JP2022149804A - 保護膜形成用フィルム - Google Patents

保護膜形成用フィルム Download PDF

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Publication number
JP2022149804A
JP2022149804A JP2021052114A JP2021052114A JP2022149804A JP 2022149804 A JP2022149804 A JP 2022149804A JP 2021052114 A JP2021052114 A JP 2021052114A JP 2021052114 A JP2021052114 A JP 2021052114A JP 2022149804 A JP2022149804 A JP 2022149804A
Authority
JP
Japan
Prior art keywords
protective film
film
forming
meth
acrylate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021052114A
Other languages
English (en)
Japanese (ja)
Inventor
茂之 山下
Shigeyuki Yamashita
大輔 山本
Daisuke Yamamoto
康喜 中石
Koki Nakanishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP2021052114A priority Critical patent/JP2022149804A/ja
Priority to CN202210081668.8A priority patent/CN115132634A/zh
Priority to TW111108316A priority patent/TW202303714A/zh
Priority to KR1020220034278A priority patent/KR20220133785A/ko
Publication of JP2022149804A publication Critical patent/JP2022149804A/ja
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67356Closed carriers specially adapted for containing chips, dies or ICs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/544Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Dicing (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
JP2021052114A 2021-03-25 2021-03-25 保護膜形成用フィルム Pending JP2022149804A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2021052114A JP2022149804A (ja) 2021-03-25 2021-03-25 保護膜形成用フィルム
CN202210081668.8A CN115132634A (zh) 2021-03-25 2022-01-24 保护膜形成用膜
TW111108316A TW202303714A (zh) 2021-03-25 2022-03-08 保護膜形成用膜
KR1020220034278A KR20220133785A (ko) 2021-03-25 2022-03-18 보호막 형성용 필름

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021052114A JP2022149804A (ja) 2021-03-25 2021-03-25 保護膜形成用フィルム

Publications (1)

Publication Number Publication Date
JP2022149804A true JP2022149804A (ja) 2022-10-07

Family

ID=83375527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021052114A Pending JP2022149804A (ja) 2021-03-25 2021-03-25 保護膜形成用フィルム

Country Status (4)

Country Link
JP (1) JP2022149804A (zh)
KR (1) KR20220133785A (zh)
CN (1) CN115132634A (zh)
TW (1) TW202303714A (zh)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5249290B2 (ja) 2010-07-20 2013-07-31 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、半導体装置の製造方法、及び、フリップチップ型半導体装置
SG11201607716PA (en) 2014-03-24 2016-11-29 Lintec Corp Protection membrane forming film, protection membrane forming utilization sheet, production method and inspection method for workpiece or processed product, workpiece determined as adequate product, and processed product determined as adequate product

Also Published As

Publication number Publication date
CN115132634A (zh) 2022-09-30
TW202303714A (zh) 2023-01-16
KR20220133785A (ko) 2022-10-05

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Effective date: 20240112