JP2023031244A - 静電チャックを含む基板処理装置と基板処理方法、及び静電チャックの製造方法 - Google Patents
静電チャックを含む基板処理装置と基板処理方法、及び静電チャックの製造方法 Download PDFInfo
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Abstract
Description
210 チャック部材
211 誘電板
212 電極
220 ピンホール
240 リフトピン
500 膨張部材
Claims (20)
- 基板を支持し、少なくとも一つのピンホールが上下方向に貫通し、前記ピンホールにリフトピンが昇降可能に収容されるチャック部材と、
前記ピンホールの内周に設けられ、拡張可能であり、拡張の際に、前記ピンホールに収容される前記リフトピンの外周面に密着する内周面を有する膨張部材と、を含む、静電チャック。 - 前記膨張部材は、電源の供給に応じて膨張する圧電素子である、請求項1に記載の静電チャック。
- 前記静電チャックは、前記チャック部材に内蔵され、静電気力を発生させる電極をさらに含む、請求項2に記載の静電チャック。
- 前記圧電素子は、前記電極と電気的に接続され、
前記電極に電源が印加されると、前記電極から電源の供給を受けて膨張する、請求項3に記載の静電チャック。 - 前記圧電素子は、前記電極に電源が遮断されると、膨張する前の状態に復元される、請求項4に記載の静電チャック。
- 前記チャック部材は、誘電物質からなり、
前記圧電素子は、前記チャック部材と同等な誘電率を有するとともに、前記チャック部材に比べて高い体積抵抗を有する、請求項2に記載の静電チャック。 - 前記チャック部材と前記圧電素子は焼結方式で結合される、請求項6に記載の静電チャック。
- 前記圧電素子と前記電極は、個別に電源の供給を受け、独立して制御される、請求項3に記載の静電チャック。
- 前記ピンホールの上端には、前記膨張部材が収容される収容溝が形成される、請求項1に記載の静電チャック。
- 基板処理空間を提供する工程チャンバと、
前記基板処理空間に配置された静電チャックと、
前記基板処理空間にプラズマを発生させるためのプラズマ発生器と、を含み、
前記静電チャックは、
基板を支持し、少なくとも一つのピンホールが上下方向に貫通し、前記ピンホールにリフトピンが昇降可能に収容されるチャック部材と、
前記ピンホールの内周に設けられ、膨張可能であり、膨張の際に、前記ピンホールに収容される前記リフトピンの外周面に密着する内周面を有する膨張部材と、を含み、
前記膨張部材は、電源の供給に応じて膨張する管状の圧電素子である、基板処理装置。 - 前記圧電素子は、前記静電チャックに静電気力を発生させる電極と電気的に接続され、
前記電極に電源が印加されると、前記電極から電源の供給を受けて前記ピンホールの内側方向に膨張する、請求項10に記載の基板処理装置。 - 前記圧電素子は、前記電極に供給される電源が遮断されると、元の状態に復元される、請求項11に記載の基板処理装置。
- 前記圧電素子は、独立して制御される別途の電源に接続される、請求項10に記載の基板処理装置。
- 前記圧電素子は、前記チャック部材よりも高い体積抵抗を有する、請求項10に記載の基板処理装置。
- 基板を支持し、少なくとも一つのピンホールが上下方向に貫通し、前記ピンホールにリフトピンが昇降可能に収容されるチャック部材と、前記チャック部材に内蔵され、前記チャック部材に静電気力を発生させる電極と、前記ピンホールの内周に設けられ、拡張可能であり、拡張の際に、前記ピンホールに収容される前記リフトピンの外周面に密着する内周面を有する圧電素子と、を含む静電チャックを用いて基板を処理する方法であって、
前記チャック部材に電源が印加されて基板がチャッキングされるときに前記圧電素子が膨張することにより、前記ピンホールの内周の長さが減少したままでプラズマ処理を行う、基板処理方法。 - 前記プラズマ処理が完了すると、
前記チャック部材に電源が遮断されて基板がデチャッキングされるとき、前記圧電素子が膨張する前の状態に復元され、前記減少したピンホールの内周の長さが減少する前の長さに復元される、請求項15に記載の基板処理方法。 - チャック部材の上面と下面を貫通するようにリフトピンが昇降するためのピンホールを加工するステップと、
前記ピンホールの上端部に、膨張の際に前記リフトピンの外周面に密着する内周面を有する膨張部材を挿入するステップと、
前記挿入した膨張部材を前記チャック部材に固定するステップと、を含む、静電チャックの製造方法。 - 前記膨張部材は、前記チャック部材と比較して高い体積抵抗を有し、電源の供給に応じて膨張する管状の圧電素子である、請求項17に記載の静電チャックの製造方法。
- 前記ピンホール加工ステップは、
前記ピンホールの上端部を前記膨張部材の形状にカウンターボーリング(counter-boring)するステップを含む、請求項17に記載の静電チャックの製造方法。 - 前記ピンホールは前記チャック部材に少なくとも一つ形成される、請求項17に記載の静電チャックの製造方法。
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KR1020210111958A KR102615217B1 (ko) | 2021-08-24 | 2021-08-24 | 정전 척을 포함하는 기판 처리 장치와 기판 처리 방법 및 정전 척 제조 방법 |
KR10-2021-0111958 | 2021-08-24 |
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US6481723B1 (en) * | 2001-03-30 | 2002-11-19 | Lam Research Corporation | Lift pin impact management |
JP2003243374A (ja) | 2002-02-20 | 2003-08-29 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
KR100638059B1 (ko) * | 2005-05-26 | 2006-10-24 | 주식회사 에이디피엔지니어링 | 플라즈마 처리장치 |
JP2009191339A (ja) | 2008-02-18 | 2009-08-27 | Seiko Epson Corp | 成膜装置 |
TWI575103B (zh) * | 2011-10-13 | 2017-03-21 | 愛發科股份有限公司 | 真空處理裝置 |
KR102459563B1 (ko) * | 2015-01-09 | 2022-10-26 | 도쿄엘렉트론가부시키가이샤 | 접합 장치, 접합 시스템, 접합 방법, 및 컴퓨터 기억 매체 |
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