JP2022507554A - 一体化センサカートリッジのための装置及び方法 - Google Patents
一体化センサカートリッジのための装置及び方法 Download PDFInfo
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- JP2022507554A JP2022507554A JP2021526606A JP2021526606A JP2022507554A JP 2022507554 A JP2022507554 A JP 2022507554A JP 2021526606 A JP2021526606 A JP 2021526606A JP 2021526606 A JP2021526606 A JP 2021526606A JP 2022507554 A JP2022507554 A JP 2022507554A
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Abstract
Description
本出願は、2018年11月15日に出願された米国仮特許出願第62/767,998号の優先権を主張し、その内容の全てを援用する。
210において、プリント回路基板(PCB)を提供する。
220において、PCBに生物チップを取り付ける。
230において、生物チップとPCBの間のワイヤ結合を形成する。
240において、マイクロ流体筐体を提供する。
250において、第1と第2の接着層を配置する。
260において、生物チップとPCB上にマイクロ流体筐体を取り付ける。
270において、接着層を硬化する。
これらのプロセスは、以下に詳細に記載される。
Claims (41)
- PCB(プリント回路基板)と、
前記PCB上にある生物チップと、
前記生物チップと前記PCB上にあるマイクロ流体筐体であって、前記マイクロ流体筐体は、注入口と、排出口と、第1の空洞とを有し、前記マイクロ流体筐体は、前記第1の空洞に隣接する内側側壁を有し、前記内側側壁は、第1の接着層を用いて前記生物チップに取り付けられ、フローセルを形成し、前記マイクロ流体筐体は、第2の接着層を用いて前記PCBに取り付けられた外側側壁を有する、マイクロ流体筐体とを備え、
前記外側側壁の下面と前記PCBの間の距離は、前記内側側壁の下面と前記生物チップの間の距離より大きく、
前記第2の接着層は、前記第1の接着層より厚く、
前記第1の接着層は、第1の接着材料を含み、
前記第2の接着層は、第2の接着材料を含む、マイクロ流体装置。 - 前記第1の接着材料は、硬化前に固体であり、実質的に硬化後にその厚さを維持し、前記マイクロ流体装置の高さの正確性と均一性を提供し、
前記第2の接着材料は、硬化前に液体であり、前記外側側壁の下面と前記PCBの間の距離の変動を調整する、請求項1に記載の装置。 - 前記第2の接着材料は、前記第1の接着材料より硬化収縮が大きい、請求項2に記載の装置。
- 前記第1の接着材料は、ダイアタッチフィルム(DAF)を含み、
前記第2の接着材料は、液体エポキシを含む、請求項2に記載の装置。 - 前記第1の接着材料は、硬化後適合する接着剤であり、操作の間、熱サイクルを通して、前記生物チップと前記マイクロ流体筐体の間の不一致の熱膨張を調整し、
前記第2の接着材料は、硬化前に液体形態である、請求項1に記載の装置。 - 前記第1の接着材料は、適合するウレタン接着材料を含み、
前記第2の接着材料は、液体エポキシを含む、請求項5に記載の装置。 - 前記第1の接着材料は、感圧接着剤(PSA)を含み、
前記第2の接着材料は、液体エポキシを含む、請求項5に記載の装置。 - 前記第1の接着材料と前記第2の接着材料は、例えば熱、水分または紫外線照射硬化など、異なる硬化プロセスによって硬化される、請求項1に記載の装置。
- 前記生物チップは、生物センサチップを含む、請求項1に記載の装置。
- 前記マイクロ流体筐体は、前記生物チップと前記PCBを結合する結合ワイヤを収容する前記内側側壁と前記外側側壁の間の第2の空洞の1またはそれ以上を備える、請求項1に記載の装置。
- さらに前記PCBに前記生物チップを取り付けるダイアタッチ接着層を備える、請求項1に記載の装置。
- さらに、前記PCBに取り付けられる第2の生物チップを備える、請求項1乃至11のいずれか1項に記載の装置。
- 前記第2の生物チップは、バイオセンサを備える、請求項12に記載の装置。
- 前記第2の生物チップは、流体液滴生成装置を備える、請求項12に記載の装置。
- 前記PCBに取り付けられる集積回路チップを備える、請求項1乃至11のいずれか1項に記載の装置。
- 前記集積回路チップは、プロセッサを備える、請求項15に記載の装置。
- さらに前記PCBに取り付けられるMEMSチップを備える、請求項1乃至11のいずれか1項に記載の装置。
- 前記MEMSチップは、前記生物チップに検出された信号に応答して動作を開始するアクチュエータを備える、請求項17に記載の装置。
- 前記第2の接着層は、前記第1の接着層の気密試験のための開口を備える、請求項1に記載の装置。
- 前記マイクロ流体筐体は、前記第1の接着層の気密試験のための開口を備える、請求項1に記載の装置。
- PCB(プリント回路基板)と、
前記PCB上にある生物チップと、
前記生物チップと前記PCB上にあるマイクロ流体筐体と、
第1の接着層と第2の接着層であって、前記第1の接着層は、前記生物チップに前記マイクロ流体筐体を取り付け、前記第2の接着層は、前記PCBに前記マイクロ流体筐体を取り付け、前記第2の接着層は、前記第1の接着層より厚い、第1の接着層と第2の接着層と、を備え、
前記第1の接着層は、第1の接着材料を含み、前記第2の接着層は、第2の接着材料を含む、マイクロ流体装置。 - 前記マイクロ流体筐体は、注入口と、排出口と、第1の空洞とを備え、
前記マイクロ流体筐体は、前記第1の空洞に隣接する内側側壁を有し、
前記内側側壁は、前記第1の接着層を用いて前記生物チップに取り付けられ、フローセルを形成し、
前記マイクロ流体筐体は、第2の接着層を用いて前記PCBに取り付けられる外側側壁を有する、請求項21に記載の装置。 - 前記第1の接着材料は、硬化前に固体であり、実質的に硬化後のその厚さを維持して前記マイクロ流体装置の高さの正確性と均一性を提供し、
前記第2の接着材料は、硬化前に液体であり、前記外側側壁の下面と前記PCBの間の距離の変動を調整する、請求項22に記載の装置。 - 前記第1の接着材料は、ダイアタッチフィルム(DAF)を含み、
前記第2の接着材料は、液体エポキシを含む、請求項23に記載の装置。 - 前記第2の接着材料は、前記第1の接着材料より硬化収縮が大きい、請求項23に記載の装置。
- 前記第1の接着材料は、硬化後に適合する接着材であり、操作の間、熱サイクルを通して生物チップと前記マイクロ流体筐体の間の不均一な熱膨張を調整し、
前記第2の接着材料は、硬化前に液体形態である、請求項21に記載の装置。 - 前記第1の接着材料は、適合するウレタン接着材料を含み、
前記第2の接着材料は、液体エポキシを含む、請求項26に記載の装置。 - 前記第1の接着材料は、感圧接着剤(PSA)を含み、
前記第2の接着剤は、液体エポキシを含む、請求項26に記載の装置。 - マイクロ流体装置を作る方法であって、
PCB(プリント回路基板)を提供するステップと、
前記PCBに生物チップを取り付けるステップと、
マイクロ流体筐体を提供するステップと、
第1と第2の接着材料を堆積するステップであって、前記第1の接着材料は、前記生物チップに前記マイクロ流体筐体を取り付け、前記第2の接着材料は、前記PCBに前記マイクロ流体筐体を取り付け、前記第2の接着材料は、硬化前に液体形態である、第1と第2の接着材料を堆積するステップと、
前記第1の接着材料を用いて前記生物チップに前記マイクロ流体筐体を取り付け、前記第2の接着材料を用いて前記PCBに前記マイクロ流体筐体を取り付けるステップと、
前記第1と第2の接着材料を硬化して、それぞれ第1と第2の接着層を形成するステップであって、前記第2の接着層は、前記第1の接着層より厚い、第1と第2の接着層を形成するステップと、を備える方法。 - 前記マイクロ流体筐体は、注入口と、排出口と、第1の空洞とを備え、
前記マイクロ流体筐体は、前記第1の空洞に隣接する内側側壁を有し、
前記内側側壁は、第1の接着層を用いて前記生物チップに取り付けられ、フローセルを形成し、
前記マイクロ流体筐体は、第2の接着層を用いて前記PCBに取り付けられた外側側壁を有する、請求項29に記載の方法。 - 前記第1の接着材料は、硬化前に固体であり、実質的に硬化後にその厚さを維持し、前記マイクロ流体装置の高さの正確性と均一性を提供し、
前記第2の接着材料は、硬化前に液体であり、前記外側側壁の下面と前記PCBの間の距離の変動を調整する、請求項30に記載の方法。 - 前記第1の接着材料は、ダイアタッチフィルム(DAF)を含み、
前記第2の接着材料は、液体エポキシを含む、請求項31に記載の方法。 - 前記第2の接着材料は、前記第1の接着材料より硬化収縮が大きい、請求項31に記載の方法。
- 前記第1の接着材料は、硬化後に適合する接着剤であり、操作の間、熱サイクルを通して生物チップと前記マイクロ流体筐体の間の不一致の熱膨張を調整し、
前記第2の接着材料は、硬化前に液体形態である、請求項29に記載の方法。 - 前記第1の接着材料は、適合するウレタン接着材料を含み、
前記第2の接着材料は、液体エポキシを含む、請求項34に記載の方法。 - 前記第1の接着材料は、感圧接着剤(PSA)を含み、
前記第2の接着材料は、液体エポキシを含む、請求項34に記載の方法。 - さらに、前記マイクロ流体筐体を取り付ける前に、前記PCBに第2の生物チップを取り付けるステップを備える、請求項29に記載の方法。
- さらに、前記マイクロ流体筐体に取り付ける前に、前記PCBに集積回路チップを取り付けるステップを備える、請求項29に記載の方法。
- さらに前記マイクロ流体筐体を取り付ける前に、前記PCBにMEMSチップを取り付けるステップを備える、請求項29に記載の方法。
- さらに前記第1の接着層の気密試験のために前記第2の接着層に開口を形成するステップを備える、請求項29に記載の方法。
- さらに前記第1の接着層の気密試験のために前記マイクロ流体筐体に開口を形成するステップを備える、請求項29に記載の方法。
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US20210402391A1 (en) | 2021-12-30 |
JP7423626B2 (ja) | 2024-01-29 |
SG11202104209VA (en) | 2021-05-28 |
EP3880784A4 (en) | 2022-08-17 |
EP3880784A1 (en) | 2021-09-22 |
TW202043450A (zh) | 2020-12-01 |
WO2020098761A1 (en) | 2020-05-22 |
CN113039263A (zh) | 2021-06-25 |
CA3119950A1 (en) | 2020-05-22 |
JP2024050640A (ja) | 2024-04-10 |
AU2019381255A1 (en) | 2021-05-20 |
KR20210092777A (ko) | 2021-07-26 |
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