JP2022501641A - 光学材料を結合するロバストな方法 - Google Patents
光学材料を結合するロバストな方法 Download PDFInfo
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- 239000000463 material Substances 0.000 title claims abstract description 121
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- 238000000034 method Methods 0.000 claims description 38
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 claims description 32
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 claims description 32
- 239000000919 ceramic Substances 0.000 claims description 17
- 239000013078 crystal Substances 0.000 claims description 12
- 230000008878 coupling Effects 0.000 claims description 11
- 238000010168 coupling process Methods 0.000 claims description 11
- 238000005859 coupling reaction Methods 0.000 claims description 11
- 229910017109 AlON Inorganic materials 0.000 claims description 5
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- 229910052779 Neodymium Inorganic materials 0.000 claims description 4
- 239000002019 doping agent Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 claims description 4
- 229910052594 sapphire Inorganic materials 0.000 claims description 4
- 239000010980 sapphire Substances 0.000 claims description 4
- 229910052596 spinel Inorganic materials 0.000 claims description 3
- 239000011029 spinel Substances 0.000 claims description 3
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- 229910052727 yttrium Inorganic materials 0.000 claims 6
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims 6
- 241001269524 Dura Species 0.000 claims 2
- 244000245420 ail Species 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
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- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
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- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
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- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
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- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
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- 229910052751 metal Inorganic materials 0.000 description 1
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- 150000002739 metals Chemical class 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
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- 238000005498 polishing Methods 0.000 description 1
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- 229910052566 spinel group Inorganic materials 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
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- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
- B29C66/472—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially flat
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- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
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- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
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- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
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- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
- H01S3/16—Solid materials
- H01S3/1601—Solid materials characterised by an active (lasing) ion
- H01S3/1603—Solid materials characterised by an active (lasing) ion rare earth
- H01S3/1618—Solid materials characterised by an active (lasing) ion rare earth ytterbium
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- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
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- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
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Abstract
Description
Claims (20)
- 光学素子であって、
第1の端部および対向する第2の端部を有する光学材料と、
前記光学材料内に配置された複数のマイクロチャネルと、
を有し、
前記複数のマイクロチャネルのマイクロチャネルの各々は、前記光学材料の前記第1の端部から前記第2の端部まで延在する、光学素子。 - 前記光学材料は、単結晶の未ドープイットリウムアルミニウムガーネット(YAG)、セラミックの未ドープYAG、単結晶のドープ化YAG、セラミックのドープ化YAG、サファイア、スピネル、イットリア、ナノ複合体光学セラミックス(NCOC)、酸窒化アルミニウム(AlON)、またはこれらの組み合わせを含む、請求項1に記載の光学素子。
- 前記単結晶のドープ化YAGおよびセラミックドープ化YAGの各々は、活性ドーパントとして、ネオジム、または(Nd:YAG)、またはイッテルビウム(Yb:YAG)を含む、請求項2に記載の光学素子。
- 前記複数のマイクロチャネルは、約10から約600nmの深さを有する、請求項1に記載の光学素子。
- 前記複数のマイクロチャネルは、約10から約2000μmのピッチを有する、請求項1に記載の光学素子。
- 当該光学素子は、平坦な導波管、プリズム、またはビームスプリッタである、請求項1に記載の光学素子。
- 光学素子であって、
第1の平坦面および対向する第2の平坦面を有する光学材料と、
前記光学材料内に配置された複数のマイクロチャネルと、
を有し、
前記複数のマイクロチャネルのマイクロチャネルの各々は、前記光学材料の少なくとも前記第1の平坦面の端部まで延在する、光学素子。 - 前記光学材料は、単結晶の未ドープイットリウムアルミニウムガーネット(YAG)、セラミックの未ドープYAG、単結晶のドープ化YAG、セラミックのドープ化YAG、サファイア、スピネル、イットリア、ナノ複合体光学セラミックス(NCOC)、酸窒化アルミニウム(AlON)、またはこれらの組み合わせを含む、請求項7に記載の光学素子。
- 前記単結晶のドープ化YAGおよびセラミックドープ化YAGの各々は、活性ドーパントとして、ネオジム、または(Nd:YAG)、またはイッテルビウム(Yb:YAG)を含む、請求項8に記載の光学素子。
- 前記複数のマイクロチャネルは、約10から約600nmの深さを有する、請求項7に記載の光学素子。
- 前記複数のマイクロチャネルは、約10から約2000μmのピッチを有する、請求項7に記載の光学素子。
- 当該光学素子は、平坦な導波管、プリズム、ビームスプリッタ、または端部結合窓である、請求項7に記載の光学素子。
- 光学素子を製造する方法であって、
第1の材料部分および第2の材料部分を提供するステップと、
前記第1の材料部分の表面に、複数のマイクロチャネルを形成するステップと、
前記第1の材料部分の前記複数のマイクロチャネルが、前記第1の材料部分と前記第2の材料部分の間の界面に配置されるように、前記第1の材料部分を前記第2の材料部分に接触させ、結合を形成するステップと、
を有する、方法。 - さらに、前記第1の材料部分を前記第2の材料部分と接触させるステップの後、約1000から約2000℃の温度で、熱を印加するステップを有する、請求項13に記載の方法。
- さらに、前記複数のマイクロチャネルを形成するステップは、コンタクトマスキング、リソグラフィパターン処理、イオンミル処理、化学エッチング処理、プラズマエッチング処理、またはこれらの組み合わせを有する、請求項13に記載の方法。
- 前記第1の材料部分および前記第2の材料部分は、各々、単結晶の未ドープイットリウムアルミニウムガーネット(YAG)、セラミックの未ドープYAG、単結晶のドープ化YAG、セラミックのドープ化YAG、サファイア、スピネル、イットリア、ナノ複合体光学セラミックス(NCOC)、酸窒化アルミニウム(AlON)、またはこれらの組み合わせを含む、請求項13に記載の方法。
- 前記単結晶のドープ化YAGおよびセラミックドープ化YAGの各々は、活性ドーパントとして、ネオジム、または(Nd:YAG)、またはイッテルビウム(Yb:YAG)を含む、請求項16に記載の方法。
- 前記複数のマイクロチャネルは、約10から約600nmの深さを有する、請求項13に記載の方法。
- 前記複数のマイクロチャネルは、約10から約2000μmのピッチを有する、請求項13に記載の方法。
- 前記光学素子は、平坦な導波管、プリズム、ビームスプリッタ、または端部結合窓である、請求項13に記載の方法。
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