JP2022187884A - Electronic control device and method for manufacturing electronic control device - Google Patents

Abstract

To provide an electronic control device which achieves both improvement of connection quality and reliability, and a method for manufacturing an electronic control device.SOLUTION: A substrate of an electronic control device has a third electrode arranged at a position opposite to the outer peripheral part of a first electronic component, and a spread preventive part which is formed between the third electrode and a second electrode and suppresses spread of a resin, wherein a solder material of the third electrode and the first electronic component are connected to each other by a resin agent. The manufacturing method thereof includes: a first step of arranging a solder material on the second electrode and the third electrode; a second step of connecting a solder ball and the solder material by heating and melting; and a third step of connecting the solder material on the third electrode and the first electronic component by a resin agent.SELECTED DRAWING: Figure 1

Description

The present invention relates to an electronic control device and a method of manufacturing an electronic control device.

In recent years, with the aim of miniaturizing, increasing the density and increasing the functionality of electronic equipment, miniaturization and increasing the density are required for semiconductor devices. Area array type package type semiconductor devices are widely used. Under these circumstances, for example, in the case of BGA, since it is necessary to adopt a double-sided mounting configuration under the condition that the restriction of component arrangement becomes severe, the structure is being improved day by day.

As a background art of the present invention, in Patent Document 1 below, in connection between a BGA package and a wiring board, one end of a reinforcing member is inserted into a positioning hole of a reinforcing pad arranged around an electrode of the BGA package and soldered. A technique is disclosed in which the side surface of the BGA package is adhesively bonded to the side surface of the other end of the reinforcing member.

Japanese Patent No. 3214486

Patent Document 1 mentions the relaxation of the stress applied to the solder bumps at the outermost corners, but does not mention the second reflow process when a BGA package is mounted on the back surface of the substrate. Since the reinforcing member inserted into the positioning hole is connected by soldering, it is not considered that the solder in the positioning hole is remelted in the second reflow process and the BGA package falls.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide an electronic control device and a method of manufacturing an electronic control device that achieve both improved connection quality and improved reliability.

The electronic control device of the present invention is an electronic control device in which a first electronic component having a first electrode on one surface and a substrate having a second electrode disposed corresponding to the first electrode are connected by a solder material. In the control device, the substrate includes a third electrode arranged at a position facing an outer peripheral portion of the first electronic component, and a substrate formed between the third electrode and the second electrode. a spread preventing portion for suppressing spread of the resin in the third electrode, the solder material is printed on the third electrode, and the solder material printed on the third electrode and the first electronic component are made of resin connected by an agent.
A method of manufacturing an electronic control device according to the present invention includes a first electronic component having a first electrode on one surface, a second electrode corresponding to the first electrode, and a third electrode arranged adjacent to the second electrode. A method of manufacturing an electronic control device comprising: a substrate having a spread prevention portion between it and an electrode, wherein a first step of disposing a solder material on the second electrode and the third electrode; a second step in which the solder ball arranged on one electrode and the solder material on the second electrode are heated and melted to make a solder connection; and the solder material on the third electrode and the first electronic component. and a third step of connecting with a resin agent.

ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the electronic control apparatus and electronic control apparatus which made both the improvement of connection quality and the improvement of reliability compatible can be provided.

1 is a cross-sectional view of an electronic control unit according to a first embodiment of the invention; FIG. 2 is a cross-sectional view of the wiring board 1 and the package 2 of the electronic control device of FIG. 1 before solder connection; FIG. It is a figure showing the manufacturing process of the electronic control unit which concerns on 1st Embodiment. FIG. 2 is a plan view of the electronic control unit of FIG. 1; It is the 1st modification of FIG. FIG. 5 is a second modification of FIG. 4; It is the 3rd modification of FIG. It is a cross-sectional view of an electronic control unit according to a second embodiment. FIG. 9 is a cross-sectional view of the electronic control unit resin-connected in FIG. 8 ; It is a top view of the electronic control unit which concerns on 3rd Embodiment. It is a modification of FIG. It is a sectional view of the electronic control unit concerning a 4th embodiment.

Embodiments of the present invention will be described below with reference to the drawings. The following description and drawings are examples for explaining the present invention, and are appropriately omitted and simplified for clarity of explanation. The present invention can also be implemented in various other forms. Unless otherwise specified, each component may be singular or plural.

The position, size, shape, range, etc. of each component shown in the drawings may not represent the actual position, size, shape, range, etc., in order to facilitate understanding of the invention. As such, the present invention is not necessarily limited to the locations, sizes, shapes, extents, etc., disclosed in the drawings.

(Configuration of First Embodiment and Electronic Control Unit)
1 and 2 are cross-sectional views of an electronic control unit according to a first embodiment of the present invention.

The electronic control device 100 includes a wiring board 1 (hereinafter referred to as substrate 1), a semiconductor package 2 (hereinafter referred to as package 2) having a semiconductor element and an area array type connection structure, a semiconductor element side electrode 3 (hereinafter referred to as electrode 3), and a substrate side electrode 4. (electrodes 4 hereinafter), solder bumps 7 , dummy wirings 8 , solder material 9 , and resin agent 10 are provided. The solder bumps 7 are solder balls 5 (see FIG. 2) before the electrodes 4 of the substrate 1 and the electrodes 3 of the package 2 are connected.

The package 2, which is a package type semiconductor device, has, for example, a BGA and CSP structure, and is an electronic component that electrically connects corresponding electrodes of the substrate 1 and the package 2 by soldering.

In the configuration of the present invention, the package 2 has a plurality of electrodes 3 on the lower side of the paper, and the electrodes 3 are provided with solder balls 5 (see FIG. 2). The electrodes 3 and the solder balls 5 are formed on one surface of the package 2 with a constant size and area, and are arranged side by side at a constant pitch.

In the package 2, a Si chip, which is a semiconductor element, is connected to an interposer (upper surface of the package 2) by, for example, wires. is molded with resin.

The substrate 1 has electrodes 4a on one surface at positions corresponding to the electrodes 3 and facing the electrodes 3 and solder balls 5 provided on the package 2 . Further, electrodes 4 b for resin connection with the package 2 are provided on the substrate 1 at positions facing the outer periphery of the package 2 and not facing the electrodes 3 and the solder balls 5 . Two electrodes 4b are arranged on the substrate 1 at positions facing each other with the electrode 4a interposed therebetween.

In the substrate 1, a dummy wiring 8 that is not electrically connected to the package 2 is provided between the electrode 4b and the adjacent electrode 4a. The dummy wiring 8 is a dummy land for bonding and fixing by adhesion, not by soldering. Like the electrodes 3, the electrodes 4a have a constant size and area, and are formed at constant pitch intervals.

The electrodes 4a and 4b are provided with solder paste 6, which is a solder material. The solder paste 6 printed on the electrode 4b becomes a solder material 9 at the time of soldering, and functions as a resin connection with the package 2. FIG. Also, the solder paste 6 is a solder material that functions as solder for the solder balls 5 provided on the surfaces of the electrodes 3 facing each other. As a result, when the substrate 1 and the package 2 are soldered to form the solder bumps 7, which are the solder joints, the possibility that the adjacent solder bumps 7 are erroneously joined together is reduced, and the solder joints are normally made. I'm trying

In the reflow process, the solder balls 5 and the solder paste 6 are joined to form solder bumps 7 . At this time, not only the electrode 4a but also the solder paste 6 formed on the electrode 4b is melted, forming a solder material 9 on the electrode 4b. A resin agent 10 is formed between the solder material 9 on the electrode 4 b and the package 2 . At this time, the resin agent 10 is formed between the electrode 4b and the dummy wiring 8 on the substrate 1. Next, as shown in FIG. Although the substrate 1 and the package 2 are connected by resin, the resin agent 10 does not adhere to the solder bumps 7 .

Although not shown, when the package 2 is mounted on the back side (lower side of the page) of the substrate 1, the solder bumps 7 are re-melted by reflowing in the same manner as the front side (upper side of the page) of the substrate 1. At this time, since the conventional connection structure does not have a portion that contacts the resin agent 10 , the package 2 is held only by the surface tension of the solder bumps 7 . With such a configuration, for example, in the case of the package 2 to which a heat sink or the like is attached, the connection shape of the solder bumps 7 may be deformed due to the large weight of the package 2 , resulting in unbonded solder bumps 7 . Furthermore, there is a possibility that the package 2 will drop due to the vibration of the reflow furnace and the large load such as the air volume.

Therefore, in the structure in which the resin agent 10 is formed between the substrate 1 and the package 2 at two opposing locations of the package 2 as in the present invention, when the substrate 1 is reflowed for the second time, the package 2 does not adhere to the substrate 1 . Even if reflow is performed in the reverse direction while being on the back side of the paper (lower side of the paper surface), the substrate 1 and the package 2 are connected by the resin agent 10, so deformation and unbonded state of the solder bumps 7 during remelting are suppressed. can do.

In addition, by adopting the present invention, it is possible to prevent the package 2 from dropping without machining parts or adding processes. In addition, according to the present invention, any kind of resin agent (adhesive) 10 does not affect the reliability of solder joints, which contributes to flexibility in the materials used.

In addition, the dummy wiring 8 and the solder material 9 that are not connected to the package 2 can prevent the resin agent 10 from entering the solder bump 7 side (solder joint side) and fix the package 2 with the resin. It can be fixed to the substrate 1.

When the solder paste 6 printed on the electrode 4b with the same thickness as the solder paste 6 formed on the electrode 4a becomes the solder material 9, the height thereof may be insufficient, but the chip solder material is used as the electrode. The height can be adjusted by mounting it on the solder paste 6 on 4b and heating and melting it. As a result, the connection between the substrate 1 and the resin agent 10 can be facilitated, and the connection accuracy of the resin agent 10 can be improved.

FIG. 3 is a diagram showing the manufacturing process of the electronic control device according to the first embodiment.

In FIG. 3(a), electrodes 4a having the same size and area are provided on one surface of the substrate 1 at regular pitches. Further, the electrode 4b is located on the substrate 1 so as to face the outer peripheral portion of the package 2. As shown in FIG. A dummy wiring 8 is provided between the electrodes 4a and 4b.

In FIG. 3B, as a first step, a solder paste 6 is formed on the electrodes 4a and 4b on the substrate 1 as facing solder. The solder paste 6 may be formed by printing or applied by a dispenser, and the forming method is not limited to these. Moreover, the composition of the solder paste 6 is preferably a composition that is advantageous for thermal fatigue life from the viewpoint of bondability, productivity, and reliability of electronic components other than the package 2 mounted on the substrate 1 . However, it is not limited to this, and may have the same composition as the solder balls 5 preliminarily formed on the package 2 .

In FIG. 3(c), the package 2 having the electrodes 3 and the solder balls 5 arranged at positions corresponding to the positions where the solder paste 6 is formed on the substrate 1 is mounted by a mounting machine (not shown). be.

In FIG. 3D, as a second step, the package 2 and the wiring substrate 1 are heat-bonded using a reflow furnace or the like. By heating and melting the solder ball 5 on the electrode 3 and the solder paste 6 on the electrode 4a, a solder bump 7, which is a solder joint, is formed. The solder bumps 7 are solidified by cooling, and the package 2 and the substrate 1 are electrically connected through the solder bumps 7 . At this time, the solder paste 6 on the electrode 4b is similarly heated and melted to form a solder material 9, which is formed so as not to have a height higher than that of the solder bump 7. FIG.

In FIG. 3E, as a third step, the solder material 9 on the electrode 4b and the package 2 are connected and fixed with a resin agent 10. In FIG. Even if the resin agent 10 spreads over the surface of the substrate 1, the provision of the dummy wiring 8 prevents the resin agent 10 from spreading toward the electrodes 4a and prevents the solder bumps 7 and the resin agent 10 from coming into contact with each other. Further, forming the dummy wiring 8 on the substrate 1 for preventing spreading has the effect of suppressing spreading of the resin agent 10 on the substrate 1 without requiring an additional member.

4 is a plan view of the electronic control unit of FIG. 1. FIG. FIG. 4 is a see-through view of the substrate 1 and the package 2 overlapping each other, and the electrode 3 overlaps the electrode 4a of the substrate 1. As shown in FIG.

Electrodes 4 are formed on the substrate 1 on which the package 2 is mounted so as to correspond to the electrodes 3 . The electrodes 4a are similarly arranged in a circular shape so as to correspond to the circular electrodes 3 provided on the lower surface of the package 2 . The size of the electrode 4a may be the same as that of the electrode 3, or may not be the same from the viewpoint of production, and may be appropriately designed.

Electrodes 4b are formed on the substrate 1 at the central portions of two opposite sides of the outer periphery of the package 2, respectively. A resin agent 10 is formed between the solder material 9 (not shown) on the electrode 4b and the package 2. As shown in FIG.

5 to 7 are first to third modifications of FIG. 4, respectively.

As shown in FIG. 4, the electrodes 4b are arranged at two opposing locations in the central portion of the outer periphery of the package 2 and are formed to have the same size as the electrodes 4a, but are not limited to this shape. . For example, the electrodes 4b may be arranged at two opposing locations on the outer periphery of the package 2 and not at the central portions of the opposing sides (see FIG. 6). Moreover, the size of the electrode 4b may be the same as that of the electrode 4a, or may be larger or smaller. Further, the shape of the electrode 4b can be circular, elliptical, square or rectangular (see FIGS. 5 and 6). Also, for high-density mounting, it is possible to dispose the electrode 4b within the area of the package 2 at a position that does not affect the connecting portion of the electrode 4a (see FIG. 7).

By reducing the size and pitch of the solder bumps 7, a large number of electrodes 3 and 4 can be arranged within a certain area. This is advantageous for downsizing and increasing the density of a semiconductor device including the electronic control device 100 . Moreover, since the solder bumps 7 have a shorter wiring length than a structure in which connections are made via leads, they are advantageous for high-speed transmission and can achieve high performance of the semiconductor device including the electronic control device 100 . As a result, in the process of reflowing the electronic component mounted on the front surface side of the substrate 1 to the back surface side of the substrate 1, when the solder bumps 7 are remelted in the upside down direction, the solder bumps 7 do not deform and assume a drum shape. can be maintained.

Here, the results of heat melting verification of the present invention are shown below. The composition of the solder paste 6 used in the verification is a general Sn-3Ag-0.5Cu paste. Moreover, the substrate 1 is used in which the size of the electrode 4a is φ0.8 mm and the electrodes 3 and 4 are arranged at a pitch of 2.5 mm. An element sample is used in which the composition of the solder balls 5 of the package 2 is general Sn-3Ag-0.5Cu and the size is φ1.0 mm. The resin agent 10 has an initial viscosity of 10 Pa·s before curing, and the size of the electrode 4b is also φ0.8 mm. Under these composition conditions, the resin agent 10 was formed at two opposing locations in the central portion of the outer periphery of the package 2, as shown in FIG.

In the heating and melting verification, the package 2 was soldered to the substrate 1, and on the opposite side of the substrate 1 side of the package 2, a weight four times the withstand load calculated from the surface tension of the solder was attached with an adhesive, and turned upside down. was heated and melted. A pattern A in which the substrate 1 and the package 2 are connected without using the resin agent 10 and a pattern B in which the solder material 9 formed on the electrodes 4b and the package 2 are connected with the resin agent 10 as in the present invention were compared.

According to the above verification results, in the pattern A, the solder bumps 7 were deformed during heating and melting, and unbonded solder joints were generated, and the package 2 dropped. On the other hand, in pattern B, the package 2 did not drop and the solder bumps 7 did not deform.

As can be seen from the above verification results, according to the present invention, it is possible to suppress deformation of the solder bumps 7 that are reflowed in the upside down direction, and prevent deterioration of the connection quality of the electronic control unit 100 . In addition, since the resin agent 10 is prevented from adhering to the solder bumps 7 by the dummy wirings 8, the stress load on the solder bumps 7 during operation can be reduced, and the electronic control device 100 with high connection quality can be realized. can provide.

Furthermore, by adopting this configuration, there is no need to perform re-soldering by turning over, and since the solder bumps 7 are not covered with anything even after the second reflow, the solder joints can be visually inspected. is possible. Moreover, since the connection between the board 1 and the electronic component 2 is local, the load when removing the electronic component 2 from the board 1 and repairing it can be reduced.

In other words, according to the present invention, it is possible to realize a double-sided BGA package component that allows both simple fixing and simple visual inspection, so that the electronic control device 100 can be improved in reliability and reduced in size.

At the time of soldering, the solder material 9 is used on the electrodes 4b and the resin agent 10 is used to bond the substrate 1 and the package 2 together. can be omitted.

(Second embodiment)
8 and 9 are cross-sectional views of the electronic control unit according to the second embodiment.

In the first embodiment, the electrodes 4b are arranged at two opposing locations on the outer periphery of the package 2, and when the electrodes 4b and the solder material 9 on the electrodes 4b and the package 2 are connected with the resin agent 10, the electrodes 4b The adhesion of the resin agent 10 to the solder bumps 7 adjacent to the electrodes is prevented by the dummy wirings 8 disposed between the electrodes 4b and the adjacent electrodes 4a. However, due to the low viscosity of the resin agent 10 , the resin agent 10 may spread outside the package 2 on the surface of the substrate 1 opposite to the solder bumps 7 . Here, when the electronic component 11 adjacent to the package 2 is connected and fixed to the electrode 4A, there is a problem that the connection quality is affected.

Based on this point, in FIG. 8, the dummy wiring 8 is also arranged between the electrode 4b and the electronic component 11 adjacent to the package 2 as a second embodiment. On the substrate 1, the electrodes 4b are surrounded by dummy wirings 8 on both sides. This allows the resin agent 10 to control the shapes of the second electrodes 4a and the solder bumps 7 .

As shown in FIG. 9, when the substrate 1 and the package 2 are heated and melted and fixed with the resin agent 10, the spread of the resin agent 10 can be stopped by the dummy wiring 8, so that the resin does not spread to the adjacent electronic component 11. As shown in FIG. Adhesion of the agent 10 can be prevented. By doing so, it is possible to prevent the package 2 from dropping even in the second reflow process without affecting the connection quality of the adjacent electronic components 11 while exhibiting the same effect as the first embodiment.

(Third embodiment)
FIG. 10 is a plan view of the electronic control device according to the third embodiment.

The third electrodes 4b are arranged at positions facing each other on the outer periphery of the package 2. By arranging them at four locations facing each side, the substrate 1 and the package 2 can be fixed more firmly. Thus, even a heavy package 2 can be arranged on the back surface of the substrate 1, and the degree of freedom in arranging electronic components can be increased. In addition, this makes it possible to utilize the BGA package 2, which is easy to increase the number of pins, and to increase the speed and reduce the size of the electronic control device 100. FIG.

FIG. 11 is a modification of FIG.

The electrodes 3 arranged in the central part of the package 2 often carry important signals, and the central part of each side of the outer circumference of the package 2 is densely packed with wiring drawn out from the bumps in the central part of the package 2 . Therefore, electrodes 4b are formed on the substrate 1 at positions facing the four corners (corners) of the outer periphery of the package 2, and the solder material 9 on the electrodes 4b and the four corners of the package 2 are bonded with a resin agent 10. to fix the substrate 1 and the package 2. This makes it possible to secure the fixability of the package 2 to the substrate 1 while protecting important signals.

(Fourth embodiment)
FIG. 12 is a cross-sectional view of an electronic control device according to a fourth embodiment.

In the fourth embodiment, in order to prevent the resin agent 10 from adhering to the bumps adjacent to the third electrode 4b, on the substrate 1, between the third electrode 4b and the second electrode 4a adjacent to the third electrode 4b, a A concave portion 12 is provided as a groove for preventing spreading of the resin agent 10 instead of the dummy wiring 8 .

Further, when the distance between the package 2 and the adjacent electronic component 11 is within the range where the resin agent 10 spreads, the concave portion 12 is also provided between the electrode 4b and the electrode 4c of the adjacent electronic component so that the electronic component 11 can be It prevents adhesion of the resin agent 10 . As a result, the influence of the lead wiring on the layout can be reduced, and the reliability of the solder joints between the electronic component 11 and the electrodes 4A can be maintained. In addition, the resin agent 10 that has flowed into the concave portion 12 can also contribute to fixing the substrate 1 and the package 2 together.

According to the first to fourth embodiments of the present invention described above, the following effects are obtained.

(1) The electronic control device 100 includes a first electronic component 2 having a first electrode 3 on one surface, a substrate 1 having a second electrode 4a disposed corresponding to the first electrode 3, and a solder material. connected by 9. The substrate 1 includes a third electrode 4b arranged at a position facing the outer peripheral portion of the first electronic component 2, and a resin 10 formed between the third electrode 4b and the second electrode 4a on the substrate 1. The solder material 9 is printed on the third electrode 4b, and the solder material 9 printed on the third electrode 4b and the first electronic component 2 are separated by the resin agent 10. Connected. By doing so, it is possible to provide an electronic control device that achieves both improved connection quality and improved reliability.

(2) The spread preventing portion 8 formed on the substrate 1 is further arranged between the third electrode 4b and the fourth electrode 4A connected to the second electronic component 11 adjacent to the first electronic component 2. . By doing so, it is possible to prevent the resin agent 10 from spreading to the second electronic component.

(3) The spreading preventing portion 8 formed on the substrate 1 is the dummy wiring 8 or the concave portion 12 formed on the substrate 1 . By doing so, it is possible to change the method of forming the spread preventing portion 8 for reasons of design.

(4) The viscosity before curing of the resin agent 10 for connecting the solder material 9 printed on the third electrode 4b and the first electronic component 2 is 10 Pa·s or less. This prevents the solder joints from becoming unbonded or deformed when employing embodiments of the present invention.

(5) The substrate 1 has a plurality of third electrodes 4b, and the plurality of third electrodes 4b are arranged at positions facing each other on the substrate 1 with the second electrodes 4a interposed therebetween. By doing so, the load on the solder joint can be reduced.

(6) The plurality of third electrodes 4b are formed at positions facing the central portions of two opposing sides of the outer peripheral portion of the first electronic component 2, respectively. By doing so, the load on the solder joint can be reduced.

(7) The third electrodes 4b are formed on the substrate 1 at positions facing the four corners of the outer periphery of the first electronic component 2, respectively. By doing so, it is possible to achieve both protection of important signals on the package 2 and fixability of the package 2 to the substrate 1 .

(8) The manufacturing method of the electronic control device 100 includes a first electronic component 2 having a first electrode 3 on one surface, and a second electrode 4a corresponding to the first electrode 3 and arranged adjacent to the second electrode 4a. a first step in which the solder material 9 is arranged on the second electrode 4a and the third electrode 4b; A second step in which the solder balls 5 arranged above and the solder material 9 on the second electrode 4a are heated and melted and connected by soldering, and the solder material 9 on the third electrode 4b and the first electronic component 2 are made of resin. and a third step of connecting with the agent 10 . By doing so, it is possible to realize the electronic control unit 100 that employs the present invention.

The shape of the third electrode 4b used in the first to fourth embodiments and examples is determined according to the size and weight of the package 2 and the layout of lead wires.

Moreover, depending on the arrangement of the electronic components 11 around the package 2, the dummy wirings 8 or the concave portions 12 may be formed, and the positions thereof are not limited.

The above description is merely an example, and when interpreting the invention, the corresponding relationship between the descriptions of the above-described embodiments and the descriptions of the claims is neither limited nor constrained. Further, the dimensions, ratios, and shapes used in the present invention are not limited to the configurations shown in the drawings, and any constituent members can be used. Furthermore, it is possible to delete, replace with another configuration, or add another configuration without departing from the technical idea of the invention, and such aspects are also included in the scope of the present invention.

DESCRIPTION OF SYMBOLS 1... Wiring board 2... Semiconductor package 3... Semiconductor element side electrodes 4, 4a, 4b, 4A... Board side electrodes 5... Solder balls 6... Solder paste 7... Solder bumps 8... Dummy wiring 9... Solder material 10... Resin agent 11 ... Electronic component 12 ... Recess 100 ... Electronic control device

Claims (8)

a first electronic component having a first electrode on one surface;
A substrate having a second electrode arranged corresponding to the first electrode and an electronic control device connected by a solder material,
The substrate includes a third electrode arranged at a position facing the outer peripheral portion of the first electronic component, and is formed between the third electrode and the second electrode to prevent the resin from spreading on the substrate. and a spread preventing portion for suppressing,
The third electrode is printed with the solder material,
The electronic control device, wherein the solder material printed on the third electrode and the first electronic component are connected by a resin agent. The electronic control device according to claim 1,
The electronic control device, wherein the spread preventing portion is further arranged between the third electrode and a fourth electrode connected to a second electronic component adjacent to the first electronic component. The electronic control device according to claim 1,
The electronic control device, wherein the spread preventing portion is a dummy wiring or a concave portion formed on the substrate. The electronic control device according to claim 1,
The electronic control device, wherein the viscosity of the resin agent before curing is 10 Pa·s or less. The electronic control device according to any one of claims 1 to 4,
The substrate has a plurality of the third electrodes,
The electronic control device, wherein the plurality of third electrodes are arranged at positions facing each other on the substrate with the second electrodes interposed therebetween. The electronic control device according to claim 5,
The electronic control device, wherein the plurality of third electrodes are respectively formed at positions facing central portions of two opposing sides of the outer peripheral portion of the first electronic component. The electronic control device according to claim 5,
The electronic control device, wherein the third electrodes are formed on the substrate at positions facing four corners of the outer periphery of the first electronic component. A substrate having a first electronic component having a first electrode on one surface, and a spread preventing portion between a second electrode corresponding to the first electrode and a third electrode arranged adjacent to the second electrode. and a method of manufacturing an electronic control device comprising:
a first step in which a solder material is placed on the second electrode and the third electrode;
a second step of heating and melting the solder ball arranged on the first electrode and the solder material on the second electrode for solder connection;
and a third step of connecting the solder material on the third electrode and the first electronic component with a resin agent.

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