JP2023048697A5 - - Google Patents
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- Publication number
- JP2023048697A5 JP2023048697A5 JP2021158152A JP2021158152A JP2023048697A5 JP 2023048697 A5 JP2023048697 A5 JP 2023048697A5 JP 2021158152 A JP2021158152 A JP 2021158152A JP 2021158152 A JP2021158152 A JP 2021158152A JP 2023048697 A5 JP2023048697 A5 JP 2023048697A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- volatile solvent
- liquid film
- liquid
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000002904 solvent Substances 0.000 claims description 72
- 239000000758 substrate Substances 0.000 claims description 68
- 239000007788 liquid Substances 0.000 claims description 50
- 239000005871 repellent Substances 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 20
- 238000001035 drying Methods 0.000 claims description 19
- 230000007246 mechanism Effects 0.000 claims description 17
- 238000012545 processing Methods 0.000 claims description 17
- 238000004140 cleaning Methods 0.000 claims description 11
- 230000002940 repellent Effects 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- 239000012528 membrane Substances 0.000 claims 1
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 6
- 230000032258 transport Effects 0.000 description 5
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- JOOMLFKONHCLCJ-UHFFFAOYSA-N N-(trimethylsilyl)diethylamine Chemical compound CCN(CC)[Si](C)(C)C JOOMLFKONHCLCJ-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- 101100441413 Caenorhabditis elegans cup-15 gene Proteins 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021158152A JP7504850B2 (ja) | 2021-09-28 | 2021-09-28 | 基板乾燥装置、基板処理装置及び基板乾燥方法 |
| KR1020220108178A KR102740095B1 (ko) | 2021-09-28 | 2022-08-29 | 기판 건조 장치, 기판 처리 장치 및 기판 건조 방법 |
| CN202211158535.2A CN115881587B (zh) | 2021-09-28 | 2022-09-22 | 基板干燥装置、基板处理装置及基板干燥方法 |
| TW111136084A TWI808006B (zh) | 2021-09-28 | 2022-09-23 | 基板乾燥裝置、基板處理裝置及基板乾燥方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021158152A JP7504850B2 (ja) | 2021-09-28 | 2021-09-28 | 基板乾燥装置、基板処理装置及び基板乾燥方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023048697A JP2023048697A (ja) | 2023-04-07 |
| JP2023048697A5 true JP2023048697A5 (https=) | 2023-07-10 |
| JP7504850B2 JP7504850B2 (ja) | 2024-06-24 |
Family
ID=85769969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021158152A Active JP7504850B2 (ja) | 2021-09-28 | 2021-09-28 | 基板乾燥装置、基板処理装置及び基板乾燥方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7504850B2 (https=) |
| KR (1) | KR102740095B1 (https=) |
| CN (1) | CN115881587B (https=) |
| TW (1) | TWI808006B (https=) |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100524639C (zh) * | 2005-02-07 | 2009-08-05 | 株式会社荏原制作所 | 基板处理方法、基板处理装置及控制程序 |
| JP2008034779A (ja) | 2006-06-27 | 2008-02-14 | Dainippon Screen Mfg Co Ltd | 基板処理方法および基板処理装置 |
| JP2008091751A (ja) * | 2006-10-04 | 2008-04-17 | Sokudo:Kk | 基板の現像処理方法および基板の現像処理装置 |
| CN101165854A (zh) * | 2006-10-19 | 2008-04-23 | 大日本网目版制造株式会社 | 基板处理装置和基板处理方法 |
| JP5662081B2 (ja) | 2010-08-20 | 2015-01-28 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
| JP2013118347A (ja) | 2010-12-28 | 2013-06-13 | Central Glass Co Ltd | ウェハの洗浄方法 |
| JP6172306B2 (ja) * | 2011-01-12 | 2017-08-02 | セントラル硝子株式会社 | 保護膜形成用薬液 |
| JP5586734B2 (ja) * | 2012-08-07 | 2014-09-10 | 東京エレクトロン株式会社 | 基板洗浄装置、基板洗浄システム、基板洗浄方法および記憶媒体 |
| JP2015092539A (ja) * | 2013-09-30 | 2015-05-14 | 芝浦メカトロニクス株式会社 | 基板処理装置及び基板処理方法 |
| JP6524573B2 (ja) | 2014-09-30 | 2019-06-05 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
| JP6444698B2 (ja) * | 2014-11-17 | 2018-12-26 | 東芝メモリ株式会社 | 基板処理装置および基板処理方法 |
| JP6687436B2 (ja) | 2015-04-30 | 2020-04-22 | 芝浦メカトロニクス株式会社 | 基板処理装置及び基板処理方法 |
| JP6563762B2 (ja) | 2015-09-29 | 2019-08-21 | 芝浦メカトロニクス株式会社 | 基板処理装置及び基板処理方法 |
| JP6728009B2 (ja) | 2016-09-26 | 2020-07-22 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
| JP6814653B2 (ja) * | 2017-02-09 | 2021-01-20 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
-
2021
- 2021-09-28 JP JP2021158152A patent/JP7504850B2/ja active Active
-
2022
- 2022-08-29 KR KR1020220108178A patent/KR102740095B1/ko active Active
- 2022-09-22 CN CN202211158535.2A patent/CN115881587B/zh active Active
- 2022-09-23 TW TW111136084A patent/TWI808006B/zh active
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