JP2022114182A - Drawing device, drawing method, method for manufacturing laminated substrate, and program - Google Patents

Abstract

To appropriately generate drawing data.SOLUTION: A drawing device includes: a drawing unit for drawing a pattern on a substrate; and a drawing data generation part 42 for generating drawing data used in drawing of the pattern in the drawing unit. Design data indicating the pattern to be drawn on the substrate includes a lower figure that is a pattern region, and an upper figure superposed on the lower figure. The drawing data generation part 42 subjects the one figure of the lower figure and the upper figure to deformation processing, and generates drawing data by superposing the deformed one figure on the other figure that is not subjected to deformation processing or the other figure that has been subjected to deformation processing different from that of the one figure. Thereby, it is possible to appropriately generate the drawing data in which the one figure of the lower figure and the upper figure has been subjected to the deformation processing, and the other figure has not been subjected to the deformation processing or has been subjected to the different deformation processing.SELECTED DRAWING: Figure 3

Description

The present invention relates to a drawing apparatus, a drawing method, a laminated substrate manufacturing method, and a program.

2. Description of the Related Art Conventionally, a drawing apparatus that draws a pattern on a photosensitive material on a substrate without using a mask has been put into practical use. In the drawing apparatus, design data, which is vector data created using CAD or the like, is RIP-processed to generate drawing data used for pattern drawing, and pattern drawing is performed based on the drawing data. . In the apparatus disclosed in Patent Document 1, when an image indicated by image information is recorded on a recording medium that is deformed after the image is recorded, the image on the recording medium after deformation has the same shape as the image indicated by the image information. The image information is converted so that Then, based on the converted image information, an image is recorded on the recording medium before deformation.

Also, in recent years, ultra-high multilayer substrates (hereinafter referred to as "laminated substrates") in which a large number of substrates are laminated have been manufactured. In manufacturing a laminated substrate, a circuit pattern is formed by drawing a circuit pattern on each of a plurality of substrates and performing processing such as development and etching. Subsequently, a hole is formed in each substrate, and then multiple substrates are laminated. A plurality of laminated substrates are attached to a mold. In the plurality of substrates, the plurality of holes are continuous in the stacking direction, and the plurality of substrates are subjected to a bonding process while the positioning reference pins included in the mold are inserted into the plurality of holes. is applied.

JP 2005-157326 A

By the way, in a laminated board, since each board is thin, the board expands and contracts in the bonding process, and the size of the board changes from the size in the design data. The expansion ratio (scale) of the substrate differs, for example, depending on the position in the stacking direction. Therefore, in order for the circuit pattern on each board in the laminated board to approach the design data, the drawing data is deformed (corrected) based on the expected expansion and contraction rate of the board, and the circuit pattern is drawn on the board. can be considered. On the other hand, on each substrate, reference pin marks indicating positions where holes should be formed are also drawn. In this case, the design data includes, in addition to the lower graphic indicating the circuit pattern, an upper graphic superimposed on the lower graphic and indicating the reference pin mark. The rendering data is substantially raster data representing an image in which the upper graphic is superimposed on the lower graphic.

Here, if the drawing data is subjected to deformation processing based on the expansion/contraction rate of the substrate as described above, the positions of the plurality of holes in the plurality of stacked substrates will be shifted from each other. It becomes impossible to properly insert the reference pin into the part. In order to align the positions of a plurality of holes in a plurality of stacked substrates, the reference pin marks need to be at the same positions in the design data, drawing data, and patterns formed on the substrates. Therefore, without moving the reference pin mark, which is the upper graphic (that is, the reference pin mark is not deformed), drawing data in which the circuit pattern, which is the lower graphic, is deformed A method to generate it appropriately is required. Depending on the use of the board, there may be drawing data in which the upper graphic is transformed differently from the lower graphic. There is also a possibility that drawing data that has been written is required.

The present invention has been devised in view of the above problems. One of the lower graphic and the upper graphic is subjected to deformation processing, and the other graphic is not subjected to deformation processing or is subjected to different deformation processing. The purpose is to properly generate drawing data in which

According to a first aspect of the present invention, there is provided a drawing apparatus for drawing a pattern, comprising: a drawing unit for drawing a pattern on a substrate; and a drawing data generating section for generating drawing data used for drawing the pattern in the drawing unit. wherein design data indicating a pattern to be drawn on the substrate includes a lower graphic that is a pattern area and an upper graphic that is superimposed on the lower graphic, and the drawing data generation unit includes the lower graphic and Transformation processing is performed on one graphic of the upper graphic, and the other graphic is not subjected to the deformation processing, or the other graphic subjected to a deformation processing different from the one graphic is superimposed on the one graphic after deformation. generates the drawing data.

According to a second aspect of the invention, there is provided the drawing apparatus according to the first aspect, wherein the drawing data generation unit generates a lower figure image, which is raster data representing the lower figure, and raster data representing the upper figure. The drawing data is generated using a certain upper graphic image.

The invention according to claim 3 is the drawing apparatus according to claim 2, wherein the upper figure is a pattern area, and the design data is superimposed on the lower figure and around the upper figure. and the drawing data generation unit generates the drawing data using a background graphic image, which is raster data representing the background graphic.

The invention according to claim 4 is the drawing apparatus according to claim 2 or 3, wherein each of the lower graphic image and the upper graphic image is run-length compressed data.

The invention according to claim 5 is the drawing apparatus according to any one of claims 1 to 4, wherein the drawing unit comprises a stage for holding the substrate and a pattern for applying a pattern to the substrate on the stage. a head for drawing, a movement mechanism for moving the stage relative to the head, a drawing controller for executing drawing on the substrate by controlling the head and the movement mechanism, and the an imaging unit that captures an image of an alignment mark formed on a substrate to obtain a captured image; Perform transformation processing.

The invention according to claim 6 is the drawing apparatus according to any one of claims 1 to 5, wherein the substrate is one of a plurality of substrates included in a laminated substrate, and the upper figure is , indicates a position used for alignment of the substrate with respect to another substrate in manufacturing the laminated substrate, and deformation processing is not performed on the upper graphic in generating the drawing data.

According to a seventh aspect of the invention, there is provided the drawing apparatus according to the sixth aspect, wherein the drawing data generation unit is configured to generate the lower figure according to the deformation of the substrate that is expected to occur during the manufacturing of the laminated substrate. to perform the transformation process.

According to an eighth aspect of the present invention, there is provided a drawing method for drawing a pattern, comprising: a) indicating a pattern to be drawn on a substrate, and defining a lower figure as a pattern area and an upper figure superimposed on the lower figure; b) performing deformation processing on one of the lower graphic and the upper graphic, and performing the other graphic without the deformation processing, or performing a different deformation processing from the one graphic generating drawing data by overlapping the other graphic and the deformed one graphic; and c) drawing a pattern on the substrate by a drawing unit using the drawing data.

According to a ninth aspect of the invention, there is provided a method for manufacturing a laminated substrate, comprising: stacking a plurality of substrates including a substrate on which a pattern has been drawn by the drawing method according to the eighth aspect; A plurality of holes, including the holes formed at the positions indicated by , are continuous in the stacking direction in the plurality of stacked substrates, and the plurality of and performing a bonding process on the substrate of the drawing method, wherein the deformation process is not performed on the upper figure in the step b) of the drawing method.

According to a tenth aspect of the present invention, there is provided a program for causing a computer to generate drawing data used for drawing a pattern, wherein execution of the program by the computer causes the computer to: a) create a pattern to be drawn on a substrate; a step of preparing design data including a lower figure which is a pattern area and an upper figure to be superimposed on the lower figure; and a step of generating drawing data by superimposing the other graphic which is not deformed, or the other graphic which is deformed differently from the one graphic, and the one graphic after deformation.

According to the present invention, drawing data in which one of the lower graphic and the upper graphic has undergone deformation processing, and the other graphic has not been subjected to deformation processing or has been subjected to different deformation processing. can be generated properly.

1 is a perspective view showing the configuration of a drawing device; FIG. It is a figure which shows the structure of a computer. 3 is a block diagram showing functions of a control unit; FIG. It is a figure for demonstrating manufacture of a laminated substrate. It is a figure which shows the flow of manufacture of a laminated substrate. FIG. 4 is a diagram showing the flow of drawing in the drawing device; It is a figure which shows the upper surface of a board|substrate. FIG. 4 is a diagram showing part of a pattern indicated by design data; FIG. 10 is a diagram showing a full graphic image; FIG. 10 is a diagram showing a lower graphic image; It is a figure which shows an upper area|region image. It is the figure which overlap|superposed the all figure image and the upper area|region image. It is a figure which shows an upper figure image. It is the figure which superimposed the upper graphic image and the upper region image. FIG. 10 is a diagram showing a background graphic image; It is the figure which overlap|superposed the figure image under deformation|transformation and the background figure image. FIG. 10 is a diagram showing an intermediate synthesized image; It is the figure which superimposed the intermediate synthetic|combination image and the upper figure image. FIG. 4 is a diagram showing a drawing image;

FIG. 1 is a perspective view showing the configuration of a drawing device 1 according to one embodiment of the present invention. In FIG. 1, three directions orthogonal to each other are indicated by arrows as the X direction, the Y direction, and the Z direction. In the example shown in FIG. 1, the X and Y directions are horizontal and the Z direction is vertical.

The drawing apparatus 1 is a direct drawing apparatus that draws a pattern by irradiating a photosensitive material on a substrate 9 with spatially modulated light and scanning the irradiation area of the light on the substrate 9 . The substrate 9 is, for example, a substantially rectangular plate member in a plan view. The substrate 9 is, for example, a flexible printed wiring board. In the substrate 9, a resist film made of a photosensitive material is provided on the copper layer. The drawing apparatus 1 draws a circuit pattern on the resist film of the substrate 9 . In post-processes, processing such as development and etching is performed to obtain a substrate 9 on which a circuit pattern is formed.

The drawing apparatus 1 includes a stage 21 , a stage moving mechanism 22 , a stage elevating mechanism 23 , a drawing section 3 , an imaging section 5 and a control section 4 . The control unit 4 controls the stage moving mechanism 22, the stage elevating mechanism 23, the drawing unit 3, the imaging unit 5, and the like. The stage 21 is a substantially flat plate-like holding portion that holds the horizontal substrate 9 from below below the drawing portion 3 (that is, on the (−Z) side). The (+Z) side principal surface of the substrate 9 placed on the stage 21 (hereinafter referred to as “upper surface 91”) is substantially perpendicular to the Z direction and substantially parallel to the X and Y directions. be.

A stage lifting mechanism 23 moves the stage 21 in the Z direction. The stage moving mechanism 22 horizontally moves the stage 21 relative to the drawing unit 3 . In the example shown in FIG. 1, the stage moving mechanism 22 moves the stage 21 together with the stage lifting mechanism 23 in the Y direction. In other words, the stage moving mechanism 22 moves the stage 21 in a direction substantially parallel to the upper surface 91 of the substrate 9 . For example, the stage moving mechanism 22 is a moving mechanism that linearly moves the stage 21 along the guide rails, and uses a linear servomotor as a drive source. This allows the stage 21 to move with high precision. As a drive source for the stage moving mechanism 22, a ball screw with a motor attached may be used. The drawing apparatus 1 may be provided with a rotation mechanism that rotates the stage 21 in the circumferential direction around a rotation axis extending in the Z direction. Further, in the drawing apparatus 1, the stage lifting mechanism 23 may be omitted.

The drawing unit 3 includes a plurality of (five in the example shown in FIG. 1) heads 31 arranged in the X direction and the Y direction. A plurality of heads 31 are supported above the stage 21 by a head support portion 19 provided across the stage 21 . Each head 31 includes a light source and an optical modulator. For example, a DMD (digital mirror device) in which a plurality of micromirrors are arranged two-dimensionally is used as the light modulation section. The light modulating section may be a modulator or the like in which a plurality of light modulating elements are arranged one-dimensionally. The multiple heads 31 have substantially the same structure.

In the drawing apparatus 1, the upper surface 91 of the substrate 9 is irradiated with modulated (that is, spatially modulated) light from the plurality of heads 31 of the drawing unit 3, and the substrate 9 is moved in the Y direction by the stage moving mechanism 22. . As a result, the irradiation area of the light from the plurality of heads 31 scans the substrate 9 in the Y direction, and the circuit pattern is drawn on the substrate 9 . In the following description, the Y direction is also called "scanning direction", and the X direction is also called "width direction".

In the drawing apparatus 1 of FIG. 1, drawing on the substrate 9 is performed by a so-called single-pass (one-pass) method. Specifically, the stage moving mechanism 22 moves the stage 21 with respect to the plurality of heads 31 in the Y direction, and the irradiation area of the light from the plurality of heads 31 is shifted in the Y direction ( That is, scanning is performed only once in the scanning direction. Thus, drawing of the circuit pattern on the substrate 9 is completed. Note that the drawing apparatus 1 may be provided with a sub-scanning mechanism that moves the stage 21 or the head 31 in the X direction, and drawing on the substrate 9 may be performed by a so-called multi-pass method.

The imaging unit 5 has a plurality of cameras 51 (for example, CCD cameras). A plurality of cameras 51 are supported above the stage 21 by the head support section 19 in the same manner as the head 31 . The multiple cameras 51 are arranged at intervals in the width direction. In the example of FIG. 1, two cameras 51 are provided on both sides of the drawing unit 3 in the width direction. Each camera 51 captures an image of the substrate 9 on the stage 21 and acquires captured image data. Note that the number and arrangement of the cameras 51 may be changed variously.

FIG. 2 is a diagram showing the configuration of the computer 11. As shown in FIG. The computer 11 has a configuration of a general computer system including a CPU 111 that performs various arithmetic processing, a ROM 112 that stores basic programs, and a RAM 113 that stores various information. The computer 11 includes a fixed disk 114 for storing information, a display unit 115 for displaying various kinds of information, a keyboard 116a and a mouse 116b for receiving input from an operator as an input unit 116, an optical disk, a magnetic disk, and a magneto-optical disk. A reading/writing device 118 for reading information from or writing information to a computer-readable recording medium 12 such as a computer-readable recording medium 12; .

In the computer 11 , the program 120 is previously read from the recording medium 12 via the read/write device 118 and stored in the fixed disk 114 . Programs 120 may be stored on fixed disk 114 over a network. The computer 11 functions as the control unit 4 in the drawing apparatus 1 of FIG. do. The control unit 4 may be constructed by a dedicated electric circuit, or partially using a dedicated electric circuit. The control unit 4 may be implemented by cooperation of a plurality of computers, and in this case, the plurality of computers may be provided at positions separated from each other.

FIG. 3 is a block diagram showing functions of the control unit 4 realized by the computer 11. As shown in FIG. In FIG. 3, configurations other than the control unit 4 are also shown. The control unit 4 includes a storage unit 41 , a drawing data generation unit 42 and a drawing control unit 43 . The storage unit 41 is mainly realized by the RAM 113 and the fixed disk 114, and stores various information such as design data. The design data indicates images such as circuit patterns to be drawn on the substrate 9 . The drawing data generation unit 42 is mainly realized by the CPU 111 and generates drawing data, which will be described later, used for pattern drawing. The drawing control unit 43 is mainly realized by the CPU 111, and executes drawing on the substrate 9 by controlling the stage moving mechanism 22, the head 31 of the drawing unit 3, and the like based on the drawing data.

Here, a laminated substrate manufactured using the substrate 9 will be described. 4A and 4B are diagrams for explaining the manufacturing of the laminated substrate 90, and FIG. 5 is a diagram showing the flow of manufacturing the laminated substrate 90. FIG. The laminated board 90 is a super multi-layered board in which a plurality of (for example, 80 to 100) boards 900 are laminated. In FIG. 4, the number of substrates 900 is drawn smaller than the actual number. Typically, the multiple substrates 900 are approximately the same size. The substrate 9 on which the circuit pattern is drawn by the drawing device 1 is one of the plurality of substrates 900 included in the laminated substrate 90 . The laminated substrate 90 may include two or more substrates 9 on which circuit patterns are drawn by the drawing device 1 .

In manufacturing the laminated substrate 90, a plurality of substrates 900 having circuit patterns formed thereon are prepared and laminated (step S1). For example, a plurality of substrates 900 on which circuit patterns are formed are prepared by drawing a circuit pattern on each substrate 900 having a resist film provided on a copper layer, and then performing processing such as development and etching. be done. A plurality of substrates 900 are stacked in a predetermined order.

Here, on each substrate 900, a plurality of marks indicating the positions where the hole portions 901 are to be formed are formed together with a circuit pattern. A hole 901 is formed at the position. Since a reference pin 81, which will be described later, is inserted into the hole 901, the mark is hereinafter referred to as a "reference pin mark". The position of each reference pin mark relative to a predetermined reference position (eg, center) on substrate 900 is the same for multiple substrates 900 . Therefore, in the plurality of stacked substrates 900, the plurality of holes 901 are continuous in the stacking direction (vertical direction in FIG. 4).

A positioning reference pin 81 included in the mold 80 is inserted into a plurality of continuous holes 901 . The mold 80 also includes an upper mold 82 and a lower mold 83, and the upper mold 82 and the lower mold 83 are arranged on both sides of the plurality of substrates 900 in the stacking direction. Both ends of the plurality of reference pins 81 are supported by an upper die 82 and a lower die 83 . Two hot plates 84 are provided on both outer sides of the upper mold 82 and the lower mold 83 in the stacking direction. The two hot plates 84 are heated to a predetermined temperature. With the reference pins 81 inserted into the holes 901, the substrates 900 are hot-pressed in the stacking direction via the two hot plates 84 (see arrow A1 in FIG. 4). By performing the bonding process on the plurality of substrates 900 in this manner, the plurality of substrates 900 are bonded to each other to manufacture the laminated substrate 90 (step S2).

In one example of laminated substrates 90, the bonding process causes each substrate 900 to shrink slightly overall due to thermal effects. Also, the shrinkage rate differs depending on the position of the substrate 900 in the stacking direction. In manufacturing the laminated substrate 90, the shrinkage rate of the substrate 900 arranged at each position in the lamination direction is acquired in advance as deformation information during lamination by experiment or empirically. The deformation information of the substrate 9 during stacking is stored in the drawing data generation unit 42 of FIG.

Next, the flow of drawing in the drawing apparatus 1 will be described with reference to FIG. In the drawing apparatus 1, design data indicating a pattern to be drawn on the substrate 9 is stored in the storage unit 41 and prepared (step S11). The design data in the present embodiment is CAD (Computer-Aided Design) data, which is vector data including a plurality of graphics (objects). Details of the design data will be described later.

Also, the substrate 9 to be processed is placed and held on the stage 21 in FIG. The substrate 9 is moved below the imaging unit 5 by the movement of the stage 21 , and the upper surface 91 of the substrate 9 is imaged by the cameras 51 .

FIG. 7 is a diagram showing the top surface 91 of the substrate 9. As shown in FIG. A plurality of alignment marks 911 are formed on the upper surface 91 of the substrate 9 . The alignment mark 911 may be a part of a through-hole, wiring, or the like that is provided in advance on the substrate 9 . The alignment mark 911 can be observed through the resist film, and each camera 51 acquires (data of) a captured image of the alignment mark 911 . In the example of FIG. 7, a plurality of alignment marks 911 are provided at both ends in the scanning direction (Y direction). Therefore, when the stage moving mechanism 22 moves the substrate 9 in the scanning direction, the plural alignment marks 911 at both ends of the substrate 9 are imaged by the plural cameras 51 .

A plurality of captured images are input to the control unit 4 . The controller 4 obtains the positions (relative positions to the reference position) of the plurality of alignment marks 911 on the substrate 9 on the stage 21 from the plurality of captured images. The controller 4 also pre-stores the positions of the plurality of alignment marks 911 on the ideal substrate (the substrate 9 without deformation) and compares them with the positions of the alignment marks 911 on the actual substrate 9 . As a result, drawing deformation information indicating the deformation of the substrate 9 during pattern writing is obtained (step S12). The deformation of the substrate 9 is, for example, expansion and contraction or strain that occurs in the substrate 9 due to a previous process for the substrate 9 . The drawing deformation information indicating the deformation of the substrate 9 is output to the drawing data generation unit 42 in FIG.

The drawing data generator 42 generates drawing data used for pattern drawing from the design data (step S13). Details of the process of generating drawing data from design data will be described later. The drawing data generated by the drawing data generating section 42 is sent to the drawing control section 43 . Then, the stage moving mechanism 22 and the head 31 of the drawing section 3 are controlled by the drawing control section 43 based on the drawing data, so that the pattern is drawn on the substrate 9 (step S14). In the drawing apparatus 1 , a pattern is drawn on the substrate 9 by a drawing unit mainly composed of a stage 21 , a head 31 , a stage moving mechanism 22 , a drawing control section 43 and an imaging section 5 .

Next, processing for generating drawing data from design data will be described. FIG. 8 is a diagram showing part of a pattern indicated by design data. The design data includes a lower graphic and an upper graphic superimposed on the lower graphic. The lower figure is a pattern area (positive polarity area) indicating a circuit pattern 71 to be drawn on the substrate 9 . The upper figure is a pattern area showing the reference pin mark 76 already described. A reference pin mark 76 is superimposed on the circuit pattern 71 . The design data further includes a background graphic that is superimposed on the lower graphic and surrounds the upper graphic. The background figure is a non-pattern area (negative polarity area) indicating a surrounding area 77 of the reference pin mark 76 (hereinafter referred to as "mark surrounding area 77"). A mark surrounding region 77 is overlaid on the circuit pattern 71 . In the image indicated by the design data, the area of the circuit pattern 71 that overlaps the mark surrounding area 77 is a non-pattern area.

In the design data in this processing example, different attribute information is given to the lower graphic and the upper graphic and background graphic, and the lower graphic, upper graphic and background graphic can be distinguished using the attribute information. . In other words, in this processing example, the same attribute information is given to the top graphic and the background graphic, and it is impossible to distinguish between the two using the attribute information. As will be described later, different attribute information may be given to the upper graphic and the background graphic. In FIG. 8, the circuit pattern 71 and the reference pin marks 76, that is, the pattern regions are hatched (the same applies to FIGS. 9 to 19 described later). Also, the outer edge of the mark surrounding area 77 is indicated by a thin dashed line.

The drawing data generation unit 42 generates raster data representing a lower graphic, an upper graphic superimposed on the lower graphic, and a background graphic by RIP-processing the design data. The raster data represents a binary image 61 (hereinafter referred to as "full graphic image 61") in which the reference pin mark 76 and the mark surrounding area 77 are superimposed on the circuit pattern 71, as shown in FIG. The full graphic image 61 may be a multivalued image (similarly for other images). In the actual rendering device 1, the entire graphic image 61 is run-length compressed data, that is, run-length data. The run-length data indicates positions (change points) at which ON/OFF of light irradiation to the substrate 9 is switched during pattern writing.

By RIP-processing the design data excluding the upper graphic and the background graphic, raster data representing the lower graphic is generated. The raster data indicates a binary image 62 of the circuit pattern 71 (hereinafter referred to as "lower graphic image 62"), as shown in FIG. The lower graphic image 62 is also run-length compressed data. Furthermore, while extracting the upper graphic and the background graphic from the design data, RIP processing is performed on all the extracted figures as pattern regions to generate raster data indicating the regions of the upper graphic and the background graphic. As shown in FIG. 11, the raster data represents a binary image 62 (hereinafter referred to as "upper area image 63") having both the reference pin mark 76 and the mark surrounding area 77 as pattern areas. The upper region image 63 is also run-length compressed data. In FIG. 11, the outer edge of the reference pin mark 76 is indicated by a thin dashed line.

Typically, in the drawing data generation unit 42, immediately after the design data is stored in the storage unit 41 in step S11 of FIG. be. The generation of the full graphic image 61 , the lower graphic image 62 and the upper area image 63 is preferably completed when the substrate 9 is placed on the stage 21 . By performing the RIP process, which requires a certain amount of time, in advance, it is possible to start pattern drawing in a short time after the substrate 9 is placed on the stage 21 .

Subsequently, as shown in FIG. 12, when the full figure image 61 (see FIG. 9) and the upper area image 63 (see FIG. 11) are superimposed, the pattern area (see FIG. 12) is formed in both images. cross-hatched area) are extracted. In other words, an AND (logical product) combination of the all graphic image 61 and the upper area image 63 is performed. As a result, as shown in FIG. 13, an upper figure image 64 showing the reference pin mark 76 as a pattern area is generated. In the design data, when different attribute information is assigned to the upper graphic and the background graphic, the upper graphic image 64 is generated by RIP-processing the upper graphic extracted from the design data. may

When the upper figure image 64 is generated, as shown in FIG. 14, when the upper figure image 64 and the upper area image 63 (see FIG. 11) are superimposed, only one of the images becomes a pattern area. 14 (regions hatched in FIG. 14, excluding cross-hatched regions) are extracted. In other words, the upper graphic image 64 and the upper area image 63 are XOR-combined. As a result, as shown in FIG. 15, a background graphic image 65 showing the mark surrounding area 77 as a pattern area is generated. In the design data, when different attribute information is assigned to the upper graphic and the background graphic, the background graphic image 65 is generated by RIP-processing the background graphic extracted from the design data. may When the substrate 9 is placed on the stage 21, it is preferable that the generation of the upper graphic image 64 and the background graphic image 65 is completed.

Subsequently, deformation processing is performed on the lower graphic image 62 in FIG. At this time, preferably, a plurality of drawing blocks arranged in a matrix in two directions orthogonal to each other are set on the upper surface 91 of the substrate 9, and when the above-described RIP processing is performed, each image is divided into a plurality of drawing blocks. is divided into a plurality of drawing data elements (so-called mesh data) corresponding to the drawing blocks. In the drawing data generation unit 42 , deformation processing is performed by moving the positions of the plurality of drawing data elements in the lower graphic image 62 , that is, by moving the drawing positions of the plurality of drawing blocks on the substrate 9 . Of course, deformation processing may be performed by other methods.

In this embodiment, the deformation processing is performed based on the drawing deformation information. As described above, the deformation information during writing indicates the difference between the position of the alignment mark 911 on the ideal substrate (the substrate 9 with no deformation) and the position of the alignment mark 911 on the actual substrate 9 . Also, the lower graphic image 62 shows a circuit pattern 71 adapted to an ideal substrate. Therefore, by referring to the drawing deformation information, the lower graphic image 62 is deformed (corrected) in accordance with the deformation of the substrate 9, and a deformed lower graphic image representing the circuit pattern after deformation is generated. Note that the substrate 9 in FIG. 7 in which the alignment marks 911 are provided at four corners is merely an example, and the alignment marks 911 may be provided at desired positions. Further, a plurality of individual piece areas may be set on the upper surface 91, and the deformation processing of the lower figure image 62 may be performed for each individual piece area based on the drawing-time deformation information.

The deformation processing may be performed based on the already described deformation information during stacking. In this case, for example, a process of enlarging or reducing the entire lower graphic image 62 is performed with the reference position as the center. In the example of FIG. 4, since the substrate 9 shrinks slightly during the manufacturing of the laminated substrate 90, deformation processing is performed to enlarge the lower graphic image 62 so that the pattern according to the design data is formed on the substrate 9 after shrinking. will be As a result, a deformed graphic image showing the circuit pattern after enlargement is generated. The deformation processing may be performed based on both the drawing deformation information and the lamination deformation information. In this case, for example, the deformation processing for enlarging or reducing the entire lower graphic image after deformation based on the drawing deformation information is further performed based on the stacking deformation information. In the drawing device 1, the deformation processing of the lower graphic image 62 may be performed based on information other than the deformation information during drawing and the deformation information during stacking.

Subsequently, as shown in FIG. 16, when the deformed graphic image showing the circuit pattern 71a after deformation is superimposed on the background graphic image 65 (see FIG. 15) on which the deformation processing is not performed, the deformed In the pattern area of the graphic image, the area overlapping the pattern area of the background graphic image 65 (that is, the area where the modified circuit pattern 71a and the mark surrounding area 77 overlap, and the cross-hatched area in FIG. 16) is non-existent. Converted to pattern area. As a result, as shown in FIG. 17, an intermediate synthesized image 66 is generated that shows, as a pattern area, the area of the modified circuit pattern 71a excluding the mark surrounding area 77. FIG. An intermediate composite image 66 shows an image in which a background graphic that has not undergone deformation processing is superimposed on the lower graphic after deformation. In FIGS. 16 and 17, the circuit pattern 71a is moved to the right side due to the deformation processing of the lower graphic image 62. FIG.

After that, as shown in FIG. 18, when the intermediate synthesized image 66 and the upper graphic image 64 (see FIG. 13) not subjected to deformation processing are superimposed, one or both images have a pattern area. Regions (in FIG. 18, any of the hatched regions) are extracted. In other words, the intermediate synthesized image 66 and the upper graphic image 64 are OR-synthesized. As a result, the drawing image 67 shown in FIG. 19, that is, the drawing data is generated. The drawing image 67 shows an image in which the reference pin mark 76, which is the pattern area, and the mark surrounding area 77, which is the non-pattern area, are superimposed on the modified circuit pattern 71a. In other words, the drawing image 67 shows an image in which the upper graphic and the background graphic which have not been deformed are superimposed on the lower graphic after deformation.

As described above, the drawing apparatus 1 prepares design data indicating patterns to be drawn on the substrate 9 . The design data includes a lower figure that is a pattern area, an upper figure that is a pattern area superimposed on the lower figure, and a background figure that is a non-pattern area that is superimposed on the lower figure and surrounds the upper figure. . The drawing data generation unit 42 generates drawing data by performing a deformation process on the lower graphic and superimposing the upper graphic and the background graphic which are not subjected to the deformation process on the modified lower graphic. As a result, it is possible to appropriately generate drawing data in which the lower graphic has been subjected to the deformation process and the upper graphic and the background graphic have not been subjected to the deformation process.

As described above, the top figure shows the positions (reference pin marks 76 in the above example) that are used to align the substrate 9 with respect to the other substrate 900 in manufacturing the laminated substrate 90 . Since the drawing apparatus 1 does not perform deformation processing on the upper graphic, the position used for alignment is prevented from deviating from the position indicated by the design data. As a result, it is possible to prevent the position of the substrate 9 from being shifted in the manufacturing of the laminated substrate 90, and as a result, the laminated substrate 90 can be properly manufactured. Preferably, the drawing data generation unit 42 performs deformation processing on the lower graphic according to the deformation of the substrate 9 that is expected to occur when the laminated substrate 90 is manufactured. Thereby, in the laminated substrate 90, the circuit pattern on the substrate 9 corresponding to the lower figure can be approximated to the design data.

By the way, raster data (in this embodiment, run length data) generated from design data cannot contain information about superimposition of graphics unlike design data. Therefore, it is impossible to specify the area of the circuit pattern 71 and the area of the reference pin mark 76 only with the full graphic image 61 of FIG. Therefore, for example, it is conceivable to perform deformation processing on the circuit pattern 71 by separately designating the area of the circuit pattern 71 in the all graphic image 61 . However, in the all-graphic image 61, the information of the portion of the circuit pattern 71 (lower graphic) that overlaps the reference pin mark 76 and the mark surrounding area 77 (upper graphic and background image) is lost. Even if the relevant portion of the pattern 71 does not overlap the reference pin mark 76 and the mark surrounding area 77, the relevant portion cannot be reproduced properly.

On the other hand, the drawing data generator 42 generates a lower figure image 62 as raster data representing a lower figure, an upper figure image 64 as raster data representing an upper figure, and a background figure image as raster data representing a background figure. 65 are used to generate drawing data. As a result, even the portion of the lower graphic that does not overlap the upper graphic and the background graphic due to the deformation process can be appropriately reproduced in the drawing data, and the drawing data can be generated with high accuracy. The background graphic image may be the upper area image 63 in FIG. 11 showing both the reference pin mark 76 and the mark surrounding area 77 as pattern areas. In the above processing example, the lower graphic image 62, the upper graphic image 64, and the background graphic image 65 are run-length data, but they do not necessarily have to be run-length data.

In the drawing data generator 42, the design data (vector data) including the lower graphic, the upper graphic and the background graphic may be subjected to deformation processing for the lower graphic. In this case, drawing data is generated by performing RIP processing on modified design data representing an image in which an upper graphic and a background graphic which have not been subjected to deformation processing and a lower graphic after deformation are superimposed. As a result, it is possible to appropriately generate drawing data in which the lower graphic has been subjected to the deformation process and the upper graphic and the background graphic have not been subjected to the deformation process.

By the way, since the RIP process requires a certain amount of time, in order to start pattern drawing in a short time after mounting the substrate 9 on the stage 21, it is necessary to perform RIP when the substrate 9 is mounted on the stage 21. Processing is preferably complete. On the other hand, in preferred processing in the drawing apparatus 1, the deformation processing is performed on the lower figure based on the actual position of the alignment mark 911 on the substrate 9 indicated by the captured image. In this case, if the above-described method of performing deformation processing on the lower figure in the design data is adopted, the lower figure is subjected to the deformation process after the captured image is acquired, and then the RIP process is performed. pattern drawing cannot be started in a short period of time after the placement of the . Therefore, in order to start pattern drawing in a short time after placing the substrate 9 on the stage 21, the lower graphic image 62, the upper graphic image 64 and the background graphic image 65 are used as described above. Data is preferably generated.

Various modifications can be made to the drawing apparatus 1, the drawing method, and the manufacturing method of the laminated substrate 90 described above.

Depending on the pattern to be drawn on the substrate 9, the background figure may be omitted from the design data. In this case, the drawing data generator 42 generates drawing data using the lower graphic image, which is raster data representing the lower graphic, and the upper graphic image, which is raster data representing the upper graphic. Also, the upper figure may be a non-pattern area. In other words, the design data may include a lower figure, which is a pattern area, and an upper figure, which is a non-pattern area.

In the drawing device 1, the deformation processing different from that for the lower graphic may be performed on the upper graphic. Also, the deformation process may be performed on the upper graphic without performing the deformation process on the lower graphic. As described above, the drawing data generation unit 42 performs the deformation process on one of the lower graphic and the upper graphic, and the other graphic without the deformation process, or the corresponding figure with the deformation process different from the one graphic. Drawing data is generated by superimposing the other graphic and the deformed one graphic. As a result, drawing data in which one of the lower graphic and the upper graphic has undergone transformation processing, and the other graphic has not undergone transformation processing or has undergone a different transformation processing, can be displayed appropriately. can be generated.

In the design data, the overlapping relationship (hierarchical relationship) between the upper graphic and the lower graphic may be expressed by arranging the two graphics on different layers.

Various structures can be adopted for the movement mechanism in the drawing apparatus 1 as long as the stage 21 moves relative to the head 31 . For example, the stage 21 may be fixed and the head 31 may move in the Y direction. Alternatively, both head 31 and stage 21 may move.

In the drawing apparatus 1, the drawing unit that draws the pattern on the substrate 9 may draw the pattern with an electron beam or the like, or draw the pattern with an inkjet.

The drawing apparatus 1 may be used for purposes other than manufacturing the laminated substrate 90 . The substrate 9 on which the pattern is drawn may be a semiconductor substrate, a glass substrate, or the like, in addition to the printed wiring board.

The configurations in the above embodiment and each modified example may be combined as appropriate as long as they do not contradict each other.

REFERENCE SIGNS LIST 1 drawing device 5 imaging section 9,900 substrate 11 computer 21 stage 22 stage moving mechanism 31 head 42 drawing data generation section 43 drawing control section 62 lower graphic image 64 upper graphic image 65 background graphic image 67 drawing image 71, 71a circuit pattern 76 reference pin mark 77 mark surrounding area 81 reference pin 90 laminated substrate 120 program 901 hole (of substrate) 911 alignment mark S1, S2, S11 to S14 steps

Claims (10)

A drawing device for drawing a pattern,
a drawing unit for drawing a pattern on a substrate;
a drawing data generation unit that generates drawing data used for pattern drawing in the drawing unit;
with
design data indicating a pattern to be drawn on the substrate includes a lower figure that is a pattern area and an upper figure that is superimposed on the lower figure;
The drawing data generation unit performs a deformation process on one of the lower graphic and the upper graphic, and converts the other graphic to which no deformation process is performed, or the other graphic to which a different deformation process is performed than the one graphic. and generating the drawing data by superimposing the deformed one graphic. The drawing apparatus according to claim 1,
The drawing data generation unit generates the drawing data using a lower graphic image that is raster data representing the lower graphic and an upper graphic image that is raster data representing the upper graphic. Device. The drawing apparatus according to claim 2,
the upper figure is a pattern area,
The design data further includes a background graphic that is a non-pattern area that is superimposed on the lower graphic and surrounds the upper graphic,
A drawing apparatus, wherein the drawing data generation unit generates the drawing data using a background graphic image, which is raster data representing the background graphic. 4. The drawing device according to claim 2 or 3,
A drawing apparatus, wherein each of said lower graphic image and said upper graphic image is run-length compressed data. The drawing apparatus according to any one of claims 1 to 4,
The drawing unit
a stage holding the substrate;
a head for drawing a pattern on the substrate on the stage;
a moving mechanism that moves the stage relative to the head;
a drawing control unit that executes drawing on the substrate by controlling the head and the moving mechanism;
an imaging unit that captures an image of an alignment mark formed on the substrate on the stage to obtain a captured image;
with
The drawing apparatus, wherein the drawing data generating section performs deformation processing on the one figure based on the position of the alignment mark indicated by the captured image. The drawing apparatus according to any one of claims 1 to 5,
the substrate is one of a plurality of substrates included in a laminated substrate;
wherein the upper figure indicates a position used for aligning the substrate with respect to another substrate in manufacturing the laminated substrate;
1. A drawing apparatus, wherein in generating said drawing data, said upper graphic is not deformed. The drawing device according to claim 6,
A drawing apparatus according to claim 1, wherein the drawing data generating section performs a deformation process on the lower figure in accordance with a deformation of the substrate that is expected to occur when manufacturing the laminated substrate. A drawing method for drawing a pattern,
a) a step of preparing design data indicating a pattern to be drawn on a substrate and including a lower figure as a pattern area and an upper figure superimposed on the lower figure;
b) One of the lower graphic and the upper graphic is subjected to deformation processing and the other graphic is not subjected to deformation processing, or the other graphic is subjected to deformation processing different from that of the one graphic and the deformation processing is performed. On the other hand, a step of generating drawing data by superimposing figures;
c) drawing a pattern on the substrate by a drawing unit using the drawing data;
A drawing method comprising: A method for manufacturing a laminated substrate,
A step of stacking a plurality of substrates including a substrate on which a pattern has been drawn by the drawing method according to claim 8;
A plurality of holes including the hole formed at the position indicated by the upper figure in the substrate are continuous in the stacking direction in the plurality of stacked substrates, and a reference pin is inserted into the plurality of holes. a step of performing a bonding process on the plurality of substrates in this state;
with
A method for manufacturing a laminated substrate, wherein in the step b) of the drawing method, the upper figure is not deformed. A program for causing a computer to generate drawing data used for drawing a pattern, wherein execution of the program by the computer causes the computer to:
a) a step of preparing design data indicating a pattern to be drawn on a substrate and including a lower figure as a pattern area and an upper figure superimposed on the lower figure;
b) One of the lower graphic and the upper graphic is subjected to deformation processing and the other graphic is not subjected to deformation processing, or the other graphic is subjected to deformation processing different from that of the one graphic and the deformation processing is performed. On the other hand, a step of generating drawing data by superimposing figures;
A program characterized by causing the execution of

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