JP2023000535A - Curved work bonding apparatus and curved work bonding method - Google Patents

Abstract

To provide an apparatus and method for uniformly bonding a first work and a second work having three-dimensional curved surfaces over entire surfaces.SOLUTION: There is provided a curved work bonding apparatus that comprises: a first concave-convex mold 1 having a first curved surface 1a on which a first non-bonding surface W11 of a first work W1 is detachably held; a second concave-convex mold 2 having a second curved surface 2a on which a second non-bonding surface W21 of a second work W2 is detachably held; a drive unit that relatively moves one or both of the first concave-convex mold and the second concave-convex mold toward each other in a thickness direction of the first work and the second work; and a control unit that controls operation of the driving unit. The second curved surface is a transfer surface obtained by duplication of the first curved surface. The control unit that causes the driving unit to approach and move so as to overlap the first work and the second work in the thickness direction between the first curved surface of the first concave-convex mold and the second curved surface of the second concave-convex mold, pressurizes the first work and the second work in the thickness direction, and controls so as to bond the first bonding surface W12 of the first work and the second bonding surface W22 of the second work.SELECTED DRAWING: Figure 1

Description

The present invention relates to a curved work bonding apparatus for bonding a thin plate-like first work and a second work formed in a three-dimensional curved shape, and a curved work bonding method using the curved work bonding apparatus.

Conventionally, in this type of curved surface work bonding apparatus, a lower die provided with an abutment block protruding from the surface of a base and an upper die provided with a suction platform having a cavity are arranged so as to be adsorbed in the cavity. There is a curved surface laminating apparatus that places a curved object, a flexible member, and an adhesive layer provided on the surface of the flexible member positioned by a slab, and bonds the flexible member and the curved object by joining the upper mold and the lower mold (for example, See Patent Document 1).
A curved arc surface that joins with the curved surface portion of the curved object is formed in the cavity, and a curved surface is formed in the corresponding portion of the abutment block.
After the curved surface is formed on the soft position member along the curved surface of the abutting block, the surface of the flexible member is bonded to the curved object via the adhesive layer by joining the upper mold and the lower mold. By separating the lower mold and the upper mold after joining, the curved object and the flexible member that are integrally connected can be obtained.

JP 2019-077172 A

By the way, when the thin plates to be bonded have a complicated three-dimensional curved surface shape, it becomes difficult to bond them uniformly and with high accuracy.
In Patent Document 1, since the curved arc surface of the cavity corresponding to the curved surface portion of the curved object and the curved surface of the abutment block are formed separately, if the shape of the three-dimensional curved surface is complicated, the processing accuracy of each of them is very small. Due to such differences, the flexible member is not uniformly bonded to the curved surface over the entire bonding surface, and air bubbles are likely to enter the bonding surface, resulting in poor bonding accuracy.

In order to solve such problems, the curved surface work bonding apparatus according to the present invention is a curved surface work bonding apparatus for bonding a first work and a second work formed in a thin plate shape with three-dimensional curved surfaces, A first concave-convex mold having a first curved surface on which the first non-bonding surface of the first work is detachably held, and a second concave-convex mold on which the second non-bonding surface of the second work is detachably held. A driving unit that relatively moves a second concave-convex mold having a curved surface and one or both of the first concave-convex mold and the second concave-convex mold toward each other in the thickness direction of the first work and the second work. and a control unit that controls the operation of the drive unit, wherein the second curved surface is a transfer surface obtained by duplicating the first curved surface, and the control unit performs the approaching movement of the drive unit. , the first workpiece and the second workpiece are overlapped in the thickness direction between the first curved surface of the first concave-convex mold and the second curved surface of the second concave-convex mold; The one work and the second work are pressurized in the thickness direction, and controlled so that the first bonding surface of the first work and the second bonding surface of the second work are bonded. .
Further, in order to solve such problems, a curved surface work bonding method according to the present invention is a curved surface work bonding method for bonding a first work and a second work formed in a three-dimensional curved thin plate shape. a step of forming a second concave-convex mold having a second curved surface from a first concave-convex mold having a first curved surface; While detachably holding the first non-bonding surface of the second concave-convex mold, the second non-bonding surface of the second work is attached to the second curved surface of the second uneven mold, the first work and the second work a setting step of holding the workpiece so as to be separated and sandwiched in the thickness direction; and a pressing step in which the second work is superimposed so as to be in contact with the thickness direction and pressurized to join the first bonding surface of the first work and the second bonding surface of the second work. In the molding step, the second curved surface is formed as a transfer surface by duplicating the first curved surface.

BRIEF DESCRIPTION OF THE DRAWINGS It is explanatory drawing which shows the whole structure of the curved-surface work bonding apparatus based on embodiment (1st embodiment) of this invention, and the curved-surface work bonding method, (a) is a longitudinal front view of a mold-making process, (b) is FIG. 2(c) is a longitudinal front view and a transverse plan view of the setting process, and FIG. It is explanatory drawing which shows a carrying-in process, (a) is a longitudinal front view before reception, (b) is a longitudinal front view at the time of reception, (c) is a longitudinal front view at the time of delivery. FIG. 4 is an explanatory view showing the overall configuration of a curved workpiece bonding apparatus and a curved workpiece bonding method according to another embodiment (second embodiment) of the present invention, where (a) is a longitudinal front view of a setting process, and (b) is. is a longitudinal front view of the pressurizing process, and (c) is a longitudinal front view after the pressurizing process is completed.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail based on the drawings.
As shown in FIGS. 1 to 3, the curved surface work bonding apparatus A according to the embodiment of the present invention is a flat panel display such as a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (PDP). FPD), or flexible displays, sensor devices, such as touch panel type FPD, 3D (three-dimensional) displays, liquid crystal modules (LCM) such as e-books, flexible printed circuit boards (FPC), etc. It is a bonding machine of a bonding device D that bonds another thin plate-like or film-like second work W2 such as a touch panel, a cover glass, a cover film, or an FPD to a first work W1.
The first work W1 is a thin plate-like substrate formed in a three-dimensional curved shape including a circuit substrate such as a glass substrate, an acrylic plate, a stainless steel plate, etc., which constitutes a liquid crystal panel, a touch panel, or the like. A first non-bonding surface W11 is formed on the back side of the first work W1 and faces the first concave-convex mold 1, which will be described later, and a first bonding surface W12 is formed on the front side of the first work W1.
The second work W2 is a thin board having a three-dimensional curved surface including a circuit board such as a film sensor and a touch panel, or a thin board having a three-dimensional curved surface such as a cover. is the substrate of The thin plate-like substrate that becomes the second work W2 includes a film-like substrate, and also includes thin plates and films that are elastically deformable at least in the thickness direction. A second non-bonding surface W21 is formed on the back side of the second work W2 to face the second concave-convex mold 2 described later, and a second bonding surface W22 is formed on the front side of the second work W2.
Either the first bonding surface W12 of the first work W1 or the second bonding surface W22 of the second work W2, or both the first bonding surface W12 and the second bonding surface W22, is provided with an adhesive layer W3. It is preferable to provide The adhesive layer W3 is made of a denatured material that is denatured (altered) by irradiation with ultraviolet rays, heat rays (infrared rays), heating, etc., and has an appropriate adhesive strength, and finally the first work W1 and the second work W2 are firmly bonded. It is preferable to use a material that provides a good adhesion state.

More specifically, the curved workpiece bonding apparatus A according to the embodiment of the present invention includes a first concave-convex mold 1 corresponding to a first work W1, a second concave-convex mold 2 corresponding to a second work W2, a first concave-convex mold The main constituent elements are a drive unit 3 that relatively moves either or both of the mold 1 and the second concave-convex mold 2 toward or away from each other in the thickness direction, and a control unit 4 that controls the operation of the drive unit 3 and the like. It is equipped as
Further, a first holding member 31 provided to detachably hold the first concave-convex mold 1 and a second holding member 32 provided to detachably hold the second concave-convex mold 2 are provided. It is preferable to move the first holding member 31 and the second holding member 32 relatively closer to each other at the portion 3 .
1(a) to (c) and FIGS. 2(a) to (c) show the curved work bonding apparatus A1 according to the first embodiment of the present invention. The coupling device A2 is shown in FIGS. 3(a)-(c).
At least the first concave-convex mold 1, the second concave-convex mold 2, the drive unit 3, the first holding member 31, and the second holding member 32 are arranged in the bonding space S. The first work W1 and the second work W2 are each carried from an external space (not shown) into the bonding space S by a transport means 5 including a transport jig 51, a transport robot, etc., and transferred to the bonding device after completion of bonding. D is transported from the bonding space S to the external space by the transport means 5 .
In addition, the first work W1 and the second work W2 are usually arranged so as to face each other in the vertical direction, and the direction in which the lower (lower) first work W1 and the upper (upper) second work W2 are bonded together. is hereinafter referred to as "Z direction". A direction along the first work W1 and the second work W2 that intersects with the Z direction is hereinafter referred to as "XY direction".

One of the first concave-convex mold 1 and the second concave-convex mold 2 is a casting, and the other is a replica of the casting. A case where the first concave-convex mold 1 is a casting made of aluminum, other metals, hard synthetic resins, or other hard materials will be described below. In particular, when the first uneven mold 1 is a cast product and the height of the unevenness in the Z direction of the first workpiece W1 corresponding to the first uneven mold 1 is relatively low, the outer surface of the first uneven mold 1 It is also possible to form a plated layer (not shown) by electroforming or the like.
The first concave-convex mold 1 is formed to be larger in the XY direction than the size of the first work W1. A first curved surface 1a is formed.
The first curved surface 1a is unevenly formed into a three-dimensional curved surface shape that fits in the Z direction with the first non-bonding surface W11 of the first workpiece W1 as a reference surface. It is configured such that the bonding surface W11 is bonded without a gap.
The first curved mold surface 1a is provided with a first work holding portion 1b that detachably temporarily holds the first non-bonding surface W11 of the first work W1 carried into the bonding space S by the conveying means 5. As shown in FIG. The first non-bonding surface W11 of the first work W1 is temporarily held at a predetermined position of the first curved surface 1a by the first work holding portion 1b so as not to be displaced in the XY directions. As a specific example of the first workpiece holding portion 1b, a differential pressure chuck such as a vacuum chuck is used.
Furthermore, as a method of positioning the first work W1 with respect to the first curved surface 1a, a position detector such as a CCD camera detects the carry-in position of the first work W1 with respect to the first curved surface 1a. A method of finely adjusting the carry-in position of the first work W1 by using the There is a method of setting the first work W1 in accordance with the positioning pins.
1 and 3 as a specific example of the first concave-convex mold 1, the first concave-convex mold 1 is used as a lower surface plate arranged in the lower Z direction, and the predetermined position of the first curved mold surface 1a , a glass substrate that becomes the first work W1 is set by being vacuum-sucked as the first work holding portion 1b.

The second concave-convex mold 2 is a duplicate of the first concave-convex mold 1 or a mold member (casting) separately manufactured in the same shape as the first concave-convex mold 1, and is larger than the size of the second workpiece W2. A second curved surface 2a is formed on the front side of the second concave-convex mold 2 facing the second non-bonding surface W21 of the second workpiece W2 in the Z direction.
The second curved surface 2a is a transfer surface by copying the first curved surface 1a. More specifically, the first curved mold surface 1a is duplicated (transferred) to the surface of the second concave-convex mold 2 by casting from the first concave-convex mold 1 using a liquid replication material 2R having excellent fluidity. It becomes the second curved surface 2a. As the replication material 2R, it is preferable to use a soft synthetic resin having appropriate elasticity such as silicone rubber or silicone resin. In this case, deformation of the master mold (second concave-convex mold 2) due to heat or the like during casting is small, and the second concave-convex mold 2 is elastically deformed at least in the Z direction due to pressure directed toward the first concave-convex mold 1. As a result, the entire surface of the first curved surface 1a of the first workpiece W1 can be closely contacted.
The second curved mold surface 2a is provided with a second work holding portion 2b that detachably temporarily holds the second non-bonding surface W21 of the second work W2 carried into the bonding space S by the conveying means 5. As shown in FIG. The second non-bonding surface W21 of the second work W2 is temporarily held with respect to a predetermined position of the second curved surface 2a by the second work holding portion 2b so as not to be displaced in the XY directions.
In particular, when the replication material 2R is a soft synthetic resin having appropriate adhesiveness such as silicone rubber or silicone resin, the second workpiece W2 can be held by only the adhesive force of the replication material 2R as the second workpiece holder 2b. It becomes possible to closely hold the second non-bonding surface W21 of the second non-bonding surface W21 so as not to be displaced.
Further, the method of positioning the second work W2 with respect to the second curved surface 2a is the same as the method of positioning the first work W1 with respect to the first curved surface 1a.
1 and 3 as a specific example of the second concave-convex mold 2, the second concave-convex mold 2 of the replica is used as an upper surface plate arranged above in the Z direction, and the second curved mold surface At a predetermined position 2a, a film substrate as a second work W2 is set so as not to fall off due to the adhesive force of the replication material 2R.

The first holding member 31 is a rigid body such as a metal and is formed in a flat plate shape with a thickness that does not cause distortion (bending) deformation. It has a first holding surface 31a that is detachably held facing the direction. A first holding chuck 31b that detachably holds the first non-mold surface 1c of the first concave-convex mold 1 is provided on the first holding surface 31a.
When the first holding surface 31a is shown in FIGS. 1 and 3 as a specific example, the first holding surface 31a is generally formed in a substantially flat planar shape. I use a chuck.
The second holding member 32 is a rigid body such as metal and is formed in a flat plate shape with a thickness that does not cause distortion (bending) deformation. It has a second holding surface 32a that faces and contacts in the direction. A second holding chuck 32b that detachably holds the second non-mold surface 2c of the second concave-convex mold 2 is provided on the second holding surface 32a.
1(a) to 1(c) as an example (first embodiment) of the second holding surface 32a, the second holding chuck 32b is formed to have a generally smooth surface. Differential pressure chucks such as adsorption are used.
3A to 3C as another example (second embodiment) of the second holding surface 32a, a part of the front side of the second holding member 32 is the second concave-convex mold 2. It is formed in a curved surface shape having a convex portion 32c partially protruding in the Z direction toward the second non-mold surface 2c, and a differential pressure chuck such as a vacuum chuck is used as the second holding chuck 32b.

The drive unit 3 is configured by an actuator or the like that relatively reciprocates either one or both of the first holding member 31 and the second holding member 32 in the Z direction. On the other hand, the operation is controlled so as to interlock with the conveying means 5 for carrying in or carrying out the first work W1 or the second work W2.
As an example of control of the drive unit 3 by the control unit 4, as shown in FIGS. In the initial state before being transferred to the concave-convex mold 1 and the second concave-convex mold 2, the driving unit 3 relatively separates either the first holding member 31 or the second holding member 32 from the other in the Z direction. Alternatively, both the first holding member 31 and the second holding member 32 are relatively moved away from each other in the Z direction. After that, as shown in FIGS. 1(c) and 3(b)(c), the drive unit 3 moves either the first holding member 31 or the second holding member 32 toward the other in the Z direction. Alternatively, both the first holding member 31 and the second holding member 32 are moved closer to each other in the Z direction. As a result, the first work W1 and the second work W2 are superimposed in the Z direction with the sealing material W3 interposed therebetween, and if necessary, further pressure is applied to bond them together. After the bonding is completed, the first holding member 31 and the second holding member 32 are relatively moved apart in the Z direction to return to the initial state.
In the illustrated example as a specific example of the drive unit 3, only the second holding member 32 is linked to the drive unit 3, and the second holding member 32 is relatively reciprocated in the Z direction toward the first holding member 31. I am moving

The bonding space S is formed around the first workpiece W1 and the second workpiece W2, and at least the first concave-convex mold 1, the second concave-convex mold 2, the drive unit 3, the first holding member 31, and the second holding member 31. A member 32 is deployed.
In the bonding space S, the first holding member 31 and the second holding member 32 are arranged so that the first holding surface 31a and the second holding surface 32a on the front side face each other in the Z direction. In this facing state, the first holding chuck 31 b detachably holds the first non-molding surface 1 c of the first concave-convex mold 1 to the first holding surface 31 a of the first holding member 31 . The second non-molding surface 2c of the second concave-convex mold 2 is detachably held on the second holding surface 32a of the second holding member 32 by the second holding chuck 32b. As a result, with respect to the first curved surface 1a of the first concave-convex mold 1 held by the first holding member 31,
It becomes possible to temporarily hold the first non-bonding surface W11 of the first work W1 carried into the bonding space S by the conveying means 5 by the first work holding portion 1b. The second non-bonding surface W21 of the second workpiece W2 carried into the bonding space S by the conveying means 5 is placed on the second curved surface 2a of the second concave-convex mold 2 held by the second holding member 32. It becomes possible to temporarily hold the work by the second work holding portion 2b.
If necessary, it is preferable that the bonding space S is configured so that the pressure can be adjusted from an atmospheric atmosphere to a reduced pressure atmosphere of a predetermined degree of vacuum, or that heating can be adjusted from a room temperature atmosphere to a predetermined high temperature atmosphere.
By forming the bonding space S inside a vacuum device (not shown) such as a vacuum chamber, the first work W1 and the second work W2 can be bonded together in a vacuum atmosphere. By forming the bonding space S inside a heating device (not shown), the first work W1 and the second work W2 can be bonded together in a high-temperature atmosphere.
Furthermore, when the first work W1 and the second work W2 are overlapped in a vacuum atmosphere and then heated to be thermally bonded by the adhesive layer W3, the first work W1 and the second work W2 are placed between the first uneven mold 1 and the second uneven mold 2. The polymer integrated by sandwiching W1 and the second work W2 is removed from the first holding member 31 and the second holding member 32, carried out, and placed in a heating furnace (not shown) configured separately from the vacuum device. It is possible by carrying it inside and heating it while applying a load with a weight or the like.

The control unit 4 is a controller that is electrically connected to the driving unit 3 and the conveying means 5 for the first work W1 and the second work W2.
This controller is also electrically connected to drive sources (not shown) such as a vacuum device and a heating device.
The controller, which serves as the control unit 4, sequentially controls operations at preset timings according to a preset program in its control circuit (not shown).
A program set in the control circuit of the controller 4 will be described as a lamination method of the lamination device D. FIG.
A curved workpiece bonding method using a curved workpiece bonding apparatus A according to an embodiment of the present invention comprises a mold taking step of creating a second uneven mold 2 from a first uneven mold 1, A setting step of temporarily holding the first workpiece W1 and the second workpiece W2 between the curved mold surface 1a and the second curved mold surface 2a of the second concave-convex mold 2; A main process includes a pressurizing process in which either one or both of them are relatively moved in the Z direction to press the first work W1 and the second work W2 in the Z direction.
Further, it is preferable to include a carry-in step of putting the first work W1 and the second work W2 into the bonding space S and a carry-out step of taking out the bonded device D from the bonding space S.

In the mold making step, as shown in FIG. 1A, a second concave-convex mold 2, which is a replica of the first concave-convex mold 1 as a copy source, is created by casting using a replication material 2R. As a result, the second curved surface 2 a of the second concave-convex mold 2 becomes a transfer surface from the first curved surface 1 a of the first concave-convex mold 1 .
In the illustrated example as a specific example of the molding process, first, the first concave-convex mold 1 to be the duplication source is placed inside the mold 6 and fixed to the bottom 6 a of the mold 6 . Next, the liquid replication material 2R is injected until the first concave-convex mold 1 is filled, defoamed, and then solidified. Finally, by removing the solidified matrix from the formwork 6, the second concave-convex mold 2 for the replica is completed.
In the setting step, as shown in FIGS. 1(b) and 3(a), the first holding surface 31a of the first holding member 31 arranged in the bonding space S is provided with the first holding surface 31a of the first concave-convex mold 1. The non-molding surface 1 c is held, and the second holding surface 32 a of the second holding member 32 holds the second non-molding surface 2 c of the second uneven mold 2 . The carrying-in process is started in this holding state.

In the carry-in step, the first work W1 and the second work W2 are carried from the external space into the bonding space S by the transport means 5, and the first work holding part 1b and the second work holding part 2b are operated to move the first concave-convex mold. The first workpiece W1 is transferred to the first curved surface 1a of the second concave-convex mold 2, the second workpiece W2 is transferred to the second curved surface 2a of the second uneven mold 2, and the first bonding surface W12 of the first workpiece W1 and the second bonding surface W12 are transferred. The second bonding surfaces W22 of the two works W2 are separated in the Z direction and temporarily held.
In particular, when the second workpiece W2 is a curved film or thin plate, first, as shown in FIG. A second workpiece W2 is mounted on a tray-shaped holding base 7 having a holding surface 7a so as to fit with the holding surface 7a. As a specific example of the holding surface 7a, a differential pressure chuck such as a vacuum chuck is used.
The mounting position of the second work W2 with respect to the holding surface 7a is preferably positioned by a positioning pin or a position detector such as a CCD camera, and temporarily fixed by vacuum suction or the like. As the conveying means 5, a conveying jig 51 having a compressed gas injection function and a suction function is used. It is preferable to jet toward the second bonding surface W22 of W2, smooth out the wrinkles of the second work W2, and follow the uneven shape of the holding surface 7a.
Then, as shown in FIG. 2(b), the entire second bonding surface W22 of the second work W2 is vacuum-sucked and received by suction from the conveying jig 51. Next, as shown in FIG.
2(c), the conveying jig 51 is moved to receive the second non-bonding surface W21 of the second workpiece W2 on the second curved surface 2a of the second concave-convex mold 2. hand over. In the illustrated example, the second concave-convex mold 2 has the second curved surface 2a and the second workpiece holding portion 2b facing upward, and the set state shown in FIGS. After that, the second concave-convex mold 2 to which the second workpiece W2 is transferred is turned upside down and held on the second holding surface 32a of the second holding member 32 by the second holding chuck 32b.
In addition, although not shown as another example, the conveying jig 51 is moved and turned upside down so that the second curved mold surface 2a and the second work holding portion 2b in the set state with respect to the second concave-convex mold 2 facing downward, It is also possible to transfer the second non-bonding surface W21 of the second work W2.
In the illustrated example, the compressed gas is injected from the conveying jig 51, but instead of this, the compressed gas may be injected from the holding surface 7a of the holding base 7, or the compressed gas may be injected from both the conveying jig 51 and the holding surface 7a. Modifications such as injecting gas are possible.
As a result, even if the second work W2 is in the form of a thin film, it can be transferred to the second concave-convex mold 2 with no wrinkles and a stable shape. A high-quality bonding can be achieved without causing air bubbles to enter the bonding device D after completion or leaving internal stress.

In the pressurizing step, as shown in FIGS. 1(c), 3(b) and 3(c), the drive unit 3 operates the first holding member 31 and the second holding member 32 to press the first concave-convex mold 1 or Either one or both of the second concave-convex molds 2 are moved relatively closer in the Z direction, and the first bonding surface W12 of the first work W1 and the second bonding surface W22 of the second work W2 are brought into contact with the adhesive layer W3. are overlapped so as to be in contact with each other in the Z direction. The first work W1 and the second work W2 are pressurized in the Z direction by the subsequent relative approaching movement. As a result, the first bonding surface W12 of the first work W1 and the second bonding surface W22 of the second work W2 are uniformly bonded over the entire surface via the adhesive layer W3.
Furthermore, the stacking of the first work W1 and the second work W2 in the pressurizing process can be performed in a vacuum atmosphere or a high temperature atmosphere, if necessary.
In the final unloading step, the first holding member 31 and the second holding member 32 are operated by the drive unit 3, so that either one or both of the first concave-convex mold 1 and the second concave-convex mold 2 are relatively separated in the Z direction. By moving and releasing the operation of the first workpiece holding part 1b and the second workpiece holding part 2b, the first curved surface 1a of the first concave-convex mold 1 and the second curved surface 2a of the second concave-convex mold 2 are stuck. The combined bonded device D is carried out from the bonding space S to the external space.

Next, a curved surface workpiece bonding apparatus A2 according to a second embodiment of the present invention will be described.
3(a) to 3(c), the curved surface workpiece bonding apparatus A2 of the second embodiment has a configuration in which the second holding surface 32a' of the second holding member 32' has a convex portion 32c projecting in the Z direction. However, unlike the above-described first embodiment, the configuration other than that is the same as that of the first embodiment.
The protrusion 32c partially protrudes from the second holding surface 32a of the second holding member 32 of the first embodiment shown by the dashed line in FIG. It is preferable to form a mountain shape in which the amount of protrusion gradually decreases toward one or both of them.
In the illustrated example, the convex portion 32c is formed in a mountain shape in which the amount of protrusion gradually decreases only in the Y direction. In addition, although not shown, the shape and number of the protrusions 32c can be changed to a shape and number other than the illustrated example.
Therefore, in the set state shown in FIG. 3(a), the second non-molding surface 2c' of the second concave-convex mold 2' is placed against the second holding surface 32a' and the convex portion 32c of the second holding member 32'. The second concave-convex mold 2' is held by the second holding chuck 32b in contact. Compared to the second concave-convex mold 2 of the first embodiment shown by the dashed line in FIG. Become.
As a result, when the second work W2 is in the form of a thin plate or a film that can be elastically deformed at least in the Z direction, the second work W2 follows the partial bulging portion 2d of the second curved surface 2a'. is deformed to bulge, and a mountain-shaped bulging deformation portion W23 is partially formed on the second bonding surface W22.
Therefore, in the first half of the pressurizing step shown in FIG. 3(b), the second concave-convex mold 2' is relatively moved toward the first concave-convex mold 1 via the second holding member 32' by the drive unit 3. By doing so, first, the mountain-shaped swelling deformation portion W23 on the second bonding surface W22 of the second work W2 is partially bonded to the first bonding surface W12 of the first work W1.
In the latter half of the subsequent pressurizing step shown in FIG. The swelling deformation portion W23 of the bonding surface W22 and the partial swelling portion 2d of the second curved surface 2a are gradually crushed and deformed, and the surrounding portions around the swelling deformation portion W23 are sequentially pressed.
Thereby, the contact area of the second bonding surface W22 with respect to the first bonding surface W12 gradually widens, and finally the entire second bonding surface W22 is pressed against the entire first bonding surface W12.

According to the curved workpiece bonding apparatus A (A1, A2) and the curved workpiece bonding method according to the embodiment of the present invention, the first uneven mold 1 and the second uneven mold 2,2 ' move relatively closer to each other, and between the first curved surface 1a and the second curved surfaces 2a, 2a' which are transfer surfaces of the first curved surface 1a, the first workpiece W1 and the second workpiece W2 is overlaid (with an adhesive layer W3 interposed therebetween) in the thickness direction (Z direction).
As the driving unit 3 subsequently moves the first concave-convex mold 1 and the second concave-convex mold 2, 2' toward each other, the first work W1 and the second work W2 are pressed in the thickness direction (Z direction). , the first bonding surface W12 of the first work W1 and the second bonding surface W22 of the second work W2 are bonded.
Therefore, the first workpiece W1 and the second workpiece W2 having three-dimensional curved surfaces can be evenly bonded together over the entire surface.
As a result, the second curved surface 2a is different from the first curved surface 1a, compared to the conventional method in which the curved surface of the cavity corresponding to the curved surface of the curved object and the curved surface of the abutment block are separately formed. Since it is a transfer surface, even if the first work W1 and the second work W2 have a complicated three-dimensional curved surface shape, the first bonding surface W12 and the second bonding surface do not cause a slight difference in processing accuracy. W22 can easily and reliably produce a uniform bonded device D.
As a result, the bonding precision can be improved.

By the way, the first work W1 and the second work W2 have a slight dimensional error due to a slight difference in their machining accuracies. As specific examples of dimensional errors, slight thickness unevenness and slight positional deviation of uneven portions may occur for each product.
Therefore, the second concave-convex molds 2 and 2' are preferably formed by using the first concave-convex mold 1 as a duplication source using the replication material 2R having elasticity.
In this case, since the second concave-convex mold 2 made of the replication material 2R is elastically deformable at least in the thickness direction (Z direction), slight thickness unevenness occurs for each product of the first work W1 and the second work W2. Even so, slight unevenness in thickness can be absorbed by elastic deformation of the second concave-convex mold 2 .
Furthermore, even if a slight positional deviation occurs in the relative positions of the uneven portions in each product of the first workpiece W1 and the second workpiece W2, the slight positional deviation in the relative positions of the uneven portions can be corrected by the elastic deformation of the second uneven mold 2. absorbable.
Therefore, the first workpiece W1 and the second workpiece W2 having three-dimensional curved surfaces can be uniformly pasted together over the entire surface without being affected by slight dimensional errors.
As a result, the bonding precision can be further improved.
In addition to this, the second concave-convex mold 2 made of the duplicate material 2R can easily mass-produce high-precision duplicates and reduce costs, as compared to machining.
Further, when the second concave-convex mold 2 made of the replication material 2R having adhesiveness is arranged higher in the thickness direction (Z direction) than the first concave-convex mold 1, the adhesion of the replication material 2R causes the second concave-convex mold 2 to move upward. The second non-bonding surface W21 of the workpiece W2 can be held so as not to fall, and the second workpiece W2 (second bonding surface W22) can be held in a vacuum state, not limited to atmospheric pressure. It can be easily and reliably bonded to one work W1 (first bonding surface W12).

Furthermore, the second work W2 is preferably made of a film-like substrate.
In this case, the rigidity of the second work W2 is lowered, and the second work W2 can be deformed following the irregularities of the first work W1.
Therefore, the second workpiece W2 (second bonding surface W22) can be uniformly adhered to the three-dimensional curved first workpiece W1 (first bonding surface W12) over the entire surface.
As a result, the bonding precision can be further improved.
In particular, when the second concave-convex mold 2 is made of an elastically deformable replication material 2R having the first curved surface 1a of the first concave-convex mold 1 as the replication source, the first workpiece W1 and the second workpiece W2 are slightly deformed. The second bonding surface W22 can be uniformly adhered to the first bonding surface W12 over the entire surface without being affected by any dimensional error.

Further, according to the curved surface work bonding apparatus A2 of the second embodiment shown in FIGS. By holding the second non-molding surface 2c' of the two concave-convex mold 2', the portion pressed by the convex portion 32c on the second curved surface 2a' of the second concave-convex mold 2' is stretched in the thickness direction (Z direction). It swells and deforms.
Therefore, a bulging deformed portion W23 is partially formed on the second bonding surface W22 of the second workpiece W2 following the partial bulging portion 2d of the second curved surface 2a'.
In this bulging deformation state, the first concave-convex mold 1 is relatively moved toward the second concave-convex mold 2, so that the bulging deformation part W23 on the second bonding surface W22 of the second work W2 becomes the first It is partially bonded to the first bonding surface W12 of the work W1.
Subsequent pressurization accompanying the relative movement of the second uneven mold 2' to the first uneven mold 1 causes the swelling deformation portion W23 of the second bonding surface W22 and the second curved surface 2a to partially expand. The bulging portion 2d is gradually crushed and deformed, and the peripheral portions around the bulging deformation portion W23 are sequentially pressed.
Thereby, the contact area of the second bonding surface W22 with respect to the first bonding surface W12 gradually widens, and finally the entire second bonding surface W22 is pressed against the entire first bonding surface W12.
Therefore, the bonding state of the second bonding surface W22 of the second workpiece W2 to the first bonding surface W12 of the first workpiece W1 having a three-dimensional curved shape can be stabilized at all times.
As a result, the bonding precision can be further improved with stable bonding.
In addition, even if the atmosphere of the bonding operation is atmospheric pressure or vacuum and gas exists between the first bonding surface W12 and the second bonding surface W22, the first bonding surface W12 may As the contact area of the two bonding surfaces W22 gradually widens, the gas is pushed out from between the first bonding surface W12 and the second bonding surface W22. For this reason, no gas remains inside the bonded first bonding surface W12 and the second bonding surface W22, and a bubble-free, high-quality bonding device D can be produced.
As a result, even in an environment where gas exists regardless of whether it is in the air or in a vacuum, it is possible to achieve stable bonding and further improve the bonding accuracy.

In the above-described embodiments (first embodiment and second embodiment), the first work W1 and the first concave-convex mold 1 are arranged in the lower position in the Z direction, and the second work W2 and the second concave-convex mold are arranged in the upper position. 2 is arranged, but it is not limited to this, and the first workpiece W1 and the first concave-convex mold 1 may be arranged on the upper side, and the second workpiece W2 and the second concave-convex mold 2 may be arranged on the lower side.
In addition to this, the case where the first concave-convex mold 1 is a casting and the second concave-convex mold 2 is a replica has been described, but the present invention is not limited to this, and the second concave-convex mold 2 is a casting and the second concave-convex mold 2 is a replica. The first concave-convex mold 1 may be the second concave-convex mold 2 or a replica of a mold member (casting) separately produced in the same shape as the second concave-convex mold 2 . In particular, when the second uneven mold 2 is a casting and the height of the unevenness in the Z direction of the second workpiece W2 corresponding to the second uneven mold 2 is relatively low, the outer surface of the second workpiece W2 has It is also possible to form a plated layer (not shown) by an electroforming method or the like.
Further, a differential pressure chuck such as a vacuum chuck is used as the first work holding portion 1b, the first holding chuck 31b, and the second holding chuck 32b, and the second work holding portion 2b is held in close contact only by the adhesive force of the replication material 2R. However, instead of the differential pressure chuck and the adhesive force of the replication material 2R, an adhesive chuck such as an adhesive member, an electrostatic chuck such as electrostatic adsorption, a fixed holding by a magnet, a mechanical chuck, or the like may be used. In particular, when bonding is performed in a vacuum atmosphere, fixing and holding methods using a magnet, a fixing and holding method using a mechanical chuck, etc. are effective.
Further, although a differential pressure chuck such as a vacuum chuck is used as the holding surface 7a of the holding table 7, the present invention is not limited to this. may be used.

A, A1, A2 Curved surface workpiece bonding device 1 First uneven mold 1a First curved surface 2 (2') Second uneven mold 2a (2a') Second curved surface 2c (2c') Second non-mold surface 2R replication material 3 drive unit 32' second holding member 32a' second holding surface 32c convex portion 4 control unit W1 first work W11 first non-bonding surface W12 first bonding surface W2 second work W21 second non-bonding surface Mating surface W22 Second bonding surface

In order to solve such problems, a curved work bonding apparatus according to the present invention is a curved work that bonds a first work including a circuit board formed in a thin plate shape with a three-dimensional curved surface, and a second work in a thin plate shape . A bonding apparatus, wherein a first concave-convex mold having a first curved surface on which a first non-bonding surface of the first work is detachably held, and a second non-bonding surface of the second work are A second concave-convex mold having a second curved surface which is detachably held, and one or both of the first concave-convex mold and the second concave-convex mold are moved in the thickness direction of the first work and the second work. A drive unit for relatively moving closer to each other, and a control unit for controlling the operation of the drive unit, wherein the second curved surface is a transfer surface obtained by duplicating the first curved surface, and the control unit comprises , the first work and the second work are moved between the first curved surface of the first concave-convex mold and the second curved surface of the second concave-convex mold by the approaching movement of the driving part. The first workpiece and the second workpiece are sandwiched and overlapped in the thickness direction, and the first bonding surface of the first workpiece and the second bonding surface of the second workpiece are pressed together in the thickness direction. It is characterized in that it is controlled to be joined as a whole .
Further, in order to solve such problems, a method for bonding a curved surface work according to the present invention is to bond a first work including a circuit board formed in a three-dimensional curved thin plate shape and a thin plate-like second work. A method for bonding curved workpieces, comprising: a molding step in which a second concave-convex mold having a second curved surface is created from a first concave-convex mold having a first curved surface; The first non-bonded surface of the first work is detachably held on the curved surface, and the second non-bonded surface of the second work is attached to the second curved surface of the second concave-convex mold. A setting step in which the first workpiece and the second workpiece are held so as to be separated in the thickness direction, and one or both of the first concave-convex mold and the second concave-convex mold are relatively approached in the thickness direction. a pressurizing step in which the first work and the second work are moved and pressurized in the thickness direction, and in the mold taking step, the second curved surface is used as a transfer surface by copying the first curved surface. A curved surface is formed, and in the pressing step, between the first curved surface of the first concave-convex mold and the second curved surface of the second concave-convex mold, the first workpiece and the second concave-convex mold are formed. Two works are sandwiched and overlapped in the thickness direction, the first work and the second work are pressed in the thickness direction, and the first bonding surface of the first work and the second bonding of the second work The faces are characterized in that they are joined across the face .

Next, a curved surface workpiece bonding apparatus A2 according to a second embodiment of the present invention will be described.
3(a) to 3(c), the curved surface workpiece bonding apparatus A2 of the second embodiment has a configuration in which the second holding surface 32a' of the second holding member 32' has a convex portion 32c projecting in the Z direction. However, unlike the above-described first embodiment, the configuration other than that is the same as that of the first embodiment.
The protrusion 32c partially protrudes from the second holding surface 32a of the second holding member 32 of the first embodiment shown by the dashed line in FIG. It is preferable to form a mountain shape in which the amount of protrusion gradually decreases toward one or both of them.
In the illustrated example, the convex portion 32c is formed in a mountain shape in which the amount of protrusion gradually decreases only in the Y direction. In addition, although not shown, the shape and number of the protrusions 32c can be changed to a shape and number other than the illustrated example.
Therefore, in the set state shown in FIG. 3(a), the second non-molding surface 2c' of the second concave-convex mold 2' is placed against the second holding surface 32a' and the convex portion 32c of the second holding member 32'. The second concave-convex mold 2' is held by the second holding chuck 32b in contact. Compared to the second concave-convex mold 2 of the first embodiment shown by the dashed line in FIG. Become.
As a result, when the second work W2 is in the form of a thin plate or a film that can be elastically deformed at least in the Z direction, the second work W2 follows the partial bulging portion 2d of the second curved surface 2a'. is deformed to bulge, and a mountain-shaped bulging deformation portion W23 is partially formed on the second bonding surface W22.
Therefore, in the first half of the pressurizing step shown in FIG. 3(b), the second concave-convex mold 2' is relatively moved toward the first concave-convex mold 1 via the second holding member 32' by the drive unit 3. By doing so, first, the mountain-shaped swelling deformation portion W23 on the second bonding surface W22 of the second work W2 is partially bonded to the first bonding surface W12 of the first work W1.
In the latter half of the subsequent pressurizing step shown in FIG. The bulging deformation portion W23 of the bonding surface W22 and the partial bulging portion 2d of the second curved surface 2a ' are gradually crushed and deformed, and the peripheral portions around the bulging deformation portion W23 are sequentially pressed.
Thereby, the contact area of the second bonding surface W22 with respect to the first bonding surface W12 gradually widens, and finally the entire second bonding surface W22 is pressed against the entire first bonding surface W12.

Further, according to the curved surface work bonding apparatus A2 of the second embodiment shown in FIGS. By holding the second non-molding surface 2c' of the two concave-convex mold 2', the portion pressed by the convex portion 32c on the second curved surface 2a' of the second concave-convex mold 2' is stretched in the thickness direction (Z direction). It swells and deforms.
Therefore, a bulging deformed portion W23 is partially formed on the second bonding surface W22 of the second workpiece W2 following the partial bulging portion 2d of the second curved surface 2a'.
In this bulging deformation state, the first concave-convex mold 1 is relatively moved toward the second concave-convex mold 2, so that the bulging deformation part W23 on the second bonding surface W22 of the second work W2 becomes the first It is partially bonded to the first bonding surface W12 of the work W1.
Subsequent pressurization accompanying the relative movement of the second concave-convex mold 2' to the first concave-convex mold 1 causes the swelling deformation portion W23 of the second bonding surface W22 and the second curved mold surface 2a ' to partially expand. The bulging portion 2d is gradually crushed and deformed, and the peripheral portions centering on the bulging deformation portion W23 are sequentially pressed.
Thereby, the contact area of the second bonding surface W22 with respect to the first bonding surface W12 gradually widens, and finally the entire second bonding surface W22 is pressed against the entire first bonding surface W12.
Therefore, the bonding state of the second bonding surface W22 of the second workpiece W2 to the first bonding surface W12 of the first workpiece W1 having a three-dimensional curved shape can be stabilized at all times.
As a result, the bonding precision can be further improved with stable bonding.
In addition, even if the atmosphere of the bonding operation is atmospheric pressure or vacuum and gas exists between the first bonding surface W12 and the second bonding surface W22, the first bonding surface W12 may As the contact area of the two bonding surfaces W22 gradually widens, the gas is pushed out from between the first bonding surface W12 and the second bonding surface W22. For this reason, no gas remains inside the bonded first bonding surface W12 and the second bonding surface W22, and a bubble-free, high-quality bonding device D can be produced.
As a result, even in an environment where gas exists regardless of whether it is in the air or in a vacuum, it is possible to achieve stable bonding and further improve the bonding accuracy.

Claims (5)

A curved surface work bonding device for bonding a first work and a second work formed in a thin plate shape with a three-dimensional curved surface,
a first concave-convex mold having a first curved surface on which the first non-bonding surface of the first work is detachably held;
a second concave-convex mold having a second curved surface on which the second non-bonding surface of the second work is detachably held;
a driving unit that moves one or both of the first concave-convex mold and the second concave-convex mold relatively closer to each other in the thickness direction of the first workpiece and the second workpiece;
a control unit that controls the operation of the drive unit,
The second curved surface is a transfer surface obtained by duplicating the first curved surface,
The control unit moves the driving unit toward the first workpiece and the second curved surface between the first curved surface of the first concave-convex mold and the second curved surface of the second concave-convex mold. Two works are superimposed in the thickness direction, and the first work and the second work are pressed in the thickness direction so that the first bonding surface of the first work and the second bonding surface of the second work An apparatus for bonding curved surfaces, characterized in that control is performed so that the workpieces are bonded. 2. The apparatus for adhering curved workpieces according to claim 1, wherein said second concave-convex mold is formed with said first concave-convex mold as a copy source by using a replication material having elasticity. 3. The curved work bonding apparatus according to claim 1, wherein said second work is made of a film-like substrate. A second holding member having a second holding surface for holding the second non-molding surface of the second concave-convex mold, wherein the second holding surface protrudes in the thickness direction and contacts the second non-molding surface. and the drive unit causes the second concave-convex mold to move relatively closer to the first concave-convex mold in the thickness direction (Z direction) via the second holding member. 4. The curved surface work bonding apparatus according to claim 2 or 3. A curved surface work bonding method for bonding a first work and a second work formed in a three-dimensional curved thin plate shape,
a molding step in which a second concave-convex mold having a second curved surface is created from a first concave-convex mold having a first curved surface;
The first non-bonding surface of the first work is detachably held on the first curved surface of the first concave-convex mold, and the second workpiece is held on the second curved surface of the second concave-convex mold. A setting step of holding the second non-bonding surface so that the first work and the second work are separated and sandwiched in the thickness direction;
Either one or both of the first concave-convex mold and the second concave-convex mold are moved relatively closer to each other in the thickness direction, and the first work and the second work are overlapped so as to be in contact with each other in the thickness direction, and a pressurizing step of applying pressure to join the first bonding surface of the first work and the second bonding surface of the second work,
A curved surface work bonding method, wherein, in the molding step, the second curved surface is formed as a transfer surface by duplicating the first curved surface.

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