JP2022145478A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2022145478A5 JP2022145478A5 JP2021204585A JP2021204585A JP2022145478A5 JP 2022145478 A5 JP2022145478 A5 JP 2022145478A5 JP 2021204585 A JP2021204585 A JP 2021204585A JP 2021204585 A JP2021204585 A JP 2021204585A JP 2022145478 A5 JP2022145478 A5 JP 2022145478A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- examples
- plasma irradiation
- irradiation time
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17/696,361 US12257641B2 (en) | 2021-03-18 | 2022-03-16 | Work processing apparatus |
CN202210263158.2A CN115116817A (zh) | 2021-03-18 | 2022-03-17 | 工件加工装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021044350 | 2021-03-18 | ||
JP2021044350 | 2021-03-18 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2022145478A JP2022145478A (ja) | 2022-10-04 |
JP2022145478A5 true JP2022145478A5 (enrdf_load_html_response) | 2024-11-12 |
JP7750471B2 JP7750471B2 (ja) | 2025-10-07 |
Family
ID=83460385
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021204585A Active JP7750471B2 (ja) | 2021-03-18 | 2021-12-16 | ワーク加工装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP7750471B2 (enrdf_load_html_response) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2025062269A (ja) * | 2023-10-02 | 2025-04-14 | 株式会社ジェイテックコーポレーション | プラズマ援用研磨方法及びその装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05226258A (ja) * | 1992-02-13 | 1993-09-03 | Applied Materials Japan Kk | プラズマ発生装置 |
US5238532A (en) * | 1992-02-27 | 1993-08-24 | Hughes Aircraft Company | Method and apparatus for removal of subsurface damage in semiconductor materials by plasma etching |
US5372674A (en) * | 1993-05-14 | 1994-12-13 | Hughes Aircraft Company | Electrode for use in a plasma assisted chemical etching process |
JP2000058521A (ja) * | 1998-08-08 | 2000-02-25 | Tokyo Electron Ltd | プラズマ研磨装置 |
JP2002103207A (ja) * | 2000-09-27 | 2002-04-09 | Hitachi Ltd | 乾式化学機械研磨方法 |
JP5614677B2 (ja) * | 2010-02-25 | 2014-10-29 | 国立大学法人大阪大学 | 難加工材料の精密加工方法及びその装置 |
-
2021
- 2021-12-16 JP JP2021204585A patent/JP7750471B2/ja active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE143991T1 (de) | Polymermetallkomposit und verfahren zur herstellung | |
JP2022145478A5 (enrdf_load_html_response) | ||
US3581776A (en) | Pipe insulation structure | |
Koros et al. | Transport properties | |
JP2018535419A5 (enrdf_load_html_response) | ||
JPH09278907A (ja) | 摺動部材 | |
EP1816161A4 (en) | Thermoplastic Polyethylene Composition | |
CN110191865A (zh) | 高耐化学性的硼硅酸盐玻璃及其应用 | |
JP2016135862A (ja) | フッ素樹脂の改質成形品の製造方法 | |
Eby et al. | Relaxations in copolymers of tetrafluoroethylene and hexafluoropropylene | |
MX166757B (es) | Composicion de revestimiento util para proteger materiales metalicos | |
JPS54156083A (en) | Composite molded article of vinyl chloride resin and silicone | |
JPH10259216A (ja) | 含フッ素共重合体の成形体 | |
RU2015148108A (ru) | Полимерцементная композиция и способ цементирования | |
JPH11349711A (ja) | 改質フッ素樹脂の製造方法 | |
TWI280331B (en) | Fluoroplastic tubular member | |
Mamleev et al. | Thermogravimetric analysis of multistage decomposition of materials | |
CN207253518U (zh) | 胶管结构 | |
CN113056510A (zh) | 涂覆的气凝胶 | |
JP2005178297A (ja) | 含フッ素成形体及び半導体製造装置 | |
JP2000291848A (ja) | 球状半導体用樹脂製チューブ | |
JP3903547B2 (ja) | 配向ふっ素樹脂成形体及びその製造方法 | |
US11969752B2 (en) | Organic polymer film and manufacturing method thereof | |
KR20200011645A (ko) | 발열관체 | |
Mohamed Sunar et al. | Chemical contaminants of indoor air quality (IAQ): a review |