JP2022093854A5 - - Google Patents

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Publication number
JP2022093854A5
JP2022093854A5 JP2020206567A JP2020206567A JP2022093854A5 JP 2022093854 A5 JP2022093854 A5 JP 2022093854A5 JP 2020206567 A JP2020206567 A JP 2020206567A JP 2020206567 A JP2020206567 A JP 2020206567A JP 2022093854 A5 JP2022093854 A5 JP 2022093854A5
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JP
Japan
Prior art keywords
wiring
electrode pad
element substrate
liquid
electrode
Prior art date
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Application number
JP2020206567A
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English (en)
Japanese (ja)
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JP2022093854A (ja
JP7614817B2 (ja
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Priority to JP2020206567A priority Critical patent/JP7614817B2/ja
Priority claimed from JP2020206567A external-priority patent/JP7614817B2/ja
Priority to US17/537,795 priority patent/US11820141B2/en
Publication of JP2022093854A publication Critical patent/JP2022093854A/ja
Publication of JP2022093854A5 publication Critical patent/JP2022093854A5/ja
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Publication of JP7614817B2 publication Critical patent/JP7614817B2/ja
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JP2020206567A 2020-12-14 2020-12-14 素子基板、液体吐出ヘッド、液体吐出装置および製造方法 Active JP7614817B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2020206567A JP7614817B2 (ja) 2020-12-14 2020-12-14 素子基板、液体吐出ヘッド、液体吐出装置および製造方法
US17/537,795 US11820141B2 (en) 2020-12-14 2021-11-30 Element substrate, liquid ejection head, liquid ejection apparatus, and manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020206567A JP7614817B2 (ja) 2020-12-14 2020-12-14 素子基板、液体吐出ヘッド、液体吐出装置および製造方法

Publications (3)

Publication Number Publication Date
JP2022093854A JP2022093854A (ja) 2022-06-24
JP2022093854A5 true JP2022093854A5 (enExample) 2023-12-08
JP7614817B2 JP7614817B2 (ja) 2025-01-16

Family

ID=81943148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020206567A Active JP7614817B2 (ja) 2020-12-14 2020-12-14 素子基板、液体吐出ヘッド、液体吐出装置および製造方法

Country Status (2)

Country Link
US (1) US11820141B2 (enExample)
JP (1) JP7614817B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4484018A4 (en) * 2022-02-21 2025-11-19 Toshiba Kk COATING DEVICE AND COATING METHOD

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6431678B2 (en) * 1998-09-01 2002-08-13 Hewlett-Packard Company Ink leakage detecting apparatus
JP4886497B2 (ja) 2006-12-18 2012-02-29 キヤノン株式会社 インクジェット記録ヘッド及びインクジェット記録装置
JP5202373B2 (ja) * 2008-06-16 2013-06-05 キヤノン株式会社 インクジェット記録ヘッド用基板、インクジェット記録ヘッド用基板の製造方法、インクジェット記録ヘッドおよびインクジェット記録装置
JP2019136960A (ja) 2018-02-13 2019-08-22 キヤノン株式会社 液体吐出ヘッド用基板、その製造方法及び液体吐出ヘッド
JP7163134B2 (ja) 2018-10-18 2022-10-31 キヤノン株式会社 液体吐出ヘッド、液体吐出ヘッドの製造方法および液体吐出装置

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