attaching the adhesive layer 16 of the RFID label 10 created by the RFID label creating unit 110 to the inside of the back cover 21 of the cover material 20 .

The binding unit 130 wraps the collated book 24 with the cover created by the cover creating unit 120, and the inner surface of the back cover 21 and the surface of the heat-resistant layer 17 of the RFID label 10 are attached to the spine of the collated book 24 using hot melt 23. to produce a perfect bound book 30 with an RFID label.

The conveying unit 160 conveys the RFID-labeled perfect binding book 30 produced by the binding unit 130 to the inspection unit 140 and the sorting unit 150 . The transport section 160 is, for example, a belt conveyor.

The inspection unit 140 inspects whether or not the RFID label 10 attached to the perfect bound book 30 conveyed on the conveying unit 160 is abnormal.

The sorting unit 150 sorts out the perfect bound books 30 to which the RFID labels 10 detected as abnormal by the inspection unit 140 are attached.

In the manufacturing system 100, the inspection unit 140, the sorting unit 150, and the transport unit 160 in the latter stage can also be collectively referred to as an "inspection system 180 for the RFID-labeled perfect binding book 30".

FIG. 6 is a diagram showing an example of the configuration of the cover creating section 120 in FIG. In the example of FIG. 6, the cover creating section 120 has a labeler 121 . The labeler 121 is a well-known device that automatically applies labels to various packages, cardboard boxes, and the like. In this embodiment, a labeler 121 is provided with a long release material 122 extending in one direction and wound into a roll. The release material 122 in FIG. 6 corresponds to the release material 18 of the RFID label 10 shown in FIG. Further, in the example of FIG. 6, the extending direction of the release material 122 and the longitudinal direction of the individual RFID labels 10 placed thereon are configured to be the same direction.

Further, in the cover creating unit 120, the cover material 20 is conveyed in a predetermined conveying direction A along the longitudinal direction of the back cover 21 by an arbitrary conveying device. The conveying direction A of the cover material 20 is the same as the X direction shown in FIG. 3 and the like. In the cover creating unit 120, a roll-shaped release material 122 is pulled out from a labeler 121, and the cover material 20 is placed at a predetermined position in the conveying direction A (in the example of FIG. 6, three sheets are illustrated along the conveying direction A). The individual RFID labels 10 arranged on the release material 122 are peeled off from the release material 122 at the timing of passing through the position of the cover material 20 in the middle of the cover material 20, and the back cover 21 portion of the cover material 20 is removed. are affixed one by one. The peeling material 122 from which the RFID label 10 has been peeled off is wound around the labeler 121 again in a roll shape and collected.

Here, as shown in FIG. 6, in the cover creating process by the cover creating unit 120, the cover material 20 is conveyed along a predetermined conveying direction A, and the RFID label 10 is moved along this conveying direction A to form a spine. It is preferably attached to the front cover 21 . That is, it is preferable that the movement direction B of the release material 122 and the RFID label 10 immediately before the RFID label 10 is peeled off from the release material 122 and attached to the back cover 21 is the same as the transport direction A of the cover material 20 . As a result, the relative speed between the back cover 21 and the RFID label 10 being transported in the transport direction A during the sticking operation can be reduced. can be easily positioned. In addition, in the lateral direction (the Y direction in FIG. 3) of the spine cover 21, the position where the RFID label 10 is peeled off from the release material 122 can be superimposed on the position directly above the spine cover 21. Positioning of the sticking position of the RFID label 10 with respect to is also facilitated. Therefore, by attaching the RFID label 10 to the back cover 21 while moving the RFID label 10 along the conveying direction A of the cover material 20, the positioning accuracy of the attaching position of the RFID label 10 to the back cover 21 can be improved.

FIG. 7 is a diagram showing an example configuration of an inspection system 180 including the inspection unit 140, the sorting unit 150, and the transport unit 160 in FIG.

The conveying unit 160 conveys the RFID-labeled perfect binding book 30 produced by the binding unit 130 to the inspection unit 140 and the sorting unit 150 . In the example of FIG. 7, a belt conveyor is illustrated as an example of the conveying unit 160, and the perfect bound book 30 placed on the endless conveyor belt is conveyed by the rotation of the pulleys. It should be noted that the conveying unit 160 may apply other types of conveyors such as a drive roller conveyor and a chain conveyor. Also, if the perfect bound book 30 can be transported to the inspection section 140 and the sorting section 150, a device other than the conveyor may be applied.

Inspection unit 140 has two gates 141 and 142 . The gates 141 and 142 are formed so as to surround the conveying portion 160 and are installed at positions through which the perfect bound book 30 conveyed on the conveying portion 160 passes. In addition, a gate 141 is installed on the upstream side in the transportation direction of the perfectly bound book 30 by the transportation section 160, and a gate 142 is installed on the downstream side.

The gate 141 on the upstream side has a detection unit 143 that detects the passage of the perfectly bound book 30 , and the detector 143 can detect the perfectly bound book 30 passing through the gate 141 . Any detection device such as an infrared sensor or a camera can be applied to the detection unit 143 .

The gate 142 on the downstream side has an RFID reader/writer 144 , and information can be written to or read from the RFID label 10 of the perfect bound book 30 passing through the gate 142 with the RFID reader/writer 144 .

The detection unit 143 and the RFID reader/writer 144 detect the position of the perfect binding passing through the gate 141, such as the position of the spine 21 of the perfect binding book 30 passing through the gates 141 and 142 (the front side of the drawing in the example of FIG. 7). It is arranged at a position where the book 30 can be reliably detected and a position where the RFID label 10 of the perfect bound book 30 passing through the gate 142 can be reliably read.

The inspection unit 140 uses the RFID reader/writer 144 to write and read information on the perfect bound book 30 whose passage has been detected by the detection unit 143, and detects an abnormality in the RFID label 10 according to the result.

The sorting unit 150 sorts out the perfect bound books 30 in which the built-in RFID label 10 is detected to be abnormal according to the inspection result of the inspection unit 140 as "NG books". In FIG. 7, as an example, a discharge conveyor 161 branching from the transport section 160 in a different direction and a perfect bound book 30 being transported on the transport section 160 are transported from the transport path of the transport section 160 to the discharge conveyor 161. It has a pusher 151 that pushes out. A belt conveyor or the like similar to the transport section 160 is applied to the discharge conveyor 161, for example.

In the example of FIG. 6 , a discharge conveyor 161 is connected to one side of the transport section 160 in the width direction so as to extend in a direction orthogonal to the transport direction of the transport section 160 . The pusher 151 is arranged on the other side of the transport section 160 in the width direction so as to face the discharge conveyor 161, and is installed movably toward the center of the transport section along the width direction of the transport section 160. there is When the perfect bound book 30 that has been determined to be abnormal by the inspection unit passes the position of the pusher 151, the pusher 151 operates to push the back cover 21 of the perfect bound book 30 toward the discharge conveyor 161. The perfect bound book 30 can be moved from the transport section 160 to the discharge conveyor 161 .

Note that the sorting unit 150 may have any configuration as long as it can sort NG products into another system, and may have a configuration other than the combination of the pusher 151 and the discharge conveyor 161 . For example, an opening and closing hole may be provided on the conveying section 160, and in the case of an NG product, the opening and closing hole may be opened to drop the corresponding perfect bound book 30 from the conveying section 160 for sorting.

The operation of each element of the conveying unit 160, the inspection unit 140, and the sorting unit 150 is controlled by the control unit 170, for example. The control unit 170 causes the conveying unit 160 to convey the perfect bound book 30 , causes the inspection unit 140 to inspect the RFID labels 10 , and causes the sorting unit 150 to perform the sorting operation based on the inspection result of the inspection unit 140 .

The control unit 170 is configured as a computer system that physically includes a CPU (Central Processing Unit), RAM (Random Access Memory) and ROM (Read Only Memory) as main storage devices, a communication module, an auxiliary storage device, and the like. can do. Each function of the control unit 170 described with reference to FIG. 7 operates various hardware under the control of the CPU by causing the CPU, RAM, or the like to read predetermined computer software, and reads data in the RAM. This is achieved by reading and writing the

By the way, in the case of a conventional general bookbinding process, perfect bound books are often manufactured at a rate of, for example, 10,000 books per hour, or about 3 books per second. For this reason, it is preferable that the conveying unit 160 of the present embodiment also conveys the perfect bound book 30 after being manufactured by the binding unit 130 at the same high speed. On the other hand, even if an operator manually inspects the RFID label 10 affixed to the perfect bound book 30 manufactured in the present embodiment, for example, using a handy RFID reader or the like, Of course, it is difficult to reliably perform the inspection while the transport unit 160 is transporting. In this case, for example, the transport speed of the transport unit 160 is slowed down, or unnecessary work such as inspection of the perfectly bound book 30 stored in a warehouse after transport occurs, resulting in an increase in man-hours, resulting in poor work efficiency. It may get worse.

On the other hand, the inspection system 180 for the RFID-labeled perfect bound book 30 according to the present embodiment includes a transport unit 160 that transports the perfect bound book 30 to which the RFID label 10 is affixed, and a wireless An inspection unit 140 that inspects the presence or absence of an abnormality in the RFID label 10 attached to the bound book 30, and a sorting unit 150 that sorts out the perfect bound book 30 to which the RFID label 10 detected as abnormal by the inspection unit 140 is attached. Prepare. The detection unit 143 of the inspection unit 140 can detect the passage of a plurality of articles in one second, and the RFID reader/writer 144 of the inspection unit 140 can similarly write and write to a plurality of RFID tags in one second. Readable. Also, the sorting unit 150 can sort OK products and NG products at the same speed.

With these configurations, in the inspection system 180 of the present embodiment, the inspection unit 140 inspects the perfect bound book 30 transported on the transport unit 160 at a high speed similar to the conventional general bookbinding process as described above. It is possible to sufficiently and reliably inspect whether the RFID label 10 of each perfect bound book 30 is abnormal. Further, the sorting unit 150 can sufficiently and reliably sort out the individual perfect bound books 30 . Therefore, the inspection system 180 of the present embodiment can inspect and sort the RFID tags (inlets 11) attached to the perfect bound book 30 after being manufactured in the binding unit 130 at high speed and with high accuracy. becomes.

In addition, since the sorting unit 150 automatically sorts out OK products and NG products of the perfect binding book 30 according to the inspection result of the inspection unit 140, it is not necessary for workers to sort manually. Work load can be reduced. Note that steps S04 to S06 in FIG. 8 and RFID label inspection processing using the inspection system 180 (an inspection method for a perfect bound book with an RFID label), which will be described later with reference to FIG. It can be effective.

Further, the RFID label 10 according to this embodiment has the inlet 11 arranged inside, the heat-resistant layer 17 provided on one side of the inlet 11, and the adhesive layer 16 on the side opposite to the heat-resistant layer 17. and is attached to the inner surface of the back cover 21 of the perfect bound book 30 by the adhesive layer 16 . With this configuration, as described above, the heat-resistant layer 17 has the effect of suppressing failure of the RFID label 10 due to heat in the bookbinding process. However, depending on how the hot melt 23 flows between the collated book 24 and the back cover 21, for example, heat may be transferred beyond the heat-resistant layer 17 to the inlet 11 side. There are situations where it is not possible. The inspection system 180 of the present embodiment can detect and sort out even when a failure that cannot be prevented only by structural measures of the RFID label 10 occurs. The reliability of the book 30 can be further improved.

In addition, in the bookbinding process, the cause of failure of the RFID label 10 is considered other than the heat of the hot melt 23 . For example, if the position where the RFID label 10 is affixed protrudes from the range of the back cover 21, the RFID label 10 is also folded when the cover 22 is folded, causing physical damage such as damage to the IC chip 12 and the antenna section 13. failure is also possible. The inspection system 180 of the present embodiment can detect and sort physical failures of the RFID label 10 that may occur in such a bookbinding process. The reliability of the bound book 30 can be further improved. Similarly, the inspection system 180 of the present embodiment can also detect manufacturing-related defects related to the IC chip 12, the antenna section 13, and their connection portions, so that the reliability of the perfect bound book 30 shipped after manufacturing can be further improved. .

FIG. 8 is a flow chart showing the manufacturing procedure (manufacturing method) of the RFID-labeled perfect bound book according to this embodiment.

In step S01, RFID label creating unit 110 creates RFID label 10 having inlet 11 inside, heat-resistant layer 17 provided on the surface, and adhesive layer 16 on the opposite side of heat-resistant layer 17 (RFID label creation process).

In step S02, the cover creating unit 120 creates a cover by attaching the adhesive layer 16 of the RFID label 10 created in step S01 to the inner side of the back cover 21 of the cover material 20 (cover creating process).

In step S03, the bookbinding unit 130 wraps the collated book 24 with the cover prepared in step S02, and the inner surface of the back cover 21 and the surface of the heat-resistant layer 17 of the RFID label 10 are attached to the spine of the collated book 24. They are adhered using the melt 23 (adhesion step), and the RFID-labeled perfect bound book 30 is produced.

FIG. 9 is a schematic diagram for explaining the work of steps S02 and S03 in FIG. As shown in FIG. 9A, the release material 18 is removed from the RFID label 10, and the adhesive layer 16 is adhered to the inner surface of the back cover 21 of the cover material 20. As shown in FIG. Next, as shown in FIG. 9B, the inner surface of the back cover 21 and the heat-resistant layer 17 of the RFID label 10 attached to the back cover 21 are arranged so as to face the spine of the collated book 24. As shown in 9(C), the spine 21 and the RFID label 10 are adhered to the collated book 24 by the hot melt 23, and the pair of covers 22 on both sides of the spine 21 of the cover material 20 are attached to the collated book. 24 side. As a result, the perfect bound book 30 with the RFID label 10 embedded inside the back cover 21 is completed.

As described above, in this embodiment, the inlet 11, the heat-resistant layer 17, and the adhesive layer 16 are laminated in step S01 to form the RFID label 10 having an integrated structure, and then the RFID label 10 is attached to the back in step S02. Affixed to cover 21 . As a result, when the RFID tag (inlet 11) is installed on the cover material 20 of the object to be affixed, the release material 18 is peeled off from the RFID label 10, placed at a desired position, and the adhesive layer 16 is attached to the surface of the back cover 21. The lamination structure of the inlet 11, the heat-resistant layer 17 and the adhesive layer 16 can be easily installed on the cover material 20 only by adhering it to the cover material 20.例文帳に追加Therefore, procedures such as application of an adhesive layer, placement of the inlet 11 (RFID tag), lamination of a heat-resistant layer, and the like, which are required for conventional RFID tags, can be omitted, and the attachment work can be facilitated.

Also, in step S03, since the adhesive layer 16 of the RFID label 10 is adhered to the back cover 21, the heat-resistant layer 17 on the opposite side is located on the innermost front side of the back cover 21 (uppermost in FIG. 9). It will be. Therefore, as shown in FIG. 9(C), when the hot melt 23 is used to bond the collated book 24 and the back cover 21, a heat-resistant layer is required between the inlet 11 of the RFID label 10 and the hot melt 23. Since the heat-resistant layer 17 is interposed, the heat-resistant layer 17 prevents the heat of the hot-melt 23 from being transferred to the inlet 11 side. As a result, failure of the inlet 11 due to high heat in the process of step S03 can be suitably prevented. As a result, in this embodiment, the heat resistance of the RFID tag (inlet 11) can be improved, and the efficiency of the bookbinding process can be maintained.

In step S02, the RFID label 10 is placed inside the back cover 21, so that the RFID label 10 is not exposed on the surface of the book in the perfect bound book 30 after being bound in step S03. be. This prevents the RFID label 10 from detaching from the perfect bound book 30 or breaking down the RFID label 10 due to the application of an external force, such as when the bound perfect bound book 30 collides with an external object, for example. can be suppressed.

Returning to FIG. 8, in step S04, the conveying unit 160 conveys the perfectly bound book 30 with the RFID label 10 attached to the inner surface of the back cover 21 in step S03 to the inspection unit 140 and the sorting unit 150 (conveying step ).

In step S05, the inspection unit 140 inspects whether or not there is an abnormality in the RFID label 10 attached to the perfect bound book 30 conveyed by the conveying unit 160 in step S04 (inspection step).

In step S06, the sorting unit 150 sorts out the perfect bound books 30 to which the RFID labels 10 detected as abnormal in step S06 are attached (sorting step).

Steps S04 to S06 can also be expressed as an RFID label inspection process (an inspection method for a perfect bound book with an RFID label) performed by the inspection system 180. FIG. The RFID label inspection process will be further described with reference to FIG. FIG. 10 is a flow chart showing an example of a specific procedure of RFID label inspection processing in steps S04 to S06 in FIG. A series of processes of the RFID label inspection process shown in FIG. 10 is performed by the control unit 170 shown in FIG. 7, for example.

In step S<b>11 , the transport unit 160 transports the RFID-labeled perfect bound book 30 (bookbinding) to the inspection unit 140 .

In step S<b>12 , the detection unit 143 of the inspection unit 140 detects passage of the bookbinding.

In step S13, the RFID reader/writer 144 of the inspection unit 140 writes inspection information to the RFID label 10 attached to the bound book (perfectly bound book 30) whose passing is detected.

In step S14, the inspection information is read from the RFID label 10 written in step S13 by the RFID reader/writer 144 as well.

In step S<b>15 , the inspection unit 140 transmits the determination result of whether or not the RFID label 10 is abnormal to the selection unit 150 . For example, the RFID reader/writer 144 transmits the result of reading the inspection information to the control unit 170 . If the inspection information is read from the RFID label 10, the control unit 170 determines that the RFID label 10 functions normally and is an OK product. On the other hand, if the inspection information has not been read from the RFID label 10, the RFID label 10 is not functioning normally and some kind of abnormality has occurred, and it is determined that the product is NG.

If the determination result is an NG product (Yes in step S16), the perfect bound book 30 determined as an NG product by the sorting unit 150 in step S17 is discharged. In this case, the pusher 151 of the sorting section 150 pushes out the corresponding perfect bound book 30 from the conveying section 160 and moves it to the discharge conveyor 161 .

On the other hand, if the determination result is an OK product (No in step S16), the pertinent perfect bound book 30 is conveyed through the conveying section 160 as an OK product without performing the discharge process in step S17.

As described above, in the present embodiment, in the inspection process of the RFID label 10, the inspection unit 140 has the RFID reader/writer 144, writes inspection information to the RFID label 10, and if the written inspection information cannot be read, the RFID Abnormality of the label 10 is detected. With this configuration, it is possible to inspect the writing and reading of the RFID label 10 at the same time, so that the abnormality detection of the RFID label 10 can be performed with higher accuracy.

In the RFID label inspection process (method for inspecting a perfect bound book with an RFID label) using the inspection system 180 described with reference to steps S04 to S06 in FIG. 8 and FIG. Although the configuration using the label 10 having the adhesive layer 16 is exemplified, the configuration using the RFID label without the adhesive layer 16 may be used. In the above example, the inspection process of the perfect binding book 30 with the RFID label 10 attached to the inner side of the back cover 21 was illustrated. A configuration may be adopted in which the perfect bound book 30 attached to a portion other than the back cover 21 is inspected.

8, the inlet 11 is placed inside step S01, the heat-resistant layer 17 is provided on the surface, and the adhesive layer 16 is provided on the side opposite to the heat-resistant layer 17. A configuration that does not include the RFID label creation process for creating the label 10 may be employed. In this case, the manufacturing system 100 of this embodiment shown in FIG. In these configurations, the RFID label 10 can apply to products manufactured at a location other than the manufacturing system 100 or the inspection system 180, for example.

[Modification]
A modification of the above embodiment will be described with reference to FIGS. 11 to 13. FIG.

FIG. 11 is a cross-sectional view showing a schematic configuration of an RFID label 10A according to a modification. Like the RFID label 10A shown in FIG. 110, in addition to the heat-resistant layer 17 on the surface side of the RFID label 10A, a heat-resistant layer 17A (second heat-resistant layer) is provided between the inlet 11 and the adhesive layer 16. That is, the RFID label 10A may also have a heat-resistant layer 17A on the back side thereof.

In this case, a step of providing a heat-resistant layer 17A between the inlet 11 and the adhesive layer 16 is added to the RFID label production step of step S01 in FIG.

Like the heat-resistant layer 17, the heat-resistant layer 17A is made of a structural material that can withstand high temperatures of about 150 to 180.degree. C., such as ceramic fiber paper. The heat-resistant layer 17A is adhered to the lower surface of the base material 14 of the inlet 11 with the adhesive layer 15A. Like the adhesive layer 15, the adhesive layer 15A is also preferably formed of a material having higher heat resistance than hot-melt, such as an acrylic adhesive.

By covering both the front side and the back side of the inlet 11 with the heat-resistant layers 17 and 17A in this way, it is possible to further prevent the inlet 11 of the RFID label 10 from coming into direct contact with the hot melt during the bookbinding process. 10 can be further suppressed.

FIG. 12 is a plan view showing a schematic configuration of an inspection unit 140 according to a modification. As indicated by dotted arrows in FIG. 12, the detection ranges of the detection unit 143 of the first gate 141 and the detection range of the RFID reader/writer 144 of the second gate 142 may be shifted away from each other. As a result, interference between the detection unit 143 and the RFID reader/writer 144 can be reduced, and erroneous detection by the detection unit 143 and failures in writing and reading by the RFID reader/writer 144 can be suppressed.

Alternatively, as shown in FIG. 12, a shield plate 145 may be provided between the first gate 141 and the second gate 142 to separate the detection ranges of the detection section 143 and the RFID reader/writer 144 .

Further, the inspection unit 140 may be configured without the detection unit 143 . In this case, the timing at which the perfect bound book 30 passes through the detection range of the RFID reader/writer 144 may be managed by the control unit 170 based on, for example, the time required from the time it enters the conveying unit 160 .

Also, instead of the RFID reader/writer 144 capable of both writing information to and reading information from the RFID label 10, the inspection unit 140 may have an RFID reader that only reads information. In this case, instead of the above inspection information, the RFID reader reads some information recorded in the IC chip 12 from the beginning when the RFID label 10 was manufactured. Presence or absence can be determined. In this configuration, the inspection unit 140 uses an RFID reader to inspect only the reading of information from the RFID label 10 without writing information to the RFID label 10, so the inspection speed can be improved.

Also, the inspection unit 140 may be provided with two or more RFID reader/writers 144 or RFID readers. As a result, it is possible to increase the number of inspections for writing or reading information to the same RFID label 10, so that the reliability of the inspection results can be increased and the inspection accuracy can be improved.

FIG. 13 is a plan view showing a modification of the RFID label attaching method. In the above embodiment, as illustrated in FIG. 6 and the like, when attaching the RFID label 10 to the cover material 20, the transport direction A of the cover material 20 and the moving direction B of the RFID label 10 are the same. Although exemplified, it is not limited to this. For example, as shown in FIG. 13, the moving direction B of the release material 122 and the RFID label 10 immediately before the RFID label 10 is peeled off from the release material 122 and attached to the back cover 21 is a direction perpendicular to the conveying direction A of the cover material 20. may be configured as follows. In this configuration, the longitudinal direction of each RFID label 10 placed thereon is perpendicular to the extending direction (moving direction B) of the release material 122 . 6, the RFID label 10 can be affixed so that the longitudinal direction of the RFID label 10 and the back cover 21 are the same.

Next, examples of the present invention will be specifically described.

[Example]
For the same inlet 11 as shown in FIGS. 1 and 2, an RFID label 10 having a laminate structure was produced by sandwiching both the front and back surfaces of the inlet 11 with heat-resistant layers 17 . Ceramic fiber paper (thickness 1 mm) manufactured by Sakaguchi Electric Heating Co., Ltd. was used for the heat-resistant layer 17 . For the inlet 11, an antenna portion 13 was formed by dry laminating a 10 μm aluminum sheet on a 38 μm thick PET film substrate 14, and an IC chip 12 was mounted at a prescribed position. The antenna pattern of the inlet 11 has the same shape, arrangement and dimensions as shown in FIG.

The communication performance (frequency characteristics) of the RFID label 10 was measured using an RFID tag performance inspection device (Tagformance Pro, manufactured by Voyantic) while the RFID label 10 thus produced was attached to an object to be attached. The measurement frequency band of radio waves for wireless communication during measurement was set to 700 to 1200 MHz, and EIRP (Equivalent Isotropically Radiated Power) was set to 3.28W.

Furthermore, the produced RFID label 10 was left in a drier at 180 degrees for a predetermined time (1 minute), and the communication performance of the RFID label 10 after that was measured. As the dryer, model number WFO-520 manufactured by EYELA was used.

[Comparative example]
An RFID label was produced in the same manner as in the example except that the heat-resistant layer 17 was omitted, and the frequency characteristics of the produced RFID label were measured in the same manner as in the example.

FIG. 14 is a diagram showing frequency characteristics of RFID labels of Examples and Comparative Examples. In FIG. 14, (A) is the frequency characteristic before heating of the comparative example, (B) is the frequency characteristic after heating by the dryer of the comparative example, (C) is the frequency characteristic before heating of the example, and (D) is The frequency characteristics after heating by the dryer of the example are shown. In each figure, the horizontal axis represents the frequency of the radio wave for wireless communication, and the vertical axis represents the communicable distance from the RFID label 10 to the reader (Tagformance Pro).

In the comparative example, as shown in FIGS. 14A and 14B, the peak value of the communication distance, which occurred around a frequency of 950 MHz before heating, was reduced to less than half after heating. A deterioration in performance was confirmed. On the other hand, in the example, as shown in FIGS. 14C and 14D, there was no significant change in the frequency characteristics before and after heating, confirming that the communication performance was maintained.

Moreover, in the comparative example, it was confirmed that the base material 14 was deformed into a wavy shape due to the influence of the heating in the sample after heating. On the other hand, in the example, no deformation of the substrate 14 due to similar heating was confirmed. In the example, it is considered that the heat-resistant layer 17 acts as a support to suppress the elongation of the base material 14 made of PET due to heat. Since the waviness of the base material 14 causes variations in the frequency characteristics of the RFID label 10, the use of the heat-resistant layer 17, which is less stretched by heat, as the support for the inlet 11 is effective in maintaining communication performance and preventing failures. Conceivable.

In the comparative example, it was confirmed that the ACP (anisotropic conductive adhesive) layer that bonds the IC chip 12 and the antenna section 13 of the inlet 11 was cracked in the heated sample. It is conceivable that the adhesion of the ACP to the antenna section 13 is weakened due to the extension of the PET base material 14 due to the influence of high heat, and the resistance is increased, resulting in deterioration of the communication performance. On the other hand, no damage such as cracks occurred in the IC chip 12 in the example. It can be seen that the provision of the heat-resistant layer 17 can suppress the influence of high heat.

From the experimental results shown in FIG. 14, covering the surface of the inlet 11 with the heat-resistant layer 17 according to the embodiment can reduce the influence of high heat on the inlet 11, and suppress deterioration of the communication performance of the RFID label 10 and the occurrence of failures. It was shown to be effective in that it can be done.

The present embodiment has been described above with reference to specific examples. However, the present disclosure is not limited to these specific examples. Design modifications to these specific examples by those skilled in the art are also included in the scope of the present disclosure as long as they have the features of the present disclosure. Each element included in each specific example described above and its arrangement, conditions, shape, etc. are not limited to those illustrated and can be changed as appropriate. As long as there is no technical contradiction, the combination of the elements included in the specific examples described above can be changed as appropriate.

REFERENCE SIGNS LIST 10 RFID label 11 inlet 12 IC chip 13 antenna part 16 adhesive layer 17 heat-resistant layer 17A heat-resistant layer (second heat-resistant layer)
20 cover material 21 back cover 23 hot melt (bonding agent)
24 Collated Book 30 RFID Labeled Perfectly Bound Book 100 Manufacturing System 140 Inspection Department 144 RFID Reader/Writer 150 Sorting Department 160 Conveying Department 180 Inspection System

Claims (7)

An inlet is arranged inside, a heat-resistant layer is provided on one side of the inlet, and an adhesive layer is attached to the inside of the back cover of the RFID label having an adhesive layer on the side opposite to the heat-resistant layer. a cover creation process for creating a cover by
a bonding step of wrapping a collated book with the cover created in the cover creating step, and adhering the inner surface of the back cover and the surface of the heat-resistant layer to the spine of the collated book using a bonding agent;
including,
A manufacturing method for a perfect bound book with an RFID label. An RFID label making step of placing the inlet inside, providing the heat resistant layer on one side of the inlet, and creating an RFID label having the adhesive layer on the side opposite to the heat resistant layer. ,
The cover creating step affixes the RFID label created in the RFID label creating step.
The manufacturing method of the RFID-labeled perfect binding book according to claim 1 . In the cover creating step, the cover material is conveyed along a predetermined conveying direction, and the RFID label is attached to the back cover while moving along the conveying direction.
3. The method for manufacturing the RFID-labeled perfect bound book according to claim 1 or 2. The RFID label is further provided with a second heat-resistant layer between the inlet and the adhesive layer.
The method for manufacturing the RFID labeled perfect binding book according to any one of claims 1 to 3. an inlet having an IC chip on which identification information is recorded and an antenna unit connected to the IC chip;
a heat-resistant layer laminated on one side of the inlet;
an adhesive layer laminated on the other side of the inlet;
having
RFID label. Having a second heat-resistant layer provided between the inlet and the adhesive layer,
The RFID label according to claim 5. A perfectly bound book, wherein the RFID label according to claim 5 or 6 is attached to the inner side of the spine.

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