KR102740095B1 - 기판 건조 장치, 기판 처리 장치 및 기판 건조 방법 - Google Patents

기판 건조 장치, 기판 처리 장치 및 기판 건조 방법 Download PDF

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Publication number
KR102740095B1
KR102740095B1 KR1020220108178A KR20220108178A KR102740095B1 KR 102740095 B1 KR102740095 B1 KR 102740095B1 KR 1020220108178 A KR1020220108178 A KR 1020220108178A KR 20220108178 A KR20220108178 A KR 20220108178A KR 102740095 B1 KR102740095 B1 KR 102740095B1
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South Korea
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substrate
volatile solvent
film
liquid
water
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KR1020220108178A
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Korean (ko)
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KR20230045537A (ko
Inventor
준 마츠시타
요코 다루노
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시바우라 메카트로닉스 가부시끼가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H01L21/67034—
    • H01L21/02057—
    • H01L21/67023—
    • H01L21/67051—
    • H01L21/6708—
    • H01L21/67115—
    • H01L21/67253—
    • H01L21/67742—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices

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  • Cleaning Or Drying Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Drying Of Solid Materials (AREA)
KR1020220108178A 2021-09-28 2022-08-29 기판 건조 장치, 기판 처리 장치 및 기판 건조 방법 Active KR102740095B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021158152A JP7504850B2 (ja) 2021-09-28 2021-09-28 基板乾燥装置、基板処理装置及び基板乾燥方法
JPJP-P-2021-158152 2021-09-28

Publications (2)

Publication Number Publication Date
KR20230045537A KR20230045537A (ko) 2023-04-04
KR102740095B1 true KR102740095B1 (ko) 2024-12-06

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KR1020220108178A Active KR102740095B1 (ko) 2021-09-28 2022-08-29 기판 건조 장치, 기판 처리 장치 및 기판 건조 방법

Country Status (4)

Country Link
JP (1) JP7504850B2 (https=)
KR (1) KR102740095B1 (https=)
CN (1) CN115881587B (https=)
TW (1) TWI808006B (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017098576A (ja) * 2011-01-12 2017-06-01 セントラル硝子株式会社 保護膜形成用薬液

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100524639C (zh) * 2005-02-07 2009-08-05 株式会社荏原制作所 基板处理方法、基板处理装置及控制程序
JP2008034779A (ja) 2006-06-27 2008-02-14 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2008091751A (ja) * 2006-10-04 2008-04-17 Sokudo:Kk 基板の現像処理方法および基板の現像処理装置
CN101165854A (zh) * 2006-10-19 2008-04-23 大日本网目版制造株式会社 基板处理装置和基板处理方法
JP5662081B2 (ja) 2010-08-20 2015-01-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2013118347A (ja) 2010-12-28 2013-06-13 Central Glass Co Ltd ウェハの洗浄方法
JP5586734B2 (ja) * 2012-08-07 2014-09-10 東京エレクトロン株式会社 基板洗浄装置、基板洗浄システム、基板洗浄方法および記憶媒体
JP2015092539A (ja) * 2013-09-30 2015-05-14 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6524573B2 (ja) 2014-09-30 2019-06-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6444698B2 (ja) * 2014-11-17 2018-12-26 東芝メモリ株式会社 基板処理装置および基板処理方法
JP6687436B2 (ja) 2015-04-30 2020-04-22 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6563762B2 (ja) 2015-09-29 2019-08-21 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6728009B2 (ja) 2016-09-26 2020-07-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6814653B2 (ja) * 2017-02-09 2021-01-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017098576A (ja) * 2011-01-12 2017-06-01 セントラル硝子株式会社 保護膜形成用薬液

Also Published As

Publication number Publication date
TWI808006B (zh) 2023-07-01
JP7504850B2 (ja) 2024-06-24
TW202314921A (zh) 2023-04-01
CN115881587B (zh) 2025-07-18
KR20230045537A (ko) 2023-04-04
JP2023048697A (ja) 2023-04-07
CN115881587A (zh) 2023-03-31

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