JP2023046873A

JP2023046873A - 保護膜の形成方法、半導体チップの製造方法及び塗布液の調製方法

保護膜の形成方法、半導体チップの製造方法及び塗布液の調製方法 Download PDF

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Publication number: JP2023046873A
Authority: JP; Japan
Prior art keywords: protective film; forming; semiconductor wafer; forming agent; coating liquid
Prior art date: 2021-09-24
Legal status : Pending

Application number

JP2021155706A

Other languages

English (en)

Japanese (ja)

Inventor

明日香大久保

Asuka Okubo

Current Assignee

Tokyo Ohka Kogyo Co Ltd

Original Assignee

Tokyo Ohka Kogyo Co Ltd

Priority date

2021-09-24

Filing date

2021-09-24

Publication date

2023-04-05

2021-09-24 Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd

2021-09-24 Priority to JP2021155706A priority Critical patent/JP2023046873A/ja

2022-07-22 Priority to TW111127523A priority patent/TW202313872A/zh

2022-07-25 Priority to CN202210884323.6A priority patent/CN115850744A/zh

2023-04-05 Publication of JP2023046873A publication Critical patent/JP2023046873A/ja

Status Pending legal-status Critical Current

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230000001681 protective effect Effects 0.000 title claims abstract description 289
239000004065 semiconductor Substances 0.000 title claims abstract description 173
238000000034 method Methods 0.000 title claims abstract description 86
239000011248 coating agent Substances 0.000 title claims abstract description 65
238000000576 coating method Methods 0.000 title claims abstract description 65
239000007788 liquid Substances 0.000 title claims abstract description 57
238000004519 manufacturing process Methods 0.000 title claims abstract description 45
238000002360 preparation method Methods 0.000 title claims abstract description 18
230000015572 biosynthetic process Effects 0.000 title abstract description 9
239000003795 chemical substances by application Substances 0.000 claims abstract description 124
239000011347 resin Substances 0.000 claims abstract description 45
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239000007787 solid Substances 0.000 claims abstract description 27
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238000012545 processing Methods 0.000 claims description 27
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239000000243 solution Substances 0.000 claims description 12
238000003860 storage Methods 0.000 claims description 10
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