JP2022071310A - module - Google Patents

Abstract

To provide a smaller module including an inductor for impedance matching, in which the insertion loss of a wire itself is reduced.SOLUTION: A module includes a wiring board including a plurality of external connection terminals, an acoustic wave element substrate mounted on the wiring board and including an acoustic wave element, and a passive element mounted on the acoustic wave element substrate. The acoustic wave element substrate includes a first wiring pattern formed on a main surface facing the wiring board, a second wiring pattern formed on a surface in a thickness direction of the acoustic wave element substrate, and a third wiring pattern formed on the main surface of the acoustic wave element substrate where the passive element is mounted. The passive element is electrically connected to the acoustic wave element through the first wiring pattern, the second wiring pattern, and the third wiring pattern.SELECTED DRAWING: Figure 2

Description

The present invention relates to modules, including front-end modules.

Smartphones represented by mobile communication terminals are required to support communication in a plurality of high frequency bands. For this reason, a front-end module equipped with a plurality of bandpass filters that pass communication in a high frequency band is used.

Further, in the front-end module, an inductor for impedance matching the bandpass filter and the low noise amplifier is used between the bandpass filter and the low noise amplifier.

Further, in recent years, there has been a strong demand for miniaturization of front-end modules due to the demand for thinner and more integrated smartphones, and the inductor for impedance matching is becoming IPD (Integrated Passive Device).

Patent Document 1 discloses an example of a technique relating to impedance matching of a front-end module.

Japanese Unexamined Patent Publication No. 2019-192992

The main problem to be solved by the present invention will be described.

In recent years, inductors for impedance matching have become almost indispensable for integrated circuits such as bandpass filters and low noise amplifiers mounted on front-end modules.

However, due to the demand for higher integration and miniaturization of mobile communication terminals, there is also a high demand for further miniaturization of front-end modules.

Further, in order to reduce the insertion loss of the wiring itself, wiring at a shorter distance is desired for the wiring pattern for impedance matching.

FIG. 1 is a diagram showing an example of a conventional module. As shown in FIG. 1, a module equipped with an IPD for impedance matching for each of the two bandpass filters BPF and the two bandpass filters BPF requires a large area. In addition, wiring from the bandpass filter BPF to the IPD is also required.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a module or a front-end module having an impedance matching inductor that is smaller and has a reduced insertion loss of the wiring itself.

In order to achieve the above problems, in the present invention,
A wiring board with multiple external connection terminals and
An elastic wave element substrate mounted on the wiring board and having an elastic wave element,
Passive components mounted on the elastic wave element substrate and
Is a module with
The elastic wave element substrate is
The first wiring pattern formed on the main surface facing the wiring board,
It has a second wiring pattern formed on a surface in the thickness direction of the elastic wave element substrate and a third wiring pattern formed on the main surface on which the passive component of the elastic wave element substrate is mounted.
The passive component is a module characterized in that it is electrically connected to the elastic wave element via the first wiring pattern, the second wiring pattern, and the third wiring pattern.

It is one aspect of the present invention that the passive component is a chip inductor.

It is one aspect of the present invention that the passive component is an IPD (Integrated Passive Device).

One embodiment of the present invention is that the elastic wave element substrate includes a piezoelectric substrate and a support substrate, and the support substrate is a substrate made of sapphire, alumina, spinel, or high-resistance silicon.

It is one aspect of the present invention that the elastic wave element is an elastic surface wave resonator.

It is one aspect of the present invention that the elastic wave element is an elastic thin film resonator.

The elastic wave element includes a first bandpass filter and a second bandpass filter.
The elastic wave element substrate includes at least four of the first wiring pattern, the second wiring pattern, and the third wiring pattern, respectively.
The passive component is
The first bandpass filter is electrically connected to the first bandpass filter via the first wiring pattern, the second wiring pattern, and the third wiring pattern, and the second wiring pattern, the second wiring pattern. A first inductor electrically connected to an external connection terminal via a wiring pattern and the third wiring pattern, and
The second band pass filter is electrically connected to the third band path filter via the first wiring pattern, the second wiring pattern, and the third wiring pattern, and the fourth wiring pattern, the second wiring pattern. It is possible to include a second inductor in which the first inductor is electrically connected to an external connection terminal different from the external connection terminal to which the first inductor is electrically connected via the wiring pattern and the third wiring pattern. It is a form of the present invention.

It is one embodiment of the present invention to include integrated circuit components including a switching circuit and a low noise amplifier.

It is possible that at least a part of the region where the wiring board and the elastic wave element substrate are joined and at least a part of the region where the elastic wave element substrate and the passive component are joined overlap each other on a plan perspective view. It is a form of the present invention.

According to the present invention, it is possible to provide a front-end module that is impedance-matched with an optimum inductance value at low cost.

FIG. 1 is a diagram showing an example of a conventional module. FIG. 2 is a cross-sectional view of the module 1 according to the present embodiment. FIG. 3 is a diagram showing a configuration example of the elastic wave element substrate 5. FIG. 4 is a plan view showing an example in which the elastic wave element 52 is an elastic surface wave resonator. FIG. 5 is a cross-sectional view showing an example in which the elastic wave element 52 is a piezoelectric thin film resonator. FIG. 6 is a diagram for explaining an example of a method for manufacturing the elastic wave element substrate 5 according to the present embodiment. FIG. 7 is a diagram for explaining an example of the manufacturing method of the module 1 according to the present embodiment. FIG. 8 is a cross-sectional view of the module 100 according to the second embodiment of the present invention. FIG. 9 is a plan view of the module 100 according to the second embodiment of the present invention. FIG. 10 is a diagram showing an outline of the circuit configuration of the front-end module 200. FIG. 11 is a cross-sectional view of the front end module 200 according to the third embodiment.

Hereinafter, the present invention will be clarified by explaining specific embodiments of the present invention with reference to the drawings.

(Example 1)
FIG. 2 is a cross-sectional view of the module 1 according to the present embodiment.

As shown in FIG. 2, the module 1 according to this embodiment includes a wiring board 3 and an elastic wave element board 5 mounted on the wiring board 3. Further, the passive component 7 mounted on the elastic wave element substrate 5 is provided.

As the wiring board 3, for example, a multilayer substrate made of resin, a low temperature co-fired ceramics (LTCC) multilayer substrate made of a plurality of dielectric layers, or the like is used. Further, the wiring board 3 includes a plurality of external connection terminals 31.

As the elastic wave element substrate 5, for example, a substrate made of a piezoelectric single crystal such as lithium tantalate, lithium niobate or quartz, or a piezoelectric ceramic can be used. Further, as the elastic wave element substrate 5, a substrate in which a piezoelectric substrate and a support substrate are bonded may be used. As the support substrate, for example, a sapphire substrate, an alumina substrate, a spinel substrate, or a high resistance silicon substrate can be used. Further, the high resistance silicon means silicon having a volume resistivity of 1000 Ω · cm or more.

The elastic wave element substrate 5 is mounted on the wiring substrate 3 by flip-chip bonding via the bump 15.

As the bump 15, for example, a gold bump can be used. The height of the bump 15 is, for example, 20 μm to 50 μm.

For the passive component 7, for example, a chip inductor or an IPD can be used. Further, the inductor may be formed by a metal pattern such as a meander pattern. The passive component 7 is electrically connected to an elastic wave element (not shown here) via a second wiring pattern 11 formed on a surface of the elastic wave element substrate 5 in the thickness direction. Further, it is electrically connected to the external connection terminal 31 of the wiring board 3 via another second wiring pattern 11. The passive component 7 can be mounted on the elastic wave element substrate 5, for example, by using a solder bump.

As shown in FIG. 2, there is a region A where the region of the bump 15 which is the region where the wiring board 3 and the elastic wave element substrate 5 are joined and the region where the elastic wave element substrate 5 and the passive component 7 are joined overlap each other. By providing the region A, it is possible to suppress the destruction of the elastic wave element substrate 5 when the passive component 7 is mounted on the elastic wave element substrate 5.

A sealing portion 17 is formed so as to cover the elastic wave element substrate 5 and the passive component 7. The sealing portion 17 may be formed of, for example, an insulator such as a synthetic resin, or a metal may be used. As the synthetic resin, for example, epoxy resin, polyimide and the like can be used, but the synthetic resin is not limited thereto. Preferably, an epoxy resin is used and a low temperature curing process is used to form the sealing portion 17.

FIG. 3 is a diagram for explaining the configuration of the elastic wave element substrate 5.

FIG. 3A shows an example of the main surface of the elastic wave element substrate 5 facing the wiring board 3. Further, FIG. 3B shows an example of a surface of the elastic wave element substrate 5 in the thickness direction. Further, FIG. 3C shows an example of the main surface on which the passive component 7 of the elastic wave element substrate 5 is mounted. The lower side of the substantially quadrangle showing one main surface of the elastic wave element substrate 5 in FIG. 3A coincides with the upper side of the substantially quadrangle showing the surface of the elastic wave element substrate 5 in the thickness direction in FIG. 3B. Further, the lower side of the substantially quadrangle showing the surface of the elastic wave element substrate 5 in the thickness direction in FIG. 3B coincides with the upper side of the substantially quadrangle showing one main surface of the elastic wave element substrate 5 in FIG. 3C. .. Further, the passive component 7 shown in FIG. 3C is shown by a top perspective view.

As shown in FIG. 3A, the first wiring pattern 9, the elastic wave element 52, and the wiring pattern 54 are formed on the elastic wave element substrate 5.

An insulator 56 is formed on the wiring pattern 54. As the insulator 56, for example, polyimide can be used. The insulator 56 is formed, for example, with a film thickness of 1000 nm.

A wiring pattern 54 is also formed on the insulator 56, and the wiring is formed so as to intersect three-dimensionally via the insulator 56.

The first wiring pattern 9, the elastic wave element 52, and the wiring pattern 54 are made of an appropriate metal or alloy such as silver, aluminum, copper, titanium, and palladium. Further, these metal patterns may be formed by a laminated metal film formed by laminating a plurality of metal layers. The thickness of the first wiring pattern 9, the elastic wave element 52, and the wiring pattern 54 can be, for example, 150 nm to 400 nm.

The wiring pattern 54 includes wiring constituting the input pad In, the output pad Out, and the ground pad GND. Further, the first wiring pattern 9 and the wiring pattern 54 are electrically connected to the elastic wave element 52.

As shown in FIG. 3A, for example, a bandpass filter can be configured by forming a plurality of elastic wave elements 52. The bandpass filter is designed to pass only the electric signal of a desired frequency band among the electric signals input from the input pad In.

The electric signal input from the input pad In passes through the bandpass filter, and the electric signal in a desired frequency band is output to the first wiring pattern 9.

The electric signal output to the first wiring pattern 9 is input to the passive component 7 via the second wiring pattern 11 shown in FIG. 3B and the third wiring pattern 13 shown in FIG. 3C. The electrical signal impedance-matched by the passive component 7 is output from the external connection terminal 31 of the wiring board 3 via another first to third wiring pattern, output pad Out.

FIG. 4 is a plan view showing an example in which the elastic wave element 52 is an elastic surface wave resonator.

As shown in FIG. 4, an IDT (Interdigital Transducer) 52a and a reflector 52b that excite elastic surface waves are formed on the surface acoustic wave element substrate 5. The IDT 52a has a pair of comb-shaped electrodes 52c facing each other. The comb-shaped electrode 52c has a bus bar 52e that connects a plurality of electrode fingers 52d and a plurality of electrode fingers 52d. Reflectors 52b are provided on both sides of the IDT 52a.

The IDT 52a and the reflector 52b are made of, for example, an alloy of aluminum and copper. The IDT 52a and the reflector 52b are thin films having a thickness of, for example, 150 nm to 400 nm. The IDT 52a and the reflector 52b may contain other metals, such as any suitable metal such as titanium, palladium, silver or alloys thereof, or may be formed of these alloys. Further, the IDT 52a and the reflector 52b may be formed of a laminated metal film formed by laminating a plurality of metal layers.

FIG. 5 is a cross-sectional view showing an example in which the elastic wave element 52 is a piezoelectric thin film resonator.

As shown in FIG. 5, the piezoelectric film 62 is provided on the chip substrate 60. The lower electrode 64 and the upper electrode 66 are provided so as to sandwich the piezoelectric film 62. A gap 68 is formed between the lower electrode 64 and the chip substrate 60. The lower electrode 64 and the upper electrode 66 excite elastic waves in the thickness longitudinal vibration mode in the piezoelectric film 62.

As the chip substrate 60, for example, a semiconductor substrate such as silicon or an insulating substrate such as sapphire, alumina, spinel or glass can be used. For the piezoelectric film 62, for example, aluminum nitride can be used. For the lower electrode 64 and the upper electrode 66, for example, a metal such as ruthenium can be used.

The elastic wave element 52 can be appropriately adopted in a multiple mode type filter or a ladder type filter so that the characteristics as a desired bandpass filter can be obtained.

Next, the manufacturing method of the module 1 according to this embodiment will be described.

FIG. 6 is a diagram for explaining an example of a method for manufacturing the elastic wave element substrate 5 according to the present embodiment.

In the method of manufacturing the module 1 of this embodiment, first, as shown in FIG. 6A, a substrate 70 before the elastic wave element substrate 5 is separated into individual pieces is prepared. Drilling is performed with a laser or the like so as to penetrate the substrate 70. The drilling process is performed in the region 72 where the second wiring pattern 11 is formed. The surface of the through hole formed in the region 72 is plated to form the second wiring pattern 11.

Next, as shown in FIG. 6B, the first wiring pattern 9, the elastic wave element 52, and the wiring pattern 54 are formed by a sputtering method or the like.

Next, as shown in FIG. 6C, a third wiring pattern 13 is formed on the main surface side on which the passive component 7 is mounted by a sputtering method or the like. Although not shown, when the passive component 7 is formed by the metal pattern, the passive component 7 can be formed at the same time as the formation of the third wiring pattern 13. The elastic wave element substrate 5 is obtained by dicing the substrate 70 into pieces.

FIG. 7 is a diagram for explaining an example of the manufacturing method of the module 1 according to the present embodiment.

As shown in FIG. 7A, the elastic wave element substrate 5 is mounted on the wiring board array 80, which is the wiring board 3, by flip-chip bonding. For bonding the elastic wave element substrate 5 to the wiring board 3, for example, a gold bump can be used.

Next, as shown in FIG. 7B, the passive component 7 is mounted on the elastic wave element substrate 5. The passive component 7 can be mounted on the elastic wave element substrate 5 by, for example, a solder reflow process using a solder bump.

Next, as shown in FIG. 7C, the sheet-shaped resin is pressed while being appropriately heated, and further cured by heat treatment to form the resin sealing portion 82. Module 1 is obtained by dicing and disassembling the wiring board array 80.

According to one embodiment of the present invention described above, a module having an impedance matching inductor that is smaller and has a reduced insertion loss of the wiring itself is provided.

(Example 2)
Next, Example 2 which is another embodiment of the present invention will be described.

FIG. 8 is a cross-sectional view of the module 100 according to the second embodiment of the present invention.
As shown in FIG. 8, the elastic wave element substrate 150 is mounted on the main surface of the wiring substrate 130. The wiring board 130 has a plurality of external connection terminals 131.

Although not shown, a wiring pattern, at least four first wiring patterns, a first bandpass filter BPF1 and a second bandpass filter BPF2 are placed on the main surface of the elastic wave element substrate 150 facing the wiring board 130, although not shown. It is formed. Further, a first inductor 170 and a second inductor 171 which are passive components are mounted on another main surface of the elastic wave element substrate 150.

At least four second wiring patterns 111 are formed on the surface of the elastic wave element substrate 150 in the thickness direction. Further, although not shown, at least four third wiring patterns are formed on the main surface on which the passive component of the elastic wave element substrate 150 is mounted.

The first wiring pattern, the second wiring pattern, and the third wiring pattern are electrically connected to the first bandpass filter BPF1 and the input or output terminal of the first inductor 170.

The second wiring pattern, the second wiring pattern, and the third wiring pattern are attached to the external connection terminal 131 for the input or output of the first bandpass filter BPF1 and the input or output terminal of the first inductor 170. , Electrically connected.

The third wiring pattern, the second wiring pattern, and the third wiring pattern are electrically connected to the second bandpass filter BPF2 and the input or output terminal of the second inductor 171.

The fourth wiring pattern, the second wiring pattern, and the third wiring pattern are attached to the external connection terminal 131 for the input or output of the second bandpass filter BPF2 and the input or output terminal of the second inductor 171. , Electrically connected.

FIG. 9 is a plan view of the module 100 according to the second embodiment of the present invention.

As shown in FIG. 9, the elastic wave element substrate 150 is mounted on the main surface of the wiring substrate 130. A first bandpass filter BPF1 and a second bandpass filter BPF2 are formed on the main surface of the elastic wave element substrate 150 facing the wiring board 130. The first inductor 170 and the second inductor 171 are mounted on the elastic wave element substrate 150.

Here, as compared with FIG. 1 shown as a conventional example, it can be seen that the area of the module according to this embodiment is reduced to about half. Further, the wiring length between the bandpass filter and the passive component has conventionally been, for example, about 220 μm to 270 μm. In the module according to this embodiment, it can be set to, for example, about 50 μm to 200 μm. That is, it can be shortened from one half to about one quarter. Therefore, it is possible to provide a module in which the insertion loss of the wiring itself is reduced.

As the module according to the second embodiment, an example of a module having two bandpass filters is shown. These two bandpass filters may be used as a duplexer, or both may be used as a transmission filter or a reception filter. Further, the module according to the present invention is not limited to the two bandpass filters, and may be a module including a quattroplexer or a dual duplexer including four bandpass filters.

(Example 3)
Next, Example 3 which is another embodiment of the present invention will be described.

FIG. 10 is a diagram showing an outline of the circuit configuration of the front-end module 200.

As shown in FIG. 10, the common input terminal 201 (external connection terminal 231) of the front-end module 200 is connected to the antenna terminal ANT. Although not shown, the first output terminal 203 and the second output terminal 205 (external connection terminal 231) are connected to a signal processing circuit.

From the common input terminal 201, the signal passing through the first bandpass filter BPF 21 and the signal passing through the second bandpass filter BPF 22 are separated by the switching circuit SW.

The signal that has passed through the first bandpass filter BPF 21 is impedance-matched by the first inductor 270, amplified by the first low noise amplifier LNA1, and output from the first output terminal 203. Alternatively, when the first bandpass filter BPF21 is a transmission filter, the first output terminal 203 functions as an input terminal, is amplified by the first low noise amplifier LNA1, and is impedance by the first inductor 270. The matched signal passes through the first bandpass filter BPF 21 and is transmitted from the antenna terminal.

The signal that has passed through the second bandpass filter BPF 22 is impedance-matched by the second inductor 271, amplified by the second low noise amplifier LNA2, and output from the second output terminal 205. Alternatively, when the second bandpass filter BPF22 is a transmission filter, the second output terminal 205 functions as an input terminal, is amplified by the second low noise amplifier LNA2, and has impedance by the second inductor 271. The matched signal passes through the second bandpass filter BPF22 and is transmitted from the antenna terminal.

FIG. 11 is a cross-sectional view of the front end module 200 according to the third embodiment.

As shown in FIG. 11, in the front-end module 200, the elastic wave element substrate 250 is mounted on the main surface of the wiring substrate 230. The wiring board 230 has a plurality of external connection terminals 231.

Although not shown, a wiring pattern, at least four first wiring patterns, a first bandpass filter BPF21 and a second bandpass filter BPF22 are placed on the main surface of the elastic wave element substrate 250 facing the wiring board 230, although not shown. It is formed. Further, a first inductor 270 and a second inductor 271, which are passive components, are mounted on another main surface of the elastic wave element substrate 250.

At least four second wiring patterns 211 are formed on the surface of the elastic wave element substrate 250 in the thickness direction. Further, although not shown, at least four third wiring patterns are formed on the main surface on which the passive component of the elastic wave element substrate 250 is mounted.

The first wiring pattern, the second wiring pattern, and the third wiring pattern are electrically connected to the first bandpass filter BPF 21 and the input or output terminal of the first inductor 270.

The second wiring pattern, the second wiring pattern, and the third wiring pattern are an external connection terminal 231 for input or output of the first bandpass filter BPF21 via a switching circuit or a low noise amplifier, and a first. It is electrically connected to the input or output terminal of the inductor 270.

The third wiring pattern, the second wiring pattern, and the third wiring pattern are electrically connected to the second bandpass filter BPF 22 and the input or output terminal of the second inductor 271.

The fourth wiring pattern, the second wiring pattern, and the third wiring pattern are an external connection terminal 231 for input or output of the second bandpass filter BPF22 via a switching circuit or a low noise amplifier, and a second. It is electrically connected to the input or output terminal of the inductor 271.

An integrated circuit component IC is mounted inside the wiring board 230. The integrated circuit component IC includes a switching circuit SW, a first low noise amplifier LNA1 and a second low noise amplifier LNA2.

A plurality of external connection terminals 231 (including a common input terminal 201, a first output terminal 203, and a second output terminal 205) are formed on the other main surface of the wiring board 230, and a motherboard of a mobile communication terminal is formed. It is configured to be implemented in.

Other configurations are omitted because they overlap with the contents described in the first or second embodiment.

According to the embodiment of the present invention described above, it is possible to provide a front-end module having an impedance matching inductor that is smaller and has a reduced insertion loss of the wiring itself.

As a matter of course, the present invention is not limited to the embodiments described above, but includes all embodiments that can achieve the object of the present invention.

Also, although some aspects of at least one embodiment have been described above, it should be appreciated that various modifications, modifications and improvements are readily recalled to those of skill in the art. Such modifications, modifications and improvements are intended to be part of this disclosure and are intended to be within the scope of the invention. It should be understood that the methods and embodiments of the apparatus described herein are not limited to application to the details of the structure and arrangement of the components described above or illustrated in the accompanying drawings. The methods and devices can be implemented in other embodiments and implemented or implemented in various embodiments. Specific implementation examples are given herein for illustrative purposes only and are not intended to be limited. Also, the expressions and terms used herein are for explanatory purposes only and should not be considered limiting. The use of "include", "provide", "have", "include" and variations thereof herein means inclusion of the items listed below and their equivalents and additional items. References to "or (or)" shall be construed so that any term described using "or (or)" refers to one, more than, and all of the terms in the description. Can be done. References to front-back, left-right, top-bottom top-bottom, and horizontal-vertical are intended for convenience of description, and the components of the present invention are not limited to any one of the positional or spatial orientations. Therefore, the above description and drawings are merely examples.

1 100 Module 3 130 230 Wiring board 5 150 250 Elastic wave element board 7 Passive component 9 1st wiring pattern 11 111 211 2nd wiring pattern 13 3rd wiring pattern 15 Bump 17 Sealing part 50 Inductor board 52 Elastic wave element 54 Wiring Pattern 56 Insulator 60 Chip board 62 Piezoelectric film 64 Lower electrode 66 Upper electrode 68 Void 200 Front end module 201 Common input terminal 203 First output terminal 205 Second output terminal 170 270 First inductor 171 271 Second inductor ANT antenna Terminal SW switching circuit BPF1 BPF21 1st bandpass filter BPF2 BPF22 2nd bandpass filter LNA1 1st low noise amplifier LNA2 2nd low noise amplifier IC integrated circuit component

Claims (9)

A wiring board with multiple external connection terminals and
An elastic wave element substrate mounted on the wiring board and having an elastic wave element,
Passive components mounted on the elastic wave element substrate and
Is a module with
The elastic wave element substrate is
The first wiring pattern formed on the main surface facing the wiring board,
It has a second wiring pattern formed on a surface in the thickness direction of the elastic wave element substrate and a third wiring pattern formed on the main surface on which the passive component of the elastic wave element substrate is mounted.
The passive component is a module that is electrically connected to the elastic wave element via the first wiring pattern, the second wiring pattern, and the third wiring pattern. The module according to claim 1, wherein the passive component is a chip inductor. The module according to claim 1, wherein the passive component is an IPD (Integrated Passive Device). The module according to claim 1, wherein the elastic wave element substrate includes a piezoelectric substrate and a support substrate, and the support substrate is a substrate made of sapphire, alumina, spinel, or high-resistance silicon. The module according to claim 1, wherein the surface acoustic wave element is an elastic surface wave resonator. The module according to claim 1, wherein the elastic wave element is an elastic thin film resonator. The elastic wave element includes a first bandpass filter and a second bandpass filter.
The elastic wave element substrate includes at least four of the first wiring pattern, the second wiring pattern, and the third wiring pattern, respectively.
The passive component is
The first bandpass filter is electrically connected to the first bandpass filter via the first wiring pattern, the second wiring pattern, and the third wiring pattern, and the second wiring pattern, the second wiring pattern. A first inductor electrically connected to an external connection terminal via a wiring pattern and the third wiring pattern, and
The second band pass filter is electrically connected to the third band path filter via the first wiring pattern, the second wiring pattern, and the third wiring pattern, and the fourth wiring pattern, the second wiring pattern. A second inductor is provided in which the first inductor is electrically connected to an external connection terminal different from the external connection terminal to which the first inductor is electrically connected via a wiring pattern and the third wiring pattern.
The module according to claim 1. The module according to claim 1, further comprising an integrated circuit component including a switching circuit and a low noise amplifier. Claim 1 in which at least a part of a region where the wiring board and the elastic wave element substrate are joined and at least a part of a region where the elastic wave element board and the passive component are joined overlap each other on a plan perspective view. Module described in.

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