JP2010204421A - Drawing device, data processing device for drawing device, and method for generating drawing data for drawing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a direct drawing device capable of correcting a drawing data in accordance with deformation of a substrate through an easy process. <P>SOLUTION: A drawing area including an object image for drawing represented by an initial drawing data in a raster format, which is converted from a pattern data in a vector format, is virtually divided into a plurality of mesh areas; and in each of the plurality of mesh areas, a division drawing data correlating the arrangement position in the drawing area and the drawing contents at the arrangement position is created. Upon drawing, an arrangement position to rearrange the plurality of mesh areas according to the shape of a substrate is specified based on the position of an alignment mark provided on the substrate, which is identified from a photographed image obtained by photographing the substrate as a drawing object; and drawing contents correlating to the plurality of mesh areas in the division drawing data are synthesized to create one drawing data while the plurality of mesh areas are rearranged at specified arrangement positions. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a direct drawing apparatus for drawing a printed circuit board, a semiconductor substrate, a liquid crystal substrate, and the like, and more particularly to a correction process performed on drawing data at the time of drawing.

  By irradiating exposure light such as laser light while scanning, local exposure is continuously performed on a drawing target such as a printed circuit board, a semiconductor substrate, and a liquid crystal substrate (hereinafter, also simply referred to as a substrate), thereby obtaining a desired A direct drawing apparatus (direct drawing apparatus) for drawing a circuit pattern is conventionally known.

  The drawing of the circuit pattern by the direct drawing apparatus is performed in accordance with the drawing data that is converted from the circuit pattern design data and has a description format that can be processed by the direct drawing apparatus. However, although the above-mentioned substrates may have deformations such as warpage, distortion, and distortion caused by processing in the previous process, design data is usually created without taking these deformations into account. Therefore, even if the circuit pattern is drawn using the converted drawing data as it is, sufficient drawing quality cannot be obtained and the yield cannot be improved. For this reason, in the drawing by the direct drawing apparatus, the shape of the substrate to be drawn is measured in advance, and the obtained measurement result is added to the control factor to control the operation of the exposure light irradiation mechanism, or the measurement result is This is performed by correcting the drawing data itself based on the corrected drawing data.

  In the former case, for example, when scanning the exposure light, the shape of the substrate in the scanning direction front is measured, and the movement operation of the light source during the exposure process and the movement operation of the table holding the substrate are controlled according to the measurement result. The

  Various correction processes for realizing the latter are known. For example, a process of correcting drawing data by converting the coordinates of all the pixels in the divided area by a FFD (Free Form Deformation) method or an affine transformation in units of a square divided area is already known ( For example, see Patent Document 1).

  Alternatively, a mode is also known in which positioning of a plurality of patterns to be multifaceted is performed individually based on positioning coordinates for each pattern, and drawing data is corrected for each pattern (for example, Patent Document 2 and (See Patent Document 3).

JP 2005-37911 A JP-A-2005-300628 JP 2000-122303 A

  The mode of controlling the operation of the exposure light irradiation mechanism using the substrate shape measurement result as a control factor is effective for uniform distortion and warpage of the entire drawing target. However, when the substrate is irregularly deformed, there is a problem that suitable operation control may be difficult, and even if the control can be performed, it is necessary to reduce the drawing speed.

  Also, when the direct drawing device is used inline in a device manufacturing process or the like and drawing is performed continuously on a plurality of substrates, until the direct drawing device acquires the positioning coordinates and starts the drawing operation. It is required to reduce the waiting time as much as possible. In particular, the process of correcting the drawing data itself based on the shape measurement result is a process of increasing this waiting time, and therefore it is required that such a correction process can be performed in as short a time as possible.

  In this regard, in the case of the method disclosed in Patent Document 1, since complex calculation processing is performed on the coordinates of all the pixels in the divided region, drawing data with many coordinate points (for example, a large drawing size) In the case of image data expressing a circuit pattern or drawing data expressing a very complicated circuit pattern, there is a problem that it takes time to perform arithmetic processing for coordinate conversion.

  Also, in the case of the methods disclosed in Patent Document 2 and Patent Document 3, the point that the coordinates of the corresponding pattern are corrected based on the positioning coordinates is the same as in Patent Document 1, so The calculation process takes time. In addition, as a result of correcting the coordinates for each pattern, there is a contradiction in the correction contents for the boundary position of each pattern, and a suitable correction may not be performed.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a direct drawing apparatus capable of performing drawing data correction processing according to substrate deformation by simple processing.

  In order to solve the above problems, the invention of claim 1 is a drawing apparatus for forming an image on a substrate by irradiating exposure light from a light source, and a stage for placing a substrate to be drawn on, Imaging means for imaging the drawing surface of the substrate placed on the stage; conversion means for acquiring pattern data described in a vector format and converting the pattern data into initial drawing data in a raster format; A drawing area including a drawing target image represented by the initial drawing data is virtually divided into a plurality of mesh areas, and for each of the plurality of mesh areas, an arrangement position in the drawing area and a drawing content at the arrangement position are determined. A dividing unit that generates divided drawing data associated with the image, and an image captured by the imaging unit obtained by imaging the substrate; Based on the position of the alignment mark provided on the substrate, an arrangement position specifying means for specifying an arrangement position when the plurality of mesh regions are rearranged according to the shape of the substrate; and the plurality of mesh regions Combining the drawing contents associated with the plurality of mesh regions in the divided drawing data in a state of being rearranged at the arrangement position specified by the specifying means, and generating one drawing data; It is characterized by providing.

  A second aspect of the present invention is the drawing apparatus according to the first aspect, in which the data dividing means has an exposure resolution when the image is formed by the exposure light and an image for the substrate specified in advance. The drawing area is divided according to a division size determined based on a maximum degree of deformation allowed when forming the image.

  A third aspect of the present invention is the drawing apparatus according to the second aspect, wherein the drawing area is defined as a rectangular area, and a maximum degree of deformation allowed for the substrate is allowed for a side of the rectangular area. It is specified by information indicating the maximum inclination.

  A fourth aspect of the present invention is the drawing apparatus according to the first aspect, wherein the data dividing unit divides the drawing area into the plurality of mesh areas in a plurality of division modes having different division sizes, and the division is performed. The drawing is performed by generating divided drawing data in which a size, an arrangement position in the drawing area, and drawing contents at the arrangement position are associated, and the arrangement position specifying unit is specified from a position of an alignment mark provided on the substrate. In accordance with the displacement level for each predetermined partial area of the area, the division mode used for rearrangement in the partial area is specified, and then the arrangement when rearranging the plurality of mesh areas for each partial area The position is specified.

  A fifth aspect of the present invention is the drawing apparatus according to any one of the first to fourth aspects, wherein the data dividing unit is configured such that each of the plurality of mesh regions overlaps an adjacent mesh region. The drawing area is virtually divided into the plurality of mesh areas.

  The invention according to claim 6 is a data processing apparatus for a drawing apparatus that forms an image on a substrate by irradiating exposure light from a light source, obtains pattern data described in a vector format, and obtains the pattern data Conversion means for converting into initial drawing data in a raster format, and a drawing area including a drawing target image represented by the initial drawing data is virtually divided into a plurality of mesh areas, and the drawing is performed for each of the plurality of mesh areas. A division unit that generates divided drawing data in which an arrangement position in a region and drawing contents at the arrangement position are associated with each other, and a captured image obtained by imaging a substrate to be drawn are provided on the substrate. Based on the position of the alignment mark, the arrangement position when the plurality of mesh regions are rearranged according to the shape of the substrate And the drawing position associated with the plurality of mesh areas in the divided drawing data in a state where the plurality of mesh areas are rearranged to the arrangement positions specified by the position specifying means. Synthesizing means for synthesizing contents and generating one drawing data.

  The invention of claim 7 is a method of generating drawing data for a drawing apparatus that forms an image on a substrate by irradiating exposure light from a light source, obtaining pattern data described in a vector format, A conversion step of converting pattern data into initial drawing data in raster format, and a drawing area including a drawing target image represented by the initial drawing data is virtually divided into a plurality of mesh areas, and each of the plurality of mesh areas A dividing step of generating divided drawing data in which the arrangement position in the drawing area and the drawing content at the arrangement position are associated, an imaging step of imaging a substrate to be drawn, and a captured image obtained in the imaging step An alignment mark position specifying step for specifying the position of the alignment mark provided on the substrate, and the alignment An arrangement position specifying step for specifying an arrangement position when rearranging the plurality of mesh areas according to the shape of the substrate based on the identification result in the mark position specifying process, and the plurality of mesh areas for the position specifying process Combining the drawing contents associated with the plurality of mesh regions in the divided drawing data in a state where the drawing data is rearranged at the arrangement position specified in step (b), and generating one drawing data. It is characterized by.

  According to the first to seventh aspects of the present invention, if the pattern data described in the vector format is converted into the initial drawing data which is the raster format data only once, the mesh region is transformed into the substrate after that. The drawing data corrected in consideration of the deformation of the substrate can be obtained only by rearranging it accordingly. This eliminates the need to convert vector format data to vector format data, and iterative conversion from vector format data to raster format data, so it is necessary to generate drawing data according to the board. Time is remarkably shortened than before.

  In particular, according to the invention of claim 2 or claim 3, the division size of the mesh region is assumed based on the exposure resolution and the maximum degree of deformation allowed when forming an image on the substrate. The mesh region is set so that the circuit pattern is drawn with substantially sufficient drawing accuracy within the range of deformation to be performed. Thereby, the drawing data can be generated in a manner in which the calculation processing time for drawing data generation and the drawing accuracy are suitably balanced.

  In particular, according to the invention of claim 4, since mesh regions having different division sizes are selectively used according to the degree of local deformation, drawing data corresponding to the deformation of the substrate can be generated with high accuracy.

It is a figure which shows schematic structure of the drawing apparatus 1 which concerns on 1st Embodiment. It is a figure for demonstrating the relationship between the exposure resolution in the exposure apparatus 3, and the figure drawn. It is a figure which shows the flow of the pre-processing performed in the data processor 2. FIG. FIG. 6 is a diagram for explaining processing performed in a data dividing unit 22; It is a figure which shows typically the mode of the division | segmentation of the mesh area | region RE. FIG. 4 is a diagram illustrating a post-processing flow performed in the data processing device 2. It is a figure which shows the arrangement position of alignment mark Ma in an ideal state. FIG. 6 is a diagram showing the position of an alignment mark Ma on a substrate S. It is a figure which shows the state which has arrange | positioned each mesh area | region RE according to the description content of the reference position data DS. It is a figure which illustrates drawing area RE2 of drawing data DD produced | generated by the data synthetic | combination means 24. FIG. It is a figure which shows schematic structure of the drawing apparatus 101 which concerns on the 2nd Embodiment of this invention. It is a figure which shows the flow of the pre-processing performed in the data processor 102. FIG. 3 is a diagram illustrating a flow of post-processing performed in the data processing apparatus 102. FIG. 5 is a diagram for conceptually explaining processing realized by an area arrangement unit 25.

<First Embodiment>
<Outline of drawing device>
FIG. 1 is a diagram showing a schematic configuration of a drawing apparatus 1 according to the first embodiment of the present invention. The drawing apparatus 1 irradiates a laser beam LB, which is exposure light, while scanning the substrate S by continuously performing local exposure on a substrate S to be drawn such as a printed board, a semiconductor substrate, and a liquid crystal substrate. A direct drawing device (direct drawing device) for drawing an exposure image of a desired circuit pattern on S.

  The drawing apparatus 1 mainly includes a data processing device 2 that generates drawing data DD and an exposure device 3 that actually performs drawing (exposure) based on the drawing data DD. The data processing device 2 and the exposure device 3 do not have to be provided integrally, and may be physically separated as long as data can be exchanged between them.

  The data processing apparatus 2 is an apparatus that generates drawing data DD that is processing data in the exposure apparatus 3 based on pattern data DP that is design data of a circuit pattern created by a pattern design apparatus 4 such as CAD. The pattern data DP is usually described as vector data such as polygons. On the other hand, since the exposure apparatus 3 performs exposure based on the drawing data DD described as raster data, the data processing apparatus 2 needs to convert at least the pattern data DP into raster data. In the case of the drawing apparatus 1 according to the present embodiment, the drawing data DD is generated after correction processing is performed in a manner described later. Thereby, even when the substrate S is deformed, a desired circuit pattern can be drawn on the substrate S.

  The data processing apparatus 2 mainly includes a data conversion unit 21, a data division unit 22, a reference position specifying unit 23, and a data synthesis unit 24. The data processing device 2 may include the data conversion unit 21, the data division unit 22, the reference position specifying unit 23, and the data synthesis unit 24 as dedicated circuit elements, or a CPU, a ROM A computer in which each means is realized as a virtual component functions as the data processing device 2 by a predetermined program being read and executed by a control unit (not shown) such as a RAM. An aspect may be sufficient.

  The data conversion means 21 acquires the pattern data DP from the pattern design device 4 and converts it into initial drawing data D1 that is raster format data that can be processed by the exposure device 3. A known technique can be used for such conversion processing.

  The data dividing unit 22 virtually divides a drawing area including a circuit pattern (drawing target image) represented by the initial drawing data D1 into a plurality of rectangular areas (mesh areas) RE (FIG. 5) in accordance with division condition data DC given in advance. The divided drawing data D2 is generated by associating the arrangement position in the drawing area and the drawing contents with respect to each mesh area RE.

  First, the reference position specifying means 23 indicates the position of an alignment mark (positioning mark) Ma (see FIG. 7) provided on the drawing surface Sa of the substrate S using the captured image obtained by the imaging means 34 described later. It is specified based on certain mark imaging data DM. Then, based on the position of the specified alignment mark Ma, the reference position Ms (see FIG. 5) of each of the mesh regions RE when drawing is specified. Then, reference position data DS in which each mesh region is associated with the reference position Ms is generated.

  Based on the divided drawing data D2 and the reference position data DS, the data composition means 24 synthesizes the description contents of each mesh region RE in a state where a plurality of mesh regions RE are arranged according to the reference position described in the reference position data DS. Then, drawing data DD is generated.

  Details of the processing performed by the data conversion unit 21, the data division unit 22, the reference position specifying unit 23, and the data synthesis unit 24 in the data processing apparatus 2 will be described later.

  The exposure device 3 is a device that performs drawing on the substrate S in accordance with the drawing data DD given from the data processing device 2.

  The exposure apparatus 3 includes a drawing controller 31 that controls the operation of each part, a stage 32 for placing the substrate S, a light source 33 that emits laser light LB, and a drawing of the substrate S placed on the stage 32. It mainly includes imaging means 34 for imaging the surface Sa.

  In the exposure apparatus 3, at least one of the stage 32 and the light source 33 is movable in the main scanning direction and the sub-scanning direction, which are two horizontal axes orthogonal to each other. Thus, the laser light LB can be irradiated from the light source 33 while the stage 32 and the light source 33 are relatively moved in the main scanning direction while the substrate S is placed on the stage 32. Alternatively, the stage 32 may be rotatable in a horizontal plane, and the light source 33 may be movable in the vertical direction.

  The type of the laser beam LB to be used may be appropriately determined according to the type of the substrate S to be drawn.

  The light source 33 is provided with a modulation means 33a such as a DMD (digital mirror device), for example, and the substrate S on the stage 32 is irradiated with the laser light LB emitted from the light source 33 while being modulated by the modulation means 33a. It has become so. More specifically, prior to drawing, first, the laser light LB for each modulation unit of the modulation means 33a according to the description content of the drawing data DD in which the presence or absence of exposure for each pixel position is set by the drawing controller 31. ON / OFF setting of irradiation is performed. While the light source 33 is moving relative to the stage 32 (relative to the substrate S placed thereon) in the main scanning direction, the laser light LB is emitted from the light source 33 according to the on / off setting. By being emitted, the substrate S on the stage 32 is irradiated with the laser beam LB that has been modulated based on the drawing data DD.

  When the laser beam LB is scanned at a certain position in the main scanning direction and the exposure at the position is completed, the light source 33 is relatively moved by a predetermined distance in the sub-scanning direction, and the laser beam LB is scanned again at the position in the main scanning direction. Is done. By repeating this, an image (exposure image) according to the drawing data DD is formed on the substrate S.

  The imaging means 34 is mainly provided for imaging the alignment mark Ma formed on the light receiving surface of the substrate S placed on the stage 32. The captured image of such a positioning mark is provided to the reference position specifying means 23 of the data processing device 2 as mark captured data DM as described above. Of course, the imaging means 34 may be configured to perform imaging for other purposes.

  In addition, the formation aspect of the alignment mark in the board | substrate S is not specifically limited as long as the position can be pinpointed correctly. For example, an aspect using an alignment mark formed by mechanical processing such as a through hole may be used, or an aspect using an alignment mark patterned by a printing process or a photolithography process may be used.

<Basic concept of correction processing>
Hereinafter, the basic concept of the correction process performed when the drawing data DD is generated will be described.

  In general, the pattern data DP is created assuming an ideally shaped substrate with no deformation and a flat drawing surface. However, the actual substrate is subject to warpage, distortion, and processing in the previous process. Deformation such as distortion has occurred. For this reason, even if the circuit pattern is drawn on the substrate S with the arrangement position set by the pattern data DP, a desired circuit pattern cannot be obtained, so that a circuit pattern corresponding to the shape of the substrate S is formed. As described above, a process for converting the formation position coordinates of the circuit pattern according to the shape of the substrate S is required. In short, the correction process performed when the drawing data DD is generated in the present embodiment is a coordinate conversion process.

  The present embodiment is characteristic in that the correction process is performed in consideration of the exposure resolution in the exposure apparatus 3 to simplify the correction process.

  FIG. 2 is a view for explaining the relationship between the exposure resolution in the exposure apparatus 3 and the figure to be drawn. In FIG. 2, it is assumed that the X-axis direction is the main scanning direction and the Y-axis direction is the sub-scanning direction.

  In the exposure apparatus 3, as described above, exposure proceeds by the relative movement of the stage 32 and the light source 33 in the main scanning direction. Therefore, the side that is inclined at a certain inclination angle α1 with respect to the X-axis direction, such as the figure F1 shown in FIG. 2A, is shown in FIG. 2B in the actual drawing data DD. Thus, it is described by being approximated to the stepped figure F2. At this time, the step of the stepped figure F2 corresponds to the exposure resolution in the sub-scanning direction in the exposure apparatus 3. Hereinafter, such exposure resolution is assumed to be δ. Then, as shown by arrows (1) to (8) in FIG. 2B, the drawing is performed stepwise in the main scanning direction.

  This means that in the correction process for generating the drawing data DD including the figure F1 as a drawing target, it is not necessary to generate coordinate values that faithfully represent the figure F1, and the stepped figure F2 is directly expressed. This means that coordinate values need only be generated.

  Further, FIG. 2C shows a state in which a figure F3 having an inclination angle α2 smaller than the inclination angle α1 of the figure F1 is approximated by a stepped figure F4 with an exposure resolution of δ as in the figure F1. . If the step width of the stepped figure F2 is w1, and the step width of the stepped figure F2 is w2, then w2> w1.

  On the other hand, FIG. 2D also shows a state in which the figure F3 is approximated under the same exposure resolution δ in the sub-scanning direction, as in FIG. However, in FIG. 2D, when the step width of the stepped figure F5 that approximates the figure F3 is w3, w3 = 2w1 is set. In this case, although the accuracy of approximation is inferior to that of FIG. 1C, if δ is sufficiently small, approximation with sufficient accuracy in practice is realized.

  If this is utilized, it is assumed that the inclination of the figure F1 is the maximum inclination (that is, the main scanning direction) that is allowed for the circuit pattern when the circuit pattern along the main scanning direction is actually drawn on the substrate S. The maximum deformation error of the line segment along the line), the various circuit patterns drawn on the substrate S (circuit patterns whose inclination is smaller than that of the figure F1) are always an integral multiple of δ and an integral multiple of w1. It can be approximated by a staircase figure having a step width. The same argument holds for the sub-scanning direction (however, the exposure resolution in this case is defined by the size of the modulation unit of the modulation means 33a).

  This is because when a correction process (coordinate conversion process) in consideration of the deformation of the substrate S is performed, the circuit pattern after the conversion has a width determined based on the exposure resolution in the sub-scanning direction as a unit in the main scanning direction. With respect to the scanning direction, it means that drawing is performed in units of widths determined based on the exposure resolution in the main scanning direction.

  Therefore, in the present embodiment, the entire circuit pattern expressed by the initial drawing data D1, which is raster data obtained from the pattern data DP, is previously determined according to the exposure resolution and the allowable degree of pattern deformation. Drawing data DD is obtained by dividing into a plurality of rectangular regions (mesh regions) having vertical and horizontal lengths and performing coordinate conversion for each mesh region. A series of these processes corresponds to the correction process in the present embodiment.

<Processing in data processing apparatus>
Next, processing actually performed in the data processing apparatus 2 will be described in detail. In the present embodiment, the processing performed in the data processing device 2 is broadly divided into two types: preprocessing and postprocessing. The preprocessing is processing that is performed only once in advance prior to the drawing of the same circuit pattern on a plurality of substrates S. The processing result is commonly used for drawing a circuit pattern on each substrate S. On the other hand, the post-processing is processing that is performed each time drawing is performed on each substrate S.

  First, preprocessing will be described. FIG. 3 is a diagram showing the flow of preprocessing performed in the data processing apparatus 2.

  First, the data conversion means 21 obtains pattern data DP, which is circuit pattern data described in a vector format, from the pattern design device 4 (step S1), and uses this as initial drawing data D1 that is raster format data. (Step S2). In the following, it is assumed that the circuit pattern represented by the pattern data DP is drawn in a rectangular drawing area set on the drawing surface Sa of the substrate S. The description format of the initial drawing data D1 is not particularly limited.

  When the initial drawing data D1 is obtained, the data dividing unit 22 obtains the basic size of the mesh area for generating the divided drawing data D2 from the initial drawing data D1 in accordance with the description content of the division condition data DC (step S3). The division condition data DC includes information for specifying the maximum degree of deformation allowed for the circuit pattern during correction processing, and exposure resolution in the main scanning direction and the sub-scanning direction in the exposure apparatus 3 used for drawing the circuit pattern. Are included as data elements.

  FIG. 4 is a diagram for explaining processing performed in the data dividing unit 22. In FIG. 4, it is assumed that the X-axis direction is the main scanning direction and the Y-axis direction is the sub-scanning direction. In addition, a rectangle composed of the vertices A, B, C, and D indicated by solid lines in FIG. 4 indicates a circuit pattern drawing area ABCD in the pattern data DP or the initial drawing data D1. It is assumed that the coordinates of the vertex A are (X1, Y1), the coordinates of the vertex B are (X2, Y1), the coordinates of the vertex C are (X2, Y2), and the coordinates of the vertex D are (X1, Y2). If X2-X1 = Lx and Y2-Y1 = Ly, then Lx and Ly represent the size of the drawing area ABCD in the main scanning direction and the sub-scanning direction.

  Also, four rectangles centered on the vertices A, B, C, and D of the drawing area ABCD indicated by broken lines (vertices A1 to A4, B1 to B4, C1 to C4, D1 respectively) (Rectangle made up of D4) indicates an allowable error range for each vertex in the correction process. Such an error range corresponds to the maximum error range allowed for the constituent unit of the circuit pattern. Here, for simplicity of discussion, it is assumed that the size in the X-axis direction is pLx and the size in the Y-axis direction is qLy for all rectangles (where 0 <p, q << 1).

  In such a case, a line segment connecting an arbitrary point in the rectangle A1A2A3A4 and an arbitrary point in the rectangle B1B2B3B4 represents a state after the deformation that the side AB can take corresponding to the deformation of the substrate S. . At this time, the deformation in which the side AB becomes the line segment A3B1 (or the line segment A2B4) is a deformation that gives the maximum inclination permitted to the side AB. The inclination angle α of the side A3B1 with respect to the line segment AB at this time represents the maximum inclination permitted for the side AB. Note that the inclination angle α satisfies the following equation.

      tanα = qLy / (X2-X1-pLx) = qLy / (1-p) Lx ≒ qLy / Lx Equation (1)

  Such a discussion also holds true for the side CD parallel to the side AB, and the side CD is allowed to be deformed up to the line segment C4D2 or the line segment C1D3 having the same inclination angle α. That is, in the main scanning direction, deformation from the horizontal state to the inclination angle α is allowed. Incidentally, in FIG. 4, the line segment C3D1 is shown as an example of the deformation of the side CD. However, since the inclination angle α ′ due to the deformation from the side CD to the line segment C3D1 is smaller than the inclination angle α, Is not considered in the calculation of the basic size of the mesh area.

  Here, assuming that the exposure resolution in the sub-scanning direction is δy, the basic size wx of the mesh area in the main scanning direction can be obtained by the following equation.

      wx = δy / tanα = δyLx / qLy (2)

Similarly, with respect to the sub-scanning direction, the maximum inclination angle β allowed for deformation of the side BC and the side DA is
tanβ = pLx / (Y2-Y1-qLy) = pLx / (1-q) Ly ≒ pLx / Ly Equation (3)
Assuming that the exposure resolution in the main scanning direction is δx, the basic size wy of the mesh area in the sub-scanning direction can be obtained by the following equation.

      wy = δx / tanβ = δxLy / pLx (4)

  The exposure resolutions δx and δy of the exposure apparatus 3 and the error ranges of the vertices A, B, C, and D are given in advance as division condition data DC. Lx and Ly are known values specified from the initial drawing data D1. Alternatively, it may be given as a data element of the division condition data DC. In any case, these are all known values. Based on these values, the data dividing unit 22 obtains the basic sizes wx and wy of the mesh area according to the arithmetic expressions shown in the expressions (3) and (4).

  For example, the size of the drawing area is Lx = Ly = 500 mm, the exposure resolution is δx = δy = 1 μm, and the allowable error range of each vertex of the drawing area is pLx = qLy = 500 μm (that is, the allowable error range is 0 of the size of the drawing area). .1%), wx and wy are about 1 μm.

  Even when the error ranges of the vertices A, B, C, and D are different from each other, the basic sizes wx and wy can be obtained based on the same concept. If the pairs of error ranges of the vertices A, B, C, and D in the X-axis direction and the Y-axis direction are (2axLx, 2ayLy), (2bxLx, 2byLy), (2cxLx, 2cyLy), (2dxLx, 2dyLy), The basic sizes wx and wy of the mesh area RE are as follows.

wx ≒ Min {δyLx / (ay + by) Ly, δyLx / (cy + dy) Ly}
wy ≒ Min {δxLy / (bx + cx) Lx, δxLy / (dx + ax) Lx}

  When the basic sizes wx and wy are obtained, the data dividing unit 22 divides the drawing area including the circuit pattern represented by the initial drawing data D1 into a plurality of mesh areas RE to generate divided drawing data D2 (step S4).

  FIG. 5 is a diagram schematically showing how the drawing area is divided into mesh areas RE. When the data dividing means 22 generates the divided drawing data D2, the data dividing means 22 does not simply divide the drawing area for each basic size wx, wy (the area divided by this is called the basic area RE0), but the basic area RE0. Is added to each mesh region RE by adding an additional region RE1 having a width corresponding to the exposure resolutions δx and δy in the main scanning direction and the sub-scanning direction, and is added between adjacent mesh regions RE. The mesh region RE is determined so that the region RE1 overlaps. In FIG. 5, the rectangle partitioned by the broken line is the basic region RE0, the region provided around the basic region RE0 illustrated by the oblique lines is the additional region RE1, and the region partitioned by the solid line is the mesh region RE. . The reason why the additional region RE1 is divided in such a manner as to overlap is that, in the finally obtained drawing data DD, a blank region occurs even though the pattern should originally exist. This is to avoid this.

  Note that the data dividing means 22 actually describes the divided drawing data D2 as data elements for specifying individual mesh regions RE, and the coordinates of the reference position Ms of each mesh region RE and the circuit pattern in the mesh region RE. And the sizes mx and my of the main scanning direction and the sub-scanning direction of the mesh region RE. However, since mx = wx + 2δx and my = wy + 2δy, instead of mx and my, wx, wy, δx, and δy may be described as data elements. Further, although the reference position Ms of the mesh area RE can be arbitrarily set, in this embodiment, the center of the mesh area RE is handled as the reference position Ms as shown in FIG.

  When the divided drawing data D2 is generated, the preprocessing ends.

  Next, post-processing performed in the data processing device 2 will be described. The post-processing is processing that is performed each time immediately before actual drawing is performed on each substrate S.

  FIG. 6 is a diagram illustrating a flow of post-processing performed in the data processing device 2. FIG. 7 is a diagram illustrating an arrangement position of the alignment mark Ma in an ideal state assumed at the time of circuit pattern design. In the present embodiment, a case where a plurality of alignment marks Ma are provided at equal intervals in the horizontal biaxial direction as shown in FIG. 7 will be described as an example. FIG. 7 also shows the arrangement of the reference position Ms of the mesh region RE for reference. When the alignment marks Ma are arranged at regular intervals as described above, the reference positions Ms of the mesh region RE are usually arranged at regular intervals. Note that the solid lines and broken lines shown in FIG. 7 are for helping the understanding of the drawing, and such solid lines and broken lines are not necessarily observed on the substrate S as described as circuit patterns.

  In the post-processing, first, the substrate S is placed on the stage 32 of the exposure apparatus 3 (step S11), and the imaging unit 34 images the alignment mark Ma provided on the drawing surface Sa of the substrate S (step S11). S12). Note that the method of imaging the alignment mark Ma is not particularly limited as long as the alignment mark Ma can be identified in a subsequent process. For example, an aspect in which the entire substrate S is imaged at one time may be used, and in the case where the size of the alignment mark Ma is smaller than the size of the substrate S, a part of the captured image is secured to ensure the resolution. A plurality of captured images may be prepared for each alignment mark Ma to obtain a plurality of captured images.

  Mark imaging data DM, which is a captured image obtained by the imaging unit 34, is given to the reference position specifying unit 23 through the drawing controller 31.

  When the reference position specifying unit 23 acquires the mark imaging data DM, the reference position specifying unit 23 specifies the position coordinates of the alignment mark Ma provided on the substrate S based on the mark imaging data DM (step S13). For example, it is preferable to specify such position coordinates by performing known image processing such as binarization processing on the captured image.

  If the substrate S picked up by the image pickup means 34 is not deformed, the alignment marks Ma are positioned at equal intervals as shown in FIG. 7, but normally the substrate S is deformed, so the position of the alignment mark Ma. Also deviated from the ideal position. Since the method of deformation varies depending on the individual substrate S, in order to form a desired pattern on each substrate S in the exposure apparatus 3, the position of the alignment mark Ma as a deformation index of the substrate S is set respectively. It is necessary to specify the substrate S by actual measurement. FIG. 8 is a diagram showing the position of the alignment mark Ma on the actual substrate S. As shown in FIG. In FIG. 8, the alignment mark Ma having the ideal arrangement shown in FIG.

  When the position coordinates for all the alignment marks Ma are specified, the reference position specifying means 23 then moves the respective mesh regions so that the arrangement of the individual mesh regions RE corresponds to the deformation of the substrate S. The RE placement position is specified. Specifically, the position coordinates of the reference position Ms of each mesh region RE are specified based on the position coordinates of the surrounding alignment marks Ma (step S14). That is, in an ideal state, processing for specifying the arrangement position is performed when the mesh regions RE arranged in an orderly manner are rearranged according to the shape of the substrate S as shown in FIG. .

  For example, the position coordinates of the reference positions Ms1, Ms2, Ms3, and Ms4 shown in FIG. 8 are specified based on the position coordinates of the alignment marks Ma1, Ma2, Ma3, and Ma4 (or a part thereof) positioned around the reference positions Ms1, Ms2, Ms3, and Ms4. . FIG. 8 illustrates the reference position Ms whose position coordinates are specified by such processing. A known coordinate conversion method can be used to specify the position coordinates of the reference position Ms. As an example, when a triangle composed of alignment marks Ma1, Ma2, and Ma4 is considered, it represents an affine transformation from the triangle in the ideal arrangement shown in FIG. 7 to a triangle based on the actual arrangement shown in FIG. There is a mode in which a matrix is obtained and coordinate transformation of the reference position Ms is performed using this matrix.

  The reference position specifying means 23 obtains the position coordinates of the reference position Ms for each mesh area RE in such a manner, and the mesh area RE described in the position coordinates of each mesh area RE and the divided drawing data D2. The reference position data DS for associating with the drawing contents at is generated.

  When the reference position data DS is generated, the data synthesizing unit 24 generates the drawing data DD based on the reference position data DS (step S15). Specifically, the arrangement position of each mesh region RE is shifted from the ideal position described in the divided drawing data D2 in accordance with the arrangement position of the reference position Ms described in the reference position data DS. After that, the drawing contents of the individual mesh areas RE are combined to generate one drawing data DD representing the drawing contents for the entire drawing area. Note that the shift of the mesh area RE is realized by moving the coordinates of the pixels constituting each mesh area RE in accordance with the coordinate movement (translational movement) of the reference position Ms.

  FIG. 9 is a diagram showing a state in which each mesh region RE is arranged according to the description content of the reference position data DS. As shown in FIG. 9, there are places where the drawing contents overlap between adjacent mesh regions RE, and this is adjusted by executing a predetermined logical operation such as multiplying the two.

  FIG. 10 is a diagram illustrating the drawing area RE2 defined by the drawing data DD generated by the data synthesizing means 24 when the mesh area RE is arranged as shown in FIG. FIG. 10 also shows an alignment mark Ma for reference. Although not shown in FIG. 10, actually, a circuit pattern is arranged in the drawing area RE2 based on the contents described in the divided drawing data D2.

  With the generation of the drawing data DD, the post-processing in the data processing device 2 ends. The generated drawing data DD is given to the exposure apparatus 3. In the exposure apparatus 3, a drawing process on the substrate S is executed based on the acquired drawing data DD. Then, after such a drawing process is completed, when a new substrate S is a drawing target for the same circuit pattern, the data processing device 2 repeats the post-processing again.

  As described above, according to the present embodiment, at the time of the pre-processing prior to drawing on the substrate, the exposure resolution of the exposure apparatus 3 and the maximum degree of deformation allowed for the circuit pattern in advance (specifically, The drawing area is divided into a plurality of mesh areas RE according to the degree of side inclination. When actually drawing on each substrate S, the arrangement position of each mesh region RE according to the deformation of the substrate S specified from the arrangement of the alignment marks Ma provided on the substrate S. Is shifted (that is, the mesh region RE is rearranged in accordance with the deformation of the substrate S), so that the drawing data DD corresponding to the deformation of the substrate S is generated.

  In such a case, the pattern data DP described in the vector format is only converted into initial drawing data D1, which is raster format data, once in the preprocessing. That is, the conversion from the vector format data to the raster data is not repeated according to the deformation of the individual substrates S. Also, vector format data is not converted to different vector format data. Instead of these, in the present embodiment, correction is realized by rearrangement of mesh regions. Therefore, the time required for generating the drawing data DD corresponding to the substrate S is remarkably shortened compared to the conventional case. For example, it is possible to efficiently generate drawing data for complex pattern data with many changing points and pattern data with a large drawing area without requiring a long time.

  In addition, the finer the mesh area is set, the more time is required for the calculation for shifting the individual mesh areas. However, if the mesh area is set coarsely, it becomes difficult to sufficiently correspond the drawing data to the deformation of the substrate S, and the drawing accuracy of the circuit pattern is improved. Deteriorate. In the present embodiment, the circuit pattern is determined with a substantially sufficient drawing accuracy within the range of the assumed deformation by determining it based on the exposure resolution of the exposure apparatus 3 and the maximum degree of deformation allowed for the circuit pattern. Since the mesh region is set so that the drawing processing is performed, the drawing data can be generated in a manner in which the calculation processing time and the drawing accuracy are suitably balanced.

<Second Embodiment>
The mode for realizing the reduction of the drawing processing time is not limited to that shown in the first embodiment. A mode for realizing shortening of the drawing time in a mode different from that of the first embodiment will be described. In the present embodiment, components having the same functions and effects as those described in the first embodiment are denoted by the same reference numerals as those in the first embodiment, and detailed description thereof is omitted. To do.

<Outline of drawing device>
FIG. 11 is a diagram showing a schematic configuration of a drawing apparatus 101 according to the second embodiment of the present invention. Similarly to the drawing apparatus 1 according to the first embodiment, the drawing apparatus 101 continuously performs local exposure on the substrate S by irradiating the laser beam LB as exposure light while scanning. A direct drawing apparatus for drawing an exposure image of a desired circuit pattern on the substrate S.

  The drawing apparatus 101 mainly includes a data processing apparatus 102 that generates drawing data DD and an exposure apparatus 3 that actually performs drawing (exposure) based on the drawing data DD. The data processing apparatus 102 and the exposure apparatus 3 do not need to be provided integrally, and may be physically separated as long as data can be exchanged between them.

  The data processing apparatus 102 is based on pattern data DP that is design data of a circuit pattern created by a pattern design apparatus 4 such as CAD, for example, similarly to the data processing apparatus included in the drawing apparatus 1 according to the first embodiment. In this way, the exposure apparatus 3 generates drawing data DD that is processing data.

  Similar to the data processing apparatus 2, the data processing apparatus 102 includes a data conversion unit 21, a data division unit 22, and a data synthesis unit 24. Further, the data processing apparatus 102 includes an area arrangement unit 25 instead of the reference position specifying unit 23. The data processing apparatus 102 may include the data conversion unit 21, the data division unit 22, the data synthesis unit 24, and the area arrangement unit 25 as dedicated circuit elements, or may include a CPU, a ROM, A mode in which a computer in which each unit is realized as a virtual component functions as the data processing device 102 by reading and executing a predetermined program in a control unit (not shown) including a RAM or the like. It may be.

  The drawing apparatus 101 according to the present embodiment prepares in advance a plurality of divided drawing data D2 in which the basic size for dividing a drawing area into a plurality of mesh areas RE is different depending on the displacement level (described later). In the drawing on the substrate S, the mesh area RE having a size corresponding to the displacement level in the partial area is applied to each predetermined partial area of the drawing area, and these are the same as in the first embodiment. To shift to. Then, drawing data DD is generated by synthesizing the shifted results. In other words, in the present embodiment, the size of the mesh region RE to be rearranged according to the deformation of the substrate S is made different according to the degree of local deformation. Thereby, in this embodiment, the arithmetic processing for specifying the basic size, which was performed by the data dividing unit 22 in the first embodiment, is unnecessary. Therefore, in the case of the present embodiment, it is not necessary to hold the exposure resolution of the exposure apparatus 3 as the division condition data DC.

  In the present embodiment, in order to realize the above-described processing, a plurality of basic sizes are preset in accordance with the displacement level in each of the main scanning direction and the sub-scanning direction. Here, the displacement level is an arbitrary index that represents in steps the degree of displacement in the drawing area. The relationship between the displacement level and the corresponding basic size is predetermined and described in the division condition data DC. The data dividing means 22 generates a plurality of types of divided drawing data D2 corresponding to the plurality of basic sizes.

  In addition, the area arrangement unit 25 specifies the type (size) of the mesh area RE to be applied for each partial area predetermined for the drawing area, and shifts each mesh area RE according to the deformation of the partial area. The area arrangement means 25 generates area arrangement data DA describing such a result.

  The data synthesizing unit 24 synthesizes the drawing contents of the mesh area RE according to the description contents of the area arrangement data DA, and generates the drawing data DD.

<Processing in data processing apparatus>
Processing performed in the data processing apparatus 102 according to the present embodiment is also roughly divided into preprocessing and postprocessing. First, preprocessing will be described. FIG. 12 is a diagram showing the flow of preprocessing performed in the data processing apparatus 102.

  Also in the present embodiment, the acquisition of the pattern data DP by the data conversion means 21 (step S21) and the process of converting this into the initial drawing data D1 which is raster format data are the same as in the first embodiment. Performed (step S22).

  When the initial drawing data D1 is obtained, the data dividing means 22 generates a plurality of divided drawing data D2 according to the set value of the basic size described in the division condition data DC (step S23). Note that, in the same manner as in the first embodiment, only the method of setting the basic size to be used is different, and adjacent mesh regions RE have an overlap.

  When the divided drawing data D2 is generated, the preprocessing ends.

  Next, post-processing performed in the data processing apparatus 102 will be described. FIG. 13 is a diagram illustrating the flow of post-processing performed in the data processing apparatus 102.

  First, the substrate S is placed on the stage 32 (step S31), the alignment mark Ma is imaged by the imaging means 34 (step S32), and the process of specifying the position of the alignment mark Ma according to the obtained mark imaging data DM is performed. This is performed in the same manner as in the first embodiment.

  When the actual position on the substrate S is specified for each alignment mark Ma, the area placement unit 25 determines the actual substrate based on the mark imaging data DM obtained from the exposure apparatus 3 as in the first embodiment. The displacement level corresponding to each partial area of S is specified. Further, when the type of the mesh area RE associated with the displacement level is specified in the division condition data DC, the position of the reference position Ms of each mesh area RE is determined for each partial area, as in the first embodiment. Is shifted according to the deformation of the substrate S, and the arrangement is specified (step S34). The area arrangement means 25 generates area arrangement data DA describing such a result.

  FIG. 14 is a diagram for conceptually explaining the processing realized by the area arranging unit 25. As shown in FIG. 14A, as a result of specifying the position of the alignment mark Ma, the displacement amount is relatively small for the partial region AR1 and the partial region AR4, and the displacement amount for the partial region AR2 and the partial region AR3. When the area is relatively large, as shown in FIG. 14B, a mesh area REα having a relatively small basic size is arranged for the area corresponding to the latter, and the basic size is relatively set for the area corresponding to the former. A large mesh region REβ is arranged. FIG. 14 illustrates the case where the displacement level is two levels for simplicity, but the concept is the same when more displacement levels are set.

  When the area arrangement data DA is generated, the data synthesizing unit 24 generates the drawing data DD based on the area arrangement data DA (step S35). Specifically, for each partial area, as in the first embodiment, the arrangement position of each mesh area RE is changed from the ideal position described in the divided drawing data D2 to the area arrangement data DA. After shifting according to the arrangement position of the described reference position Ms, the drawing contents of the individual mesh areas RE are synthesized, and one drawing data DD representing the drawing contents for the entire drawing area is generated.

  Also in the case of the present embodiment, as in the first embodiment, the pattern data DP described in the vector format is converted into the initial drawing data D1 that is the raster format data only once in the preprocessing. Only. Therefore, the time required for generating the drawing data DD corresponding to the substrate S is remarkably shortened compared to the conventional case.

  In the case of the present embodiment, since mesh regions RE having different sizes are used depending on the degree of local deformation, drawing data corresponding to the deformation of the substrate is generated more accurately than in the first embodiment. can do.

DESCRIPTION OF SYMBOLS 1,101 Drawing apparatus 2,102 Data processing apparatus 3 Exposure apparatus 32 Stage 33 Light source 33a Modulating means 34 Imaging means Ma, Ma1, Ma2, Ma3, Ma4 Alignment mark Ms, Ms1, Ms2, Ms3, Ms4 (mesh area) standard Position RE, REα, REβ Mesh area RE0 Basic area RE1 Additional area RE2 Drawing area S Substrate Sa Surface to be drawn

Claims (7)

A drawing apparatus for forming an image on a substrate by irradiating exposure light from a light source,
A stage for placing a substrate to be drawn; and
Imaging means for imaging the drawing surface of the substrate placed on the stage;
Conversion means for acquiring pattern data described in a vector format and generating the pattern data into raster format initial drawing data; and
A drawing area including a drawing target image represented by the initial drawing data is virtually divided into a plurality of mesh areas, and for each of the plurality of mesh areas, an arrangement position in the drawing area and a drawing content at the arrangement position are determined. A dividing means for generating associated divided drawing data;
The plurality of mesh regions are rearranged in accordance with the shape of the substrate based on the position of an alignment mark provided on the substrate, which is specified from a captured image obtained by the imaging means imaging the substrate. An arrangement position specifying means for specifying the arrangement position at the time;
In a state where the plurality of mesh areas are rearranged at the arrangement positions specified by the position specifying means, the drawing contents associated with the plurality of mesh areas in the divided drawing data are synthesized, and one drawing data A synthesis means for generating
A drawing apparatus comprising: The drawing apparatus according to claim 1,
The data dividing means is
Exposure resolution when forming an image with the exposure light; and
A maximum degree of deformation that is allowed when an image is formed on the substrate specified in advance;
Dividing the drawing area according to a division size determined based on
A drawing apparatus characterized by that. The drawing apparatus according to claim 2,
The drawing area is defined as a rectangular area;
The maximum degree of deformation allowed for the substrate is specified by information indicating the maximum inclination allowed for the sides of the rectangular area.
A drawing apparatus characterized by that. The drawing apparatus according to claim 1,
The data dividing means is
Dividing the drawing area into the plurality of mesh areas in a plurality of division modes having different division sizes,
Generating divided drawing data in which the division size, the arrangement position in the drawing area, and the drawing contents at the arrangement position are associated;
The arrangement position specifying means includes:
According to the displacement level for each predetermined partial region for the drawing region, which is specified from the position of the alignment mark provided on the substrate, after specifying the division mode used for rearrangement in the partial region, Specify the placement position when rearranging the plurality of mesh regions for each partial region,
A drawing apparatus characterized by that. The drawing apparatus according to any one of claims 1 to 4,
The data dividing means virtually divides the drawing area into the plurality of mesh areas so that each of the plurality of mesh areas overlaps with an adjacent mesh area.
A drawing apparatus characterized by that. A data processing apparatus for a drawing apparatus that forms an image on a substrate by irradiating exposure light from a light source,
Conversion means for acquiring pattern data described in a vector format and generating the pattern data into raster format initial drawing data; and
A drawing area including a drawing target image represented by the initial drawing data is virtually divided into a plurality of mesh areas, and for each of the plurality of mesh areas, an arrangement position in the drawing area and a drawing content at the arrangement position are determined. A dividing means for generating associated divided drawing data;
Based on the position of the alignment mark provided on the substrate, which is specified from the captured image obtained by imaging the substrate to be drawn, the plurality of mesh regions are rearranged according to the shape of the substrate. An arrangement position specifying means for specifying the arrangement position at the time;
In a state where the plurality of mesh areas are rearranged at the arrangement positions specified by the position specifying means, the drawing contents associated with the plurality of mesh areas in the divided drawing data are synthesized, and one drawing data A synthesis means for generating
A data processing apparatus for a drawing apparatus, comprising: A method of generating drawing data for a drawing apparatus that forms an image on a substrate by irradiating exposure light from a light source,
A conversion step of acquiring pattern data described in a vector format and converting the pattern data into initial drawing data in a raster format;
A drawing area including a drawing target image represented by the initial drawing data is virtually divided into a plurality of mesh areas, and for each of the plurality of mesh areas, an arrangement position in the drawing area and a drawing content at the arrangement position are determined. A dividing step for generating associated divided drawing data;
An imaging step of imaging a substrate to be drawn;
From the captured image obtained in the imaging step, an alignment mark position specifying step for specifying the position of the alignment mark provided on the substrate;
Based on the identification result in the alignment mark position specifying step, an arrangement position specifying step for specifying an arrangement position when rearranging the plurality of mesh regions according to the shape of the substrate;
In a state where the plurality of mesh areas are rearranged at the arrangement positions specified in the position specifying step, the drawing contents associated with the plurality of mesh areas are synthesized in the divided drawing data, and one drawing data A synthesis step to generate
A drawing data generation method for a drawing apparatus, comprising:

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