JP2023064098A - 半導体試料製造のためのマスク検査 - Google Patents

半導体試料製造のためのマスク検査 Download PDF

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JP2023064098A
JP2023064098A JP2022170504A JP2022170504A JP2023064098A JP 2023064098 A JP2023064098 A JP 2023064098A JP 2022170504 A JP2022170504 A JP 2022170504A JP 2022170504 A JP2022170504 A JP 2022170504A JP 2023064098 A JP2023064098 A JP 2023064098A
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mask
images
poi
sections
values
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JP2023064098A5 (enExample
Inventor
マドモン ロナン
Madmon Ronen
シュカリム アリエル
Shkalim Ariel
ベン ヤコブ シャニ
Ben Yacov Shani
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Applied Materials Israel Ltd
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Applied Materials Israel Ltd
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    • G06V10/25—Determination of region of interest [ROI] or a volume of interest [VOI]
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    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
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    • G06T7/0006—Industrial image inspection using a design-rule based approach
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    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
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    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
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    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
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    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
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    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/60—Analysis of geometric attributes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/20—Image preprocessing
    • G06V10/24—Aligning, centring, orientation detection or correction of the image
    • G06V10/245—Aligning, centring, orientation detection or correction of the image by locating a pattern; Special marks for positioning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/74—Image or video pattern matching; Proximity measures in feature spaces
    • G06V10/75—Organisation of the matching processes, e.g. simultaneous or sequential comparisons of image or video features; Coarse-fine approaches, e.g. multi-scale approaches; using context analysis; Selection of dictionaries
    • G06V10/751—Comparing pixel values or logical combinations thereof, or feature values having positional relevance, e.g. template matching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95676—Masks, reticles, shadow masks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20021—Dividing image into blocks, subimages or windows
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/74—Image or video pattern matching; Proximity measures in feature spaces
    • G06V10/75—Organisation of the matching processes, e.g. simultaneous or sequential comparisons of image or video features; Coarse-fine approaches, e.g. multi-scale approaches; using context analysis; Selection of dictionaries
    • G06V10/759—Region-based matching
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V2201/00—Indexing scheme relating to image or video recognition or understanding
    • G06V2201/06—Recognition of objects for industrial automation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Multimedia (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Geometry (AREA)
  • Computing Systems (AREA)
  • Databases & Information Systems (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Software Systems (AREA)
  • Artificial Intelligence (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2022170504A 2021-10-25 2022-10-25 半導体試料製造のためのマスク検査 Pending JP2023064098A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/510,227 US12361535B2 (en) 2021-10-25 2021-10-25 Mask inspection for semiconductor specimen fabrication
US17/510,227 2021-10-25

Publications (2)

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JP2023064098A true JP2023064098A (ja) 2023-05-10
JP2023064098A5 JP2023064098A5 (enExample) 2025-11-05

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US (1) US12361535B2 (enExample)
JP (1) JP2023064098A (enExample)
KR (1) KR20230059132A (enExample)
CN (1) CN116029966A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3907725A1 (en) * 2020-05-06 2021-11-10 Admesy B.V. Method and setup for performing a series of optical measurements with a 2d imaging system
CN118778352B (zh) * 2024-06-24 2024-12-20 珠海市龙图光罩科技有限公司 掩膜版的参数测量方法、装置、设备、系统以及程序产品

Citations (5)

* Cited by examiner, † Cited by third party
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JP2005500671A (ja) * 2001-03-20 2005-01-06 ニューメリカル テクノロジーズ インコーポレイテッド マスク欠陥のプリンタビリティ解析を提供するシステム及び方法
JP2018120208A (ja) * 2016-12-12 2018-08-02 カール・ツァイス・エスエムティー・ゲーエムベーハー Ｅｕｖ範囲のためのフォトリソグラフィマスクの要素を検査する方法及び装置
JP2018527619A (ja) * 2015-09-04 2018-09-20 ケーエルエー−テンカー コーポレイション モデルベースの限界寸法測定の技術およびシステム
JP2020520481A (ja) * 2017-05-18 2020-07-09 ケーエルエー コーポレイション レチクルを検査する装置および方法
JP2020166282A (ja) * 2015-08-10 2020-10-08 ケーエルエー コーポレイション ウエハレベル欠陥の転写性を予測する装置および方法

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US7729529B2 (en) * 2004-12-07 2010-06-01 Kla-Tencor Technologies Corp. Computer-implemented methods for detecting and/or sorting defects in a design pattern of a reticle
US7953582B2 (en) * 2006-11-21 2011-05-31 Cadence Design Systems, Inc. Method and system for lithography simulation and measurement of critical dimensions
US9863761B2 (en) * 2012-04-18 2018-01-09 Kla-Tencor Corporation Critical dimension uniformity monitoring for extreme ultraviolet reticles
US10074036B2 (en) * 2014-10-21 2018-09-11 Kla-Tencor Corporation Critical dimension uniformity enhancement techniques and apparatus
KR20170042432A (ko) * 2015-10-08 2017-04-19 삼성전자주식회사 포토레지스트 패턴의 검사 방법
US20190164852A1 (en) * 2017-11-28 2019-05-30 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for in-line processing control
TWI716684B (zh) * 2018-05-09 2021-01-21 華邦電子股份有限公司 臨界尺寸量測方法及用於量測臨界尺寸的影像處理裝置
KR102848204B1 (ko) * 2020-05-14 2025-08-21 에이에스엠엘 네델란즈 비.브이. 확률적 기여자를 예측하는 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005500671A (ja) * 2001-03-20 2005-01-06 ニューメリカル テクノロジーズ インコーポレイテッド マスク欠陥のプリンタビリティ解析を提供するシステム及び方法
JP2020166282A (ja) * 2015-08-10 2020-10-08 ケーエルエー コーポレイション ウエハレベル欠陥の転写性を予測する装置および方法
JP2018527619A (ja) * 2015-09-04 2018-09-20 ケーエルエー−テンカー コーポレイション モデルベースの限界寸法測定の技術およびシステム
JP2018120208A (ja) * 2016-12-12 2018-08-02 カール・ツァイス・エスエムティー・ゲーエムベーハー Ｅｕｖ範囲のためのフォトリソグラフィマスクの要素を検査する方法及び装置
JP2020520481A (ja) * 2017-05-18 2020-07-09 ケーエルエー コーポレイション レチクルを検査する装置および方法

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CN116029966A (zh) 2023-04-28
US12361535B2 (en) 2025-07-15
US20230131950A1 (en) 2023-04-27
KR20230059132A (ko) 2023-05-03

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