JP2022114859A - Component mounting apparatus and component mounting method - Google Patents

Abstract

To provide a component mounting apparatus and a component mounting method, capable of improving recognition accuracy of components based on images by widely securing a dynamic range of multiple images, shortening time required for component recognition, and improving component mounting efficiency.SOLUTION: A component mounting apparatus includes: an image capturing unit including an illumination unit that illuminates a component retained by a head and capturing the components from below; and an image capturing control unit that controls illumination conditions including information on image capturing by the image capturing unit, and brightness of illumination by the illumination unit at the time of the image capturing. The image capturing control unit obtains a first image by turning on the illumination unit under a first illumination condition and causing the image capturing unit to perform image capturing at a first timing when the component is moving above the image capturing unit; and obtains a second image by turning on the illumination unit under a second illumination condition and causing the image capturing unit to perform image capturing at a second timing when the component is moving above the image capturing unit. The component recognition unit recognizes the component on the basis of the first image and the second image.SELECTED DRAWING: Figure 7

Description

The present disclosure relates to a component mounting device and a component mounting method.

A substrate manufacturing factory for semiconductors and the like is provided with a plurality of mounting substrate manufacturing lines, and a plurality of component mounting apparatuses are arranged in each of the mounting substrate manufacturing lines. Each of the component mounting apparatuses mounts a component such as an electronic component at a position where cream solder is printed on the board. In recent years, in order to improve the productivity of board manufacturing factories, there has been a demand for improvement in the operating efficiency of this component mounting apparatus as well.

As a conventional component mounting device, a moving head is equipped with a nozzle, and after illuminating the electronic component held by the nozzle with a lighting unit, an image is captured by a component recognition camera to perform image recognition of the electronic component. A device component recognition device is known (see, for example, Patent Document 1).

JP-A-2001-94299

It is assumed that the lighting unit disclosed in Patent Document 1 is used to image and recognize a component while moving (scanning) the component picked up by the nozzle mounted on the moving head above the component recognition camera. In this case, multiple images need to be acquired in order to recognize each different state or orientation of the part. Also, in order to acquire multiple images, the part must be moved over the part recognition camera at least twice. Therefore, it takes time to recognize the parts.

In addition, different pixel luminance values are required for the plurality of images in order to recognize each of the different states or orientations of the part using the plurality of acquired images. Therefore, a wide range (dynamic range) of pixel luminance values included in a plurality of images is required.

The present disclosure improves component recognition accuracy based on images by ensuring a wide dynamic range of a plurality of images, shortens the time required for component recognition, and improves component mounting efficiency. Provide a mounting method.

One aspect of the present disclosure includes an illumination unit that illuminates a component held by a head, an imaging unit that captures an image of the component from below, an image captured by the imaging unit, and brightness of the illumination by the illumination unit during imaging an imaging control unit for controlling an illumination condition including information of; a component recognition unit for recognizing the component from an image captured by the imaging unit; and a recognition result by the component recognition unit. a component mounting unit that mounts a component on a board, wherein the imaging control unit turns on the lighting unit under a first lighting condition at a first timing while the component is moving above the imaging unit. a first image is obtained by causing the imaging unit to perform imaging, and the illumination unit is lit under a second illumination condition at a second timing when the component is moving above the imaging unit. and acquiring a second image by causing the image capturing unit to perform image capturing, and the component recognition unit recognizes the component based on the first image and the second image. is.

According to one aspect of the present disclosure, an illumination condition including information on the brightness of illumination by an illumination unit that illuminates a component held by a head is controlled at the time of imaging, and the component held by the head is imaged from below. a step of controlling imaging by a unit; a step of recognizing the component from the image captured by the imaging unit; and a step of mounting the component on a board with the head based on the recognition result of the component. and the step of controlling the imaging includes lighting the lighting unit under a first lighting condition and causing the imaging unit to perform imaging at a first timing while the component is moving above the imaging unit. obtaining a first image; and lighting the illumination unit under a second illumination condition at a second timing while the component is moving above the imaging unit, and causing the imaging unit to capture an image. and obtaining a second image by aligning the part, wherein recognizing the part comprises recognizing the part based on the first image and the second image. How to wear it.

According to the present disclosure, by ensuring a wide dynamic range for a plurality of images, it is possible to improve the recognition accuracy of components based on the images, shorten the time required for component recognition, and improve component mounting efficiency.

FIG. 2 is a top view illustrating the mechanical configuration of the component mounting apparatus according to Embodiment 1; FIG. 2 is a side view illustrating the mechanical configuration of the component mounting device shown in FIG. 1; 3 is a perspective view illustrating the operation of the moving head shown in FIG. 2; FIG. 3 is a side view illustrating the mechanical configuration of the component recognition camera shown in FIG. 2; FIG. 5 is a perspective view illustrating the mechanical configuration of the lighting unit shown in FIG. 4; FIG. FIG. 2 is a block diagram illustrating the functional configuration of a control unit of the component mounting apparatus shown in FIG. 1; Schematic diagram exemplifying the arrangement of nozzles for mounting components and imaging timing under each lighting condition when imaging the components mounted on the nozzles; Graph exemplifying the work reflectance and image brightness of each part of the part when it is illuminated with an illumination value of 50 and imaged Graph exemplifying the work reflectance and image brightness of each part of the part when it is illuminated with an illumination value of 150 and imaged A table showing specific examples of lighting conditions for parts that are imaged multiple times An image diagram illustrating an image of a component imaged under illumination conditions for alignment. Image diagram illustrating an image of a component imaged under lighting conditions for character recognition Flowchart illustrating the operation of the component mounting device

Hereinafter, embodiments will be described in detail with reference to the drawings as appropriate. However, more detailed description than necessary may be omitted. For example, detailed descriptions of well-known matters and redundant descriptions of substantially the same configurations may be omitted. This is to avoid unnecessary verbosity in the following description and to facilitate understanding by those skilled in the art. It should be noted that the accompanying drawings and the following description are provided to allow those skilled in the art to fully understand the present disclosure and are not intended to limit the claimed subject matter thereby.

For example, the term "unit" or "apparatus" used in the embodiments is not limited to a physical configuration that is mechanically implemented by hardware, but also includes those that implement the functions of the configuration by software such as programs. . Also, the function of one configuration may be implemented by two or more physical configurations, or the functions of two or more configurations may be implemented by, for example, one physical configuration.

<About the mechanical configuration of the component mounting device>
First, the mechanical configuration of the component mounting apparatus 1 will be described with reference to FIGS. 1 and 2. FIG. FIG. 1 is a top view illustrating the mechanical configuration of a component mounting apparatus 1 according to Embodiment 1. FIG. FIG. 2 is a side view illustrating the mechanical configuration of the component mounting device 1 shown in FIG. 1 and 2, the front side of the component mounting device 1 (the lower side in the paper surface of FIG. 1, the left side in the paper surface of FIG. 2) is the front side, and the back side of the component mounting device 1 (the upper side in the paper surface of FIG. 2) is also referred to as the rear side.

One or a plurality of component mounting apparatuses 1 are arranged in a mounting board manufacturing line for mounting various components P on a board W and manufacturing the board W, and mounts the components P on the board W conveyed from the upstream of the mounting board manufacturing line. Wear it in the specified position and posture.

As shown in FIGS. 1 and 2, the component mounting apparatus 1 attaches components P (eg, electronic components such as ICs (Integrated Circuits), transistors, capacitors, etc., lead components, chip components, etc.) to a substrate W mainly by the operation of each part mechanism. , or BGA (Ball Grid Array) components), and a control unit 40 for controlling its operation. The body mechanism section 10 has a mounter body 11 configured by a base 12 and the like, and a head unit 23 configured to be movable with respect to the mounter body 11 . The control unit 40 is housed inside the base 12 (see below) of the component mounting apparatus 1 and controls various mechanisms such as the mounting machine main body 11 and the head unit 23 .

At the center of the base 12 of the mounter main body 11, a substrate transport mechanism 13 is arranged along the X direction (transport direction of the substrate W) shown in FIG. The substrate transport mechanism 13 has a pair of conveyor portions 14 extending along the X direction, transports the substrate W placed on the pair of conveyor portions 14, and positions the substrate W at a predetermined mounting position. and hold.

A pair of front and rear component supply mechanisms 15 are disposed facing each other on both front and rear sides of the board transfer mechanism 13 (both upper and lower sides in the plane of FIG. 1 and both left and right sides in the plane of FIG. 2). Each of the pair of component supply mechanisms 15 has a feeder base 16 provided with a slot 17, in which a plurality of tape feeders 18 are mounted in parallel as part feeders.

Moreover, the component mounting apparatus 1 further has a feeder cart 19 . The feeder cart 19 includes a truck portion 20 on which a plurality of wheels are arranged, and a plurality of reel stock portions (not shown) arranged above the truck portion 20 . A reel 21 is accommodated in each of the plurality of reel stock units. A carrier tape 22 accommodating a component P is pulled out from each of the reels 21 and the component P is supplied to the tape feeder 18 of the component supply mechanism 15 . As a result, the tape feeder 18 of the component supply mechanism 15 pitch-feeds the carrier tape 22 in the tape feeding direction, whereby the component P is picked up by the moving head 26 of the head unit 23, which will be described later. feed into position.

The head unit 23 is arranged above the base 12 and is configured to be movable between a mounting position where the component supply mechanism 15 and the substrate W are arranged, and a removal position. Specifically, the head unit 23 is linearly moved along the X direction and the Y direction by an X-axis table mechanism 25 and a Y-axis table mechanism 24 which are arranged orthogonally to each other on a plane substantially parallel to the surface of the substrate W. It is possible.

A Y-axis table mechanism 24 is arranged along the Y direction on the upper surface of the base 12 . A pair of front and rear X-axis table mechanisms 25 are arranged along the X direction, and are attached to each of the Y-axis table mechanisms 24 so as to be slidable along the Y direction. Further, a moving head 26 is attached to each tip of the pair of front and rear X-axis table mechanisms 25 so as to be slidable along the X direction. That is, in Embodiment 1, the moving head 26 is mounted on the head unit 23 , and the moving head 26 is provided so as to be movable independently of each other by the X-axis table mechanism 25 and the Y-axis table mechanism 24 . Thereby, the moving head 26 is arbitrarily positioned on a plane substantially parallel to the surface of the substrate W, that is, on a horizontal plane (XY plane). Both the X-axis table mechanism 25 and the Y-axis table mechanism 24 are composed of linear guide driving mechanisms.

A component recognition camera 28 (an example of an imaging unit) is arranged between the front and rear pair of component supply mechanism 15 and substrate transport mechanism 13 . A component holding nozzle 27 (see below) attached to the moving head 26 while picking up and holding the component P from the component supply mechanism 15 moves and passes above the component recognition camera 28 . At this time, the component recognition camera 28 images the component P sucked and held by the passing component holding nozzle 27 a plurality of times at a predetermined timing and under predetermined lighting conditions (see below). That is, the component recognition camera 28 captures an image of the component P held by the component holding nozzle 27, and while the control unit 40 is moving the component P above the component P, the lighting conditions are changed multiple times. Continuous imaging is performed at timing corresponding to each of the lighting conditions (see below). Identification and position detection of the component P are executed with high accuracy by integrating and recognizing each of the imaging results.

Further, a nozzle holder 38 and a waste box 37 are further arranged between the front and rear pair of the component supply mechanism 15 and the substrate transfer mechanism 13 . The nozzle holder 38 accommodates a plurality of types of component holding nozzles 27 of the moving head 26 corresponding to the components P to be held. By causing the moving head 26 to access the nozzle holder 38 and execute a predetermined nozzle replacement operation, the moving head 26 is mounted with a component holding nozzle 27 (described below) suitable for the object to be held. The disposal box 37 is formed in a box-like shape and has an internal space, in which parts P and the like determined to be defective as a result of recognition of imaging results by the component recognition camera 28 are discarded.

<Regarding the configuration and operation of the moving head>
Next, the configuration and operation of the moving head 26 will be described with reference to FIG. 3 is a perspective view illustrating the operation of the moving head 26 shown in FIG. 2. FIG.

The moving head 26 is a multiple head having a plurality of moving heads 26, and a plurality of component holding nozzles 27 are arranged side by side at the lower end of each moving head 26 (see FIG. 7). For example, the moving head 26 is provided with a plurality of component holding nozzles 27 (e.g., eight) in a plurality of rows (e.g., two rows). A reflector (an example of a first reflector) (not shown) for reflecting the illumination light emitted from the transmissive illumination section 34 (see below) is fixed to the moving head 26 . A reflector is placed above the part P that is held.

Each of the component holding nozzles 27 vacuum-adsorbs and holds the component P from the tape feeder 18 of the component supply mechanism 15 using air pressure, for example, and moves up and down individually. The moving head 26 also includes a Z-axis elevating mechanism (not shown) that individually raises and lowers each of the component holding nozzles 27, and a θ-axis rotating mechanism (not shown) that individually rotates each of the component holding nozzles 27 around the nozzle axis. ) and further. By driving the Y-axis table mechanism 24 and the X-axis table mechanism 25, the moving head 26 is arbitrarily positioned on the horizontal plane (XY plane). By this movement, the moving head 26 picks up the component P from the take-out position of the tape feeder 18 of the component supply mechanism 15 by sucking it with the component holding nozzle 27 .

A substrate recognition camera 36 (see FIG. 1) is fixed to the moving head 26. The board recognition camera 36 is arranged on the lower surface side of the X-axis table mechanism 25 and moves integrally with the moving head 26. As shown in FIG. As the moving head 26 moves, the substrate recognition camera 36 passes over the substrate W positioned by the substrate transport mechanism 13 and picks up an image of the substrate W. The position and orientation of the substrate W are detected by similarly recognizing this imaging result (imaging information).

As a result of detecting the position of the substrate W, the moving head 26 moves the component P to its mounting point (for example, the mounting position and mounting posture where the component P is to be mounted on the substrate W by the component holding nozzle 27 in accordance with the instruction of the control unit 40). ). This mounting of the component P per time is performed until all the components P sucked and held by each of the component holding nozzles 27 of the moving head 26 are mounted on the substrate W. FIG. In this manner, the component P is moved while being held by the component holding nozzle 27 of the moving head 26 between the picking position and the mounting position, and is finally mounted on the substrate W. FIG.

The component mounting apparatus 1 performs a series of retrieving and mounting of a plurality of components P by the component holding nozzles 27 of the moving head 26 and returning to the retrieving position until the mounting at the plurality of mounting points on the substrate W is completed. Perform work repeatedly. By repeating this operation, a large number of components P are sequentially mounted on each of the substrates W that are sequentially transported, and after mounting, the substrate W on which all the components P are mounted is transported to the downstream process. In this manner, the mounter main body 11 and the head unit 23 operate in cooperation, and this cooperative operation is executed according to instructions from the control section 40 .

Further, in the first embodiment, a series of work units consisting of forward movement from picking up of the part P at the picking position to mounting of the part P at the mounting work position, and subsequent return movement to the picking position. It is also called a work unit of "one turn". Further, forward movement in one turn from the removal position to the mounting work position is hereinafter simply referred to as "forward movement in one turn".

<About the configuration of the component recognition camera>
Next, the configuration of the component recognition camera 28 will be described with reference to FIGS. 4 and 5. FIG. FIG. 4 is a side view illustrating the mechanical configuration of component recognition camera 28 shown in FIG. FIG. 5 is a perspective view illustrating the mechanical configuration of the lighting unit section 31 shown in FIG. 4. As shown in FIG. For convenience of explanation, FIG. 4 also shows a moving head 26 that moves above the component recognition camera 28 and on its optical axis. Schematically illustrated.

As shown in FIG. 4 , the component recognition camera 28 has an imaging sensor section 29 and an illumination unit section 31 . The component recognition camera 28 illuminates the illumination unit 31 a plurality of times for the component P held by the moving head 26 only by forward movement (that is, one-way outward movement) in one turn, and corresponding to each timing. Then, the imaging sensor unit 29 continuously captures images from below.

The component recognition camera 28 can take images according to the scan imaging method, and has an ROI (Region Of Interest) function using an area sensor. The component recognition camera 28 can set the ROI range of the imaging sensor unit 29 at a plurality of locations (for example, 2 locations) by the ROI function, and continuously switch between the plurality of locations to capture images.

The imaging sensor unit 29 has a substantially cylindrical housing 30 and an imaging device (not shown) incorporated in the housing 30 . The imaging element is configured by, for example, a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). The imaging sensor section 29 has a shutter function, and is configured to be capable of performing exposure and imaging at a predetermined timing according to a command from an imaging processing section 47 (see below) of the control section 40 . The imaging sensor unit 29 transmits the result (imaging information) imaged by the imaging element to the control unit 40 .

In addition, the component recognition camera 28 has a center camera 29A and side cameras 29B as the imaging sensor section 29 . The center camera 29A is arranged such that its optical axis extends in the vertical direction (Z direction), and is capable of capturing an image of the component P moving above the component recognition camera 28 . The side cameras 29B are arranged on both sides of the center camera 29A in the horizontal direction, with their optical axes tilted with respect to the vertical direction (Z direction), and pick up images of the component P moving above the component recognition camera 28. It is possible to

The housing 32 of the lighting unit section 31 is formed in a box shape, and the housing 32 of the imaging sensor section 29 is stacked and connected to the upper side of the housing 30 . The illumination unit section 31 has a plurality of reflected illumination sections 33 , a plurality of transmission illumination sections 34 , a plurality of side illumination sections 35 and a coaxial illumination section 39 arranged inside the housing 32 thereof. The component mounting apparatus 1 illuminates the moving component P under a plurality of illumination conditions by appropriately using the plurality of reflected illumination units 33, the plurality of transmission illumination units 34, the plurality of side illumination units 35, and the coaxial illumination units 39. is turned on and the part P is imaged.

Each of the plurality of reflected illumination units 33 is arranged substantially parallel to the bottom wall 32p (that is, the XY plane, the horizontal plane) of the housing 32 of the illumination unit 31, and the irradiation direction thereof is aligned with the optical axis of the center camera 29A. provided along. When the reflected illumination unit 33 is turned on, the illumination light is emitted along the substantially vertical direction (substantially Z direction). Between the reflected illumination unit 33 and the component holding nozzle 27 that holds the component P to be illuminated, a transparent glass G is arranged along the horizontal direction. Reflected illumination is also referred to as oblique illumination.

The component P held by the component holding nozzle 27 is illuminated by the reflection illumination unit 33 at timing t1 when the component recognition camera 28 is moving above the component recognition camera 28, and the lower surface of the component P is illuminated through the transmission glass G. At least one of the center camera 29A and the side cameras 29B images the part P at this timing t1.

Each of the plurality of transmitted illumination units 34 is arranged obliquely with respect to the bottom wall 32p and the side wall 32q (that is, the Z direction) of the housing 32, and its irradiation direction is provided obliquely with respect to the optical axis of the center camera 29A. . Shielding plates B are arranged between the reflected illumination unit 33 and the transmitted illumination unit 34, respectively. The shielding plate B is also obliquely arranged with respect to both the bottom wall 32p and the side wall 32q of the housing 32 in the same manner.

When the transmissive illumination unit 34 is turned on, the illumination light is emitted obliquely with respect to the vertical direction (Z direction) and the horizontal direction (XY plane). At timing t2 when the component P held by the component holding nozzle 27 is moving above the component recognition camera 28, the transmission illumination unit 34 lights the reflector of the moving head 26, and as a result, the component P is illuminated. At least one of the center camera 29A and the side camera 29B captures an image of the component P at this lighting timing t2.

Each of the plurality of side lighting sections 35 is arranged substantially parallel to the side wall 32q of the housing 32 of the lighting unit section 31, and its irradiation direction is provided perpendicular to the optical axis of the center camera 29A. Also, the plurality of side illumination units 35 are arranged above the reflected illumination unit 33 and the transmitted illumination unit 34 . When the side illumination unit 35 is turned on, the illumination light is emitted along the horizontal plane.

The part P held by the part holding nozzle 27 is lit by the side lighting unit 35 at timing t3 when the part P is moving above the part recognition camera 28, and the side of the part P is illuminated. At least one of the center camera 29A and the side camera 29B captures an image of the component P at this lighting timing t3.

The coaxial illumination section 39 is arranged substantially parallel to the side wall 32q of the housing 32 of the illumination unit section 31, and its irradiation direction is provided perpendicular to the optical axis of the center camera 29A. The coaxial illumination section 39 is arranged below the reflected illumination section 33 . When the coaxial illumination unit 39 is turned on, the illumination light is emitted along the horizontal plane. Further, the component recognition camera 28 is provided with a reflector C (for example, a mirror) (an example of a second reflector) at a position separated from the coaxial illumination unit 39 on the XY plane. The coaxial illumination unit 39 lights up the reflector C and illuminates the area above the reflector C. As shown in FIG.

At timing t4 when the component P held by the component holding nozzle 27 is moving above the component recognition camera 28, the coaxial illumination unit 39 lights up the reflector C, and as a result, the component P passes through the transparent glass G. is illuminated. At least one of the center camera 29A and the side camera 29B captures an image of the component P at this lighting timing t4.

The lighting timings t1 to t4 of the lighting units are any one of a plurality of imaging timings within the forward movement time in one turn. Also, the lighting timings of the respective lighting units may overlap, and a plurality of lighting units may light up at the same time to illuminate the component P.

The component recognition camera 28 detects a plurality of types of images by switching the illumination conditions at each of a plurality of imaging timings when the component P is moving above according to the instruction from the control unit 40, and by lighting each of them and capturing an image. do.

As shown in FIG. 5, in the lighting unit section 31, a plurality of side lighting sections 35 are arranged in an annular shape along the horizontal direction. Also, the plurality of reflected illumination units 33 are arranged on the negative side in the Z direction with respect to the side illumination unit 35 . A central portion surrounded by a plurality of reflected illumination portions 33 is a space without illumination. A plurality of transmissive illumination units 34 are arranged outside the plurality of reflective illumination units 33 (on the side opposite to the central portion). A coaxial illumination unit 39 and a reflector C are arranged on the negative side in the Z direction of the reflected illumination unit 33 . The light emitted by the coaxial illumination section 39 is reflected by the reflector C, passes through the central portion surrounded by the plurality of reflected illumination sections 33, and travels to the positive side in the Z direction.

<Regarding the software configuration of the component mounting device>
Next, the software configuration (functional configuration) of the control unit 40 of the component mounting apparatus 1 will be described with reference to the drawings. FIG. 6 is a block diagram illustrating the functional configuration of the controller 40 of the component mounting apparatus 1 shown in FIG. 1. As shown in FIG.

The control unit 40 of the component mounting apparatus 1 is composed of a general-purpose computer, and a program as software stored in a storage device such as a ROM (Read Only Memory) or a RAM (Random Access Memory) of the computer is executed. It is executed by an arithmetic device such as a CPU (Central Processing Unit). That is, each block shown in the control unit 40 of FIG. 6 represents a function realized by software such as a program. However, the functions expressed by each of the blocks are not limited to software, and each may be configured by hardware as a physical configuration of the "apparatus".

The control unit 40 includes a storage unit 41 , a mechanism driving unit 46 and an imaging processing unit 47 . The mechanism drive unit 46 controls the main body mechanism unit 10, and controls the driving of, for example, the substrate transport mechanism 13, the component supply mechanism 15, and the head unit 23 so that they operate in cooperation with each other.

The storage unit 41 stores and holds at least mounting information 42 , component information 43 , illumination condition information 44 , and imaging timing information 45 . The mounting information 42 stores information such as the type of the component P to be mounted on each board W and the mounting position and mounting orientation of the component P on the board W. FIG. The component information 43 stores information such as the external shape of each type of component P, the presence or absence of electrodes, the number of electrodes, and the like.

The lighting condition information 44 stores information about the lighting conditions when the part P is imaged. The illumination condition information 44 may include brightness information (for example, illumination value) of each illumination channel formed for each illumination unit. The illumination value is, for example, a value corresponding to a current value flowing through each illumination (for example, LED) of each illumination channel and representing the degree of the current of the LED, and is also referred to as a lamp value. The illumination value can take any value in the range of values 0-255, for example. The illumination condition information 44 may include information indicating whether or not each illumination channel is lit (that is, whether it is lit or not). Information indicating whether or not each lighting channel is lit may include information on a combination of a plurality of lighting channels to be lit.

Also, the illumination condition information 44 may include information on the brightness of the entire illumination by the illumination unit section 31 instead of information on the brightness of each illumination channel. That is, the illumination value may correspond to, for example, a value indicating the brightness of the entire illumination of the illumination unit section 31 instead of the individual brightness of each illumination channel.

Each illumination channel may include a reflected illumination channel, a transmitted illumination channel, a side illumination channel, and a coaxial illumination channel. A reflected illumination channel is an illumination channel formed by one or more reflected illumination portions 33 . A transillumination channel is an illumination channel formed by one or more transillumination sections 34 . A side lighting channel is a lighting channel formed by one or more side lighting parts 35 . A coaxial illumination channel is an illumination channel formed by the coaxial illumination section 39 . Each lighting channel has a different lighting unit used for lighting, a different lighting direction, or the like, that is, a different lighting method.

The on and off of a lighting channel may be indicated by the lighting value of the lighting channel. For example, a lighting value of 0 may indicate that lighting channel, and a lighting value of any value between 1 and 255 may indicate that the lighting channel is illuminated. It should be noted that when the illumination channel to be turned on is switched when the illumination condition is switched, the illumination value of each illumination channel does not have to be switched. Also, when switching the lighting conditions, if the lighting value is switched, the lighting channel to be turned on does not have to be switched.

The imaging timing information 45 stores information about imaging timing (shutter timing) for imaging the component P multiple times. The image capturing timing information 45 may store, for example, information regarding the timing of turning on the lighting a plurality of times and the image capturing timing of the camera (simply referred to as the image capturing timing) during forward movement in one turn.

The imaging processing section 47 has a camera control section 48 and a component recognition section 50 .

The camera control section 48 controls imaging by the imaging sensor section 29 of the component recognition camera 28 and lighting conditions by the lighting unit section 31 at the time of imaging. For example, the camera control unit 48 reads the illumination condition information 44 and the imaging timing information 45 of the storage unit 41, and performs imaging of the component P held by the head unit 23 at a plurality of imaging timings according to the imaging timing information 45. A plurality of images are captured by lighting under a plurality of lighting conditions corresponding to the application or the type of the component P.

As a specific example, in forward movement in one turn, the camera control section 48 lights the lighting unit section 31 under the lighting condition LA at the imaging timing TA when the part P is moving above the part recognition camera 28, An image G1 (see, for example, FIG. 10A, which will be described later) showing the part P is acquired. Then, the camera control unit 48 similarly causes the lighting unit 31 to light up under the lighting condition LB at the next imaging timing TB immediately after the imaging timing TA (after a very short time) in the forward movement in one turn. An image G2 showing the same part P (for example, see FIG. 10B described later) is acquired. Various illumination conditions may be applied depending on the type of the component P, the application, etc., and are set before the component mounting apparatus 1 actually operates. The captured images G<b>1 and G<b>2 are transmitted to the component recognition section 50 .

The component recognition unit 50 recognizes each feature of the component P held by the component holding nozzle 27 based on the plurality of acquired images (for example, the image G1 and the image G2). The features of the part P may include, for example, the position of the part P, the orientation of the part P, the polarity of the part P, the three-dimensional shape of the part P, the outline of the part P, or letters added to the part P. Based on the recognition result by the component recognition section 50, the head unit 23 mounts the component P on the substrate W at a predetermined position and orientation with its moving head 26. FIG.

In addition, the polarity of the part P shows the front and back of the part P. As shown in FIG. For example, the polarity (front and back) may be indicated by chamfering a predetermined portion of the part P (for example, one of the four corners (for example, the lower left corner)). For example, the component P is mounted such that a chamfer exists at a predetermined location. Further, the polarity may be determined based on whether or not characters are present in the central portion of the part P together with the chamfering of a predetermined portion.

Note that the imaging information of the board recognition camera 36 is also transmitted to the imaging processing unit 47, and the imaging processing unit 47 recognizes the position and orientation of the substrate W from the imaging information (image) in the same manner as the component recognition unit 50. The recognition result is transmitted to the mechanism driving section 46 .

FIG. 7 is a schematic diagram illustrating the arrangement of the component holding nozzles 27 that mount the components P and the imaging timing under each lighting condition when imaging the component P mounted on the component holding nozzles 27 .

Each moving head 26 has two rows of eight component holding nozzles 27 capable of holding the component P arranged along the moving direction A of the component. It should be noted that 2 rows and 8 pieces are examples, and other plural numbers of rows and other plural numbers may be used. The arrangement position of the component recognition camera 28 is fixed. As the moving head 26 moves, the imaging sensor section 29 sequentially images each component P held by the two rows of component holding nozzles 27 . In this case, two components held by two component holding nozzles 27 located at the same position along the movement direction A in each row (for example, the first nozzle position, the second nozzle position, etc. from the right in FIG. 7). P is imaged at the same time. In other words, these two parts P are simultaneously included in the imaging range of the imaging sensor unit 29 . A plurality of component holding nozzles 27 located at the same position along the movement direction A in each row is also referred to as a "nozzle set". The moving head 26 illustrated in FIG. 7 has eight nozzle sets.

Under the control of the camera control unit 48, the imaging sensor unit 29 performs the first imaging of the component P under the illumination condition LA at the imaging timing TA during the outward movement in one turn, and immediately after the imaging timing TA (after a very short time ), the component P is imaged for the second time under the illumination condition LB at the imaging timing TB that follows. In FIG. 7, the imaging range of the first imaging is indicated by imaging range CA, and the imaging range of the second imaging is indicated by imaging range CB. That is, the imaging sensor unit 29 captures images of substantially the same location twice. Note that the imaging ranges CA and CB have the same shape and size here. In this way, the component mounting apparatus 1 suppresses the movement speed of the moving head 26 from decreasing for imaging, and performs illumination under two illumination conditions in one scan (forward movement in one turn). An image of the subject (component P) can be acquired, and image recognition accuracy based on this image can be improved.

Next, the work reflectance and the image brightness when an image is captured under illumination under each lighting condition will be described. The work reflectance is the reflectance of each work (for example, mold or electrode in part P). The work reflectance differs depending on the characteristics of each work. For example, a workpiece made of a metal material or the like has a high workpiece reflectance, and a workpiece made of a resin material or the like has a low reflectance. Image brightness corresponds to the pixel values of the captured image and is indicated by values 0-255, for example.

FIG. 8A is a graph exemplifying the work reflectance and image brightness of each part of the part when it is illuminated with an illumination value of 50 and imaged. The illumination value 50 here is a value indicating the brightness obtained by the overall illumination by the illumination unit section 31, not the individual brightness for each illumination channel. This illumination value is an example of the illumination condition LA for the first imaging.

For an illumination value of 50, the electrode portion of the part P has a higher workpiece reflectance than the mold portion. The image brightness of the mold portion is 50, and the image brightness of the electrode portion is 250. That is, the image brightness is higher in the electrode portion than in the mold portion. In other words, the molded portion does not reflect much of the illuminated light, and the image brightness of the imaged image becomes low, resulting in a state close to black. On the other hand, since the electrode portion reflects a large amount of the illuminated light, the image brightness of the picked-up image increases and becomes a state close to white. Therefore, in the image captured with the illumination value of 50, only the electrode portion is in a very bright state, and it can be said that the image is suitable for confirming the alignment based on the arrangement of the electrode portion. Alignment here refers to the arrangement of one or more electrodes on the part P. FIG.

FIG. 8B is a graph exemplifying the work reflectance and image brightness of each portion of the part when it is illuminated with an illumination value of 150 and imaged. The illumination value 150 here is a value indicating the brightness obtained by the overall illumination by the illumination unit section 31, not the individual brightness for each illumination channel. This illumination value is an example of the illumination condition LB for the second imaging.

For an illumination value of 150, the electrode portion of the part P has a higher workpiece reflectance than the mold portion. The image brightness of the mold portion is 150, and the image brightness of the electrode portion is 250. That is, the image brightness is higher in the electrode portion than in the mold portion. It should be noted that the image brightness of the mold portion is higher than that of the illumination value of 50, and the image brightness of the mold portion is about the same. Therefore, in an image captured under illumination with an illumination value of 150, the electrode portion is very bright and the mold portion is also bright. Therefore, for example, the character portion written on the mold portion of the component P also becomes bright, and it can be said that the image is suitable for character recognition. The control unit 40 can decipher the contents of the characters by recognizing the characters based on the imaged image, and can track the part P based on the result of deciphering the characters of the part P. Various inspections or traceability of the part P are possible.

In this way, the component recognition camera 28 may capture an image G1 with an illumination value that brightens the electrode portion of the component for the purpose of obtaining brightness suitable for component alignment in the first exposure. In the second exposure, the component recognition camera 28 switches the illumination value from that in the first exposure, with the aim of obtaining brightness at which the shading of the mold portion of the component P can be determined. Image G2 may be obtained by imaging at three times the illumination value of 31. Thereby, the component mounting apparatus 1 can obtain images with a wide dynamic range from the images G1 and G2, and can improve various recognition accuracy of the component P based on the images G1 and G2.

Next, specific examples of lighting conditions that take each lighting channel into consideration will be described.

FIG. 9 is a table showing specific examples of illumination conditions for a component P that is imaged multiple times. In table T1 of FIG. 9, the illumination condition includes information on the illumination value of each illumination channel. Illumination channel CH1 is a reflected illumination channel. Illumination channel CH2 is a transillumination channel. Illumination channel CH3 is a side illumination channel. Illumination channel CH4 is a coaxial illumination channel.

Also, in table T1, a combination of the first imaging of the component P and the second imaging of the component P is shown as an illumination pattern. Illumination patterns 1 to 4 are shown in table T1. For example, in the illumination pattern 1, the illumination condition LA is set for the first imaging, the illumination value of the illumination channel CH1 is 100, and the illumination values of the other illumination channels CH2 to CH4 are 0. In the illumination pattern 1, the illumination condition is LB in the second imaging, and the illumination values of the illumination channels CH1 to CH4 are all 50. FIG.

Further, in the table T1, in the first imaging, the application of the image is the same for any of the illumination patterns 1 to 4, and the illumination condition LA is fixed. The purpose of this image is for alignment. The image for alignment is an image for recognizing the arrangement of the electrodes on the component P. FIG.

On the other hand, in the table T1, in the second imaging, the images captured with the illumination patterns 1 to 4 are used for different purposes, and the illumination condition LB is variable. For example, the purpose of the second captured image of illumination pattern 1 is for character recognition. The image for character recognition is an image for recognizing characters attached to the component P. FIG. The illumination condition LB in this case is as described above.

For example, the purpose of the second captured image of illumination pattern 2 is for polarity discrimination. The image for polarity determination is an image for determining the polarity showing the front and back of the electrode pattern. The illumination condition LB in this case is such that the illumination value of the illumination channel CH1 is 100, the illumination value of the illumination channel CH2 is 100, the illumination value of the illumination channel CH3 is 30, and the illumination value of the illumination channel CH4 is 100. has the value 0.

For example, the purpose of the second captured image of the illumination pattern 3 is for 3D (three-dimensional) measurement. The image for 3D measurement is an image for measuring the height (length in the thickness direction) of the component P. In the illumination condition LB in this case, the illumination value of the illumination channel CH1 is 50, and the illumination values of the other illumination channels CH2 to CH4 are 0.

For example, the purpose of the second captured image of the illumination pattern 4 is for contour recognition. The image for shape recognition is an image for recognizing the shape of the component P (silhouette, for example, mold shape). The illumination condition LB in this case is such that the illumination value of the illumination channel CH1 is 0, the illumination value of the illumination channel CH2 is 90, the illumination value of the illumination channel CH3 is 0, and the illumination value of the illumination channel CH4 is 0. has the value 10.

Such illumination conditions for each imaging are stored in the storage unit 41 and included in the illumination condition information 44, for example. The illumination condition information 44 may be held for each illumination pattern as shown in FIG. Further, the illumination condition information 44 may be held in the storage unit 41 for each use of the image captured each time. Note that the illumination condition LA for the first imaging may be a variable condition like the illumination condition LB for the second imaging, and the imaging may be performed for purposes other than alignment.

FIG. 10A is an image diagram illustrating an image of the component P captured under the illumination condition LA for alignment. The image G1 in FIG. 10A is obtained, for example, by imaging under the illumination conditions LA of the illumination patterns 1 to 4 shown in FIG. It is an image for alignment. The image G1 is obtained, for example, by the first imaging.

In the image G1, a plurality of electrodes 61 are arranged along each edge of the component P having a substantially rectangular shape. In FIG. 10A, the array of electrodes 61 is made explicit by the fact that the image brightness of each electrode is relatively greater than the image brightness of its surroundings. The component recognition unit 50 can easily recognize the alignment of the electrodes 61 on the component P by recognizing the image G1, and can easily mount the component P based on this alignment.

FIG. 10B is an image diagram illustrating an image of the component P captured under the illumination condition LB for character recognition. The image G2 in FIG. 10B is, for example, a character recognition image obtained by imaging under the illumination condition LB of the illumination pattern 1 shown in FIG. 9 or the illumination condition LB as the illumination value 150 by the illumination unit 31 shown in FIG. 8B. This is an image for Image G2 is obtained, for example, by the second imaging.

In the image G2, a plurality of electrodes 61 are arranged along each edge of the component P having a substantially rectangular shape. Further, inside the array of the plurality of electrodes 61, there is a mold 63 to which the characters of the character portion 62 are added. In FIG. 10B, the arrangement of the electrodes 61 is clearly shown, and the characters added to the character portion 62 of the mold 63 are also clearly shown. The part recognition unit 50 can recognize the characters by extracting the characters in the part P by recognizing the image G2. Further, since the characters can be recognized, traceability of the parts P is improved based on the characters even when the parts P are manufactured or after shipment. Therefore, even if the component P is a very expensive component (for example, a BGA component), the component mounting apparatus 1 manages the serial rod of the component P, and can quickly respond to any trouble in the market. is.

Although the electrode 61 is also shown in the image G2, the mold 63 other than the electrode 61 is also shown brightly, so the difference in brightness between the electrode 61 and the other portions is smaller than in the image G1 of FIG. 10A. Therefore, the contrast of the image luminance in the image G2 is reduced. Therefore, compared with the image G2, the image G1 has a higher contrast of each electrode and a higher alignment recognition accuracy based on image recognition. Therefore, the image G1 is preferable to the image G2 as an image for alignment.

In this manner, the component recognition camera 28 may acquire the image G1 by capturing an image under illumination under the illumination condition LA for the first image capturing. The component recognition camera 28 may acquire the image G2 by changing the illumination condition in the second image capturing and capturing the image under the illumination condition LB of the second image capturing. In the image G1, the electrodes 61 have high brightness and high contrast, so the component mounting apparatus 1 can improve recognition accuracy of the component P alignment. Also, in the image G2, the characters of the character portion 62 have high brightness, so the component mounting apparatus 1 can improve the inspection accuracy or traceability accuracy of the component P. FIG.

<Operation of component mounting device>
Next, the operation of the component mounting device will be described.
FIG. 11 is a flowchart illustrating an operational flow executed by the control unit 40 shown in FIG. Note that a counter n (integer type variable) for sequentially counting the plurality of nozzle sets NS of the moving head 26 is stored in the storage unit 41 of the control unit 40 .

The mechanism drive unit 46 transmits an instruction to the head unit 23 to pick up and take out from the take-out position with the moving head 26 (S11). The head unit 23 takes out the part P from the take-out position. The mechanism drive unit 46 starts forward movement (head movement) in one turn from the transmission of S11, and moves above the component recognition camera 28 while holding the component P with the moving head 26 of the head unit 23. (S12). Then, the control unit 40 initializes the counter n (that is, assigns the integer "1" to the counter n), and counts that the nozzle set NS to be imaged is the first (S13).

The camera control unit 48 of the imaging processing unit 47 determines whether or not it is the first imaging timing TA based on the imaging timing information 45 (S14). If it is not the first imaging timing TA (No in S14), the process waits until the first imaging timing TA.

When it is the first imaging timing TA, the camera control unit 48 controls to illuminate the part P according to the illumination condition LA based on the illumination condition information 44, and controls to image the part P in the illuminated state. (S15). For example, at the first imaging timing TA, the camera control section 48 lights the illumination channel based on the illumination condition LA in the illumination unit section 31 with the illumination value based on the illumination condition LA, and causes the component recognition camera 28 to perform imaging. Accordingly, the camera control unit 48 can acquire the image G1 at the first imaging timing TA for imaging each component P held by the nozzle set NS corresponding to the counter n.

The camera control unit 48 determines whether or not it is the second imaging timing TB based on the imaging timing information 45 (S16). If it is not the second imaging timing TB (No in S16), the process waits until the second imaging timing TB.

When it is the second imaging timing TB, the camera control unit 48 controls to illuminate the part P according to the illumination condition LB based on the illumination condition information 44, and controls to image the part P in the illuminated state. (S17). For example, at the second imaging timing TB, the camera control section 48 lights the illumination channel based on the illumination condition LB in the illumination unit section 31 with the illumination value based on the illumination condition LB, and causes the component recognition camera 28 to perform imaging. Accordingly, the camera control unit 48 can acquire the image G2 at the second imaging timing TB for imaging each component P held by the nozzle set NS corresponding to the counter n. In other words, the camera control unit 48 obtains the image G2 in a state where the illumination condition is switched and illuminated at the second imaging timing TB immediately after the first imaging timing TA (after a very short period of time).

Further, in S17, the camera control unit 48 acquires information on the use of the image via an operation device (not shown), and based on the illumination condition information 44 held in the storage unit 41 and the information on the use of this image, , the illumination condition LB for the second imaging may be determined. Accordingly, the camera control unit 48 can acquire the image G2 by capturing the image under the illumination condition LB suitable for the application desired by the user, for example.

The control unit 40 determines whether or not the counter n is 8, that is, whether or not the processes of S14 to S17 have been completed for all nozzle sets NS (here, eight nozzle sets) (S18). If the eighth nozzle set NS corresponding to n=8 has not been completed, the integer 1 is added to the value of the counter n (S19), the process proceeds to S14, and the processing for the next nozzle set NS is executed. do.

In other words, the camera control unit 48 alternately captures the image G1 based on the illumination condition LA and the image G2 based on the illumination condition LB one by one, and captures each of the images G1 and G2 in the first set (first set). Nozzle set NS) is imaged. After imaging the first set, the mechanism drive unit 46 moves the moving head 26 along the movement direction A until the component holding nozzles 27 are absent (in this case, until the nozzle set NS is the eighth), A camera control unit 48 controls imaging by the component recognition camera 28 .

When the eighth nozzle set NS is completed, the component recognition unit 50 performs image recognition on each image G1 obtained by the first imaging of each nozzle set NS (S20). In this case, the component recognition unit 50 can acquire alignment information of each component P held by each component holding nozzle 27, for example, by image recognition of each image G1. The component recognition section 50 sends the recognition result of the image recognition to the mechanism driving section 46 .

Further, the component recognition unit 50 performs image recognition on each image G2 obtained by the second imaging of each nozzle set NS (S21). In this case, the component recognition unit 50 acquires recognition result information corresponding to each application (for example, character recognition, polarity discrimination, 3D measurement, or outline recognition) corresponding to the illumination condition LB by image recognition of each image G2. can. That is, the component recognition unit 50, for example, recognizes information on the recognition result of the characters attached to the component P, information on the polarity (for example, front and back) of the component P, information on the measurement result of 3D measurement, or recognition of the external shape of the component P. You can get result information. The component recognition section 50 sends the recognition result of the image recognition to the mechanism driving section 46 .

The moving head 26 reaches the vicinity of the mounting position of the component P soon after the component holding nozzles 27 of each nozzle set NS pass above the component recognition camera 28 . Then, the mechanism driving section 46 ends the upward movement of the component recognition camera 28 (S22). The mechanism drive unit 46 instructs the moving head 26 of the head unit 23 to mount the component P at a predetermined position and orientation on the substrate W based on the recognition result by the component recognition unit 50 . The head unit 23 mounts the component P on the board W with the moving head 26 according to the command from the mechanism driving section 46 (S23).

According to such a component mounting apparatus 1, since the component mounting apparatus 1 images the same component P a plurality of times during one turn forward movement, the component mounting apparatus 1 moves in the moving direction A in order to obtain a plurality of images G1 and G2. Only one scan is required, and the movement of the moving head 26 can be completed in a short time. Therefore, the component mounting apparatus 1 can shorten the imaging time of each component P, and can shorten the time until the recognition of each component P is completed. For example, when the moving head 26 moves for two turns, it takes about several 100 ms.

In addition, since the component mounting apparatus 1 sets different illumination conditions LA and LB when capturing the plurality of images G1 and G2, it is possible to obtain the plurality of images G1 and G2 with different pixel luminance values. Therefore, a wide range of pixel luminance values (dynamic range) can be secured over the plurality of images G1 and G2. Therefore, the component mounting apparatus 1 can recognize different states or postures of the component P based on the plurality of images G1 and G2 showing the component P, and can improve the recognition accuracy of the component P.

In other words, the component mounting apparatus 1 can image the same component P a plurality of times with different brightness with staggered lighting, expand the dynamic range over the plurality of images, and improve recognition accuracy of the component P. In addition, the component mounting apparatus 1 does not require the moving head 26 to hold each component P and reciprocate the same position a plurality of times to acquire images, thereby reducing the imaging time and production tact loss.

As described above, the component mounting apparatus 1 of the present embodiment includes the illumination unit 31 (an example of the illumination section) that illuminates the component P held by the moving head 26 (an example of the head), and the component P is illuminated from below. A camera control unit 48 (which controls a component recognition camera 28 (an example of an image capturing unit) that captures an image, an image captured by the component recognition camera 28, and lighting conditions including information on the brightness of the illumination by the lighting unit 31 at the time of image capturing. an example of an imaging control unit), a component recognition unit 50 for recognizing the component P from the images G1 and G2 captured by the component recognition camera 28, and the component P by the moving head 26 based on the recognition result of the component recognition unit 50. and a head unit 23 (an example of a component mounting section) to be mounted on the substrate W. The camera control section 48 sets the lighting unit section 31 to the lighting condition LA (an example of the first lighting condition) at the imaging timing TA (an example of the first timing) when the part P is moving above the part recognition camera 28 . , and an image G1 (an example of a first image) is obtained by causing the component recognition camera 28 to capture an image. The camera control section 48 sets the lighting unit section 31 to the lighting condition LB (an example of the second lighting condition) at the imaging timing TB (an example of the second timing) when the part P is moving above the part recognition camera 28 . , and an image G2 (an example of a second image) is obtained by causing the component recognition camera 28 to perform imaging. The component recognition unit 50 recognizes the component P based on the image G1 and the image G2.

As a result, the component mounting apparatus 1 acquires a plurality of images G1 and G2 in which the same component P appears under different illumination conditions LA and LB, so that images with a wide dynamic range can be obtained, and recognition accuracy of the component P can be improved. can improve. In addition, the component mounting apparatus 1 can perform two imaging operations under different lighting conditions during one movement (during forward movement in one turn). It is not necessary to do so, and the time required for recognizing the part P can be shortened.

Also, the lighting unit section 31 may have a plurality of lighting channels CH1 to CH4 with different lighting schemes. The lighting condition LA may include lighting values indicating the brightness of the first lighting by each of the plurality of lighting channels CH1-CH4. The lighting condition LB may include a lighting value indicating the brightness of the second lighting by each of the plurality of lighting channels CH1-CH4.

Thereby, the component mounting apparatus 1 can set the brightness for each illumination channel under each of the illumination conditions LA and the illumination conditions LB, and can illuminate the component P by adjusting the brightness in more detail. Therefore, the component mounting apparatus 1 can further improve recognition accuracy of the component P. FIG.

Also, the lighting unit section 31 may have a plurality of lighting channels CH1 to CH4 with different lighting schemes. The illumination condition LA may include information on the illumination channel used to capture the image G1. The illumination condition LB may include information on the illumination channel used to capture the image G2.

As a result, the component mounting apparatus 1 can adjust the illuminated position and brightness of the component P by using different illumination channels or a combination of different illumination channels as the illumination channels used to capture the image G1 and the image G2. The recognition accuracy of P can be improved.

Further, the camera control unit 48 may acquire information on the use of the image G2 and determine the illumination condition LB based on the use of the image G2.

As a result, the component mounting apparatus 1 is suitable for each application of recognition of the component P (for example, confirmation of characters attached to the component P, discrimination of the polarity of the component P, 3D measurement of the component P, and recognition of the outer shape of the component P). The image G2 can be captured by illuminating under the illumination condition LB. Therefore, the component mounting apparatus 1 can improve the recognition accuracy of recognition of the component P corresponding to each application using the captured image G2.

Also, the illumination condition LA may be a fixed condition. The illumination condition LB may be a variable condition.

As a result, the component mounting apparatus 1 can obtain the image G1 required for component recognition by setting the illumination condition for obtaining the image G1 required for component recognition as the illumination condition LA. In addition, the component mounting apparatus 1 acquires an image G2 captured under the illumination condition LB suitable for a desired application by setting an illumination condition for obtaining an arbitrary image G2 for component recognition as the illumination condition LB. can.

In addition, the plurality of illumination channels include a transmitted illumination channel CH2 that illuminates the first reflector arranged above the component P, a side illumination channel CH3 that illuminates the side of the component P, and a lower surface of the component P. A reflected illumination channel CH1 for illuminating and a coaxial illumination channel CH4 for illuminating a reflector C (an example of a second reflector) located below the part P may be included.

Thereby, the component mounting apparatus 1 can acquire the images G1 and G2 captured by illuminating the component P from various angles.

Various embodiments have been described above with reference to the drawings, but it goes without saying that the present disclosure is not limited to such examples. It is obvious that a person skilled in the art can conceive of various modifications or modifications within the scope described in the claims, and these also belong to the technical scope of the present disclosure. Understood. Further, each component in the above embodiments may be combined arbitrarily without departing from the gist of the present disclosure.

The present disclosure improves component recognition accuracy based on images by ensuring a wide dynamic range of a plurality of images, shortens the time required for component recognition, and improves component mounting efficiency. It is useful for the mounting method and the like.

1 Component Mounting Device 10 Main Body Mechanism 11 Mounting Machine Main Body 12 Base 13 Board Transfer Mechanism 14 Conveyor 15 Component Supply Mechanism 16 Feeder Base 17 Slot 18 Tape Feeder 19 Feeder Cart 20 Truck 21 Reel 22 Carrier Tape 23 Head Unit 24 Y Axis table mechanism 25 X-axis table mechanism 26 Moving head 27 Component holding nozzle 28 Component recognition camera 29 Imaging sensor section 30 Housing 31 Lighting unit section 33 Reflective lighting section 34 Transmissive lighting section 35 Side lighting section 36 Board recognition camera 37 Disposal box 38 nozzle holder 40 control unit 41 storage unit 42 mounting information 43 component information 44 illumination condition information 45 imaging timing information 46 mechanism driving unit 47 imaging processing unit 48 camera control unit 50 component recognition unit 61 electrode 62 character unit 63 mold B shield plate C Reflector G Transparent glass G1, G2 Image P Component W Substrate

Claims (7)

an imaging unit that includes an illumination unit that illuminates the component held by the head and that captures an image of the component from below;
an imaging control unit that controls imaging by the imaging unit and lighting conditions including information on the brightness of the illumination by the lighting unit at the time of imaging;
a component recognition unit that recognizes the component from the image captured by the imaging unit;
a component mounting unit that mounts the component on the board with the head based on the recognition result of the component recognition unit;
The image capturing control unit turns on the illumination unit under a first illumination condition and causes the image capturing unit to perform image capturing at a first timing while the component is moving above the image capturing unit. is obtained, and at a second timing when the component is moving above the imaging unit, the illumination unit is lit under a second illumination condition and the imaging unit is caused to perform imaging, thereby obtaining a second get the image,
the component recognition unit recognizes the component based on the first image and the second image;
Parts mounting device. The lighting unit has a plurality of lighting channels with different lighting schemes,
the first lighting condition includes lighting values indicating brightness of first lighting by each of the plurality of lighting channels;
wherein the second lighting conditions include lighting values indicative of brightness of second lighting by each of the plurality of lighting channels;
The component mounting device according to claim 1. The lighting unit has a plurality of lighting channels with different lighting schemes,
The first illumination condition includes information on an illumination channel used to capture the first image,
wherein the second lighting condition includes information on a lighting channel used to capture the second image;
The component mounting device according to claim 1 or 2. The imaging control unit is
Acquiring information on the use of the second image;
determining the second lighting condition based on the application of the second image;
The component mounting device according to any one of claims 1 to 3. The first illumination condition is a fixed condition,
The second illumination condition is a variable condition,
The component mounting device according to claim 4. The plurality of illumination channels are
a transillumination channel illuminating a first reflector positioned above the component;
a side lighting channel for illuminating the side of the component;
a reflected illumination channel for illuminating the underside of the part;
a coaxial illumination channel that illuminates a second reflector positioned below the component;
The component mounting device according to claim 2 or 3. A step of controlling illumination conditions including information on the brightness of the illumination at the time of imaging by an illumination unit that illuminates the component held by the head, and controlling imaging by an imaging unit that captures an image of the component held by the head from below. When,
a step of recognizing the component from the image captured by the imaging unit;
mounting the component on a substrate with the head based on the recognition result of the component;
has
The step of controlling the imaging includes:
obtaining a first image by turning on the illumination unit under a first illumination condition and causing the imaging unit to capture an image at a first timing when the component is moving above the imaging unit; When,
acquiring a second image by turning on the illumination unit under a second illumination condition at a second timing when the component is moving above the imaging unit and causing the imaging unit to perform imaging; , including
recognizing the component includes recognizing the component based on the first image and the second image;
How to install parts.

Images