JP2022181814A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2022181814A5 JP2022181814A5 JP2021088985A JP2021088985A JP2022181814A5 JP 2022181814 A5 JP2022181814 A5 JP 2022181814A5 JP 2021088985 A JP2021088985 A JP 2021088985A JP 2021088985 A JP2021088985 A JP 2021088985A JP 2022181814 A5 JP2022181814 A5 JP 2022181814A5
- Authority
- JP
- Japan
- Prior art keywords
- main electrode
- layer
- wiring member
- sintered
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 4
- 125000006850 spacer group Chemical group 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021088985A JP7512953B2 (ja) | 2021-05-27 | 2021-05-27 | 半導体装置 |
| PCT/JP2022/018365 WO2022249805A1 (ja) | 2021-05-27 | 2022-04-21 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021088985A JP7512953B2 (ja) | 2021-05-27 | 2021-05-27 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022181814A JP2022181814A (ja) | 2022-12-08 |
| JP2022181814A5 true JP2022181814A5 (cg-RX-API-DMAC7.html) | 2023-03-09 |
| JP7512953B2 JP7512953B2 (ja) | 2024-07-09 |
Family
ID=84228779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021088985A Active JP7512953B2 (ja) | 2021-05-27 | 2021-05-27 | 半導体装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7512953B2 (cg-RX-API-DMAC7.html) |
| WO (1) | WO2022249805A1 (cg-RX-API-DMAC7.html) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009164208A (ja) | 2007-12-28 | 2009-07-23 | Mitsubishi Electric Corp | 半導体装置および半導体装置の製造方法 |
| JP6384894B2 (ja) | 2013-11-11 | 2018-09-05 | 新日鐵住金株式会社 | 金属ナノ粒子を用いた金属接合構造及び金属接合方法並びに金属接合材料 |
| JP2015177182A (ja) | 2014-03-18 | 2015-10-05 | 三菱電機株式会社 | パワーモジュール |
| WO2017002793A1 (ja) | 2015-07-01 | 2017-01-05 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
| WO2017077728A1 (ja) | 2015-11-05 | 2017-05-11 | 三菱電機株式会社 | パワーモジュール及びパワーモジュールの製造方法 |
| JP2018026417A (ja) | 2016-08-09 | 2018-02-15 | 三菱電機株式会社 | 電力用半導体装置 |
| JP7130445B2 (ja) | 2018-06-05 | 2022-09-05 | 新光電気工業株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP2020191367A (ja) | 2019-05-21 | 2020-11-26 | 株式会社デンソー | 半導体装置 |
| WO2020255773A1 (ja) | 2019-06-20 | 2020-12-24 | 富士電機株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP7495225B2 (ja) | 2019-12-16 | 2024-06-04 | 株式会社デンソー | 半導体装置 |
-
2021
- 2021-05-27 JP JP2021088985A patent/JP7512953B2/ja active Active
-
2022
- 2022-04-21 WO PCT/JP2022/018365 patent/WO2022249805A1/ja not_active Ceased