JP2022543078A - 回路基板アセンブリ - Google Patents
回路基板アセンブリ Download PDFInfo
- Publication number
- JP2022543078A JP2022543078A JP2022506543A JP2022506543A JP2022543078A JP 2022543078 A JP2022543078 A JP 2022543078A JP 2022506543 A JP2022506543 A JP 2022506543A JP 2022506543 A JP2022506543 A JP 2022506543A JP 2022543078 A JP2022543078 A JP 2022543078A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- heat sink
- circuit boards
- connectors
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 125000006850 spacer group Chemical group 0.000 claims description 8
- 239000002826 coolant Substances 0.000 claims description 7
- 239000012530 fluid Substances 0.000 claims description 3
- FPWNLURCHDRMHC-UHFFFAOYSA-N 4-chlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1 FPWNLURCHDRMHC-UHFFFAOYSA-N 0.000 abstract description 7
- 238000001816 cooling Methods 0.000 abstract description 4
- 230000013011 mating Effects 0.000 abstract description 4
- JAYCNKDKIKZTAF-UHFFFAOYSA-N 1-chloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1Cl JAYCNKDKIKZTAF-UHFFFAOYSA-N 0.000 abstract description 3
- 101100084627 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) pcb-4 gene Proteins 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
Claims (8)
- 2つの回路基板と、前記2つの回路基板から熱を吸収するように配置されたヒートシンクと、を備え、前記ヒートシンクが、前記2つの回路基板間に位置し、かつ前記2つの回路基板の両方と接触している、回路基板アセンブリにおいて、システムが、前記2つの回路基板間の電気的接続を提供するために、前記ヒートシンクにおける開口部を通って延在する電気ケーブルを備えることを特徴とし、ここにおいて、前記電気ケーブルは、フレキシブル基板上に形成された導電性トレースによって少なくとも部分的に設けられた複数のワイヤを備え、前記フレキシブル基板には、前記フレキシブル基板が前記導電性トレースのうちの1つまたは複数の少なくとも一部をそれぞれ担持する複数の平行なストリップを備えるように、複数の平行なスリットが設けられている、回路基板アセンブリ。
- 前記電気ケーブルは、前記2つの回路基板間のデータ接続を提供する、請求項1に記載の回路システム。
- 前記電気ケーブルは、前記2つの回路基板間の電力接続を提供する、請求項1または2に記載の回路基板アセンブリ。
- 前記電気ケーブルは、前記2つの回路基板のうちの一方の面に設けられた対応するコネクタと電気的接続を行うための基板コネクタを備え、前記基板コネクタは、前記基板コネクタが前記回路基板の前記面と平行または一致する平面に位置して、前記ヒートシンクに対して直交方向に移動することを可能にする接続部を通じて、前記ヒートシンクに取り付けられている、請求項1~3のいずれか一項に記載の回路基板アセンブリ。
- 前記電気ケーブルを前記ヒートシンクに保持するために、前記ケーブルの開口部を貫通する締結具と、前記締結具と前記ケーブルとの間に配置されたスペーサ軸受と、を備え、前記スペーサ軸受は、前記電気ケーブルの前記開口部内に少なくとも部分的に位置する、請求項4に記載の回路基板アセンブリ。
- 前記ヒートシンクは、前記熱交換器を冷却するためのクーラント流体用の経路を提供する内部流路を備える、請求項1~5のいずれか一項に記載の回路基板アセンブリ。
- 複数の前記電気ケーブルを備え、前記電気ケーブルの各々は、第1の回路基板と第2の回路基板との間の電気的接続を提供し、各電気ケーブルが、前記ヒートシンク内の異なる開口部を通って延在する、請求項1~6のいずれか一項に記載の回路基板アセンブリ。
- 前記2つの回路基板のうちの第1の回路基板が、電子走査アレイのアンテナ素子のアレイを提供する回路を担持し、前記2つの回路基板のうちの第2の回路基板が、前記第1の回路基板上の前記回路に電力を供給するために使用される電力回路を担持する、請求項1~7のいずれか一項に記載の回路基板アセンブリ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1910805.9 | 2019-07-29 | ||
GBGB1910805.9A GB201910805D0 (en) | 2019-07-29 | 2019-07-29 | Circuit board assembly |
PCT/EP2020/071252 WO2021018885A1 (en) | 2019-07-29 | 2020-07-28 | Circuit board assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022543078A true JP2022543078A (ja) | 2022-10-07 |
JP7400074B2 JP7400074B2 (ja) | 2023-12-18 |
Family
ID=67990360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022506543A Active JP7400074B2 (ja) | 2019-07-29 | 2020-07-28 | 回路基板アセンブリ |
Country Status (7)
Country | Link |
---|---|
US (1) | US11765835B2 (ja) |
EP (1) | EP4005356A1 (ja) |
JP (1) | JP7400074B2 (ja) |
CA (1) | CA3149109C (ja) |
GB (2) | GB201910805D0 (ja) |
IL (1) | IL290235A (ja) |
WO (1) | WO2021018885A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB201910805D0 (en) | 2019-07-29 | 2019-09-11 | Leonardo Mw Ltd | Circuit board assembly |
WO2022058006A1 (en) * | 2020-09-16 | 2022-03-24 | Leonardo UK Ltd | Circuit board assembly |
GB2619743A (en) * | 2022-06-15 | 2023-12-20 | Aptiv Tech Ltd | An electronic controller unit |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001111262A (ja) * | 1999-10-13 | 2001-04-20 | Canon Inc | ラック装着用基板及びラック装着用基板の実装方法 |
JP2007116217A (ja) * | 2005-10-18 | 2007-05-10 | Hitachi Ltd | ミリ波レーダ装置およびそれを用いたミリ波レーダシステム |
WO2018111460A1 (en) * | 2016-12-13 | 2018-06-21 | Northrop Grumman Systems Corporation | Flexible connector |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3818122A (en) | 1973-05-29 | 1974-06-18 | Schjeldahl Co G T | Flexible printed circuit interconnecting cable |
US5101322A (en) | 1990-03-07 | 1992-03-31 | Motorola, Inc. | Arrangement for electronic circuit module |
UA32456C2 (uk) * | 1996-01-25 | 2000-12-15 | Сіменс Аг | Блок управління, зокрема, для транспортного засобу |
DE29622097U1 (de) * | 1996-12-19 | 1997-02-27 | Siemens AG, 80333 München | Steuergerät, insbesondere für ein Kraftfahrzeug |
DE19647916C2 (de) | 1996-11-20 | 1999-02-18 | Ilfa Industrieelektronik Und L | Leiterplattenanordnung |
US6055157A (en) * | 1998-04-06 | 2000-04-25 | Cray Research, Inc. | Large area, multi-device heat pipe for stacked MCM-based systems |
US6510053B1 (en) | 2000-09-15 | 2003-01-21 | Lucent Technologies Inc. | Circuit board cooling system |
JP3846437B2 (ja) * | 2003-03-17 | 2006-11-15 | 株式会社日立製作所 | 自動車用コントロールユニット |
TW571613B (en) | 2003-04-29 | 2004-01-11 | Quanta Comp Inc | Functional module built-in with heat dissipation fin |
US8505616B2 (en) | 2006-04-20 | 2013-08-13 | The Boeing Company | Hybrid ceramic core cold plate |
US9402303B2 (en) | 2013-06-03 | 2016-07-26 | Apple Inc. | Flexible printed circuit cables with slits |
DE102013212990A1 (de) * | 2013-07-03 | 2015-01-08 | Conti Temic Microelectronic Gmbh | Flachbandkabel für Fahrzeugkameras |
JP5969645B1 (ja) * | 2015-03-16 | 2016-08-17 | 日本メクトロン株式会社 | フレキシブルプリント配線板 |
US10034375B2 (en) * | 2015-05-21 | 2018-07-24 | Apple Inc. | Circuit substrate with embedded heat sink |
US10382659B2 (en) * | 2016-07-05 | 2019-08-13 | Hanwha Techwin Co., Ltd. | Surveillance camera system |
DE102016213697A1 (de) * | 2016-07-26 | 2018-02-01 | Zf Friedrichshafen Ag | Leiterplattenanordnung |
DE102017200817A1 (de) | 2017-01-19 | 2018-07-19 | Conti Temic Microelectronic Gmbh | Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera |
GB201910805D0 (en) | 2019-07-29 | 2019-09-11 | Leonardo Mw Ltd | Circuit board assembly |
-
2019
- 2019-07-29 GB GBGB1910805.9A patent/GB201910805D0/en not_active Ceased
-
2020
- 2020-07-28 US US17/631,536 patent/US11765835B2/en active Active
- 2020-07-28 CA CA3149109A patent/CA3149109C/en active Active
- 2020-07-28 WO PCT/EP2020/071252 patent/WO2021018885A1/en active Application Filing
- 2020-07-28 EP EP20750205.5A patent/EP4005356A1/en active Pending
- 2020-07-28 JP JP2022506543A patent/JP7400074B2/ja active Active
- 2020-07-28 GB GB2011674.5A patent/GB2589410B/en active Active
-
2022
- 2022-01-30 IL IL290235A patent/IL290235A/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001111262A (ja) * | 1999-10-13 | 2001-04-20 | Canon Inc | ラック装着用基板及びラック装着用基板の実装方法 |
JP2007116217A (ja) * | 2005-10-18 | 2007-05-10 | Hitachi Ltd | ミリ波レーダ装置およびそれを用いたミリ波レーダシステム |
WO2018111460A1 (en) * | 2016-12-13 | 2018-06-21 | Northrop Grumman Systems Corporation | Flexible connector |
Also Published As
Publication number | Publication date |
---|---|
GB2589410A (en) | 2021-06-02 |
CA3149109C (en) | 2024-02-13 |
US11765835B2 (en) | 2023-09-19 |
CA3149109A1 (en) | 2021-02-04 |
GB2589410B (en) | 2022-06-01 |
JP7400074B2 (ja) | 2023-12-18 |
GB201910805D0 (en) | 2019-09-11 |
WO2021018885A1 (en) | 2021-02-04 |
EP4005356A1 (en) | 2022-06-01 |
US20220272846A1 (en) | 2022-08-25 |
GB202011674D0 (en) | 2020-09-09 |
IL290235A (en) | 2022-03-01 |
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