JP2022073108A - Unnecessary resin removal device - Google Patents

Abstract

To provide an unnecessary resin removal device capable of accurately removing an unnecessary resin from a resin-sealed molded product.SOLUTION: An unnecessary resin removal device 100 includes a gate break part 1, and a loader part 2. The gate brake part 1 relatively rotates a base material on which a semiconductor element is mounted to an unnecessary resin that is connected to a resin-sealed molded product in a state in which the base material holds a base material of the resin-sealed molded product formed by resin sealing and molding, and contains a runner and a cull, and subjects peeling treatment of peeling an unnecessary resin from the resin-sealed molded product. The loader part 2 holds the resin-sealed molded product subjected to peeling treatment by the gate brake part 1, and takes it out of the gate brake part 1. The loader part 2 includes a holding mechanism 20, and a pressing mechanism 21. The holding mechanism 20 holds a base material of the resin-sealed molded product subjected to the peeling treatment. The pressing mechanism 21 presses the cull in the unnecessary resin in a state in which the base material is held by the holding mechanism 20.SELECTED DRAWING: Figure 1

Description

The disclosed embodiment relates to an unnecessary resin removing device.

Conventionally, in a resin-sealed molded product in which a semiconductor element is placed on a base material such as a lead frame and resin-sealed and molded, unnecessary resin including cal and runner is formed during resin-sealed molding. Such unnecessary resin is removed from the resin-sealed molded product by the unnecessary resin removing device.

For example, in Patent Document 1, an unnecessary resin removing device for peeling an unnecessary resin from a resin-sealed molded product by rotating a base material of a resin-sealed molded product to which an unnecessary resin is connected with respect to the unnecessary resin. Is disclosed.

Japanese Unexamined Patent Publication No. 3-290218

However, during resin encapsulation molding by a resin encapsulation device, thin burrs due to the resin may be formed on the base material, and the base material and the unnecessary resin may be connected via the thin burrs. In this case, even if the connecting portion between the base material and the unnecessary resin is peeled off by the unnecessary resin removing device described in Patent Document 1, the state in which the unnecessary resin is connected to the resin-sealed molded product via a thin burr is maintained. In some cases, unnecessary resin cannot be removed from the resin-sealed molded product.

One aspect of the embodiment is made in view of the above, and an object thereof is to provide an unnecessary resin removing device capable of accurately removing unnecessary resin from a resin-sealed molded product.

The unnecessary resin removing device according to one embodiment includes a gate break unit and a loader unit. The gate break portion includes runners and cals connected to the resin-sealed molded product while holding the base material of the resin-sealed molded product formed by resin-sealed molding of the base material on which the semiconductor element is placed. A peeling process is performed to peel off the unnecessary resin from the resin-sealed molded product by rotating the base material relative to the unnecessary resin contained. The loader section holds the resin-sealed molded product that has been peeled off by the gate break section and carries it out from the gate break section. The loader unit includes a holding mechanism and a pressing mechanism. The holding mechanism holds the base material of the resin-sealed molded product that has been peeled off. The pressing mechanism presses the cal of the unnecessary resin while the base material is held by the holding mechanism.

According to one aspect of the embodiment, unnecessary resin can be accurately removed from the resin-sealed molded product.

FIG. 1 is a diagram showing an example of the configuration of an unnecessary resin removing device according to an embodiment. FIG. 2 is a side view of a resin-sealed molded product to which unnecessary resins according to the embodiment are connected. FIG. 3 is a plan view of a resin-sealed molded product to which unnecessary resins according to the embodiment are connected. FIG. 4 is a plan view of a resin-sealed molded product in which unnecessary resins according to the embodiment are connected and thin burrs are formed on the base material. FIG. 5 is a diagram showing an example of the configuration of the gate break portion of the unnecessary resin removing device according to the embodiment. FIG. 6 is a diagram (No. 1) for explaining the peeling process at the gate break portion according to the embodiment. FIG. 7 is a diagram (No. 2) for explaining the peeling process at the gate break portion according to the embodiment. FIG. 8 is a diagram (No. 3) for explaining the peeling process at the gate break portion according to the embodiment. FIG. 9 is a diagram (No. 1) showing an example of the configuration of the loader portion of the unnecessary resin removing device according to the embodiment. FIG. 10 is a diagram (No. 2) showing an example of the configuration of the loader portion of the unnecessary resin removing device according to the embodiment. FIG. 11 is a diagram (No. 1) for explaining an example of the peeling process by the loader portion shown in FIG. FIG. 12 is a diagram (No. 2) for explaining an example of the peeling process by the loader portion shown in FIG. FIG. 13 is a diagram (No. 3) for explaining an example of the peeling process by the loader portion shown in FIG. FIG. 14 is a diagram (No. 4) for explaining an example of the peeling process by the loader portion shown in FIG. FIG. 15 is a diagram showing another example of the configuration of a part of the loader portion of the unnecessary resin removing device according to the embodiment. FIG. 16 is a diagram (No. 1) for explaining another example of the peeling process by the loader portion shown in FIG. FIG. 17 is a diagram (No. 2) for explaining another example of the peeling process by the loader portion shown in FIG. FIG. 18 is a diagram (No. 3) for explaining another example of the peeling process by the loader portion shown in FIG.

Hereinafter, embodiments of the unnecessary resin removing apparatus disclosed in the present application will be described in detail with reference to the accompanying drawings. The present invention is not limited to the embodiments shown below.

<1. Configuration of unnecessary resin removal device>
As shown in FIG. 1, the unnecessary resin removing device 100 according to the embodiment includes a gate break unit 1 and a loader unit 2. In the gate break portion 1, a resin-sealed molded product to which an unnecessary resin including a runner and a cal is connected is carried in, and the resin-sealed molded product is relatively relative to the unnecessary resin connected to the resin-sealed molded product. A peeling process is performed in which the base material is rotated to peel off unnecessary resin from the resin-sealed molded product.

The loader unit 2 holds the resin-sealed molded product that has been peeled off by the gate break unit 1 and carries it out from the gate break unit 1. Even when the unnecessary resin is not peeled off from the resin-sealed molded product by the gate break unit 1, the loader unit 2 is used when the resin-sealed molded product is carried out from the gate break unit 1 or the resin is removed from the gate break unit 1. While the sealed molded product is being carried out, unnecessary resin is removed from the resin sealed molded product.

The loader unit 2 includes a holding mechanism 20 and a pressing mechanism 21. The holding mechanism 20 holds the base material of the resin-sealed molded product that has been peeled off by the gate break portion 1. The pressing mechanism 21 presses the cal of the unnecessary resin connected to the resin-sealed molded product while the base material of the resin-sealed molded product is held by the holding mechanism 20.

As a result, the unnecessary resin removing device 100 is resin-sealed even when the base material and the unnecessary resin are maintained in a connected state via a thin burr after the peeling treatment of the gate break portion 1, for example. Unnecessary resin can be removed from the molded product with high accuracy. Hereinafter, an example of the configuration of the resin-sealed molded product before the unnecessary resin is removed by the unnecessary resin removing device 100 and an example of the configuration of the unnecessary resin removing device 100 will be specifically described.

<2. Configuration of resin-sealed molded product before unnecessary resin is removed>
The resin-sealed molded product before the unnecessary resin is removed by the unnecessary resin removing device 100 is formed by a resin sealing device (not shown). The resin sealing device includes a mold having a pot, a cal resin path, a runner resin path, a cavity, and the like, and a base material such as a lead frame in which a plurality of semiconductor elements are placed is supplied to the mold. .. Further, a sealing resin is supplied to the pot of the mold.

The resin sealing device closes the mold and melts the sealing resin after the sealing resin is supplied to the pot of the mold. The molten sealing resin flows from the pot of the mold into the cavity through the caracal resin path and the runner resin path, and seals a plurality of semiconductor elements placed on the base material.

As shown in FIGS. 2 and 3, the resin-sealed molded product 3 before the unnecessary resin is removed by the unnecessary resin removing device 100 includes two lead frames 30 and 31 as a base material and each lead frame 30. A plurality of semiconductor elements 32 mounted on 31 and an unnecessary resin 33 including a cal 34 and a runner 35 are included. The two lead frames 30 and 31 are connected at a distance by an unnecessary resin 33.

The cal 34 is formed by the cal resin path in the mold of the resin sealing device, and the runner 35 is formed by the runner resin path in the mold of the resin sealing device. The runner 35 is formed on the back surface (lower surface in FIG. 2) of the lead frames 30 and 31. The two lead frames 30 and 31 are examples of the base material.

The base material is not limited to the lead frames 30 and 31. Further, the arrangement and number of the cal 34 and the runner 35 are not limited to the example shown in FIG. Further, in the example shown in FIG. 3, a plurality of semiconductor elements 32 are mounted on the lead frames 30 and 31, but the number of semiconductor elements 32 mounted on the lead frames 30 and 31 may be one. good.

Even if the above-mentioned base material and the mold are finished within the tolerance according to the design drawing, a gap is generated between the base material and the cal resin path of the mold, and the gap causes a lead frame as shown in FIG. Thin burrs 36 made of resin may be formed on 30 and 31. The thin burr 36 is formed so as to straddle each of the lead frames 30 and 31 and the unnecessary resin 33.

<3. Configuration of gate break part 1>
Next, the configuration of the gate break unit 1 will be described. As shown in FIG. 5, the gate break portion 1 includes an upper break board 4 and a lower break board 5 facing the upper break board 4.

The upper break board 4 has two clamp members 41 and 42 that abut from above on the lead frames 30 and 31 of the resin-sealed molded product 3 described above in FIG. 5, and an unnecessary resin 33 connected to the resin-sealed molded product 3. Of these, a pressing member 43 that presses the cal 34, and a support member 44 that supports the two clamp members 41, 42 and the pressing member 43 are provided. Each of the clamp members 41 and 42 is rotatably supported by the support member 44 about a rotation axis (not shown).

The lower break board 5 has two clamp members 51 and 52 and two clamp members 51 and 52 that abut from below in FIG. 5 on the lead frames 30 and 31 of the resin-sealed molded product 3 centered on a rotation axis (not shown). It is provided with a support portion 53 that rotatably supports the vehicle.

The lower break board 5 has a drive mechanism (not shown) that pushes the ends of the clamp members 51 and 52 upward in FIG. 5, and the drive mechanism causes the clamp members 51 and 52 to rotate the rotation shaft described above. Rotated to the center. The clamp members 51 and 52 are examples of the holding portion.

Further, the gate break portion 1 has a moving mechanism (not shown) for moving the upper break board 4, and the upper break board 4 is moved in the vertical direction in FIG. 5 by such a moving mechanism. The gate break portion 1 may be configured such that the lower break board 5 is moved in the vertical direction in FIG. 5 by a moving mechanism.

Next, the peeling treatment of the unnecessary resin 33 from the resin-sealed molded product 3 by the gate break portion 1 will be described. As shown in FIG. 6, the resin-sealed molded product 3 before the unnecessary resin 33 is removed is placed on the two clamp members 51 and 52 in the lower break board 5.

The resin-sealed molded product 3 is placed on the clamp members 51 and 52 by an outlaw unit (not shown) that carries out the resin-sealed molded product 3 from a resin-sealed molded product (not shown). The device for carrying out the resin-sealed molded product 3 from the resin-sealing device may be the loader unit 2. In this case, the loader unit 2 carries out the resin-sealed molded product 3 from a resin sealing device (not shown), carries the carried-out resin-sealed molded product 3 into the gate break portion 1, and places it on the clamp members 51 and 52. The resin-sealed molded product 3 is placed.

After the resin-sealed molded product 3 before the unnecessary resin 33 is removed is placed on the clamp members 51 and 52 of the lower break board 5, the upper break board 4 is moved downward in FIG. 6 by a moving mechanism (not shown). Be moved.

As a result, in the gate break portion 1, as shown in FIG. 7, the resin-sealed molded product 3 is formed by the two clamp members 41, 42 of the upper break board 4 and the two clamp members 51, 52 of the lower break board 5. The lead frames 30 and 31 are clamped. Specifically, the lead frame 30 is clamped by the clamp member 41 and the clamp member 51, and the lead frame 31 is clamped by the clamp member 42 and the clamp member 52.

Further, in the state shown in FIG. 7, the cal 34 is sandwiched between the pressing member 43 of the upper break board 4 and the support portion 53 of the lower break board 5.

Next, the gate break portion 1 separates the unnecessary resin 33 from the resin-sealed molded product 3 by rotating the lead frames 30 and 31 relative to the unnecessary resin 33 connected to the resin-sealed molded product 3. Perform peeling treatment.

In such a peeling process, the cal 34 is sandwiched between the pressing member 43 of the upper break board 4 and the support portion 53 of the lower break board 5, and the drive mechanism (not shown) in the lower break board 5 is the clamp member 51. This is done by pushing the end of 52.

Specifically, the left end portion of the clamp member 51 in FIG. 7 and the right end portion of the clamp member 52 in FIG. 7 are pushed upward in FIG. 7 by a drive mechanism (not shown). As a result, as shown in FIG. 8, the clamp member 41 and the clamp member 51 rotate clockwise in FIG. 8 about a rotation axis (not shown), and the clamp member 42 and the clamp member 52 are not shown. It rotates counterclockwise in FIG. 8 around the axis of rotation.

In this way, the gate break portion 1 rotates the clamp member 41 and the clamp member 51 holding the lead frame 30 in a state where the cal 34 is sandwiched between the pressing member 43 and the support portion 53, and the lead frame 31 The clamp member 42 and the clamp member 52 that sandwich the clamp member 52 are rotated.

As a result, when the thin burrs 36 are not formed on the lead frames 30 and 31, the lead frames 30 and 31 rotate relative to the unnecessary resin 33 connected to the resin-sealed molded product 3. The unnecessary resin 33 is peeled off from the lead frames 30 and 31.

On the other hand, when thin burrs 36 are formed on the lead frames 30 and 31, even if the gate break portion 1 performs the peeling treatment, each of the lead frames 30 and 31 and the unnecessary resin 33 are connected via the thin burrs 36. In some cases, the unnecessary resin 33 may not be peeled off from the resin-sealed molded product 3 while the state of being maintained is maintained.

Even in such a case, in the unnecessary resin removing device 100, the unnecessary resin 33 can be peeled from the resin-sealed molded product 3 by the loader unit 2. Hereinafter, the loader unit 2 will be specifically described.

<4. Configuration of loader unit 2>
As shown in FIG. 9, the loader unit 2 includes a holding mechanism 20, a pressing mechanism 21, and a support unit 22. The holding mechanism 20 holds the lead frames 30 and 31 of the resin-sealed molded product 3 that has been peeled off by the gate break portion 1.

The pressing mechanism 21 presses the cal 34 of the unnecessary resins 33 while the lead frames 30 and 31 are held by the holding mechanism 20. In FIG. 9, the lead frame 31 is hidden behind the lead frame 30 and cannot be seen. The support portion 22 supports the holding mechanism 20 and the pressing mechanism 21.

In the example shown in FIG. 9, the lead frame 30 and the lead frame 31 are connected by an unnecessary resin 33 including six cals 34, and each of the six cals 34 is each of the six pressing portions 80 provided in the pressing mechanism 21. Of these, it is in a state of being pressed by the corresponding pressing portion 80. In the pressing mechanism 21, the pressing portion 80 is provided for each cal 34, but may be provided for each of a plurality of cals 34.

As shown in FIG. 10, the holding mechanism 20 includes a holding portion 60 for holding the lead frame 30 and a holding portion 70 for holding the lead frame 31. Note that FIG. 10 is a view of the loader unit 2 as viewed from a different angle from that of FIG.

The holding portion 60 includes arm portions 63, 64 having claw portions 61, 62 that abut on the back surface of the lead frame 30, and a driving portion 65 that moves one of the arm portions 63, 64 in the left-right direction in FIG. The holding portion 70 includes arm portions 73, 74 having claw portions 71, 72 that abut on the back surface of the lead frame 31, and a driving portion 75 that moves one of the arm portions 73, 74 in the left-right direction in FIG.

The pressing portion 80 of the pressing mechanism 21 movably supports the abutting member 81 that abuts on the cal 34, the elastic member 82 that presses the abutting member 81 against the cal 34, and the abutting member 81 in the vertical direction in FIG. A support portion 83 is provided. The contact member 81 is a pin-shaped member, and includes a head portion 811 and a body portion 812 whose base end is continuous with the head portion 811.

The head 811 is formed in a disk shape, and the body portion 812 is formed in a columnar shape. The diameter of the head 811 is larger than the diameter of the body 812. The body portion 812 is inserted through a through hole 831 formed in the support portion 83, and is movable in the vertical direction in FIG. An engaging portion 813 is provided at the tip opposite to the base end on which the head 811 of the body portion 812 is formed, and the engaging portion 813 provided on the body portion 812 is provided on the support surface 832 of the support portion 83. By engaging, the body portion 812 is prevented from falling off from the through hole 831.

The elastic member 82 is, for example, a cylindrical coil spring, and a body portion 812 is inserted into the cylindrical coil. One end of the elastic member 82 is in contact with the head 811, and the other end of the elastic member 82 is in contact with the contact surface 833 of the support portion 83. In the state shown in FIG. 10, the elastic member 82 is compressed in the vertical direction in FIG. 10, and the abutting member 81 is urged downward in FIG. The elastic member 82 is not limited to the cylindrical coil spring, and may be a spring other than the cylindrical coil spring, or may be an elastic member made of rubber or resin.

Next, the peeling treatment of the unnecessary resin 33 from the resin-sealed molded product 3 by the loader unit 2 when the unnecessary resin 33 is not peeled from the resin-sealed molded product 3 in the peeling treatment of the gate break portion 1 will be described. As shown in FIG. 11, in the gate break portion 1, the peeling process is completed and the upper break board 4 is moved upward in FIG. 11 with respect to the lower break board 5, and the upper break board 4 is shown in FIG. It is in an invisible position.

The resin-sealed molded product 3 is placed on the clamp members 51 and 52 of the lower break board 5, and the loader unit 2 moves upward in FIG. 11 of the lower break board 5. After that, the loader unit 2 moves downward in FIG. 11, and the loader unit 2 and the lower break board 5 are in the state shown in FIG. The unnecessary resin removing device 100 may have a configuration in which the lower break board 5 moves in the vertical direction in FIG. 11 instead of the loader unit 2.

Before the loader portion 2 and the lower break board 5 are in the state shown in FIG. 12, the cal 34 of the unnecessary resin 33 abuts on the abutting member 81 of the pressing portion 80, and the loader portion 2 further downwards in FIG. Along with the movement, the contact member 81 of the pressing portion 80 moves upward in FIG. 11 due to the reaction force from the cal 34 against the contact member 81, the elastic member 82 of the pressing portion 80 contracts, and the engaging portion 813 Move away from the support surface 832.

In the state shown in FIG. 12, the lead frame 30 is held by the holding portion 60, the lead frame 31 is held by the holding portion 70, and the cal 34 of the unnecessary resin 33 is pressed by the contact member 81 of the pressing portion 80. It is in the state of being done.

As described above, in the unnecessary resin removing device 100, the contact member 81 comes into contact with the cal 34 as the holding mechanism 20 moves when the holding mechanism 20 moves to the position where the holding mechanism 20 starts holding the lead frames 30 and 31. The elastic member 82 is contracted.

After that, in the unnecessary resin removing device 100, the loader unit 2 moves upward in FIG. 12 from the state shown in FIG. 12, and becomes the state shown in FIG. In the process of moving the loader unit 2 from the state shown in FIG. 12 to the state shown in FIG. 13, the loader unit 2 moves upward as shown in FIG. 12 while the lead frames 30 and 31 are held by the holding units 60 and 70. However, due to the repulsive force against the contraction of the elastic member 82 of the pressing portion 80, the contact member 81 of the pressing portion 80 moves downward in FIG. 12 until the engaging portion 813 abuts on the support surface 832, which is unnecessary. The state in which the cal 34 of the resin 33 is pressed by the pressing portion 80 is maintained.

Therefore, in the unnecessary resin removing device 100, the unnecessary resin 33 is surely peeled from the resin-sealed molded product 3 in the process of moving the loader unit 2 from the state shown in FIG. 12 to the state shown in FIG. As described above, the unnecessary resin removing device 100 has a loader unit as shown in FIGS. 13 and 14 even when the unnecessary resin 33 is not peeled from the resin-sealed molded product 3 by the peeling process of the gate break portion 1. According to 2, the unnecessary resin 33 can be accurately removed from the resin-sealed molded product 3.

Further, in the unnecessary resin removing device 100, the lead frames 30 and 31 of the resin-sealed molded product 3 are held by the holding mechanism 20 in a state where the resin-sealed molded product 3 is placed on the clamp members 51 and 52 of the gate break portion 1. It is held and moved in a state where the cal 34 is pressed by the pressing mechanism 21. Therefore, the position of the unnecessary resin 33 when the unnecessary resin 33 is peeled from the resin-sealed molded product 3 by the gate break portion 1 and the position of the unnecessary resin 33 when the unnecessary resin 33 is peeled from the resin-sealed molded product 3 by the loader portion 2. The position of the unnecessary resin 33 can be the same as that of the unnecessary resin 33.

As a result, in the unnecessary resin removing device 100, even if the unnecessary resin 33 is not peeled from the resin-sealed molded product 3 by the peeling treatment of the gate break portion 1, the resin-sealed molded product is peeled by the peeling treatment of the gate break portion 1. The unnecessary resin 33 can be discharged to the outside from the gate break portion 1 by the same treatment as when the unnecessary resin 33 is peeled from 3.

The configuration and operation of the loader unit 2 are not limited to the above-mentioned example. For example, the unnecessary resin removing device 100 may be configured to include the loader unit 2A shown in FIG. 15 instead of the loader unit 2 shown in FIGS. 10 to 14. The loader unit 2A is provided with a pressing mechanism 21A including a plurality of pressing portions 80A including the abutting member 84 and the actuator 85, instead of the pressing mechanism 21 including the abutting member 81 and the elastic member 82. Different from 2.

The actuator 85 of the pressing portion 80A presses the contact member 84 against the cal 34 in a state where the contact member 84 is in contact with the cal 34. The contact member 84 is formed at the tip of the piston of the actuator 85. Although the actuator 85 is an air cylinder, it may be an electromagnetic solenoid or a hydraulic cylinder.

Similar to the loader unit 2, the loader unit 2A is in a state where the cal 34 of the resin-sealed molded product 3 placed on the clamp members 51 and 52 of the lower break board 5 is pressed by the abutting member 84 by the actuator 85. By moving with, the unnecessary resin 33 can be removed from the resin-sealed molded product 3.

Further, the loader unit 2A attaches the cal 34 to the contact member 84 by the actuator 85 while the resin-sealed molded product 3 is being carried out from the gate break part 1 or after the resin-sealed molded product 3 is carried out from the gate break part 1. By pressing, the unnecessary resin 33 can also be removed from the resin-sealed molded product 3.

For example, as shown in FIG. 16, the loader unit 2A carries out the resin-sealed molded product 3 in a state where the unnecessary resin 33 is connected from the lower break board 5 of the gate break unit 1, and then, as shown in FIG. , The actuator 85 is driven to bring the contact member 84 into contact with the cal 34 of the unnecessary resin 33. Then, the loader unit 2A further drives the actuator 85 and presses the cal 34 of the unnecessary resin 33 downward in FIG. 17 by the contact member 84. As a result, as shown in FIG. 18, the unnecessary resin 33 is peeled off from the resin-sealed molded product 3.

As described above, the unnecessary resin removing device 100 according to the embodiment includes a gate break unit 1 and a loader unit 2 and 2A. The gate break portion 1 is resin-sealed molded in a state where the lead frames 30 and 31 on which the semiconductor element 32 is placed are held by the lead frames 30 and 31 of the resin-sealed molded product 3 formed by resin-sealed molding. The lead frames 30 and 31 are relatively rotated with respect to the unnecessary resin 33 including the runner 35 and the cal 34 connected to the product 3, and the unnecessary resin 33 is peeled off from the resin-sealed molded product 3. The lead frames 30 and 31 are examples of the base material. The loader units 2 and 2A hold the resin-sealed molded product 3 that has been peeled off by the gate break unit 1 and carry it out from the gate break unit 1. The loader units 2 and 2A include a holding mechanism 20 and pressing mechanisms 21 and 21A. The holding mechanism 20 holds the lead frames 30 and 31 of the resin-sealed molded product 3 that has been peeled off. The pressing mechanisms 21 and 21A press the cal 34 of the unnecessary resins 33 while the lead frames 30 and 31 are held by the holding mechanism 20. As a result, the unnecessary resin removing device 100 can accurately remove the unnecessary resin 33 from the resin-sealed molded product 3 even when the unnecessary resin 33 is not peeled from the resin-sealed molded product 3 by the peeling process of the gate break portion 1. Can be removed.

Further, the loader portions 2 and 2A hold the lead frames 30 and 31 of the resin-sealed molded product 3 by the holding mechanism 20 in a state where the resin-sealed molded product 3 is placed on the clamp members 51 and 52 of the gate break portion 1. It is held and moved in a state where the cal 34 is pressed by the pressing mechanisms 21 and 21A. As a result, in the unnecessary resin removing device 100, even if the unnecessary resin 33 is not peeled from the resin-sealed molded product 3 by the peeling process of the gate break portion 1, the unnecessary resin 33 is accurately removed from the resin-sealed molded product 3. Can be removed.

Further, the pressing mechanism 21 includes a contact member 81 that abuts on the cal 34 and an elastic member 82 that presses the contact member 81 against the cal 34. As a result, in the unnecessary resin removing device 100, the pressing mechanism 21 for pressing the cal 34 can be formed with a simple configuration.

Further, when the holding mechanism 20 moves to the position where the holding mechanism 20 starts holding the lead frames 30, the contact member 81 comes into contact with the cal 34 as the holding mechanism 20 moves, and the elastic member 82 contracts. The elastic member 82 presses the cal 34 against the contact member 81 by the repulsive force against the contraction of the elastic member 82. As a result, in the unnecessary resin removing device 100, the pressing mechanism 21 for pressing the cal 34 can be formed with a simpler configuration.

Further, the pressing mechanism 21A includes a contact member 84 that abuts on the cal 34, and an actuator 85 that presses the contact member 84 against the cal 34 while the contact member 84 is in contact with the cal 34. As a result, in the unnecessary resin removing device 100, the cal 34 can be pressed by the pressing mechanism 21A regardless of the position of the loader portion 2A.

Further, the actuator 85 is an air cylinder. Thereby, in the unnecessary resin removing device 100, for example, when the loader unit 2A is moved by air drive, the pressing mechanism 21A can be easily provided on the loader unit 2A.

Further effects and variations can be easily derived by those skilled in the art. For this reason, the broader aspects of the invention are not limited to the particular details and representative embodiments described and described above. Accordingly, various modifications can be made without departing from the spirit or scope of the general concept of the invention as defined by the appended claims and their equivalents.

1 Gate break part 2, 2A Loader part 3 Resin-sealed molded product 4 Upper break board 5 Lower break board 20 Holding mechanism 21,21A Pressing mechanism 30, 31 Lead frame (example of base material)
32 Semiconductor element 33 Unnecessary resin 34 Cal 35 Runner 36 Vari 51, 52 Clamp member (example of holding part)
80,80A Pressing part 81,84 Contact member 82 Elastic member 85 Actuator 100 Unnecessary resin removal device

Claims (6)

An unnecessary resin including a runner and a cal that is connected to the resin-sealed molded product while holding the base material of the resin-sealed molded product formed by resin-sealing molding the base material on which the semiconductor element is placed. A gate break portion that performs a peeling process for peeling the unnecessary resin from the resin-sealed molded product by rotating the base material relatively with respect to the resin-sealed molded product.
A loader unit that holds the resin-sealed molded product that has been peeled off by the gate break unit and carries it out from the gate break unit is provided.
The loader unit
A holding mechanism for holding the base material of the resin-sealed molded product subjected to the peeling treatment, and
An unnecessary resin removing device comprising: a pressing mechanism for pressing the cal of the unnecessary resin while the base material is held by the holding mechanism. The loader unit
In a state where the resin-sealed molded product is placed on the holding portion of the gate break portion, the base material of the resin-sealed molded product is held by the holding mechanism, and the cal is pressed by the pressing mechanism. The unnecessary resin removing device according to claim 1, wherein the device is movable. The pressing mechanism is
The contact member that comes into contact with the cal
The unnecessary resin removing device according to claim 1 or 2, further comprising an elastic member that presses the contact member against the cal. The contact member is
When the holding mechanism moves to a position where the holding of the base material is started, the elastic member abuts on the cal as the holding mechanism moves, and the elastic member is contracted.
The elastic member is
The unnecessary resin removing device according to claim 3, wherein the contact member is pressed against the cal by a repulsive force against the contraction of the elastic member. The pressing mechanism is
The contact member that comes into contact with the cal
The unnecessary resin removing device according to claim 1 or 2, further comprising an actuator that presses the contact member against the cal while the contact member is in contact with the cal. The pressing mechanism is
The unnecessary resin removing device according to claim 5, which is an air cylinder.

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