KR20230039557A - 반도체 시편 제조를 위한 마스크 검사 - Google Patents

반도체 시편 제조를 위한 마스크 검사 Download PDF

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Publication number
KR20230039557A
KR20230039557A KR1020220113367A KR20220113367A KR20230039557A KR 20230039557 A KR20230039557 A KR 20230039557A KR 1020220113367 A KR1020220113367 A KR 1020220113367A KR 20220113367 A KR20220113367 A KR 20220113367A KR 20230039557 A KR20230039557 A KR 20230039557A
Authority
KR
South Korea
Prior art keywords
mask
contours
contour
image
defect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020220113367A
Other languages
English (en)
Korean (ko)
Inventor
아리엘 쉬카림
에브게니 발
Original Assignee
어플라이드 머티리얼즈 이스라엘 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어플라이드 머티리얼즈 이스라엘 리미티드 filed Critical 어플라이드 머티리얼즈 이스라엘 리미티드
Publication of KR20230039557A publication Critical patent/KR20230039557A/ko
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/11—Region-based segmentation
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/13—Edge detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G01N2021/95615—Inspecting patterns on the surface of objects using a comparative method with stored comparision signal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95676—Masks, reticles, shadow masks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Image Processing (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
KR1020220113367A 2021-09-13 2022-09-07 반도체 시편 제조를 위한 마스크 검사 Pending KR20230039557A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/473,342 2021-09-13
US17/473,342 US12400314B2 (en) 2021-09-13 2021-09-13 Mask inspection for semiconductor specimen fabrication

Publications (1)

Publication Number Publication Date
KR20230039557A true KR20230039557A (ko) 2023-03-21

Family

ID=85431320

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020220113367A Pending KR20230039557A (ko) 2021-09-13 2022-09-07 반도체 시편 제조를 위한 마스크 검사

Country Status (5)

Country Link
US (1) US12400314B2 (enExample)
JP (1) JP2023041623A (enExample)
KR (1) KR20230039557A (enExample)
CN (1) CN115797249A (enExample)
TW (1) TW202312099A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230028830A (ko) * 2021-08-23 2023-03-03 삼성전자주식회사 웨이퍼 불량 검사 장치, 웨이퍼 불량 검사 시스템, 웨이퍼 검사 방법 및 웨이퍼 제조 방법
CN119797274B (zh) * 2025-03-13 2025-07-15 中北大学 一种n型SiC耐高温欧姆接触电极结构的制备方法
CN120599588B (zh) * 2025-08-06 2025-09-30 昆山大洋电路板有限公司 一种基于机器视觉的装配式印刷电路板检测系统

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5795688A (en) * 1996-08-14 1998-08-18 Micron Technology, Inc. Process for detecting defects in photomasks through aerial image comparisons
US7155052B2 (en) * 2002-06-10 2006-12-26 Tokyo Seimitsu (Israel) Ltd Method for pattern inspection
KR100474571B1 (ko) * 2002-09-23 2005-03-10 삼성전자주식회사 웨이퍼의 패턴 검사용 기준 이미지 설정 방법과 이 설정방법을 이용한 패턴 검사 방법 및 장치
JP4862031B2 (ja) * 2008-10-20 2012-01-25 株式会社ニューフレアテクノロジー マスク欠陥レビュー方法及びマスク欠陥レビュー装置
JP5498189B2 (ja) * 2010-02-08 2014-05-21 株式会社日立ハイテクノロジーズ 欠陥検査方法及びその装置
KR20120068128A (ko) * 2010-12-17 2012-06-27 삼성전자주식회사 패턴의 결함 검출 방법 및 이를 수행하기 위한 결함 검출 장치
US9367911B2 (en) * 2012-06-13 2016-06-14 Applied Materials Israel, Ltd. Apparatus and method for defect detection including patch-to-patch comparisons
JP5478681B2 (ja) * 2012-08-24 2014-04-23 株式会社日立ハイテクノロジーズ 半導体欠陥検査装置ならびにその方法
KR102195231B1 (ko) * 2013-08-23 2020-12-24 케이엘에이 코포레이션 블록-투-블록 레티클 검사
US9747518B2 (en) * 2014-05-06 2017-08-29 Kla-Tencor Corporation Automatic calibration sample selection for die-to-database photomask inspection
JP2017009379A (ja) * 2015-06-19 2017-01-12 株式会社ニューフレアテクノロジー 検査装置および検査方法
US11041815B2 (en) * 2016-05-23 2021-06-22 Hitachi High-Tech Corporation Inspection information generation device, inspection information generation method, and defect inspection device
KR102692897B1 (ko) * 2019-02-25 2024-08-08 에이에스엠엘 네델란즈 비.브이. 프린트된 패턴들의 확률적 변동을 결정하는 방법
US11263496B2 (en) * 2019-02-25 2022-03-01 D2S, Inc. Methods and systems to classify features in electronic designs
US12243237B2 (en) * 2020-01-10 2025-03-04 Tasmit, Inc. Pattern-edge detection method, pattern-edge detection apparatus, and storage medium storing program for causing a computer to perform pattern-edge detection

Also Published As

Publication number Publication date
TW202312099A (zh) 2023-03-16
US20230080151A1 (en) 2023-03-16
US12400314B2 (en) 2025-08-26
JP2023041623A (ja) 2023-03-24
CN115797249A (zh) 2023-03-14

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