JP2023041623A5 - - Google Patents
Info
- Publication number
- JP2023041623A5 JP2023041623A5 JP2022129475A JP2022129475A JP2023041623A5 JP 2023041623 A5 JP2023041623 A5 JP 2023041623A5 JP 2022129475 A JP2022129475 A JP 2022129475A JP 2022129475 A JP2022129475 A JP 2022129475A JP 2023041623 A5 JP2023041623 A5 JP 2023041623A5
- Authority
- JP
- Japan
- Prior art keywords
- mask
- contour
- contours
- images
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/473,342 US12400314B2 (en) | 2021-09-13 | 2021-09-13 | Mask inspection for semiconductor specimen fabrication |
| US17/473,342 | 2021-09-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023041623A JP2023041623A (ja) | 2023-03-24 |
| JP2023041623A5 true JP2023041623A5 (enExample) | 2025-08-22 |
Family
ID=85431320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022129475A Pending JP2023041623A (ja) | 2021-09-13 | 2022-08-16 | 半導体試料製造のためのマスク検査 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12400314B2 (enExample) |
| JP (1) | JP2023041623A (enExample) |
| KR (1) | KR20230039557A (enExample) |
| CN (1) | CN115797249A (enExample) |
| TW (1) | TW202312099A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230028830A (ko) * | 2021-08-23 | 2023-03-03 | 삼성전자주식회사 | 웨이퍼 불량 검사 장치, 웨이퍼 불량 검사 시스템, 웨이퍼 검사 방법 및 웨이퍼 제조 방법 |
| CN119797274B (zh) * | 2025-03-13 | 2025-07-15 | 中北大学 | 一种n型SiC耐高温欧姆接触电极结构的制备方法 |
| CN120599588B (zh) * | 2025-08-06 | 2025-09-30 | 昆山大洋电路板有限公司 | 一种基于机器视觉的装配式印刷电路板检测系统 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5795688A (en) * | 1996-08-14 | 1998-08-18 | Micron Technology, Inc. | Process for detecting defects in photomasks through aerial image comparisons |
| US7155052B2 (en) * | 2002-06-10 | 2006-12-26 | Tokyo Seimitsu (Israel) Ltd | Method for pattern inspection |
| KR100474571B1 (ko) * | 2002-09-23 | 2005-03-10 | 삼성전자주식회사 | 웨이퍼의 패턴 검사용 기준 이미지 설정 방법과 이 설정방법을 이용한 패턴 검사 방법 및 장치 |
| JP4862031B2 (ja) * | 2008-10-20 | 2012-01-25 | 株式会社ニューフレアテクノロジー | マスク欠陥レビュー方法及びマスク欠陥レビュー装置 |
| JP5498189B2 (ja) * | 2010-02-08 | 2014-05-21 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法及びその装置 |
| KR20120068128A (ko) * | 2010-12-17 | 2012-06-27 | 삼성전자주식회사 | 패턴의 결함 검출 방법 및 이를 수행하기 위한 결함 검출 장치 |
| US9367911B2 (en) * | 2012-06-13 | 2016-06-14 | Applied Materials Israel, Ltd. | Apparatus and method for defect detection including patch-to-patch comparisons |
| JP5478681B2 (ja) * | 2012-08-24 | 2014-04-23 | 株式会社日立ハイテクノロジーズ | 半導体欠陥検査装置ならびにその方法 |
| JP6480449B2 (ja) * | 2013-08-23 | 2019-03-13 | ケーエルエー−テンカー コーポレイション | ブロック間レチクル検査 |
| US9747518B2 (en) * | 2014-05-06 | 2017-08-29 | Kla-Tencor Corporation | Automatic calibration sample selection for die-to-database photomask inspection |
| JP2017009379A (ja) * | 2015-06-19 | 2017-01-12 | 株式会社ニューフレアテクノロジー | 検査装置および検査方法 |
| WO2017203554A1 (ja) * | 2016-05-23 | 2017-11-30 | 株式会社日立ハイテクノロジーズ | 検査用情報生成装置、検査用情報生成方法、及び欠陥検査装置 |
| WO2020173654A1 (en) * | 2019-02-25 | 2020-09-03 | Asml Netherlands B.V. | Method for determining stochastic variation of printed patterns |
| US11263496B2 (en) * | 2019-02-25 | 2022-03-01 | D2S, Inc. | Methods and systems to classify features in electronic designs |
| KR20220125291A (ko) * | 2020-01-10 | 2022-09-14 | 타스밋 가부시키가이샤 | 패턴 에지 검출 방법, 패턴 에지 검출 장치, 패턴 에지 검출을 컴퓨터에 실행시키기 위한 프로그램이 기록된 기록 매체 |
-
2021
- 2021-09-13 US US17/473,342 patent/US12400314B2/en active Active
-
2022
- 2022-06-22 TW TW111123186A patent/TW202312099A/zh unknown
- 2022-07-08 CN CN202210805808.1A patent/CN115797249A/zh active Pending
- 2022-08-16 JP JP2022129475A patent/JP2023041623A/ja active Pending
- 2022-09-07 KR KR1020220113367A patent/KR20230039557A/ko active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2023041623A5 (enExample) | ||
| JP7633094B2 (ja) | 弱いラベル付けを使用した半導体試料内の欠陥の検出 | |
| US11551341B2 (en) | Method and device for automatically drawing structural cracks and precisely measuring widths thereof | |
| CA2843892C (en) | System and method for remote full field three-dimensional displacement and strain measurements | |
| Akagic et al. | Pothole detection: An efficient vision based method using RGB color space image segmentation | |
| CN114764770B (zh) | 晶圆检测方法、装置、设备及存储介质 | |
| CN108257114A (zh) | 一种基于深度学习的输电设备缺陷自动识别方法 | |
| CN107123111B (zh) | 一种用于手机屏幕缺陷检测的深度残差网络构造方法 | |
| JP2021190716A5 (enExample) | ||
| CN113850749B (zh) | 训练缺陷侦测器的方法 | |
| TW201517192A (zh) | 晶片對資料庫的影像檢測方法 | |
| JP2015527740A5 (enExample) | ||
| CN116152697B (zh) | 一种混凝土结构裂缝的三维模型测量方法及相关装置 | |
| CN114037679B (zh) | 一种基于无监督特征组合的产品图像缺陷检测方法及装置 | |
| TWI648766B (zh) | 用於晶粒對資料庫光罩檢查之自動校準樣本選擇 | |
| CN117197084A (zh) | 基于深度融合卷积神经网络的公路快检图像路面病害检测方法 | |
| CN114529493A (zh) | 基于双目视觉的电缆外观缺陷检测与定位方法 | |
| KR20230039557A (ko) | 반도체 시편 제조를 위한 마스크 검사 | |
| CN109584208A (zh) | 一种针对工业结构缺陷智能识别模型的检验方法 | |
| CN115631132A (zh) | 网络训练方法、缺陷检测方法、装置、存储介质和设备 | |
| Chen et al. | Continuous pavement crack detection using ECA-enhanced instance segmentation of video images | |
| CN104931466A (zh) | 基于列处理的plif浓度场标定方法 | |
| JP2023064098A5 (enExample) | ||
| CN115717865B (zh) | 环形结构全场变形测量方法 | |
| Kaushik et al. | Pothole Detection System: A Real-Time Solution for Detecting Potholes |