JP2022512292A5 - - Google Patents

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Publication number
JP2022512292A5
JP2022512292A5 JP2021524054A JP2021524054A JP2022512292A5 JP 2022512292 A5 JP2022512292 A5 JP 2022512292A5 JP 2021524054 A JP2021524054 A JP 2021524054A JP 2021524054 A JP2021524054 A JP 2021524054A JP 2022512292 A5 JP2022512292 A5 JP 2022512292A5
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JP
Japan
Prior art keywords
defects
class
attribute
belonging
subset
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JP2021524054A
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English (en)
Japanese (ja)
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JP2022512292A (ja
JPWO2020129041A5 (https=
JP7254921B2 (ja
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Priority claimed from US16/228,676 external-priority patent/US11321633B2/en
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JP2021524054A 2018-12-20 2019-11-24 半導体試料の欠陥の分類 Active JP7254921B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/228,676 2018-12-20
US16/228,676 US11321633B2 (en) 2018-12-20 2018-12-20 Method of classifying defects in a specimen semiconductor examination and system thereof
PCT/IL2019/051284 WO2020129041A1 (en) 2018-12-20 2019-11-24 Classifying defects in a semiconductor specimen

Publications (4)

Publication Number Publication Date
JP2022512292A JP2022512292A (ja) 2022-02-03
JPWO2020129041A5 JPWO2020129041A5 (https=) 2022-08-30
JP2022512292A5 true JP2022512292A5 (https=) 2022-08-30
JP7254921B2 JP7254921B2 (ja) 2023-04-10

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JP2021524054A Active JP7254921B2 (ja) 2018-12-20 2019-11-24 半導体試料の欠陥の分類

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US (1) US11321633B2 (https=)
JP (1) JP7254921B2 (https=)
KR (1) KR102530950B1 (https=)
CN (1) CN112805719B (https=)
TW (1) TWI791930B (https=)
WO (1) WO2020129041A1 (https=)

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CN110286279B (zh) * 2019-06-05 2021-03-16 武汉大学 基于极端树与堆栈式稀疏自编码算法的电力电子电路故障诊断方法
US11379969B2 (en) * 2019-08-01 2022-07-05 Kla Corporation Method for process monitoring with optical inspections
US11568317B2 (en) 2020-05-21 2023-01-31 Paypal, Inc. Enhanced gradient boosting tree for risk and fraud modeling
TWI770817B (zh) * 2021-02-09 2022-07-11 鴻海精密工業股份有限公司 瑕疵檢測方法、電子裝置及存儲介質
CN119359475A (zh) * 2024-12-23 2025-01-24 济南农智信息科技有限公司 一种边坡土壤肥力预测方法

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US20030204507A1 (en) 2002-04-25 2003-10-30 Li Jonathan Qiang Classification of rare events with high reliability
JP4118703B2 (ja) * 2002-05-23 2008-07-16 株式会社日立ハイテクノロジーズ 欠陥分類装置及び欠陥自動分類方法並びに欠陥検査方法及び処理装置
US7756320B2 (en) 2003-03-12 2010-07-13 Hitachi High-Technologies Corporation Defect classification using a logical equation for high stage classification
JP4443270B2 (ja) 2003-03-12 2010-03-31 株式会社日立ハイテクノロジーズ 欠陥分類方法
US20090097741A1 (en) * 2006-03-30 2009-04-16 Mantao Xu Smote algorithm with locally linear embedding
JP5156452B2 (ja) * 2008-03-27 2013-03-06 東京エレクトロン株式会社 欠陥分類方法、プログラム、コンピュータ記憶媒体及び欠陥分類装置
CN102095731A (zh) * 2010-12-02 2011-06-15 山东轻工业学院 在纸张缺陷视觉检测中识别不同缺陷类型的系统及方法
TWI574136B (zh) * 2012-02-03 2017-03-11 應用材料以色列公司 基於設計之缺陷分類之方法及系統
US9224104B2 (en) * 2013-09-24 2015-12-29 International Business Machines Corporation Generating data from imbalanced training data sets
US9489599B2 (en) * 2013-11-03 2016-11-08 Kla-Tencor Corp. Decision tree construction for automatic classification of defects on semiconductor wafers
US9286675B1 (en) * 2014-10-23 2016-03-15 Applied Materials Israel Ltd. Iterative defect filtering process
CN104458755B (zh) * 2014-11-26 2017-02-22 吴晓军 一种基于机器视觉的多类型材质表面缺陷检测方法
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