JP2022125508A - Paddle for stirring plating solution, plating device employing paddle for stirring plating solution, and plating method - Google Patents

Abstract

To provide a paddle for stirring a plating solution, capable of suppressing uneven plating and deterioration of height uniformity resulting from its unique structure that a portion of the paddle is shielded and the occurrence of variation in the uniformity of plating on the center and edge of a plating object caused by the concentration of currents, by suitably stirring a plating solution, a plating device employing the paddle for stirring a plating solution, and a plating method.SOLUTION: The paddle for stirring a plating solution, disposed in a plating tank together with a plating object to stir a plating solution stored in the plating tank, comprises a plate-shaped paddle body and a plurality of ribs formed on one face of the paddle body and parallel to each other along one direction, with a plurality of holes formed between the plurality of ribs penetrating the paddle body to allow a plating solution to flow therethrough, and the plurality of ribs each protruding in the direction away from the one face and being shaped to have a width getting smaller as it is away from the paddle body.SELECTED DRAWING: Figure 3

Description

The present invention relates to a plating solution stirring paddle used in a plating apparatus for plating a material to be plated such as a substrate, a plating apparatus using the plating solution stirring paddle, and a plating method.

2. Description of the Related Art Conventionally, a carrier-conveying type plating apparatus has been widely used as a plating technique for semiconductor printed circuit boards and the like. Such a carrier-conveying type plating apparatus conveys a plate-like work (material to be plated) into a plating tank in which a plating solution is stored, and the plating jig to which the material to be plated is fixed is placed in the plating solution. It is a mechanism that makes the flow of the plating solution uniform near the surface of the material to be plated by rocking the plated material vertically or horizontally, or by circulating the plating solution in the plating bath using a pump. ing. Using this technique, it is possible to apply plating such as copper to a material to be plated.

2. Description of the Related Art In recent years, in the field of semiconductor manufacturing, there has been a demand for plating a minute portion of a patterned material to be plated. In this regard, although the performance of the plating solution has been improved, the size of the material to be plated has also increased, so it is difficult to reliably plate the material to be plated with the conventional apparatus. In order to make the liquid flow uniform in the vicinity of the surface of the material to be plated, there is known a plating apparatus provided with a paddle for stirring the plating solution (see, for example, Patent Document 1).
The plating apparatus described in Patent Document 1 includes a plating tank for holding a plating solution, an anode configured to be connected to an anode of a power supply, and a plating solution for stirring the plating solution held in the plating tank. and a paddle movable within the plating bath such that, while the plating solution is agitated, at least a portion of the non-patterned area of the substrate as viewed from the anode is always shielded. It is configured.

JP 2019-151874 A

However, although the paddle agitation performed by the plating apparatus described in Patent Document 1 is a general technique, in advanced semiconductor devices, the size of the pattern is becoming finer according to Moore's Law. Without considering that the solution enters into the non-pattern area, there are problems such as uneven plating due to insufficient flow of the plating solution caused by the special structure that partially shields the non-pattern area, deterioration of height uniformity, Inconsistencies in plating uniformity at the center and edges of the material to be plated due to pattern sparseness and denseness due to concentration of current lines and concentration of current lines in pattern areas close to external areas and non-pattern areas. There is a problem that arises.

The present invention has been made in view of such circumstances. Provided are a paddle for stirring a plating solution, a plating apparatus using the paddle for stirring a plating solution, and a plating method, which can suppress unevenness in plating uniformity between the central portion and the end portion of a material to be plated due to concentration of current wires. intended to

A plating solution agitating paddle of the present invention is a plating solution agitating paddle that is placed in a plating tank in which a plating solution is stored together with a material to be plated and agitates the plating solution, and comprises a plate-shaped paddle body, the and a plurality of ribs formed parallel to each other along one direction on one surface of the paddle body, and between the plurality of ribs, a plurality of holes through which the plating solution can flow are formed to support the paddle body. The plurality of ribs, which are formed in a penetrating state, protrude in a direction away from the one surface and have a shape whose width decreases with distance from the paddle body.

In the present invention, when the plating solution stirring paddle is repeatedly moved in one direction (the direction in which the plurality of ribs are arranged) with a predetermined stroke in the plating tank, the plating solution is stirred by each of the plurality of ribs, and each Since the width of the ribs becomes smaller with increasing distance from the paddle body, the plating solution between the ribs is pushed by the side surfaces (inclined surfaces) of the ribs and flows along the side surfaces of the ribs toward the tip. Therefore, the plating solution on the other side of the paddle body is drawn into the holes through the holes between the ribs, flows between the ribs, and similarly moves toward the tips of the ribs. That is, the plating solution moves from the side of the paddle body on which the ribs are not formed toward the side where the ribs are formed, thereby flowing the plating solution toward the material to be plated. In this way, by moving the plating solution agitating paddle in one direction, the plating solution moves toward the material to be plated. The liquid can be properly stirred. In this way, the plating solution is properly agitated over the entire surface of the material to be plated. It is possible to suppress the occurrence of uneven plating uniformity between the central portion and the edge portions of the material to be plated.

In a preferred embodiment of the plating solution stirring paddle of the present invention, the plurality of ribs has a height of 3 mm or more and 20 mm or less, an interval between the plurality of ribs is 5 mm or more and 50 mm or less, and The inclination angle of the side surface with respect to the one surface is preferably 29° or more and 75° or less.
If the height of the plurality of ribs is less than 3 mm, the distance to the tip of the side surface of the rib becomes small, making it difficult to move toward the tip along the side surface of the rib. There is a possibility that the plating solution cannot be stirred properly on the surface of the material to be plated because the amount of the solution decreases. On the other hand, if the height of the plurality of ribs exceeds 20 mm, resistance increases when the paddle body is moved in the first direction, making it difficult to move the paddle body with an appropriate stroke, or it is difficult to move the paddle body. mechanism may become large.
If the intervals between the plurality of ribs are less than 5 mm, the intervals between the ribs are too narrow and the opening areas of the plurality of holes cannot be made large. If the spacing between multiple ribs exceeds 50 mm, the spacing between the ribs is too wide and the opening area of the multiple holes becomes too large, resulting in the amount of plating solution not along the sides. may increase, making it difficult to properly move the plating solution toward the material to be plated, or reducing the shielding effect of the current line.
If the inclination angle of the side surfaces of the plurality of ribs is less than 29°, it is difficult to increase the rib height to 3 mm or more. If it exceeds 75°, the inclination angle of the side surface is too large and resistance increases when repeatedly moving the paddle body, making it difficult to move the paddle body with an appropriate stroke, or a mechanism for moving the paddle body. may become large.

In a preferred embodiment of the plating solution stirring paddle of the present invention, the paddle body has a thickness of 4 mm or more and 20 mm or less.
The thickness of the paddle body is the maximum thickness of the plate-like portion excluding ribs.
If the thickness of the paddle body is less than 4 mm, there is a possibility that the durability of the paddle body will be low, or that stirring will be shaken due to warping of the paddle body. On the other hand, if the thickness of the paddle body exceeds 20 mm, resistance increases when repeatedly moving the paddle body, making it difficult to move the paddle body with an appropriate stroke, or the mechanism for moving the paddle body is large. may become

A plating apparatus using a plating solution stirring paddle of the present invention comprises a plating bath in which a plating solution is stored, an anode arranged in the plating bath, and a supply unit for supplying the plating solution in the plating bath. , the plating stirring paddle, and a paddle driving unit that repeatedly moves the plating stirring paddle arranged in the plating tank along the one direction, wherein the plating stirring paddle is provided with the plurality of ribs is arranged in the plating bath so as to face the material to be plated.

In the present invention, the plating solution moves toward the material to be plated simply by repeatedly moving the plating solution stirring paddle along one direction, so that the plating solution in the vicinity of the surface of the material to be plated can be appropriately stirred. In this way, the plating solution is properly agitated over the entire surface of the material to be plated. It is possible to suppress the occurrence of uneven plating uniformity between the central portion and the edge portions of the material to be plated.

In the plating method of the present invention, when plating the material to be plated using the plating apparatus, the paddle drive unit is controlled to move the plating stirring paddle at a stroke of 60 mm or more and 180 mm or less at a stroke of 100 mm/second or more and 600 mm or more. / second or less.

If the stroke of the paddle for stirring the plating solution is less than 60 mm or the speed is less than 100 mm/sec, the plating solution cannot flow appropriately toward the material to be plated. On the other hand, if the stroke exceeds 180mm, it is necessary to expand the plating bath unnecessarily, and there is a high possibility that the entire area of the object to be plated cannot be covered with the paddle, which weakens the shielding effect. , The paddle moves too fast to properly agitate the plating solution in the plating bath.

According to the present invention, by appropriately agitating the plating solution, it is possible to prevent uneven plating due to the special structure in which a part of the paddle is shielded, deterioration of height uniformity, and deterioration of the material to be plated due to concentration of current lines. It is possible to suppress the occurrence of uneven plating uniformity between the central portion and the end portions.

1 is a schematic side view of a plating apparatus provided with a plating solution stirring paddle according to an embodiment of the present invention; FIG. It is the schematic which looked at the plating apparatus of the said embodiment from the upper surface side. FIG. 4A is a plan view, a top view, and a side view of the plating solution stirring paddle of the embodiment; FIG. 4 is a perspective view showing an enlarged part of the plating solution stirring paddle of the embodiment; FIG. 4 is a cross-sectional view showing the direction of movement of the plating solution in a portion of the plating solution stirring paddle of the embodiment; FIG. 5 is a cross-sectional view showing a cross-section of ribs of a plating solution stirring paddle according to a first modified example of the embodiment; FIG. 11 is a cross-sectional view showing a cross-section of a rib of a plating solution stirring paddle according to a second modified example of the embodiment; FIG. 11 is a plan view showing a hole portion of a plating solution stirring paddle according to a third modified example of the embodiment; FIG. 11 is a plan view showing a hole portion of a plating solution stirring paddle according to a fourth modified example of the embodiment; FIG. 11 is a plan view showing a hole portion of a plating solution stirring paddle according to a fifth modification of the embodiment; FIG. 11 is a plan view of a plating solution stirring paddle according to a sixth modification of the embodiment;

An embodiment of a paddle for stirring a plating solution, a plating apparatus provided with the same, and a plating method of the present invention will be described below with reference to the drawings.

[Configuration of plating equipment]
The plating apparatus 10 is a plating apparatus for plating the surface of a material to be plated using a plating solution. In this embodiment, a pure tin plating solution for forming bump plating containing a brightener is used as the plating solution, and an example in which the substrate 20 as the material to be plated is tin-plated will be described.
As shown in FIGS. 1 and 2, the plating apparatus 10 includes a plating bath 11 that stores a plating solution, a supply unit 12 that supplies the plating solution into the plating bath 11, and an anode 13 arranged in the plating bath 11. and a substrate holding part 14 (not shown in FIG. 2) that detachably holds the substrate 20 in the plating tank 11, and the substrate 20 is arranged in the plating tank 11 from the opening end of the plating tank 11 to stir the plating solution. a paddle driving unit 15 (not shown in FIG. 2) for repeatedly moving the plating solution stirring paddle 30 in one direction (the direction along the arrow shown in FIGS. 1 and 2); An overflow tank 16 (not shown in FIG. 1) which is connected to the plating tank 11 and causes the plating solution in the plating tank 11 to overflow, and a pump 17 (not shown in FIG. 1) arranged in the overflow tank 16 are provided. .

The plating solution circulating in the plating bath 11 overflows and flows into the overflow bath 16 . A drain port (not shown) is provided at the bottom of the overflow bath 16, and the pump 17 pumps up the plating solution and controls the flow rate of the plating solution. Then, the liquid flows from the overflow tank 16 through the supply section 12 toward the substrate 20 and circulates again. It is preferable to install a filter housing for removing foreign substances in the plating solution in the circulation path composed of the plating tank 11 and the overflow tank 16 . Part of the plating solution pumped to the bottom of the plating bath 11 may be branched to supply the plating solution from the bottom. Although not shown, the plating tank 10 is provided with a temperature controller for adjusting the temperature of the plating solution.

As shown in FIGS. 2 and 3, the supply unit 12 and the anode 13 are arranged near one end of the plating bath 11 (the left end in FIGS. 2 and 3). Further, the plating solution agitating paddle 30 is arranged substantially in the center of the plating bath 11 (the position on the right side of the supply unit 12 and the anode 13 in FIGS. 2 and 3), and the substrate holding unit 14 and the substrate 20 are placed in the plating bath. 12 on the other side. That is, when the plating bath 11 is viewed from above, the supply unit 12 and the anode 13, the plating solution stirring paddle 30, the substrate holding unit 14 and the substrate 20 are arranged in the plating bath 11 in this order. The plating solution stirring paddle 30 and the substrate 20 are vertically inserted into the plating solution of the plating bath 11 from the opening end of the plating bath 11, and one surface of the plating solution stirring paddle 30 (a plurality of ribs to be described later) is inserted vertically. 33) and one surface of the substrate 20 are arranged to face each other. Further, the distance between the plating solution stirring paddle 30 and the substrate 20, specifically, the distance from the vertex of the rib 33 to the surface of the object to be plated is set to 4 mm to 70 mm.

In this embodiment, as the anode 13, a granular anode obtained by cutting metal tin into a diameter of about 10 mm is used in an anode basket covered with an anode bag. The substrate 20 and the anode 13 are electrically connected via a power supply (not shown), and a tin-plated film is formed on the surface of the substrate 20 by applying an electric current between the substrate 20 and the anode 13. . In this regard, in this embodiment, the plating solution stirring paddle 30 is arranged between the substrate 20 and the anode 13, and the plating solution stirring paddle 30 is repeatedly moved in the direction along the arrow shown in FIG. The plating solution is stirred by , and the plating solution is moved toward the substrate 20 .

[Structure of Paddle for Stirring Plating Solution]
The plating solution stirring paddle 30 is arranged together with the substrate 20 in the plating tank 11 in which the plating solution is stored, and stirs the plating solution. The plating solution stirring paddle 100 is made of, for example, a resin such as vinyl chloride, or a metal such as titanium or stainless steel coated with a fluorine resin or the like on the surface. The material forming the plating solution stirring paddle 100 preferably has chemical resistance and heat resistance.
As shown in FIG. 3, the plating solution stirring paddle 30 includes a rectangular plate-shaped paddle body 31 and one surface of the paddle body 31 (rear surface in the plan view shown in the center of FIG. 3) along one direction. A plurality of ribs 33 are formed parallel to each other, and a plurality of holes 34 through which the plating solution can flow are formed between the plurality of ribs 33 so as to pass through the paddle body 31 .

The plane size of the paddle body 31 is, for example, 420 mm to 620 mm×450 mm to 660 mm. Specifically, the length of the paddle body 31 in the vertical direction in FIG. It is set larger than the length in the horizontal direction. Specifically, the length of the paddle body 31 in the horizontal direction in FIG. Therefore, even when the paddle body 31 moves to one side and the other side, it is sized to reliably overlap the entire area of the substrate 20 .
Moreover, if the thickness of the paddle body 31 is less than 4 mm, the durability of the paddle body 31 may be reduced. On the other hand, if the thickness of the paddle body 31 exceeds 20 mm, resistance increases when the paddle body 31 is repeatedly moved. mechanism may become large. Therefore, the thickness of the paddle body 31 is set to 4 mm or more and 20 mm or less.
The thickness of the paddle body 31 means the maximum thickness of the plate-like portion excluding the ribs 33 .

Further, both side end portions (horizontal direction end portions in FIG. 3) of the paddle body 31 are formed so that the thickness decreases toward the end portions. That is, on both side end portions of the surface of the paddle body 31 on which the plurality of ribs 33 are formed, there are formed inclined surfaces 32 whose thickness decreases toward both end portions. By providing the inclined surface 32, the resistance received from the plating solution when the plating solution stirring paddle 30 is repeatedly moved in the direction indicated by the arrow in FIGS. 1 and 2 is reduced.

The plurality of ribs 33 are formed in a shape that protrudes away from one surface of the paddle body 31 (the surface on the side of the substrate 20 in FIGS. 1 and 2) and that the width of the ribs 33 decreases with increasing distance from the paddle body 31 . there is Specifically, as shown in the top view of FIG. 3, the plurality of ribs 33 are formed in a triangular cross-section, and the side surfaces 331 of each rib 33 are formed with inclined surfaces.
Moreover, the height of the plurality of ribs 33 is set to 3 mm or more and 20 mm or less. If the height of the rib 33 is less than 3 mm, the distance to the tip of the side surface 331 of the rib 33 becomes small, and it becomes difficult to move the plating solution along the side surface 331 of the rib 33 toward the tip. The amount of plating solution that moves toward the surface of the substrate 20 may decrease, and the plating solution may not be stirred properly on the surface of the substrate 20 . On the other hand, if the height of the plurality of ribs exceeds 20 mm, the resistance when moving the paddle body 31 increases, making it difficult to move the paddle body 31 with an appropriate stroke. The mechanism may become large.

Also, the interval between the plurality of ribs 33 is set to 5 mm or more and 50 mm or less. If the intervals between the plurality of ribs 33 are less than 5 mm, the intervals between the ribs 33 are too narrow to secure a large opening area for the plurality of holes 34 , so that the amount of plating solution that moves along the side surfaces 331 of the ribs 33 is reduced. If the distance between the plurality of ribs 33 exceeds 50 mm, the distance between the ribs 33 is too wide and the opening area of the plurality of holes 34 becomes too large. The amount of plating solution not along the side surface 331 increases, which may make it difficult to properly move the plating solution toward the substrate 20 or reduce the current line shielding effect. In this embodiment, the intervals between the plurality of ribs 33 are equal, but the intervals are not limited to this, and may be different among the ribs as long as they are within the above numerical range.

Furthermore, the inclination angle θ1 of the side surfaces 331 of the plurality of ribs 33 with respect to one surface of the paddle body 31 is set to 29° or more and 75° or less, as shown in FIG. If the inclination angle θ1 is less than 29°, it is difficult to increase the height of the ribs 33 to 3 mm or more. If it exceeds, the inclination angle θ1 of the side surface 331 is too large, the plating solution between the ribs 33 is difficult to push by the side surface 331 (slanted surface) of the rib, and the amount of plating solution moving toward the substrate 20 is reduced.

The plurality of holes 34 formed between the plurality of ribs 33 are set to have the number and size that allow the plating solution to be efficiently agitated and allow the plating solution to flow efficiently. Specifically, the sum of the opening areas of the plurality of holes 34 is set to 12% or more and 83% or less of the area Ar1 sandwiched between the ribs 33 of the paddle body 31 surrounded by the dashed line shown in FIG. It is This is because if the total opening area of the plurality of holes 34 is less than 12%, the amount of the plating solution flowing through the plurality of holes 34 of the paddle body 31 toward the substrate 20 decreases, If the total opening area of the plurality of holes 34 exceeds 83%, the effective area of the paddle covering the object to be plated becomes small and the current shielding effect is reduced. This is because there is a possibility that the in-plane uniformity of the object to be plated may deteriorate.
For example, in the present embodiment, each of the multiple holes 34 is formed in a circular shape with a diameter of 5 mm to 50 mm, and is set smaller than the interval between the multiple ribs 33 .

3 and 4, the plurality of holes 34 are formed in a zigzag pattern. For example, of the plurality of leftmost holes 34 in FIG. The hole 34 located at the uppermost side among the plurality of holes 34 located second from the center is located at a distance of half the size of one hole 34 (the radius of the hole 34) from the upper end of the adjacent rib 33. distance). By forming the plurality of holes 34 in a zigzag pattern, the plating solution can be uniformly stirred. Since these plurality of holes 34 are formed between the plurality of ribs 33 as described above, they are located on the left side of the leftmost rib 33 in FIG. 3 and on the right side of the rightmost rib 33 in FIG. , the plurality of holes 34 are not formed.

[Plating method using plating equipment]
Next, a method for plating the substrate 20 using the plating apparatus 10 of this embodiment will be described.
First, the plating solution is supplied from the supply unit 12 into the plating tank 11 and the plating solution is stored in the plating tank 11 . Next, the plating solution stirring paddle 30 and the substrate 20 are arranged in the plating tank 11 . Specifically, the substrate 20 is held by the substrate holder 14 in a state in which the substrate 20 is submerged in the plating solution in the plating bath 11, and the plating solution stirring paddle 30 is opposed to the substrate 20 by the plurality of ribs 33. It is fixed to the paddle drive unit 15 as shown. The plating solution stirring paddle 30 may be fixed to the paddle driving section 15 in advance.

Then, the paddle driver 15 is repeatedly moved while a current is passed between the substrate 20 and the anode 13 . It is preferable that the paddle drive unit 15 moves the plating stirring paddle 30 with a stroke of 60 mm or more and 180 mm or less at a speed of 100 mm/second or more and 600 mm/second or less. This plating time can be appropriately changed depending on the thickness of the plating applied to the substrate 20, the type of plating solution, etc. For example, in the case of tin plating, the plating solution stirring paddle 30 is repeatedly moved for 5 minutes to 30 minutes. By applying a current of 2 A/dm ² , the substrate 20 is uniformly plated even if a fine pattern is formed on the surface of the substrate 20 .
If the stroke of the plating solution agitating paddle 30 is less than 60 mm or the speed is less than 100 mm/sec, the plating solution may not flow properly toward the substrate 20 . On the other hand, if the stroke exceeds 180 mm, there is a high possibility that the plating tank 11 will need to be expanded unnecessarily, and the entire area of the object to be plated cannot be covered with the paddle, which may weaken the shielding effect. , the plating solution stirring paddle 30 may move too fast to properly stir the plating solution in the plating bath 11 .

In this embodiment, when the plating solution stirring paddle 30 repeatedly moves in one direction (the direction in which the plurality of ribs 33 are arranged) in the plating bath 11 with a predetermined stroke, the plating solution is stirred by each of the plurality of ribs 33. In addition, since the width of each rib 33 has a triangular cross-sectional shape that decreases with distance from the paddle body, the plating solution between the ribs 33 is pushed by the side surface 331 (inclined surface) of the rib 33, thereby It flows along the sides and moves towards the tip. 5, when the plating solution agitating paddle 30 moves as indicated by the arrow a, the plating solution flows along the inclined surface 331 of the rib 33 as indicated by the arrow b. The plating solution enters between the plurality of ribs 33 through the holes 34 from the back side (the side where the ribs 33 are not formed).
Therefore, the plating solution on the other side of the paddle body 31 is drawn into the hole 34 from the hole 34 between the ribs 33 , sequentially flows between the ribs 33 , and similarly moves toward the tip of the rib 33 . . That is, the plating solution moves from the surface of the paddle body 31 on which the ribs 33 are not formed toward the surface on which the ribs 33 are formed, thereby flowing the plating solution toward the substrate 20 . By simply moving the plating solution agitating paddle 30 repeatedly in one direction, the plating solution moves toward the substrate 20. Therefore, the plating solution is constantly supplied to the surface of the substrate 20 while fresh plating solution is supplied to the surface of the substrate 20. The plating solution can be properly stirred. Moreover, since the hole 34 is designed to have a predetermined area, it is possible to control the flow of the current line. In this way, the plating solution is properly agitated over the entire surface of the substrate 20, and the current line is also appropriately controlled. Also, the height uniformity deteriorates, the density of the pattern due to the concentration of the current lines, and the concentration of the current lines in the external part and the pattern part close to the non-pattern part. It is possible to suppress the occurrence of unevenness in plating uniformity.

It should be noted that the present invention is not limited to the configurations of the above-described embodiments, and various modifications can be made to the detailed configurations without departing from the gist of the present invention.
For example, the plurality of ribs 33 has a triangular cross-sectional shape, but is not limited to this, and may have, for example, a trapezoidal cross-sectional shape as shown in FIG. There may be. The rib 33A shown in FIG. 6 is formed in a trapezoidal cross-sectional view, and has a shape in which the width decreases toward the tip. In addition, the inclination angle θ2 of the rib 33A with respect to one surface of the paddle body 31 is set to 41° or more and 84° or less. On the other hand, the rib 33B shown in FIG. 7 is formed in a semicircular cross-sectional shape, and has a shape in which the width decreases toward the tip. Any of these shapes can produce the same effect as the above embodiment.

In the above embodiment, the plurality of holes 34 are assumed to be circular, but are not limited to this. It may be a square hole 34D as shown, or a rectangular hole 34E as shown in FIG. That is, the shapes of the plurality of holes can be set appropriately. Also in this case, the sum of the opening areas of the plurality of holes is set to 12% or more and 83% or less of the area of the region Ar1 sandwiched between the ribs 33 on one surface of the paddle body 31. preferably.

In the above-described embodiment, as shown in FIG. 3, the plurality of ribs 33 have a shape extending linearly from the vicinity of the upper end of one surface of the paddle body 31 to the vicinity of the lower end. , as shown in FIG. 11, the upper and lower sides of the paddle body 31 may be formed so as to be displaced from each other. Specifically, in the plating solution agitating paddle 30F of this modification, the ribs 33F on the lower side are positioned between the ribs 33F on the upper side in FIG. A plurality of ribs 33F and a plurality of holes 34 are formed in a staggered manner. Also in this case, the same effect as the above embodiment can be obtained.
Also in this modification, the rib 33F may have a trapezoidal cross-sectional shape as shown in FIG. 6 or a semi-circular cross-sectional shape as shown in FIG.

In the above embodiment, the substrate 20 having a rectangular plate shape is used as an example of the material to be plated. For example, when the material to be plated is disc-shaped, the plating solution stirring paddle may also be formed in the shape of a disc that is larger than the material to be plated.

10 plating apparatus 11 plating tank 12 supply unit 13 anode 14 substrate holding unit 15 paddle drive unit 16 overflow tank 17 pump 20 substrate 30 plating solution stirring paddle 31 paddle body 32 inclined surface 33 33A 33B 33F multiple ribs 34 34C 34D 34E multiple the hole of

Claims (5)

A plating solution agitating paddle placed together with a material to be plated in a plating bath in which a plating solution is stored and agitating the plating solution, comprising a plate-like paddle body and a plate-like paddle body, and a paddle body extending in one direction on one side of the paddle body. a plurality of ribs formed parallel to each other along and parallel to each other, and a plurality of holes through which the plating solution can flow are formed between the plurality of ribs so as to penetrate the paddle body, and the plurality of ribs A paddle for stirring a plating solution has a shape projecting in a direction away from the one surface and having a width that decreases with increasing distance from the paddle body. The plurality of ribs has a height of 3 mm or more and 20 mm or less, an interval between the plurality of ribs is 5 mm or more and 50 mm or less, and an inclination angle of the side surfaces of the plurality of ribs with respect to the one surface is 29° or more and 75°. ° or less. 3. The plating solution stirring paddle according to claim 1, wherein the paddle body has a thickness of 4 mm or more and 20 mm or less. A plating bath in which a plating solution is stored, an anode arranged in the plating bath, a supply unit for supplying the plating solution in the plating bath, and the plating according to any one of claims 1 to 3 a paddle for stirring; and a paddle driving unit for repeatedly moving the paddle for stirring the plating disposed in the plating tank along the one direction, wherein the paddle for stirring the plating is arranged such that the plurality of ribs are to be plated. A plating apparatus using a paddle for stirring a plating solution, characterized in that it is arranged in the plating tank so as to face the material. When plating the material to be plated using the plating apparatus according to claim 4, the paddle driving unit is controlled to move the plating stirring paddle at a stroke of 60 mm or more and 180 mm or less at 100 mm / sec or more and 600 mm / sec. A plating method characterized by moving at the following speeds.

Images