JP2022113598A - Multilayer ceramic capacitor and manufacturing method thereof - Google Patents

Abstract

To provide a multilayer ceramic capacitor with excellent moisture resistance.SOLUTION: A multilayer ceramic capacitor includes a capacitive element 1 in which a dielectric layer 1a is laminated, a first internal electrode 2 located inside the capacitive element 1 and exposed on a first end surface 1E, a second internal electrode 3 located inside the capacitive element 1 and exposed on a second end surface 1F, a first external electrode 4 electrically connected to the first internal electrode 2, and a second external electrode 5 electrically connected to the second internal electrode 3, and each of the first external electrode 4 and the second external electrode 5 includes a base electrode layer 8 having a metal component and a ceramic component, a Cu-plated electrode layer 9 disposed on the base electrode layer 8, a Ni-plated electrode layer 10 disposed on the Cu-plated electrode layer 9, and a Sn-plated electrode layer 11 arranged on the Ni-plated electrode layer 10, and concave portions 6 and 7 are respectively formed in a first end face 1E and a second end face 1F of the capacitive element 1, and the base electrode layer 8 is inserted into the concave portions 6 and 7.SELECTED DRAWING: Figure 2

Description

TECHNICAL FIELD The present invention relates to a multilayer ceramic capacitor, and more particularly to a multilayer ceramic capacitor with improved moisture resistance.

The present invention also relates to a method for manufacturing a multilayer ceramic capacitor suitable for manufacturing the multilayer ceramic capacitor of the present invention.

A typical multilayer ceramic capacitor includes a capacitive element in which a plurality of dielectric layers made of ceramic and a plurality of internal electrodes are laminated, and external electrodes are formed on the surface of the capacitive element. The internal electrodes are drawn out to end faces and side faces of the capacitive element and electrically connected to the external electrodes.

The external electrodes are composed of, for example, a base electrode layer formed by applying a conductive paste and baking the paste, and a plated electrode layer formed on the surface of the base electrode layer. The plating electrode layer may be composed of multiple layers as required.

For example, Patent Document 1 (Japanese Patent Application Laid-Open No. 2017-168488) describes a base electrode layer containing Ni or the like as a main component, a Cu-plated electrode layer formed on the surface of the base electrode layer, and a surface of the Cu-plated electrode layer. and a Sn-plated electrode layer formed on the surface of the Ni-plated electrode layer.

JP 2017-168488 A

In the conventional multilayer ceramic capacitor described above, the moisture resistance is mainly maintained by the base electrode layer and the Cu-plated electrode layer of the external electrodes. In other words, the base electrode layer and the Cu-plated electrode layer prevent moisture from entering the internal electrodes.

However, when the base electrode layer is formed by applying a conductive paste, for example, by dipping, to the end face of the capacitor and firing the conductive paste, the thickness of the base electrode layer becomes uneven on the end face of the capacitor. There was a problem of becoming That is, there is a problem that the thickness of the underlying electrode layer in the central portion of the end face is large, but the thickness of the underlying electrode layer near the periphery of the end face is small.

In addition, there is a problem that the moisture resistance of the portion where the thickness of the underlying electrode layer is small becomes low, and moisture enters the internal electrode from that portion, resulting in a decrease in the IR (insulation resistance) of the multilayer ceramic capacitor. Below, it demonstrates using drawing.

FIG. 12 shows a conventional laminated ceramic capacitor 1000. As shown in FIG. However, FIG. 12 is a cross-sectional view showing a cross-section parallel to the side surface of the multilayer ceramic capacitor 1000. FIG. It should be noted that FIG. 12 was created by the applicant of the present application and is not described in Patent Document 1. FIG.

A multilayer ceramic capacitor 1000 includes a capacitive element 101 . The capacitive element 101 is formed by laminating a dielectric layer 101a made of ceramic, a first internal electrode 102, and a second internal electrode 103. As shown in FIG. A first internal electrode 102 is led out to one end face of the capacitive element 101, and a second internal electrode 103 is led out to the other end face of the capacitive element. Note that the cross-sectional view of FIG. 12 shows one end face side of the capacitive element 101 from which the first internal electrode 102 is drawn.

External electrodes 104 are formed on both end surfaces of the capacitive element 101 . An external electrode 104 formed on one end face of the capacitive element 101 is electrically connected to the first internal electrode 102 . An external electrode 104 formed on the other end surface of the capacitive element 101 is electrically connected to the second internal electrode 103 .

The external electrodes 104 are composed of a base electrode layer 108 mainly composed of Ni or the like, which is formed by applying a conductive paste and baking it, a Cu-plated electrode layer 109 formed on the base electrode layer 108, and a Cu-plated electrode layer 109 formed on the base electrode layer 108. It is composed of a Ni-plated electrode layer 110 formed on the electrode layer 109 and a Sn-plated electrode layer 111 formed on the Ni-plated electrode layer 110 .

As can be seen from FIG. 12, the underlying electrode layer 108 has a large thickness M in the central portion of the end surface, but a small thickness N near the periphery of the end surface. As described above, the multilayer ceramic capacitor 1000 maintains moisture resistance mainly by the base electrode layer 108 and the Cu-plated electrode layer 109. There was a problem that water intruded inside. Then, there is a problem that the IR is lowered.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described conventional problems. A main surface, a first side surface and a second side surface facing each other in a width direction perpendicular to the height direction, and a first end surface and a second end surface facing each other in a length direction perpendicular to the height direction and the width direction. a capacitive element in which a plurality of dielectric layers are stacked in the height direction; , a first internal electrode exposed on the first end surface, and a plurality of dielectric layers arbitrarily selected from the plurality of dielectric layers, positioned inside the capacitor, and exposed on the second end surface; a second internal electrode disposed on the first end face and electrically connected to the first internal electrode; and a second internal electrode disposed on the second end face and electrically connected to the first internal electrode. and a second external electrode electrically connected to a multilayer ceramic capacitor, wherein the first external electrode and the second external electrode are respectively a base electrode layer having a metal component and a ceramic component; a Cu-plated electrode layer disposed on the base electrode layer, a Ni-plated electrode layer disposed on the Cu-plated electrode layer, and a Sn-plated electrode layer disposed on the Ni-plated electrode layer; It is assumed that recesses are formed in the first end surface and the second end surface of the element, respectively, and that the base electrode layer is inserted into the recesses.

Further, a method for manufacturing a multilayer ceramic capacitor according to one embodiment of the present invention includes steps of producing a plurality of ceramic green sheets, A step of applying a conductive paste for forming internal electrodes on the surface in a desired shape, laminating and integrating a plurality of ceramic green sheets to form a first main surface and a second main surface; forming a green capacitor element having first and second side surfaces and first and second end surfaces; and cutting the first and second end surfaces of the green capacitor element. and applying a conductive paste for forming a base electrode layer of the external electrode to each of the first end face and the second end face including the unfired recess. , firing an unfired capacitive element, having first and second main surfaces, first and second side surfaces, and first and second end surfaces; A plurality of dielectric layers, a plurality of first internal electrodes, and a plurality of second internal electrodes are laminated, recesses are formed in the first end face and the second end face, respectively, and the first end face including the recess is formed. forming a base electrode layer for a first external electrode on an end surface and forming a base electrode layer for a second external electrode on a second end surface including a recess; a step of forming a Cu plating electrode layer; a step of forming a Ni plating electrode layer on the Cu plating electrode layer; and a step of forming a Sn plating electrode layer on the Ni plating electrode layer. shall be assumed.

In addition, a method for manufacturing a laminated ceramic capacitor according to another embodiment of the present invention includes the steps of producing a plurality of ceramic green sheets, A step of applying a release agent in a desired shape to an arbitrarily selected region on the surface, a main surface of a plurality of ceramic green sheets arbitrarily selected from a plurality of ceramic green sheets, and / or A step of applying a conductive paste for forming internal electrodes on a release agent in a desired shape, and laminating and integrating a plurality of ceramic green sheets to form a first main surface and a second main surface. and a step of fabricating a green capacitive element having first and second side surfaces and first and second end faces; vibrating the green capacitive element to apply a release agent; a step of partially separating the laminated ceramic green sheets and the ceramic green sheets in the part to form unfired concave portions in the first end surface and the second end surface, respectively; a step of applying a conductive paste for forming a base electrode layer of the external electrode to each of the end faces and the second end face of the, and firing the unfired capacitive element to form the first principal face and the second principal face , a first side surface, a second side surface, a first end surface and a second end surface, and inside, a plurality of dielectric layers, a plurality of first internal electrodes, and a plurality of second are laminated, recesses are formed in the first end surface and the second end surface, respectively, a base electrode layer of the first external electrode is formed in the first end surface including the recess, and a second electrode layer including the recess is formed. a step of forming a capacitive element in which a base electrode layer of a second external electrode is formed on an end face of the; a step of forming a Cu plated electrode layer on the base electrode layer; a step of forming a Cu plated electrode layer on the Cu plated electrode layer; The method includes a step of forming a Ni-plated electrode layer, and a step of forming a Sn-plated electrode layer on the Ni-plated electrode layer.

In the method for manufacturing a laminated ceramic capacitor according to another embodiment, the step of applying a release agent onto the main surfaces of the ceramic green sheets and the step of applying a conductive paste onto the main surfaces of the ceramic green sheets are different. , the order may be changed.

In the laminated ceramic capacitor according to one embodiment of the present invention, the concave portion is formed in the end face of the capacitive element, and the base electrode layer of the external electrode is inserted into the concave portion, so that the thickness of the base electrode layer is increased at that portion. and has excellent moisture resistance. Therefore, the multilayer ceramic capacitor according to one embodiment of the present invention has a large IR.

Further, according to the manufacturing method of a laminated ceramic capacitor according to one embodiment or another embodiment of the present invention, the laminated ceramic capacitor of the present invention can be easily produced.

FIG. 1A is a plan view of a multilayer ceramic capacitor 100 according to the first embodiment. FIG. 1B is a side view of the multilayer ceramic capacitor 100. FIG. FIG. 1C is a front view of the multilayer ceramic capacitor 100. FIG. 1 is a cross-sectional view of a multilayer ceramic capacitor 100; FIG. 1 is a cross-sectional view of a main part of a multilayer ceramic capacitor 100; FIG. 1 is an exploded front view of a multilayer ceramic capacitor 100; FIG. 5A to 5C are cross-sectional views each showing an example of a method for manufacturing the multilayer ceramic capacitor 100. FIG. 6(D) to (F) are continuations of FIG. 5(C), and are cross-sectional views each showing an example of the manufacturing method of the multilayer ceramic capacitor 100. FIG. FIG. 4 is a cross-sectional view of a main part of a laminated ceramic capacitor 200 according to a second embodiment; 8A and 8B are cross-sectional views showing an example of a method for manufacturing the multilayer ceramic capacitor 200, respectively. FIG. 10 is a cross-sectional view of a main part of a laminated ceramic capacitor 300 according to a third embodiment; FIG. 10A is a plan view of a multilayer ceramic capacitor 400 according to the fourth embodiment. FIG. 10B is a side view of the multilayer ceramic capacitor 400. FIG. 4 is a cross-sectional view of a multilayer ceramic capacitor 400; FIG. FIG. 10 is a cross-sectional view of a main part of a conventional laminated ceramic capacitor 1000;

Embodiments for carrying out the present invention will be described below with reference to the drawings. Each embodiment is an example of an embodiment of the present invention, and the present invention is not limited to the content of the embodiment. Moreover, it is also possible to combine the contents described in different embodiments, and the contents of the implementation in that case are also included in the present invention. In addition, the drawings are intended to aid understanding of the specification, and may be schematically drawn, and the drawn components or the dimensional ratios between the components may not be the same as those described in the specification. The proportions of those dimensions may not match. In addition, there are cases where constituent elements described in the specification are omitted in the drawings, or where the number of constituent elements is omitted.

[First embodiment]
1A to 1C, 2, 3 and 4 show a multilayer ceramic capacitor 100 according to the first embodiment. However, FIG. 1A is a plan view of the multilayer ceramic capacitor 100. FIG. FIG. 1B is a side view of the multilayer ceramic capacitor 100. FIG. FIG. 1C is a front view of the multilayer ceramic capacitor 100. FIG. FIG. 2 is a cross-sectional view of the laminated ceramic capacitor 100, showing the X-X portion indicated by the dashed-dotted arrows in FIGS. 1(A) and (C). FIG. 3 is a cross-sectional view of the main part of the multilayer ceramic capacitor 100. As shown in FIG. FIG. 4 is an exploded front view of the multilayer ceramic capacitor 100 with the first external electrode 4 (second external electrode 5) removed.

In these drawings, a view showing one end face of the capacitive element 1 of the multilayer ceramic capacitor 100 is a front view, a view showing one main face is a plan view, and a view showing one side face is a side view. and Each figure shows the height direction T, length direction L, and width direction W of the multilayer ceramic capacitor 100 (capacitor 1), and these directions may be referred to in the following description.

A multilayer ceramic capacitor 100 includes a capacitive element 1 having a rectangular parallelepiped shape. The capacitive element 1 has a first principal surface 1A and a second principal surface 1B that face each other in the height direction T, and a first side face 1C and a second side face that face each other in the width direction W orthogonal to the height direction T. 1D, and a first end surface 1E and a second end surface 1F facing each other in the length direction L orthogonal to both the height direction T and the width direction W.

The dimensions of the multilayer ceramic capacitor 100 are arbitrary. However, the dimension in the height direction T can be, for example, about 0.1 mm to 2.5 mm. The dimension in the width direction W can be, for example, about 0.1 mm to 2.5 mm. The dimension in the length direction L can be, for example, about 0.1 mm to 3.2 mm.

The capacitive element 1 is formed by laminating a plurality of dielectric layers 1a, a plurality of first internal electrodes 2, and a plurality of second internal electrodes 3. As shown in FIG. The dielectric layer 1 a , the first internal electrode 2 , and the second internal electrode 3 are laminated in the height direction T of the capacitive element 1 .

Any material can be used for the capacitive element 1 (dielectric layer 1a). For example, dielectric ceramics containing BaTiO ₃ as a main component can be used. However, instead of BaTiO ₃ , dielectric ceramics containing other materials as main components such as CaTiO ₃ , SrTiO ₃ and CaZrO ₃ may be used.

The thickness of the dielectric layer 1a is arbitrary, but for example, it can be about 0.3 .mu.m to 2.0 .mu.m in the effective region of capacitance formation in which the first internal electrode 2 and the second internal electrode 3 are formed. can.

Although the number of layers of the dielectric layer 1a is arbitrary, for example, it can be about 1 layer to 6000 layers in the effective region of capacitance formation in which the first internal electrode 2 and the second internal electrode 3 are formed. .

On both upper and lower sides of the capacitive element 1, outer layers (protective layers) are provided, which are not formed with the first internal electrode 2 and the second internal electrode 3, and are composed only of the dielectric layer 1a. Although the thickness of the outer layer is arbitrary, it can be, for example, about 5 μm to 150 μm. Note that the thickness of the dielectric layer 1a in the outer layer region may be larger than the thickness of the dielectric layer 1a in the effective region for capacitance formation in which the first internal electrode 2 and the second internal electrode 3 are formed. (However, in FIGS. 1B, 2, 3 and 4, the thickness of the dielectric layer 1a is shown to be the same in the outer layer region and the effective region). Also, the material of the dielectric layer 1a in the outer layer region may be different from the material of the dielectric layer 1a in the effective region.

As can be seen from FIG. 2, the first internal electrode 2 extends in the length direction L of the capacitive element 1 and is drawn out to the first end face 1E of the capacitive element 1. As shown in FIG. The second internal electrode 3 extends in the length direction L of the capacitive element 1 and is drawn out to the second end surface 1F of the capacitive element 1 . In principle, the first internal electrodes 2 and the second internal electrodes 3 are alternately laminated.

Although the material of the main component (metal component) of the first internal electrode 2 and the second internal electrode 3 is arbitrary, Ni is used in this embodiment. However, other metals such as Cu, Ag, Pd, and Au may be used instead of Ni. Also, Ni, Cu, Ag, Pd, Au, etc. may be alloys with other metals. The first internal electrode 2 and the second internal electrode 3 may contain other components such as ceramics in addition to metal components.

The thickness of the first internal electrode 2 and the second internal electrode 3 is arbitrary, but can be, for example, about 0.3 μm to 1.5 μm.

A first external electrode 4 is formed on the first end surface 1</b>E of the capacitive element 1 . A second external electrode 5 is formed on the second end surface 1F.

The first external electrode 4 is formed in a cap shape, and the edge portion extends from the first end surface 1E of the capacitive element 1 to the first main surface 1A, the second main surface 1B, and the first side surface. 1C, extending to the second side surface 1D and forming a folded portion 4a.

The second external electrode 5 is formed in a cap shape, and the edge portion extends from the second end surface 1F of the capacitive element 1 to the first main surface 1A, the second main surface 1B, and the first side surface. 1C, extending to the second side surface 1D and forming a folded portion 5a.

In the multilayer ceramic capacitor 100 , the first internal electrode 2 drawn out to the first end surface 1</b>E of the capacitive element 1 is electrically connected to the first external electrode 4 . A second internal electrode 3 drawn out to the second end surface 1F of the capacitive element 1 is electrically connected to a second external electrode 5 .

The first external electrode 4 and the second external electrode 5 have the same multilayer structure. Specifically, as shown in FIGS. 2 and 3, the first external electrode 4 and the second external electrode 5 are respectively a base electrode layer 8 and a base electrode layer 8 formed on the surface of the capacitor 1. 8, a Ni-plated electrode layer 10 formed on the Cu-plated electrode layer 9, and a Sn-plated electrode layer 11 formed on the Ni-plated electrode layer 10. is doing.

The base electrode layer 8 is a base portion of the first external electrode 4 and the second external electrode 5 . The base electrode layer 8 also has a function of improving moisture resistance. The Cu-plated electrode layer 9 mainly functions to improve moisture resistance. The Ni-plated electrode layer 10 mainly functions to improve solder heat resistance and bondability. The Sn-plated electrode layer 11 mainly functions to improve solderability.

The base electrode layer 8 has a metal component and a ceramic component. In this embodiment, Ni is used as the main component of the metal component. However, the material of the main component of the metal component of the base electrode layer 8 is arbitrary, and instead of Ni, for example, Cu, Ag, or the like may be used as the main component. Also, Ni, Cu, Ag, etc. may be alloys with other metals. Moreover, the main component of the ceramic component of the underlying electrode layer 8 is also arbitrary. However, for example, the same material as that of the capacitive element 1 (dielectric layer 1a) can be used.

Although the thickness of the base electrode layer 8 is arbitrary, it can be, for example, about 2 μm to 150 μm in the thick central regions of the first end face 1E and the second end face 1F.

Although the thickness of the Cu plating electrode layer 9 is arbitrary, it can be, for example, about 2 μm to 20 μm.

Although the thickness of the Ni-plated electrode layer 10 is arbitrary, it can be, for example, about 2 μm to 7 μm.

Although the thickness of the Sn-plated electrode layer 11 is arbitrary, it can be, for example, about 1 μm to 8 μm.

A multilayer ceramic capacitor 100 has a recess 6 formed in a first end face 1E and a recess 7 formed in a second end face 1F. In this embodiment, two recesses 6 are formed in the first end face 1E and two recesses 7 are formed in the second end face 1F. You may let

As shown in FIG. 4, in this embodiment, the recesses 6, 7 have a width _FW and a length _FL longer than the width _FW . Although FIG. 4 shows the recess 6 formed in the first end face 1E, the recess 7 formed in the second end face 1F has a similar shape. The width F _W and the length _FL of the recesses 6 and 7 are arbitrary and can be set freely.

As can be seen from FIG. 4, the direction of the length _FL of the recess 6 formed in the first end face 1E is the same as the direction in which the first internal electrodes 2 exposed on the first end face 1E extend. . Similarly, the direction of the length _FL of the recess 7 formed in the second end face 1F is the same as the direction in which the second internal electrodes 3 exposed on the second end face 1F extend. However, the direction of the length _FL of the recesses 6 and 7 is arbitrary and can be set freely.

As can be seen from FIGS. 2 and 3, the direction of depth _FD of recesses 6 and 7 is the same as the direction in which first internal electrode 2 and second internal electrode 3 extend.

As can be seen from FIGS. 2 and 3, a portion 8a of the base electrode layer 8 of the first external electrode 4 and a portion 9a of the Cu-plated electrode layer 9 are inserted into the concave portion 6. As shown in FIG. Similarly, a portion 8 a of the base electrode layer 8 of the first external electrode 4 and a portion 9 a of the Cu-plated electrode layer 9 are inserted into the recess 7 .

A portion 8 a of the underlying electrode layer 8 of the first external electrode 4 that has entered the recess 6 is electrically connected to the first internal electrode 2 . Similarly, the portion 8 a of the base electrode layer 8 of the second external electrode 5 that has entered the recess 7 is electrically connected to the second internal electrode 3 .

The concave portions 6 and 7 are formed by increasing the thickness of the base electrode layer 8 (or the base electrode layer 8 and the Cu-plated electrode layer 9) of the first external electrode 4 and the second external electrode 5 at that portion to provide moisture resistance. It is designed to improve That is, by adding the depth of the portions 8a of the underlying electrode layer 8 that have entered the recesses 6 and 7 to the thickness of the underlying electrode layer 8, the substantial thickness of the underlying electrode layer 8 is increased. Therefore, it is preferable to provide the concave portions 6 and 7 in the vicinity of the periphery of the first end face 1E and the second end face 1F of the capacitive element 1, where the thickness of the base electrode layer 8 tends to be small.

It should be noted that the portion 8a of the base electrode layer 8 that has entered the recess 6 and the first internal electrode 2 do not necessarily need to be electrically connected. However, the portion 8 a of the base electrode layer 8 that has entered the recess 6 must be electrically insulated from the second internal electrode 3 . Similarly, the portion 8a of the underlying electrode layer 8 that has entered the recess 7 and the second internal electrode 3 do not necessarily need to be electrically connected. However, the portion 8a of the base electrode layer 8 that has entered the recess 7 needs to be electrically insulated from the first internal electrode 2 .

As can be seen from FIG. 2, in the present embodiment, the portion 8a of the base electrode layer 8 that has entered the recess 6, the first internal electrode 2 that is arranged closest to the first main surface 1A side, and the 2 are electrically connected to the first internal electrodes 2 arranged on the main surface 1B side of the electrodes 2, respectively. Similarly, the portion 8a of the underlying electrode layer 8 that has entered the recess 7, the second internal electrode 3 that is arranged closest to the first main surface 1A side, and the second internal electrode 3 that is arranged closest to the second main surface 1B side. The second internal electrodes 3 are electrically connected to each other. Since the thickness of the base electrode layer 8 tends to be small in these regions, the recesses 6 and 7 are formed to increase the substantial thickness of the base electrode layer 8, thereby improving the moisture resistance.

In the present embodiment, the portion 8a of the underlying electrode layer 8 that has entered the recess 6 is electrically connected to one first internal electrode 2. The portion 8a of the electrode layer 8 and the plurality of first internal electrodes 2 may be electrically connected. Similarly, the portion 8a of the underlying electrode layer 8 that enters the recess 7 is electrically connected to one second internal electrode 3, but instead of this, the portion 8a of the underlying electrode layer 8 that enters the recess 7 is electrically connected. portion 8a and the plurality of second internal electrodes 3 may be electrically connected.

The size of the depth F _D of the concave portions 6 and 7 is arbitrary and can be set freely. However, as shown in FIG. 3, the depth _FD of the concave portions 6 and 7 is greater than the thickness P of the base electrode layer 8 at that portion with reference to the first end face 1E or the second end face 1F. is preferred. This is because in this case, the moisture resistance can be favorably improved. Further, the depth _FD of the concave portions 6 and 7 is preferably smaller than the length Q of the folded portions 4a and 5a of the first external electrode 4 and the second external electrode 5, respectively. If the depths _FD of the recesses 6 and 7 are too large, the lengths of the first internal electrodes 2 and the second internal electrodes 3 must be shortened to prevent short circuits. This is because there is a possibility that the capacity may become small.

The multilayer ceramic capacitor 100 according to this embodiment has improved moisture resistance and a large IR.

(Example of manufacturing method of multilayer ceramic capacitor 100)
The multilayer ceramic capacitor 100 according to the first embodiment can be manufactured, for example, by the manufacturing method shown in FIGS. 5(A) to 6(F).

First, an unfired capacitive element 51 shown in FIG. 5A is manufactured. The unfired capacitive element 51 includes a plurality of ceramic green sheets 11a, a plurality of conductive pastes 12 for forming the first internal electrodes 2, and a plurality of conductive pastes for forming the second internal electrodes 3. 13 are laminated, pressurized, and integrated.

Although not shown, first, dielectric ceramic powder, binder resin, solvent, etc. are prepared and wet-mixed to prepare ceramic slurry.

Next, the ceramic slurry is coated on the carrier film in the form of a sheet using a die coater, gravure coater, micro gravure coater, or the like, and dried to produce a ceramic green sheet.

Next, in order to form the first internal electrodes 2 and the second internal electrodes 3, conductive pastes 12 and 13 prepared in advance are applied to the main surfaces of predetermined ceramic green sheets in a desired pattern shape (for example, Print. The conductive paste is not applied to the ceramic green sheets serving as outer layers. As the conductive paste, for example, a mixture of solvent, binder resin, metal powder (for example, Ni powder) and the like can be used.

Next, the ceramic green sheets are laminated in a predetermined order and integrated by thermocompression bonding to produce an unfired capacitive element 51 shown in FIG. 5(A). In a general production line, in order to manufacture a large number of multilayer ceramic capacitors 100 with high productivity, mother ceramic green sheets are prepared, conductive pastes 12 and 13 are applied to them, and mother ceramic green sheets are applied. In many cases, sheets are laminated, pressed, and integrated to form a mother unfired capacitive element, and the mother unfired capacitive element is divided into individual unfired capacitive elements 51 .

Next, if necessary, as shown in FIG. 5B, the green capacitor element 51 is barrel-polished to form rounded corners and ridges of the green capacitor element 51 .

Next, as shown in FIG. 5C, both end faces of the unfired capacitive element 51 are partially cut with a blade or the like to form unfired recesses 16 and 17 for forming the recesses 6 and 7 . Note that the means used for cutting is not limited to the blade, and other means such as laser beam irradiation may be used.

Next, as shown in FIG. 6D, the conductive paste 18 for forming the base electrode layer 8 is applied to both end surfaces of the green capacitor element 51 by dipping, for example. As the conductive paste, for example, a mixture of solvent, binder resin, metal powder (for example, Ni powder), ceramic powder and the like can be used. As shown in FIG. 6(D), the conductive paste 18 is also applied to the inner walls and bottoms of the non-fired recesses 16 and 17 .

Next, the unfired capacitive element 51 is fired with a predetermined profile to complete the capacitive element 1 shown in FIG. 6(E). At this time, the ceramic green sheets 11a are fired to form the dielectric layers 1a, and the conductive pastes 12 and 13 applied to the main surfaces of the ceramic green sheets 11a are simultaneously fired to form the first internal electrodes 2 and the second internal electrodes 2. The conductive paste 18 applied to the end face of the non-fired capacitive element 51 becomes the internal electrode 3 and is simultaneously fired to become the base electrode layer 8 . Further, the unfired concave portions 16 and 17 become the concave portions 6 and 7, and the portions 8a of the base electrode layer 8 are formed on the inner walls and bottom portions of the concave portions 6 and 7, respectively. The portion 8a of the base electrode layer 8 may completely fill the recesses 6 and 7. FIG.

Next, as shown in FIG. 6F, a Cu-plated electrode layer 9 is formed on the base electrode layer 8, a Ni-plated electrode layer 10 is formed on the Cu-plated electrode layer 9, and a Ni-plated electrode layer is formed. A Sn-plated electrode layer 11 is formed on 10 to complete the multilayer ceramic capacitor 100 . A portion 9a of the Cu plating electrode layer 9 is formed inside the portion 8a of the underlying electrode layer 8 .

(Experiment 1)
In order to confirm the effectiveness of the present invention, the following Experiment 1 was conducted.

As an example, 20 laminated ceramic capacitors 100 described above were produced. Also, as a comparative example, 20 conventional laminated ceramic capacitors were produced by omitting the concave portions 6 and 7 from the laminated ceramic capacitor 100 . All of the produced multilayer ceramic capacitors had the required IR magnitude.

Next, a voltage of 3.2 V was applied to each of the laminated ceramic capacitors of Examples and Comparative Examples for 72 hours under an environment of 125° C. temperature and 95% humidity.

After 72 hours, the IR of each multilayer ceramic capacitor was measured, and those exceeding the standard size were rated as "good", and those below the standard size were rated as "bad". The defective rate of the example was 0%. The defect rate of the comparative example was 10%.

From the above, the effectiveness of the present invention was confirmed.

[Second embodiment]
FIG. 7 shows a laminated ceramic capacitor 200 according to the second embodiment. However, it is a cross-sectional view of a main part of the multilayer ceramic capacitor 200 .

A laminated ceramic capacitor 200 according to the second embodiment is obtained by partially modifying the structure of the laminated ceramic capacitor 100 according to the first embodiment. Specifically, in the multilayer ceramic capacitor 100, the concave portions 6 and 7 are respectively formed over a certain dielectric layer 1a and a partial portion of the dielectric layers 1a stacked above and below. In the laminated ceramic capacitor 200, this is changed, and recesses 26 and 27 are formed in the boundary region between two adjacent dielectric layers 1a. Then, a portion 8b of the base electrode layer 8 and a portion 9b of the Cu plated electrode layer 9 were formed inside the concave portions 26 and 27 . Other configurations of the laminated ceramic capacitor 200 were the same as those of the laminated ceramic capacitor 100 .

(Example of manufacturing method of multilayer ceramic capacitor 200)
The laminated ceramic capacitor 200 according to the second embodiment can be manufactured, for example, by the manufacturing method shown in FIGS. 8(A) and 8(B).

First, although not shown, the ceramic green sheet 11a is produced by the same method as shown in the manufacturing method of the first embodiment.

Next, a release agent 20 is applied to the areas where the recesses 26 and 27 are to be formed on the upper or lower main surface of the predetermined ceramic green sheet 11a. Any material can be used for the release agent 20 as long as it can partially separate the ceramic green sheets 11a from each other by applying vibration.

Next, in order to form the first internal electrodes 2 and the second internal electrodes 3, conductive pastes 12 and 13 prepared in advance are applied in a desired pattern on the main surfaces of the predetermined ceramic green sheets 11a. . The order of applying the release agent 20 to the main surface of the ceramic green sheet 11a and applying the conductive pastes 12 and 13 to the main surface of the ceramic green sheet 11a may be reversed.

Next, as shown in FIG. 8(A), the ceramic green sheets 11a are laminated in a predetermined order and integrated by thermocompression bonding to produce an unfired capacitive element 51. Next, as shown in FIG.

Next, as shown in FIG. 8B, the unfired capacitor element 51 is subjected to barrel polishing to form roundnesses R on the corners and ridges of the unfired capacitor element 51, and the release agent 20 is removed by the vibration of the barrel polishing. are partially peeled off from each other to form unfired concave portions 56 and 57 . At this time, the conductive pastes 12 and 13 inside the non-fired concave portions 56 and 57 are also removed by the vibration.

Next, although not shown, the conductive paste 18 for forming the base electrode layer 8 is applied to both end surfaces of the green capacitor element 51 by dipping, for example, by the same method as the manufacturing method of the first embodiment.

Next, the unfired capacitive element 51 is fired with a predetermined profile to complete the capacitive element 1 . At this time, the ceramic green sheets 11a are fired to form the dielectric layers 1a, and the conductive pastes 12 and 13 applied to the main surfaces of the ceramic green sheets 11a are simultaneously fired to form the first internal electrodes 2 and the second internal electrodes 2. The conductive paste 18 applied to the end face of the non-fired capacitive element 51 becomes the internal electrode 3 and is simultaneously fired to become the base electrode layer 8 . Then, the unbaked recesses 56 and 57 become the recesses 26 and 27, and the portions 8b of the base electrode layer 8 are formed on the inner walls and bottoms of the recesses 26 and 27, respectively.

Next, a Cu plated electrode layer 9 is formed on the base electrode layer 8, a Ni plated electrode layer 10 is formed on the Cu plated electrode layer 9, and a Sn plated electrode layer is formed on the Ni plated electrode layer 10. Then, the multilayer ceramic capacitor 200 is completed. A portion 9b of the Cu plating electrode layer 9 is formed inside the portion 8b of the underlying electrode layer 8 .

The multilayer ceramic capacitor 200 according to the second embodiment also has improved moisture resistance in the recessed portions 26 and 27 of the first external electrode 4 and the second external electrode 5, and IR is increased.

[Third Embodiment]
FIG. 9 shows a laminated ceramic capacitor 300 according to the third embodiment. However, FIG. 9 is a cross-sectional view of a main part of the laminated ceramic capacitor 300. As shown in FIG. Although FIG. 9 shows the recess 36 formed in the first end surface 1E of the capacitive element 1 and the first external electrode 4, the second end surface 1F of the capacitative element 1 is similarly formed with A recess 37 and a second external electrode 5 are formed.

The multilayer ceramic capacitor 300 according to the third embodiment also has a part of the configuration of the multilayer ceramic capacitor 100 according to the first embodiment described above. Specifically, in the multilayer ceramic capacitor 100, the portion 8a of the base electrode layer 8 formed inside the recess 6 (recess 7) is electrically connected to one first internal electrode 2 (second internal electrode 3). However, in the multilayer ceramic capacitor 300, this is changed so that the portion 8c of the base electrode layer 8 formed inside the recess 36 (recess 37) is replaced with the plurality of first internal electrodes 2 (second was electrically connected to the internal electrode 3) of the A portion 9c of the Cu-plated electrode layer 9 is formed inside the portion 8c of the base electrode layer 8. As shown in FIG. Other configurations of the laminated ceramic capacitor 300 were the same as those of the laminated ceramic capacitor 100 .

The multilayer ceramic capacitor 300 according to the third embodiment also has improved moisture resistance in the portions where the recesses 36 and 37 of the first external electrode 4 and the second external electrode 5 are formed, and the IR is increased.

[Fourth Embodiment]
10A, 10B, and 11 show a multilayer ceramic capacitor 400 according to the fourth embodiment. However, FIG. 10A is a plan view of the laminated ceramic capacitor 400. FIG. FIG. 10B is a side view of the multilayer ceramic capacitor 400. FIG. FIG. 11 is a cross-sectional view of the multilayer ceramic capacitor 400, showing the YY portion indicated by the dashed-dotted line arrow in FIG. 10(A).

Each of the multilayer ceramic capacitors 100, 200, and 300 according to the first to third embodiments includes a pair of external electrodes, a first external electrode 4 and a second external electrode 5, respectively. was a capacitor. The multilayer ceramic capacitor 400 of the fourth embodiment constitutes a three-terminal capacitor by forming third external electrodes 40a and 40b in addition to the first external electrode 4 and the second external electrode 5. ing.

In the multilayer ceramic capacitors 100 , 200 , and 300 , the first internal electrodes 2 and the second internal electrodes 3 are alternately laminated inside the capacitive element 1 . Instead of this, the multilayer ceramic capacitor 400 of the fourth embodiment has a third internal electrode 44, a first internal electrode 2, and a second internal electrode 3 arranged in this order inside the capacitive element 1. are repeatedly laminated.

Each third internal electrode 44 is led out to both side surfaces of the capacitive element 1, namely, the first side surface 1C and the second side surface 1D. The third internal electrode 44 drawn out to the first side surface 1C is connected to the third external electrode 40a, and the third internal electrode 44 drawn out to the second side surface 1D is connected to the third external electrode 40a. It is connected to the electrode 40b. The third external electrode 40a and the third external electrode 40b are electrically connected to each other via the first main surface 1A and/or the second main surface 1B of the capacitive element 1. good too.

In the laminated ceramic capacitor 400, two recesses 46 are formed on the first side surface 1C of the capacitive element 1, and two recesses 47 are formed on the second side surface 1D.

Similar to the first external electrode 4 and the second external electrode 5, the third external electrodes 40a and 40b include a base electrode layer 8, a Cu-plated electrode layer 9, a Ni-plated electrode layer 10, and a Sn-plated electrode layer. 11 are laminated. A portion 8 d of the underlying electrode layer 8 and a portion 9 d of the Cu plating electrode layer 9 enter the concave portions 46 and 47 . Then, the third internal electrode 44 laminated on the top and the third internal electrode 44 laminated on the bottom are formed in the portion 8a of the base electrode layer 8 that has entered the inside of the recess 46 and the inside of the recess 47, respectively. It is electrically connected to the portion 8a of the base electrode layer 8 which has entered. Other configurations of the laminated ceramic capacitor 400 are the same as those of the laminated ceramic capacitor 100 of the first embodiment.

Multilayer ceramic capacitor 400 can be used as a three-terminal capacitor. That is, the multilayer ceramic capacitor 400 has a circuit in which a power supply line or a signal line is cut in the middle, the first external electrode 4 is connected to one of the cuts, the second external electrode 5 is connected to the other of the cuts, and , and the third external electrodes 40a, 40b can be connected to the ground, it can be used as a three-terminal capacitor.

The multilayer ceramic capacitor 400 according to the fourth embodiment also has improved moisture resistance in the portions of the third external electrodes 40a and 40b where the concave portions 46 and 47 are formed, and IR is increased.

The multilayer ceramic capacitors 100, 200, 300, and 400 according to the first to fourth embodiments have been described above. However, the present invention is not limited to the contents described above, and various modifications can be made along the spirit of the invention.

For example, in the multilayer ceramic capacitors 100, 200, 300, and 400, Ni was used as the main component of the metal component of the underlying electrode layer 8, but the type of the main component of the metal component is arbitrary. Cu, Ag, etc. may also be used.

Further, the extending direction (lengthwise direction) of the concave portions 6, 7 and the like formed in the capacitive element 1 is also arbitrary, and may be changed from the direction shown in each embodiment. Further, the number of concave portions 6, 7, etc. formed in the capacitive element 1 is arbitrary, and may be increased or decreased from the number shown in each embodiment.

A laminated ceramic capacitor according to an embodiment of the present invention is as described in the section "Means for Solving the Problems".

In this multilayer ceramic capacitor, it is also preferable that the base electrode layer and the Cu-plated electrode layer are embedded in the concave portion. In this case, the moisture resistance can be improved by the base electrode layer and the Cu-plated electrode layer that have entered the recess.

In addition, the underlying electrode layer that has entered into the recess formed in the first end surface is electrically connected to at least one first internal electrode, and the underlying electrode layer has entered into the recess formed in the second end surface. and at least one second internal electrode are also preferably electrically connected. In this case, the intrusion of moisture from the outside into the first internal electrode and the second internal electrode is suppressed.

When viewing the first end face from which the first external electrode is removed or the second end face from which the second external electrode is removed, the recess has a width and a length longer than the width. It is also preferable that the length direction and the direction in which the first internal electrodes exposed on the first end face extend or the direction in which the second internal electrodes exposed on the second end face extend are the same. In this case, the electrical connection between the first internal electrode and the first external electrode or the electrical connection between the second internal electrode and the second external electrode in the recess is good. It is carried out.

When the cross section of the capacitor parallel to the first side surface and the second side surface is viewed, the direction of the depth of the recess is the same as the direction in which the first internal electrode and the second internal electrode extend. is also preferred. In this case, the electrical connection between the first internal electrode and the first external electrode or the electrical connection between the second internal electrode and the second external electrode in the recess is good. It is carried out.

When viewing a cross section of the capacitor parallel to the first side surface and the second side surface, the depth of the recess is based on the first end surface or the second end surface at the position where the recess is formed, It is also preferable that the thickness is greater than the thickness of the underlying electrode layer. In this case, moisture resistance can be favorably improved.

a first external electrode disposed on the first end surface and a second external electrode disposed on the second end surface, respectively, extending to the first major surface and the second major surface, respectively; It is also preferable that the depth of the concave portion is smaller than the length of the folded portion when the cross section of the capacitive element having the folded portion and parallel to the first side surface and the second side surface is viewed. If the depth of the concave portion is too large, the lengths of the first internal electrode and the second internal electrode must be shortened in order to prevent a short circuit, which may reduce the capacity of the multilayer ceramic capacitor. Because there is

When looking at the cross section of the capacitor parallel to the first side surface and the second side surface, the underlying electrode layer that has entered the recess formed in the first end surface and the underlying electrode layer that is disposed closest to the first main surface The underlying electrode layer electrically connected to the first internal electrode and/or the first internal electrode arranged closest to the second main surface and entering into the recess formed in the second end surface and the second internal electrode closest to the first main surface and/or the second internal electrode closest to the second main surface are electrically connected is also preferred. In this case, it is possible to improve the moisture resistance of the region where the moisture resistance tends to be low.

It is also preferable that the metal component of the underlying electrode layer contains Ni as a main component. In this case, the underlying electrode layer can be fired at the same time as the capacitive element and the internal electrodes are fired, thereby improving productivity.

A third internal electrode disposed on a plurality of dielectric layers arbitrarily selected from a plurality of dielectric layers, positioned inside the capacitive element, and exposed to the first side surface and/or the second side surface and a third external electrode disposed on the first side surface and/or the second side surface and connected to the third internal electrode, thereby forming a three-terminal capacitor. is also preferred. In this case, it is possible to obtain a three-terminal type multilayer ceramic capacitor with high moisture resistance and large IR.

Reference Signs List 1 Capacitive element 1A First main surface 1B Second main surface 1C First side surface 1D Second side surface 1E First end surface 1F . Second end surface 1a .. Dielectric layer 2 .. First internal electrode 3 .. Second internal electrode 4 .. First external electrode 4 a . Second external electrode 5a Folded portions 6, 7, 26, 27, 36, 37, 46, 47 Recess 8 Underlying electrode layer 9 Cu plating layer 10 Ni plating Layer 11... Sn-plated layers 40a, 40b... Third external electrode 44... Third internal electrode

Claims (13)

A first main surface and a second main surface facing in the height direction, a first side surface and a second side surface facing in the width direction perpendicular to the height direction, and a side surface perpendicular to the height direction and the width direction a capacitive element having a first end surface and a second end surface facing each other in the length direction, and having a plurality of dielectric layers laminated in the height direction;
a first internal electrode disposed on a plurality of dielectric layers arbitrarily selected from the plurality of dielectric layers, positioned inside the capacitive element, and exposed to the first end surface;
a second internal electrode disposed on a plurality of dielectric layers arbitrarily selected from the plurality of dielectric layers, located inside the capacitive element, and exposed to the second end surface;
a first external electrode disposed on the first end surface and electrically connected to the first internal electrode;
A multilayer ceramic capacitor having a second external electrode disposed on the second end face and electrically connected to the second internal electrode,
The first external electrode and the second external electrode each include a base electrode layer having a metal component and a ceramic component, a Cu-plated electrode layer disposed on the base electrode layer, and the Cu-plated electrode layer. a Ni-plated electrode layer disposed thereon, and a Sn-plated electrode layer disposed on the Ni-plated electrode layer,
a recess is formed in each of the first end surface and the second end surface of the capacitive element, and the base electrode layer is inserted into the recess;
Multilayer ceramic capacitor. The base electrode layer and the Cu-plated electrode layer are embedded in the recess,
A laminated ceramic capacitor according to claim 1 . the underlying electrode layer entering the recess formed in the first end face and at least one of the first internal electrodes are electrically connected,
the base electrode layer entering the recess formed in the second end face and at least one of the second internal electrodes are electrically connected;
A laminated ceramic capacitor according to claim 1 or 2. When looking at the first end face from which the first external electrode is removed or the second end face from which the second external electrode is removed,
the recess has a width and a length greater than the width;
The direction of the length of the recess and the direction in which the first internal electrode exposed on the first end face extends, or the direction in which the second internal electrode exposed on the second end face extends, in the same direction,
A multilayer ceramic capacitor according to any one of claims 1 to 3. When looking at a cross section of the capacitive element parallel to the first side surface and the second side surface,
The direction of the depth of the recess is the same as the direction in which the first internal electrode and the second internal electrode extend,
A multilayer ceramic capacitor according to any one of claims 1 to 4. When looking at a cross section of the capacitive element parallel to the first side surface and the second side surface,
The depth of the recess is
larger than the thickness of the base electrode layer, with reference to the first end face or the second end face at the position where the recess is formed;
A multilayer ceramic capacitor according to any one of claims 1 to 5. The first external electrode arranged on the first end surface and the second external electrode arranged on the second end surface are arranged on the first main surface and the second main surface, respectively. having folded portions each extending on a major surface;
When looking at a cross section of the capacitive element parallel to the first side surface and the second side surface,
The depth of the recess is
smaller than the length of the folded portion,
A multilayer ceramic capacitor according to any one of claims 1 to 6. When looking at a cross section of the capacitive element parallel to the first side surface and the second side surface,
The base electrode layer entering the recess formed in the first end surface, the first internal electrode closest to the first main surface, and/or the second main surface closest to the second main surface. electrically connected to the first internal electrode disposed near the surface,
the underlying electrode layer that has entered the recess formed in the second end face, the second internal electrode that is closest to the first principal surface, and/or the second principal electrically connected to the second internal electrode disposed near the surface,
A multilayer ceramic capacitor according to any one of claims 1 to 7. wherein the metal component of the base electrode layer contains Ni as a main component;
A multilayer ceramic capacitor according to any one of claims 1 to 8. a second dielectric layer disposed on a plurality of dielectric layers arbitrarily selected from the plurality of dielectric layers, located inside the capacitive element, and exposed to the first side surface and/or the second side surface; 3 internal electrodes;
a third external electrode disposed on the first side surface and/or the second side surface and connected to the third internal electrode;
A three-terminal capacitor is configured,
A multilayer ceramic capacitor according to any one of claims 1 to 9. A method for manufacturing a multilayer ceramic capacitor according to any one of claims 1 to 10,
a step of producing a plurality of ceramic green sheets;
a step of applying a conductive paste in a desired shape for forming internal electrodes on the main surfaces of a plurality of ceramic green sheets arbitrarily selected from the plurality of ceramic green sheets;
The plurality of ceramic green sheets are laminated and integrated to form a first main surface, a second main surface, a first side surface, a second side surface, and a first end surface and a second end surface. a step of fabricating an unfired capacitive element having
cutting the first end face and the second end face of the unfired capacitive element to form an unfired concave portion in each;
applying a conductive paste for forming a base electrode layer of an external electrode to each of the first end surface and the second end surface including the unfired concave portion;
firing the unfired capacitive element, having first and second main surfaces, first and second side surfaces, and first and second end surfaces; A plurality of dielectric layers, a plurality of first internal electrodes, and a plurality of second internal electrodes are laminated, and recesses are formed in each of the first end surface and the second end surface, and the recesses are included. fabricating a capacitive element in which the underlying electrode layer of a first external electrode is formed on the first end surface, and the underlying electrode layer of a second external electrode is formed on the second end surface including the concave portion; process and
forming a Cu-plated electrode layer on the underlying electrode layer;
forming a Ni-plated electrode layer on the Cu-plated electrode layer;
forming a Sn-plated electrode layer on the Ni-plated electrode layer,
A manufacturing method for a multilayer ceramic capacitor. A method for manufacturing a multilayer ceramic capacitor according to any one of claims 1 to 10,
a step of producing a plurality of ceramic green sheets;
applying a release agent in a desired shape to an arbitrarily selected region on the main surface of a ceramic green sheet arbitrarily selected from the plurality of ceramic green sheets;
A conductive paste for forming internal electrodes is applied in a desired shape on the main surfaces of a plurality of ceramic green sheets arbitrarily selected from the plurality of ceramic green sheets and/or on the applied release agent. and
The plurality of ceramic green sheets are laminated and integrated to form a first main surface, a second main surface, a first side surface, a second side surface, and a first end surface and a second end surface. a step of fabricating an unfired capacitive element having
Vibration is applied to the unfired capacitive element to partially separate the laminated ceramic green sheets from the ceramic green sheets at the portion coated with the release agent, thereby separating the first end surface and the second end surface. forming unfired recesses on the end surfaces, respectively;
applying a conductive paste for forming a base electrode layer of an external electrode to each of the first end surface and the second end surface including the unfired concave portion;
firing the unfired capacitive element, having first and second main surfaces, first and second side surfaces, and first and second end surfaces; A plurality of dielectric layers, a plurality of first internal electrodes, and a plurality of second internal electrodes are laminated, and recesses are formed in each of the first end surface and the second end surface, and the recesses are included. fabricating a capacitive element in which the underlying electrode layer of a first external electrode is formed on the first end surface, and the underlying electrode layer of a second external electrode is formed on the second end surface including the concave portion; process and
forming a Cu-plated electrode layer on the underlying electrode layer;
forming a Ni-plated electrode layer on the Cu-plated electrode layer;
forming a Sn-plated electrode layer on the Ni-plated electrode layer,
A manufacturing method for a multilayer ceramic capacitor. A method for manufacturing a multilayer ceramic capacitor according to any one of claims 1 to 10,
a step of producing a plurality of ceramic green sheets;
a step of applying a conductive paste in a desired shape for forming internal electrodes onto the main surfaces of a plurality of ceramic green sheets arbitrarily selected from the plurality of ceramic green sheets;
A step of applying a release agent in a desired shape to a main surface of a ceramic green sheet arbitrarily selected from the plurality of ceramic green sheets and/or an arbitrarily selected region on the applied conductive paste. When,
The plurality of ceramic green sheets are laminated and integrated to form a first main surface, a second main surface, a first side surface, a second side surface, and a first end surface and a second end surface. a step of fabricating an unfired capacitive element having
Vibration is applied to the unfired capacitive element to partially separate the laminated ceramic green sheets from the ceramic green sheets at the portion coated with the release agent, thereby separating the first end surface and the second end surface. forming unfired recesses on the end surfaces, respectively;
applying a conductive paste for forming a base electrode layer of an external electrode to each of the first end surface and the second end surface including the unfired concave portion;
firing the unfired capacitive element, having first and second main surfaces, first and second side surfaces, and first and second end surfaces; A plurality of dielectric layers, a plurality of first internal electrodes, and a plurality of second internal electrodes are laminated, and recesses are formed in each of the first end surface and the second end surface, and the recesses are included. fabricating a capacitive element in which the underlying electrode layer of a first external electrode is formed on the first end surface, and the underlying electrode layer of a second external electrode is formed on the second end surface including the concave portion; process and
forming a Cu-plated electrode layer on the underlying electrode layer;
forming a Ni-plated electrode layer on the Cu-plated electrode layer;
forming a Sn-plated electrode layer on the Ni-plated electrode layer,
A manufacturing method for a multilayer ceramic capacitor.

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