JP2022082030A - ベーパーチャンバ - Google Patents
ベーパーチャンバ Download PDFInfo
- Publication number
- JP2022082030A JP2022082030A JP2020193330A JP2020193330A JP2022082030A JP 2022082030 A JP2022082030 A JP 2022082030A JP 2020193330 A JP2020193330 A JP 2020193330A JP 2020193330 A JP2020193330 A JP 2020193330A JP 2022082030 A JP2022082030 A JP 2022082030A
- Authority
- JP
- Japan
- Prior art keywords
- vapor chamber
- hydrogen storage
- cavity
- storage metal
- hydrogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 147
- 229910052751 metal Inorganic materials 0.000 claims abstract description 112
- 239000002184 metal Substances 0.000 claims abstract description 112
- 239000001257 hydrogen Substances 0.000 claims abstract description 111
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 111
- 238000003860 storage Methods 0.000 claims abstract description 98
- 239000007789 gas Substances 0.000 claims abstract description 51
- 239000012530 fluid Substances 0.000 claims abstract description 42
- 238000000576 coating method Methods 0.000 claims abstract description 35
- 239000011248 coating agent Substances 0.000 claims abstract description 34
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 16
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 9
- 229910052763 palladium Inorganic materials 0.000 claims description 9
- 229910001220 stainless steel Inorganic materials 0.000 claims description 9
- 239000010936 titanium Substances 0.000 claims description 9
- 229910052719 titanium Inorganic materials 0.000 claims description 9
- 239000002131 composite material Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 7
- 238000004544 sputter deposition Methods 0.000 claims description 7
- 239000010935 stainless steel Substances 0.000 claims description 7
- 238000007740 vapor deposition Methods 0.000 claims description 7
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 6
- 229910000640 Fe alloy Inorganic materials 0.000 claims description 6
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 3
- 229910052791 calcium Inorganic materials 0.000 claims description 3
- 239000011575 calcium Substances 0.000 claims description 3
- 229910052720 vanadium Inorganic materials 0.000 claims description 3
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 3
- 238000001816 cooling Methods 0.000 abstract description 15
- 238000009833 condensation Methods 0.000 abstract 1
- 230000005494 condensation Effects 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 description 20
- 239000010410 layer Substances 0.000 description 19
- 239000012071 phase Substances 0.000 description 17
- 230000008020 evaporation Effects 0.000 description 15
- 238000010521 absorption reaction Methods 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- 239000007791 liquid phase Substances 0.000 description 4
- 229910001026 inconel Inorganic materials 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229960004643 cupric oxide Drugs 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B3/00—Hydrogen; Gaseous mixtures containing hydrogen; Separation of hydrogen from mixtures containing it; Purification of hydrogen
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/32—Hydrogen storage
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Filling Or Discharging Of Gas Storage Vessels (AREA)
- Hydrogen, Water And Hydrids (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Physical Vapour Deposition (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Non-Reversible Transmitting Devices (AREA)
Abstract
Description
[1]内部に空洞部を有するコンテナと、前記空洞部に設けられたウィック構造体と、前記空洞部に封入された作動流体と、前記空洞部に形成された、気相の前記作動流体が流通する蒸気流路と、前記空洞部に配置された350℃以下で水素を吸収し且つ350℃以下で水素を放出しない水素吸蔵金属と、を有し、
前記水素吸蔵金属が、前記空洞部の内面及び/または前記ウィック構造体のうち、前記作動流体と接触する領域にコーティングされているベーパーチャンバ。
[2]前記コンテナが、一方の板状体と前記一方の板状体と対向する他方の板状体とにより形成された平面型コンテナである[1]に記載のベーパーチャンバ。
[3]前記水素吸蔵金属が、前記作動流体の凝縮する部位に配置されている[1]または[2]に記載のベーパーチャンバ。
[4]前記水素吸蔵金属のコーティングが、めっき層、スパッタリング層及び蒸着層からなる群から選択された少なくとも1種の層である[1]乃至[3]のいずれか1つに記載のベーパーチャンバ。
[5]前記水素吸蔵金属のコーティングの厚さに対する、前記水素吸蔵金属のコーティングの直上における前記蒸気流路の厚さが、0.50以上20以下である[1]乃至[4]のいずれか1つに記載のベーパーチャンバ。
[6]前記水素吸蔵金属のコーティングの平均厚さが、0.01mm以上0.10mm以下である[1]乃至[5]のいずれか1つに記載のベーパーチャンバ。
[7]前記水素吸蔵金属が、チタン系、パラジウム系、バナジウム系、カルシウム系またはこれらの複合系である[1]乃至[6]のいずれか1つに記載のベーパーチャンバ。
[8]前記水素吸蔵金属が、チタンとパラジウムの複合した複合系である[1]乃至[7]のいずれか1つに記載のベーパーチャンバ。
[9]前記コンテナの材質が、銅、銅合金、鉄、鉄合金、ステンレス鋼、アルミニウム、アルミニウム合金、ニッケルまたはニッケル合金である[1]乃至[8]のいずれか1つに記載のベーパーチャンバ。
[10]前記コンテナの材料が、ステンレス鋼である[1]乃至[9]のいずれか1つに記載のベーパーチャンバ。
[11]前記空洞部の水素ガス量が、作動温度50℃における前記空洞部内の全ガス量の10体積%以下である[1]乃至[10]のいずれか1つに記載のベーパーチャンバ。
[12][1]乃至[11]のいずれか1つに記載のベーパーチャンバを備えたヒートシンク。
10 コンテナ
11 空洞部
12 ウィック構造体
13 水素吸蔵金属
14 蒸気流路
15 内面
Claims (12)
- 内部に空洞部を有するコンテナと、前記空洞部に設けられたウィック構造体と、前記空洞部に封入された作動流体と、前記空洞部に形成された、気相の前記作動流体が流通する蒸気流路と、前記空洞部に配置された350℃以下で水素を吸収し且つ350℃以下で水素を放出しない水素吸蔵金属と、を有し、
前記水素吸蔵金属が、前記空洞部の内面及び/または前記ウィック構造体のうち、前記作動流体と接触する領域にコーティングされているベーパーチャンバ。 - 前記コンテナが、一方の板状体と前記一方の板状体と対向する他方の板状体とにより形成された平面型コンテナである請求項1に記載のベーパーチャンバ。
- 前記水素吸蔵金属が、前記作動流体の凝縮する部位に配置されている請求項1または2に記載のベーパーチャンバ。
- 前記水素吸蔵金属のコーティングが、めっき層、スパッタリング層及び蒸着層からなる群から選択された少なくとも1種の層である請求項1乃至3のいずれか1項に記載のベーパーチャンバ。
- 前記水素吸蔵金属のコーティングの厚さに対する、前記水素吸蔵金属のコーティングの直上における前記蒸気流路の厚さが、0.50以上20以下である請求項1乃至4のいずれか1項に記載のベーパーチャンバ。
- 前記水素吸蔵金属のコーティングの平均厚さが、0.01mm以上0.10mm以下である請求項1乃至5のいずれか1項に記載のベーパーチャンバ。
- 前記水素吸蔵金属が、チタン系、パラジウム系、バナジウム系、カルシウム系またはこれらの複合系である請求項1乃至6のいずれか1項に記載のベーパーチャンバ。
- 前記水素吸蔵金属が、チタンとパラジウムの複合した複合系である請求項1乃至7のいずれか1項に記載のベーパーチャンバ。
- 前記コンテナの材質が、銅、銅合金、鉄、鉄合金、ステンレス鋼、アルミニウム、アルミニウム合金、ニッケルまたはニッケル合金である請求項1乃至8のいずれか1項に記載のベーパーチャンバ。
- 前記コンテナの材料が、ステンレス鋼である請求項1乃至9のいずれか1項に記載のベーパーチャンバ。
- 前記空洞部の水素ガス量が、作動温度50℃における前記空洞部内の全ガス量の10体積%以下である請求項1乃至10のいずれか1項に記載のベーパーチャンバ。
- 請求項1乃至11のいずれか1項に記載のベーパーチャンバを備えたヒートシンク。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020193330A JP6928860B1 (ja) | 2020-11-20 | 2020-11-20 | ベーパーチャンバ |
CN202190000274.4U CN220187501U (zh) | 2020-11-20 | 2021-11-08 | 均热板以及散热器 |
PCT/JP2021/040970 WO2022107630A1 (ja) | 2020-11-20 | 2021-11-08 | ベーパーチャンバ |
TW110142372A TWI821783B (zh) | 2020-11-20 | 2021-11-15 | 熱導板及散熱器 |
US18/053,481 US11874068B2 (en) | 2020-11-20 | 2022-11-08 | Vapor chamber |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020193330A JP6928860B1 (ja) | 2020-11-20 | 2020-11-20 | ベーパーチャンバ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6928860B1 JP6928860B1 (ja) | 2021-09-01 |
JP2022082030A true JP2022082030A (ja) | 2022-06-01 |
Family
ID=77456432
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2020193330A Active JP6928860B1 (ja) | 2020-11-20 | 2020-11-20 | ベーパーチャンバ |
Country Status (5)
Country | Link |
---|---|
US (1) | US11874068B2 (ja) |
JP (1) | JP6928860B1 (ja) |
CN (1) | CN220187501U (ja) |
TW (1) | TWI821783B (ja) |
WO (1) | WO2022107630A1 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS618595A (ja) * | 1984-06-22 | 1986-01-16 | Showa Alum Corp | ヒ−トパイプ |
WO2017150356A1 (ja) * | 2016-02-29 | 2017-09-08 | 古河電気工業株式会社 | ヒートパイプ |
WO2019026786A1 (ja) * | 2017-08-04 | 2019-02-07 | 株式会社村田製作所 | ベーパーチャンバー |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4043387A (en) * | 1976-11-26 | 1977-08-23 | Hughes Aircraft Company | Water heat pipe with improved compatability |
US4586561A (en) * | 1984-02-27 | 1986-05-06 | Exxon Research And Engineering Co. | Low temperature heat pipe employing a hydrogen getter |
US4884628A (en) * | 1988-10-19 | 1989-12-05 | En Jian Chen | Heat pipe employing hydrogen oxidation means |
US5645626A (en) * | 1990-08-10 | 1997-07-08 | Bend Research, Inc. | Composite hydrogen separation element and module |
US5566751A (en) * | 1995-05-22 | 1996-10-22 | Thermacore, Inc. | Vented vapor source |
US6110808A (en) * | 1998-12-04 | 2000-08-29 | Trw Inc. | Hydrogen getter for integrated microelectronic assembly |
US6209625B1 (en) * | 1999-06-14 | 2001-04-03 | Zhen Guo | Heat pipe with hydrogen getter |
JP5231143B2 (ja) | 2008-09-04 | 2013-07-10 | 株式会社フジクラ | アルミニウム製ヒートパイプ |
TWI456135B (zh) * | 2011-08-12 | 2014-10-11 | Univ Nat Central | 儲氫加熱冷卻系統 |
JP3186291U (ja) * | 2013-07-18 | 2013-09-26 | 奇▲こう▼科技股▲ふん▼有限公司 | 均温板構造 |
JP7069678B2 (ja) * | 2017-12-12 | 2022-05-18 | 大日本印刷株式会社 | ベーパーチャンバー |
CN111322891A (zh) * | 2020-02-25 | 2020-06-23 | 张于光 | 一种均温板散热器 |
-
2020
- 2020-11-20 JP JP2020193330A patent/JP6928860B1/ja active Active
-
2021
- 2021-11-08 WO PCT/JP2021/040970 patent/WO2022107630A1/ja active Application Filing
- 2021-11-08 CN CN202190000274.4U patent/CN220187501U/zh active Active
- 2021-11-15 TW TW110142372A patent/TWI821783B/zh active
-
2022
- 2022-11-08 US US18/053,481 patent/US11874068B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS618595A (ja) * | 1984-06-22 | 1986-01-16 | Showa Alum Corp | ヒ−トパイプ |
WO2017150356A1 (ja) * | 2016-02-29 | 2017-09-08 | 古河電気工業株式会社 | ヒートパイプ |
WO2019026786A1 (ja) * | 2017-08-04 | 2019-02-07 | 株式会社村田製作所 | ベーパーチャンバー |
Also Published As
Publication number | Publication date |
---|---|
TWI821783B (zh) | 2023-11-11 |
TW202229797A (zh) | 2022-08-01 |
US11874068B2 (en) | 2024-01-16 |
JP6928860B1 (ja) | 2021-09-01 |
WO2022107630A1 (ja) | 2022-05-27 |
CN220187501U (zh) | 2023-12-15 |
US20230069333A1 (en) | 2023-03-02 |
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