JP2022066273A - Photocurable adhesive composition - Google Patents
Photocurable adhesive composition Download PDFInfo
- Publication number
- JP2022066273A JP2022066273A JP2022026491A JP2022026491A JP2022066273A JP 2022066273 A JP2022066273 A JP 2022066273A JP 2022026491 A JP2022026491 A JP 2022026491A JP 2022026491 A JP2022026491 A JP 2022026491A JP 2022066273 A JP2022066273 A JP 2022066273A
- Authority
- JP
- Japan
- Prior art keywords
- meth
- adhesive composition
- acrylate
- photocurable adhesive
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 59
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 59
- 239000000203 mixture Substances 0.000 title claims abstract description 59
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 65
- 239000002608 ionic liquid Substances 0.000 claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 14
- 239000000178 monomer Substances 0.000 claims abstract description 14
- 150000003839 salts Chemical class 0.000 claims abstract description 14
- 239000003999 initiator Substances 0.000 claims abstract description 13
- 239000004014 plasticizer Substances 0.000 claims abstract description 12
- 230000003287 optical effect Effects 0.000 claims description 17
- 229920002635 polyurethane Polymers 0.000 claims description 9
- 239000004814 polyurethane Substances 0.000 claims description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 8
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 6
- 229920006243 acrylic copolymer Polymers 0.000 claims description 5
- 238000000016 photochemical curing Methods 0.000 claims description 2
- -1 2-ethylhexyl Chemical group 0.000 description 20
- 239000007788 liquid Substances 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- 229920005989 resin Polymers 0.000 description 15
- 239000004973 liquid crystal related substance Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 7
- 238000001723 curing Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- ZMDDERVSCYEKPQ-UHFFFAOYSA-N Ethyl (mesitylcarbonyl)phenylphosphinate Chemical compound C=1C=CC=CC=1P(=O)(OCC)C(=O)C1=C(C)C=C(C)C=C1C ZMDDERVSCYEKPQ-UHFFFAOYSA-N 0.000 description 4
- 239000005062 Polybutadiene Substances 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 229910052744 lithium Inorganic materials 0.000 description 4
- 229920002857 polybutadiene Polymers 0.000 description 4
- 229920001195 polyisoprene Polymers 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 150000001451 organic peroxides Chemical class 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 2
- BAWPQHHUILXQGW-UHFFFAOYSA-N 2-methyl-1-(4-prop-1-en-2-ylphenyl)propane-1,2-diol Chemical compound CC(=C)C1=CC=C(C(O)C(C)(C)O)C=C1 BAWPQHHUILXQGW-UHFFFAOYSA-N 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- NQSMEZJWJJVYOI-UHFFFAOYSA-N Methyl 2-benzoylbenzoate Chemical compound COC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 NQSMEZJWJJVYOI-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- LFOXEOLGJPJZAA-UHFFFAOYSA-N [(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl)phosphoryl]-(2,6-dimethoxyphenyl)methanone Chemical compound COC1=CC=CC(OC)=C1C(=O)P(=O)(CC(C)CC(C)(C)C)C(=O)C1=C(OC)C=CC=C1OC LFOXEOLGJPJZAA-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- HORIEOQXBKUKGQ-UHFFFAOYSA-N bis(7-methyloctyl) cyclohexane-1,2-dicarboxylate Chemical compound CC(C)CCCCCCOC(=O)C1CCCCC1C(=O)OCCCCCCC(C)C HORIEOQXBKUKGQ-UHFFFAOYSA-N 0.000 description 2
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical group 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 241000894007 species Species 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- NPENBPVOAXERED-UHFFFAOYSA-N (4-benzoylphenyl)-phenylmethanone Chemical compound C=1C=C(C(=O)C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 NPENBPVOAXERED-UHFFFAOYSA-N 0.000 description 1
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 1
- WXPWZZHELZEVPO-UHFFFAOYSA-N (4-methylphenyl)-phenylmethanone Chemical compound C1=CC(C)=CC=C1C(=O)C1=CC=CC=C1 WXPWZZHELZEVPO-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- 229940058015 1,3-butylene glycol Drugs 0.000 description 1
- WOKQGMYCUGJNIJ-UHFFFAOYSA-M 1,3-dimethylimidazol-1-ium;methyl sulfate Chemical compound COS([O-])(=O)=O.CN1C=C[N+](C)=C1 WOKQGMYCUGJNIJ-UHFFFAOYSA-M 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- WQQZMYRVHZZOEW-UHFFFAOYSA-N 1-benzyl-4-(2-methylphenyl)sulfanylbenzene Chemical compound CC1=CC=CC=C1SC(C=C1)=CC=C1CC1=CC=CC=C1 WQQZMYRVHZZOEW-UHFFFAOYSA-N 0.000 description 1
- GWQYPLXGJIXMMV-UHFFFAOYSA-M 1-ethyl-3-methylimidazol-3-ium;bromide Chemical compound [Br-].CCN1C=C[N+](C)=C1 GWQYPLXGJIXMMV-UHFFFAOYSA-M 0.000 description 1
- HSKPJQYAHCKJQC-UHFFFAOYSA-N 1-ethylanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2CC HSKPJQYAHCKJQC-UHFFFAOYSA-N 0.000 description 1
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 description 1
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- SPSPIUSUWPLVKD-UHFFFAOYSA-N 2,3-dibutyl-6-methylphenol Chemical compound CCCCC1=CC=C(C)C(O)=C1CCCC SPSPIUSUWPLVKD-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- MWSPXTHIGURRBI-UHFFFAOYSA-N 2-(2-chlorophenyl)-1-[2-(2-chlorophenyl)-4,5-bis(3,4,5-trimethoxyphenyl)imidazol-2-yl]-4,5-bis(3,4,5-trimethoxyphenyl)imidazole Chemical compound COC1=C(OC)C(OC)=CC(C=2C(=NC(N=2)(C=2C(=CC=CC=2)Cl)N2C(=C(N=C2C=2C(=CC=CC=2)Cl)C=2C=C(OC)C(OC)=C(OC)C=2)C=2C=C(OC)C(OC)=C(OC)C=2)C=2C=C(OC)C(OC)=C(OC)C=2)=C1 MWSPXTHIGURRBI-UHFFFAOYSA-N 0.000 description 1
- MHDULSOPQSUKBQ-UHFFFAOYSA-N 2-(2-chlorophenyl)-1-[2-(2-chlorophenyl)-4,5-diphenylimidazol-2-yl]-4,5-diphenylimidazole Chemical compound ClC1=CC=CC=C1C(N1C2(N=C(C(=N2)C=2C=CC=CC=2)C=2C=CC=CC=2)C=2C(=CC=CC=2)Cl)=NC(C=2C=CC=CC=2)=C1C1=CC=CC=C1 MHDULSOPQSUKBQ-UHFFFAOYSA-N 0.000 description 1
- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- FJDLQLIRZFKEKJ-UHFFFAOYSA-N 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanamide Chemical compound CC(C)(C)C1=CC(CCC(N)=O)=CC(C(C)(C)C)=C1O FJDLQLIRZFKEKJ-UHFFFAOYSA-N 0.000 description 1
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- QRLSTWVLSWCGBT-UHFFFAOYSA-N 4-((4,6-bis(octylthio)-1,3,5-triazin-2-yl)amino)-2,6-di-tert-butylphenol Chemical compound CCCCCCCCSC1=NC(SCCCCCCCC)=NC(NC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=N1 QRLSTWVLSWCGBT-UHFFFAOYSA-N 0.000 description 1
- VSAWBBYYMBQKIK-UHFFFAOYSA-N 4-[[3,5-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-2,4,6-trimethylphenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC1=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 VSAWBBYYMBQKIK-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 1
- PRKPGWQEKNEVEU-UHFFFAOYSA-N 4-methyl-n-(3-triethoxysilylpropyl)pentan-2-imine Chemical compound CCO[Si](OCC)(OCC)CCCN=C(C)CC(C)C PRKPGWQEKNEVEU-UHFFFAOYSA-N 0.000 description 1
- XPAXMFYCOOAUSA-UHFFFAOYSA-N 5-methylhexyl 4-(dimethylamino)benzoate Chemical compound CC(C)CCCCOC(=O)C1=CC=C(N(C)C)C=C1 XPAXMFYCOOAUSA-UHFFFAOYSA-N 0.000 description 1
- NLRVQGZDJHUKOM-UHFFFAOYSA-N 6-methyl-4,6-bis(octylsulfanylmethoxy)cyclohexa-1,3-dien-1-ol Chemical compound C(CCCCCCC)SCOC1(CC(=CC=C1O)OCSCCCCCCCC)C NLRVQGZDJHUKOM-UHFFFAOYSA-N 0.000 description 1
- AHIRQDYBCFZOJV-UHFFFAOYSA-N 9h-carbazol-1-yl(phenyl)methanone Chemical compound C=1C=CC=2C3=CC=CC=C3NC=2C=1C(=O)C1=CC=CC=C1 AHIRQDYBCFZOJV-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ZGFPUTOTEJOSAY-UHFFFAOYSA-N FC1=C([Ti])C(F)=CC=C1N1C=CC=C1 Chemical compound FC1=C([Ti])C(F)=CC=C1N1C=CC=C1 ZGFPUTOTEJOSAY-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical class C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 125000005210 alkyl ammonium group Chemical group 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- SUDHVXIPIDQEIT-UHFFFAOYSA-N bis(1,1,2,2,2-pentafluoroethylsulfonyl)azanide;1-ethyl-3-methylimidazol-3-ium Chemical compound CCN1C=C[N+](C)=C1.FC(F)(F)C(F)(F)S(=O)(=O)[N-]S(=O)(=O)C(F)(F)C(F)(F)F SUDHVXIPIDQEIT-UHFFFAOYSA-N 0.000 description 1
- NOFBAVDIGCEKOQ-UHFFFAOYSA-N bis(trifluoromethylsulfonyl)azanide;1-butyl-3-methylpyridin-1-ium Chemical compound CCCC[N+]1=CC=CC(C)=C1.FC(F)(F)S(=O)(=O)[N-]S(=O)(=O)C(F)(F)F NOFBAVDIGCEKOQ-UHFFFAOYSA-N 0.000 description 1
- VYHBFRJRBHMIQZ-UHFFFAOYSA-N bis[4-(diethylamino)phenyl]methanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=C(N(CC)CC)C=C1 VYHBFRJRBHMIQZ-UHFFFAOYSA-N 0.000 description 1
- 235000019437 butane-1,3-diol Nutrition 0.000 description 1
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 150000001768 cations Chemical group 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- 239000004806 diisononylester Substances 0.000 description 1
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- YDEXUEFDPVHGHE-GGMCWBHBSA-L disodium;(2r)-3-(2-hydroxy-3-methoxyphenyl)-2-[2-methoxy-4-(3-sulfonatopropyl)phenoxy]propane-1-sulfonate Chemical compound [Na+].[Na+].COC1=CC=CC(C[C@H](CS([O-])(=O)=O)OC=2C(=CC(CCCS([O-])(=O)=O)=CC=2)OC)=C1O YDEXUEFDPVHGHE-GGMCWBHBSA-L 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 150000002431 hydrogen Chemical group 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- MHCFAGZWMAWTNR-UHFFFAOYSA-M lithium perchlorate Chemical class [Li+].[O-]Cl(=O)(=O)=O MHCFAGZWMAWTNR-UHFFFAOYSA-M 0.000 description 1
- QSZMZKBZAYQGRS-UHFFFAOYSA-N lithium;bis(trifluoromethylsulfonyl)azanide Chemical compound [Li+].FC(F)(F)S(=O)(=O)[N-]S(=O)(=O)C(F)(F)F QSZMZKBZAYQGRS-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- DSQCNXSPLHDLED-UHFFFAOYSA-M methanesulfonate;tetrabutylphosphanium Chemical compound CS([O-])(=O)=O.CCCC[P+](CCCC)(CCCC)CCCC DSQCNXSPLHDLED-UHFFFAOYSA-M 0.000 description 1
- ZQLAXKQISZQPEJ-UHFFFAOYSA-M methanesulfonate;tetraphenylazanium Chemical class CS([O-])(=O)=O.C1=CC=CC=C1[N+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 ZQLAXKQISZQPEJ-UHFFFAOYSA-M 0.000 description 1
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- SJNXJRVDSTZUFB-UHFFFAOYSA-N naphthalen-2-yl(phenyl)methanone Chemical compound C=1C=C2C=CC=CC2=CC=1C(=O)C1=CC=CC=C1 SJNXJRVDSTZUFB-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- 150000002891 organic anions Chemical class 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000005634 peroxydicarbonate group Chemical group 0.000 description 1
- HPAFOABSQZMTHE-UHFFFAOYSA-N phenyl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)C1=CC=CC=C1 HPAFOABSQZMTHE-UHFFFAOYSA-N 0.000 description 1
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical group C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 125000005498 phthalate group Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-O pyridinium Chemical compound C1=CC=[NH+]C=C1 JUJWROOIHBZHMG-UHFFFAOYSA-O 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000010413 sodium alginate Nutrition 0.000 description 1
- 239000000661 sodium alginate Substances 0.000 description 1
- 229940005550 sodium alginate Drugs 0.000 description 1
- KVCGISUBCHHTDD-UHFFFAOYSA-M sodium;4-methylbenzenesulfonate Chemical compound [Na+].CC1=CC=C(S([O-])(=O)=O)C=C1 KVCGISUBCHHTDD-UHFFFAOYSA-M 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 150000003456 sulfonamides Chemical class 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- DZLFLBLQUQXARW-UHFFFAOYSA-N tetrabutylammonium Chemical compound CCCC[N+](CCCC)(CCCC)CCCC DZLFLBLQUQXARW-UHFFFAOYSA-N 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- JTSBPMJUIGOTAB-UHFFFAOYSA-N triethoxy(4-methylpentyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCC(C)C JTSBPMJUIGOTAB-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- 125000001889 triflyl group Chemical group FC(F)(F)S(*)(=O)=O 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Liquid Crystal (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
Description
本発明は、光学表示体又はタッチセンサーの貼り合わせに使用され得る光硬化型接着剤組成物、及び、これを用いて貼り合わせた光学表示体又はタッチパネルに関する。 The present invention relates to a photocurable adhesive composition that can be used for bonding an optical display or a touch sensor, and an optical display or a touch panel that is bonded using the same.
液晶パネル等の表示体、或いはコリメーターレンズ等の光学レンズのような、光学的な用途に用いられる材料には、静電気による埃の吸着、放電による電気機器の破損等を防止するため、帯電防止性を備えていることが必要とされる。このため導電性を高める物質である帯電防止剤が添加されるが、帯電防止性を持たせた部材の要求は幅広く存在する(例えばレンズ用途では特許文献1)。 Materials used for optical purposes, such as display bodies such as liquid crystal panels or optical lenses such as collimator lenses, are antistatic in order to prevent the adsorption of dust due to static electricity and the damage to electrical equipment due to electric discharge. It is necessary to have sex. For this reason, an antistatic agent, which is a substance that enhances conductivity, is added, but there is a wide range of demands for members having antistatic properties (for example, Patent Document 1 for lens applications).
表示体用途で使用される液晶パネルには駆動方式がいくつかある。IPS型の駆動方式では面方向に電界を掛ける為(横電界駆動方式)、ディスプレイ表面が帯電するなど外部電界の影響を受けると液晶分子の配向が乱れ表示不良が発生する。通常はこれを防止する為に偏光板のHC層や粘着層、CF基盤の表面に導電、帯電防止層が設けられる(特許文献2)。しかしながら、液晶パネル用途では導電、帯電防止層はその構造上側面からしかTFTと接続することができない為、その信頼性に問題がある。 There are several drive systems for liquid crystal panels used in display applications. In the IPS type drive method, an electric field is applied in the plane direction (transverse electric field drive method), so if the display surface is affected by an external electric field such as charging, the orientation of the liquid crystal molecules is disturbed and display defects occur. Normally, in order to prevent this, a conductive and antistatic layer is provided on the surface of the HC layer and the adhesive layer of the polarizing plate and the CF substrate (Patent Document 2). However, in liquid crystal panel applications, the conductive and antistatic layers can be connected to the TFT only from the side surface due to their structure, so that there is a problem in their reliability.
一方、液晶パネルには、薄いガラス基板の保護やアプリケーションの拡大のため、保護パネルやタッチパネルが設けられ、それらと液晶パネルとの固定に液状樹脂を用いる技術が知られている。液状樹脂を用いた技術では、液状樹脂が接着のため液晶パネルの表示部を覆うように適用されるので、他の部材と比べTFT基盤と接続可能な面積が大きく、帯電防止性における信頼性改善が期待される。 On the other hand, in order to protect a thin glass substrate and expand applications, a protective panel or a touch panel is provided on the liquid crystal panel, and a technique of using a liquid resin for fixing them to the liquid crystal panel is known. In the technology using liquid resin, since the liquid resin is applied so as to cover the display part of the liquid crystal panel for adhesion, the area that can be connected to the TFT board is larger than other members, and the reliability in antistatic property is improved. There is expected.
ただし、液状樹脂を用いた技術では、液状樹脂に複数の性質が要求される。液晶パネルのガラスは、表示装置の薄型、軽量化のニーズから薄くなってきており、液状樹脂が硬化する際の硬化収縮応力によって、ガラスが破損したり、変形したりする場合がある。これは表示不良の原因となることから、硬化収縮率や弾性率を低下させる必要がある(特許文献3)。また、液状樹脂を用いた技術では、液状樹脂が接着のため液晶パネルの表示部を覆うように適用されるので、利用される液状樹脂は、光学的に透明な樹脂(OCR)であること、耐熱試験後の着色、変色、耐湿試験後の強度低下を起こさないことが求められる(特許文献4)。また、液状樹脂は、熱硬化による収縮を防ぐためや、樹脂全体を万遍なく硬化させるために、紫外線等の光により硬化するタイプであることが好ましい。 However, in the technique using a liquid resin, a plurality of properties are required for the liquid resin. The glass of a liquid crystal panel is becoming thinner due to the need for thinner and lighter display devices, and the glass may be damaged or deformed due to the curing shrinkage stress when the liquid resin is cured. Since this causes display defects, it is necessary to reduce the curing shrinkage rate and elastic modulus (Patent Document 3). Further, in the technique using the liquid resin, the liquid resin is applied so as to cover the display part of the liquid crystal panel for adhesion, so that the liquid resin used is an optically transparent resin (OCR). It is required not to cause coloring, discoloration after the heat resistance test, or deterioration of strength after the moisture resistance test (Patent Document 4). Further, the liquid resin is preferably a type that is cured by light such as ultraviolet rays in order to prevent shrinkage due to thermal curing and to cure the entire resin evenly.
OCRは、他部材と比べTFT基盤と接続可能な面積が大きいため、OCRに導電、帯電防止性をもたせることができれば、OCRを帯電防止層とし、信頼性の高いデバイスを製造することが可能となる。一方で、接着剤として用いられる液状樹脂には接着剤、光学材料としての様々な特性が要求される。 Since OCR has a larger area that can be connected to the TFT substrate than other members, if OCR can be made conductive and antistatic, it will be possible to manufacture highly reliable devices using OCR as an antistatic layer. Become. On the other hand, the liquid resin used as an adhesive is required to have various properties as an adhesive and an optical material.
本発明者らは、接着剤・光学材料の成分だけでは目的の帯電防止性が発揮できないといった問題があることを見出した。したがって、本発明の課題は、接着性や透明性等の接着剤に求められる特性を備えつつ、帯電防止性に優れた光硬化型接着剤組成物を提供することである。 The present inventors have found that there is a problem that the desired antistatic property cannot be exhibited only by the components of the adhesive / optical material. Therefore, an object of the present invention is to provide a photocurable adhesive composition having excellent antistatic properties while having properties required for an adhesive such as adhesiveness and transparency.
本発明者らは、特定の光硬化型接着剤組成物において、イオン性液体又は金属塩のような導電性物質を添加することにより、上記の課題が達成されることを見出して本発明を完成した。 The present inventors have found that the above-mentioned problems can be achieved by adding a conductive substance such as an ionic liquid or a metal salt in a specific photocurable adhesive composition, and complete the present invention. bottom.
本発明は、以下の事項によって特定されるものである。
すなわち、第1の発明は、(A)(メタ)アクリレートオリゴマー、
(B)単官能の(メタ)アクリレートモノマー、
(C)可塑剤、
(D)光反応開始剤、及び
(E1)イオン液体を含む、光硬化型接着剤組成物である。
第2の発明は、(A)(メタ)アクリレートオリゴマー、
(B)単官能の(メタ)アクリレートモノマー、
(C)可塑剤、
(D)光反応開始剤、及び
(E2)金属塩を含む、光硬化型接着剤組成物である。
第3の発明は、前記(A)成分が、ポリウレタン(メタ)アクリレートオリゴマー及び(メタ)アクリロイル基を有する(メタ)アクリル共重合体からなる群より選択される1種以上である、前記第1又は2の発明に記載の光硬化型接着剤組成物である。
第4の発明は、前記(A)成分のアクリル当量が200g/mol以上である、前記第1~3のいずれかの発明に記載の光硬化型接着剤組成物である。
第5の発明は、光学表示体又はタッチセンサーの貼り合わせ用の、前記第1~4のいずれかの発明に記載の光硬化型接着剤組成物である。
第6の発明は、前記第1~5のいずれかの発明に記載の光硬化型接着剤組成物で貼り合わせた、積層体である。
第7の発明は、光学表示体又はタッチセンサーである、前記第6の発明に記載の積層体である。
The present invention is specified by the following matters.
That is, the first invention is the (A) (meth) acrylate oligomer,
(B) Monofunctional (meth) acrylate monomer,
(C) Plasticizer,
It is a photocurable adhesive composition containing (D) a photoreaction initiator and (E1) an ionic liquid.
The second invention is (A) (meth) acrylate oligomer,
(B) Monofunctional (meth) acrylate monomer,
(C) Plasticizer,
It is a photocurable adhesive composition containing (D) a photoreaction initiator and (E2) a metal salt.
In the third aspect of the invention, the component (A) is one or more selected from the group consisting of a polyurethane (meth) acrylate oligomer and a (meth) acrylic copolymer having a (meth) acryloyl group. Alternatively, it is the photocurable adhesive composition according to the second invention.
The fourth invention is the photocurable adhesive composition according to any one of the first to third inventions, wherein the acrylic equivalent of the component (A) is 200 g / mol or more.
A fifth invention is the photocurable adhesive composition according to any one of the first to fourth inventions, which is used for bonding an optical display or a touch sensor.
The sixth invention is a laminated body bonded with the photocurable adhesive composition according to any one of the first to fifth inventions.
The seventh invention is the laminated body according to the sixth invention, which is an optical display or a touch sensor.
本発明によれば、接着性や透明性等の接着剤に求められる特性を備えつつ、帯電防止性に優れた光硬化型接着剤組成物が提供される。 According to the present invention, there is provided a photocurable adhesive composition having excellent antistatic properties while having properties required for an adhesive such as adhesiveness and transparency.
以下、本発明の光硬化型接着剤組成物について、詳細に説明する。第1の態様では、本発明は、(A)(メタ)アクリレートオリゴマー、(B)単官能の(メタ)アクリレートモノマー、(C)可塑剤、(D)光反応開始剤、及び(E1)イオン液体を含む、光硬化型接着剤組成物である。以下、これら各成分について説明する。 Hereinafter, the photocurable adhesive composition of the present invention will be described in detail. In the first aspect, the present invention comprises (A) (meth) acrylate oligomers, (B) monofunctional (meth) acrylate monomers, (C) plasticizers, (D) photoinitiators, and (E1) ions. A photocurable adhesive composition comprising a liquid. Hereinafter, each of these components will be described.
[(A)(メタ)アクリレートオリゴマー]
本発明の光硬化型接着剤組成物は、(メタ)アクリレートオリゴマーを含有する。好ましくは、ポリイソプレン(メタ)アクリレートオリゴマー、ポリブタジエン(メタ)アクリレートオリゴマー及びポリウレタン(メタ)アクリレートオリゴマー、(メタ)アクリロイル基を有する(メタ)アクリル共重合体からなる群から選ばれた1種以上の(メタ)アクリレートオリゴマーを含有する。より好ましくは、ポリウレタン(メタ)アクリレートオリゴマー及び(メタ)アクリロイル基を有する(メタ)アクリル共重合体からなる群から選ばれた1種以上を含有する。(メタ)アクリレートオリゴマーは、接着剤組成物の硬化収縮率をより小さくすることができる点から、アクリル当量が200g/mol以上であることが好ましい。
[(A) (meth) acrylate oligomer]
The photocurable adhesive composition of the present invention contains a (meth) acrylate oligomer. Preferably, one or more selected from the group consisting of a polyisoprene (meth) acrylate oligomer, a polybutadiene (meth) acrylate oligomer, a polyurethane (meth) acrylate oligomer, and a (meth) acrylic copolymer having a (meth) acryloyl group. Contains (meth) acrylate oligomers. More preferably, it contains one or more selected from the group consisting of polyurethane (meth) acrylate oligomers and (meth) acrylic copolymers having (meth) acryloyl groups. The acrylic equivalent of the (meth) acrylate oligomer is preferably 200 g / mol or more from the viewpoint that the curing shrinkage rate of the adhesive composition can be further reduced.
ポリイソプレン(メタ)アクリレートオリゴマーは、(メタ)アクリル変性ポリイソプレンとも呼ばれ、好ましくは1000~100000、より好ましくは1000~50000の分子量を有する。また、これらの水素添加体も使用することができる。市販品として、例えば、クラレ社製の「UC-1」(分子量25000)等がある。 The polyisoprene (meth) acrylate oligomer is also called (meth) acrylic modified polyisoprene and has a molecular weight of preferably 1000 to 100,000, more preferably 1000 to 50,000. Moreover, these hydrogenated bodies can also be used. As a commercially available product, for example, there is "UC-1" (molecular weight 25000) manufactured by Kuraray Co., Ltd.
ポリブタジエン(メタ)アクリレートオリゴマーは、(メタ)アクリル変性ポリブタジエンとも呼ばれ、好ましくは500~100000、より好ましくは1000~30000の分子量を有する。また、これらの水素添加体も使用することができる。市販品として、例えば、日本石油社製の「TE2000」(分子量2000)等がある。 The polybutadiene (meth) acrylate oligomer is also called (meth) acrylic modified polybutadiene and has a molecular weight of preferably 500 to 100,000, more preferably 1000 to 30,000. Moreover, these hydrogenated bodies can also be used. As a commercially available product, for example, there is "TE2000" (molecular weight 2000) manufactured by Nippon Petroleum Co., Ltd.
ポリウレタン(メタ)アクリレートオリゴマーは、(メタ)アクリル変性ポリウレタンとも呼ばれ、好ましくは1000~100000、より好ましくは1000~50000の分子量を有する。(メタ)アクリル基で変性されていればポリウレタンの構造は特に制限されず、例えば、ポリエーテル、ポリカーボネート等の骨格を有するポリウレタンを原料としてポリウレタン(メタ)アクリレートオリゴマーを得ることができる。市販品として、例えば、ライトケミカル社製の「UA-1」等がある。 Polyurethane (meth) acrylate oligomers, also referred to as (meth) acrylic modified polyurethanes, preferably have a molecular weight of 1000-100,000, more preferably 1000-50,000. The structure of polyurethane is not particularly limited as long as it is modified with a (meth) acrylic group, and for example, a polyurethane (meth) acrylate oligomer can be obtained from a polyurethane having a skeleton such as polyether or polycarbonate as a raw material. As a commercially available product, for example, there is "UA-1" manufactured by Light Chemical Co., Ltd.
(メタ)アクリロイル基を有する(メタ)アクリル共重合体は、(メタ)アクリロイル基を有するモノマーを含む共重合体であり、好ましくは5000~300000、より好ましくは10000~100000の分子量を有する。 The (meth) acrylic copolymer having a (meth) acryloyl group is a copolymer containing a monomer having a (meth) acryloyl group, and has a molecular weight of preferably 5,000 to 300,000, more preferably 10,000 to 100,000.
[(B)単官能の(メタ)アクリレートモノマー]
本発明の光硬化型接着剤組成物は、さらに、(メタ)アクリレートモノマーを含む。本発明の光硬化型接着剤組成物は、(メタ)アクリレートモノマーを含むことにより、硬化物に伸びを付与することができる。
[(B) Monofunctional (meth) acrylate monomer]
The photocurable adhesive composition of the present invention further contains a (meth) acrylate monomer. The photocurable adhesive composition of the present invention can impart elongation to the cured product by containing the (meth) acrylate monomer.
(メタ)アクリレートモノマーは、例えば、2-エチルヘキシル(メタ)アクリレート、n-ブチル(メタ)アクリレート、i-ブチル(メタ)アクリレート、t-ブチル(メタ)アクリレート、ラウリル(メタ)アクリレート、アルキル(メタ)アクリレート、メトキシエチル(メタ)アクリレート、2-ヒドロキシエチル(メタ)アクリレート、2-ヒドロキシプロピル(メタ)アクリレート、2-ヒドロキシブチル(メタ)アクリレート、4-ヒドロキシブチル(メタ)アクリレート、ベンジル(メタ)アクリレート、フェニル(メタ)アクリレート、エチレングリコールジ(メタ)アクリレート、ジエチレングリコールジ(メタ)アクリレート、トリエチレングリコールジ(メタ)アクリレート、ヒドロキシエチル(メタ)アクリレート、1,3-ブチレングリコールジ(メタ)アクリレート、1,4-ブチレングリコールジ(メタ)アクリレート、ネオペンチルグリコールジ(メタ)アクリレート、1,6-ヘキサンジオールジ(メタ)アクリレート、ジシクロペンタニル(メタ)アクリレート、ジシクロペンテニルオキシエチル(メタ)アクリレート、ノルボネン(メタ)アクリレート、フェノキシエチル(メタ)アクリレート(PO)、フェノキシポリエチレングリコール(メタ)アクリレート、2-ヒドロキシ-3-フェノキシプロピル(メタ)アクリレート、シクロヘキシル(メタ)アクリレート(CH)、ノニルフェノールEO付加物(メタ)アクリレート、メトキシトリエチレングリコール(メタ)アクリレート及びテトラヒドロフルフリル(メタ)アクリレートから選択される。これらの(メタ)アクリレートモノマーは、1種類又は2種類以上を使用できる。 Examples of the (meth) acrylate monomer include 2-ethylhexyl (meth) acrylate, n-butyl (meth) acrylate, i-butyl (meth) acrylate, t-butyl (meth) acrylate, lauryl (meth) acrylate, and alkyl (meth) acrylate. ) Acrylate, methoxyethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, benzyl (meth) Acrylate, phenyl (meth) acrylate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, hydroxyethyl (meth) acrylate, 1,3-butylene glycol di (meth) acrylate , 1,4-butylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyloxyethyl (meth) ) Acrylate, norbonene (meth) acrylate, phenoxyethyl (meth) acrylate (PO), phenoxypolyethylene glycol (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, cyclohexyl (meth) acrylate (CH), nonylphenol It is selected from EO adduct (meth) acrylates, methoxytriethylene glycol (meth) acrylates and tetrahydrofurfuryl (meth) acrylates. One kind or two or more kinds of these (meth) acrylate monomers can be used.
(メタ)アクリレートモノマーは、組成物全体に対して、好ましくは5~80質量部、より好ましくは5~70質量部、最も好ましくは5~60質量部の量で含まれる。 The (meth) acrylate monomer is contained in an amount of preferably 5 to 80 parts by mass, more preferably 5 to 70 parts by mass, and most preferably 5 to 60 parts by mass with respect to the entire composition.
[(C)可塑剤]
本発明の光硬化型接着剤組成物は、さらに、可塑剤を含む。本発明の光硬化型接着剤組成物は、可塑剤を含むことにより、弾性率と収縮率を制御することができる。
可塑剤として、(メタ)アクリレートオリゴマーと相溶するポリマー、オリゴマー、フタル酸エステル類、ヒマシ油、キシレン樹脂、テルペン樹脂、ロジン等が挙げられる。オリゴマー又はポリマーとして、ポリイソプレン系、ポリブタジエン系又はキシレン系のオリゴマー又はポリマーを例示できる。これらの柔軟化成分は、クラレからLIRシリーズ、デグッサ社からポリオイルシリーズとして、フドーよりニカノールシリーズとして市販されている。これらの柔軟化成分は1種類又は2種類以上を使用することができる。
[(C) Plasticizer]
The photocurable adhesive composition of the present invention further contains a plasticizer. The photocurable adhesive composition of the present invention can control the elastic modulus and the shrinkage rate by containing a plasticizer.
Examples of the plasticizer include polymers compatible with (meth) acrylate oligomers, oligomers, phthalates, castor oil, xylene resin, terpene resin, rosin and the like. Examples of the oligomer or polymer include polyisoprene-based, polybutadiene-based or xylene-based oligomers or polymers. These softening ingredients are commercially available from Kuraray as the LIR series, Degussa as the polyoil series, and Fudo as the Nicanor series. One kind or two or more kinds of these softening components can be used.
可塑剤は、組成物全体に対して、好ましくは5~90重量部、より好ましくは10~80質量部、更に好ましくは20~70質量部以下の量で含まれる。 The plasticizer is contained in an amount of preferably 5 to 90 parts by weight, more preferably 10 to 80 parts by mass, still more preferably 20 to 70 parts by mass or less with respect to the entire composition.
[(D)光反応開始剤]
本発明の光硬化型接着剤組成物は、さらに、光開始剤を含む。光開始剤としては、一般的な開始剤を使用することができ、例えば、1-[4-(2-ヒドロキシエトキシ)フェニル]-2-ヒドロキシ-2-メチル-1-プロパン-1-オン、1-ヒドロキシーシクロヘキシルーフェニル-ケトン、ベンゾフェノン、2,2-ジメトキシ-1,2-ジフェニルエタン-1-オン、2,4,6-トリメチルベンゾイルジフェニルホスフィンオキサイド、2,4,6-トリメチルベンゾイルフェニルエトキシホスフィンオキサイド、2-ベンジル-2-ジメチルアミノ-1-(4-モルホリノフェニル)ブタノン-1、2-ヒドロキシ-2-メチル-1-フェニル-プロパン-1-オン、2-メチル-1-[4-メチルチオ]フェニル]-2-モルホリノプロパン-1-オン、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインイソブチルエーテル、ベンゾインイソプロピルエーテル、ビス(2,4,6-トリメチルベンゾイル)-フェニルホスフィンオキサイド、2-ヒドロキシ-2-メチル-[4-(1-メチルビニル)フェニル]プロパノールオリゴマー、2-ヒドロキシ-2-メチル-[4-(1-メチルビニル)フェニル]プロパノールオリゴマー,2-ヒドロキシ-2-メチル-1-フェニル-1-プロパノン、イソプロピルチオキサントン、o-ベンゾイル安息香酸メチル、[4-(メチルフェニルチオ)フェニル]フェニルメタン、2,4-ジエチルチオキサントン、2ークロロチオキサントン、ベンゾフェノン、エチルアントラキノン、ベンゾフェノンアンモニウム塩、チオキサントンアンモニウム塩、ビス(2,6-ジメトキシベンゾイル)-2,4,4-トリメチル-ペンチルホスフィンオキサイド、ビス(2,6-ジメトキシベンゾイル)-2,4,4-トリメチル-ペンチルホスフィンオキサイド、2,4,6-トリメチルベンゾフェノン、4-メチルベンゾフェノン、4,4’-ビスジエチルアミノベンゾフェノン、1,4ジベンゾイルベンゼン、10-ブチル-2-クロロアクリドン、2,2’ビス(o-クロロフェニル)4,5,4’,5’-テトラキス(3,4,5-トリメトキシフェニル)1,2’-ビイミダゾール、2,2’-ビス(o-クロロフェニル)4,5,4’,5’-テトラフェニル-1,2’-ビイミダゾール、2-ベンゾイルナフタレン、4-ベンゾイルビフェニル、4-ベンゾイルジフェニルエーテル、アクリル化ベンゾフェノン、ビス(η5-2,4-シクロペンタジエン-1-イル)-ビス(2,6-ジフルオロ-3-(1H-ピロール-1-イル)-フェニル)チタニウム、o-メチルベンゾイルベンゾエート、p-ジメチルアミノ安息香酸エチルエステル、p-ジメチルアミノ安息香酸イソアミルエチルエステル、活性ターシャリアミン、カルバゾール・フェノン系光重合開始剤、アクリジン系光重合開始剤、トリアジン系光重合開始剤、ベンゾイル系光重合開始剤などを例示できる。これらの光開始剤の1種類又は2種類以上を使用できる。
[(D) Photochemical initiator]
The photocurable adhesive composition of the present invention further comprises a photoinitiator. As the photoinitiator, a general initiator can be used, for example, 1- [4- (2-hydroxyethoxy) phenyl] -2-hydroxy-2-methyl-1-propane-1-one, 1-Hydroxycyclohexyl-phenyl-ketone, benzophenone, 2,2-dimethoxy-1,2-diphenylethane-1-one, 2,4,6-trimethylbenzoyldiphenylphosphenyl oxide, 2,4,6-trimethylbenzoylphenyl Ethoxyphosphine oxide, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butanone-1, 2-hydroxy-2-methyl-1-phenyl-propane-1-one, 2-methyl-1-[ 4-Methylthio] Phenyl] -2-morpholinopropane-1-one, benzoinmethyl ether, benzoin ethyl ether, benzoin isobutyl ether, benzoin isopropyl ether, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, 2- Hydroxy-2-methyl- [4- (1-methylvinyl) phenyl] propanol oligomer, 2-hydroxy-2-methyl- [4- (1-methylvinyl) phenyl] propanol oligomer, 2-hydroxy-2-methyl- 1-Phenyl-1-propanone, isopropylthioxanthone, methyl o-benzoylbenzoate, [4- (methylphenylthio) phenyl] phenylmethane, 2,4-diethylthioxanthone, 2-chlorothioxanthone, benzophenone, ethylanthraquinone, benzophenoneammonium Salt, thioxanthone ammonium salt, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethyl-pentylphosphine oxide, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethyl-pentylphosphinoxide, 2,4,6-trimethylbenzophenone, 4-methylbenzophenone, 4,4'-bisdiethylaminobenzophenone, 1,4dibenzoylbenzene, 10-butyl-2-chloroacrydone, 2,2'bis (o-chlorophenyl) 4,5,4', 5'-tetrakis (3,4,5-trimethoxyphenyl) 1,2'-biimidazole, 2,2'-bis (o-chlorophenyl) 4,5,4', 5'-Tetraphenyl-1,2'-biimidazole, 2-benzoylnaphthalene, 4-benzoylbiphenyl, 4-benzoyldiphenyl ether, acrylic Benzophenone, bis (η5-2,4-cyclopentadiene-1-yl) -bis (2,6-difluoro-3- (1H-pyrrole-1-yl) -phenyl) titanium, o-methylbenzoylbenzoate, p. -Dimethylaminobenzoic acid ethyl ester, p-dimethylaminobenzoic acid isoamylethyl ester, active tertiary amine, carbazole-phenone-based photopolymerization initiator, aclydin-based photopolymerization initiator, triazine-based photopolymerization initiator, benzoyl-based photopolymerization An initiator and the like can be exemplified. One or more of these photoinitiators can be used.
光開始剤の量は、組成物全体に対して、好ましくは30質量部以下、より好ましくは20質量部以下、更に好ましくは0.5~15質量部である。 The amount of the photoinitiator is preferably 30 parts by mass or less, more preferably 20 parts by mass or less, and further preferably 0.5 to 15 parts by mass with respect to the entire composition.
本発明において、好ましい光開始剤として、2,4,6-トリメチルベンゾイルフェニルエトキシホスフィンオキサイド、1-ヒドロキシ-シクロヘキシル-フェニル-ケトンが挙げられ、それぞれを単独で使用してもよいし、組み合わせてもよい。 In the present invention, preferred photoinitiators include 2,4,6-trimethylbenzoylphenylethoxyphosphine oxide and 1-hydroxy-cyclohexyl-phenyl-ketone, which may be used alone or in combination. good.
[(E1)イオン液体]
第1の態様における、本発明の光硬化型接着剤組成物は、イオン液体を含有する。イオン液体は、液体状態で存在する塩であり、本発明においては、イオン液体を含有することで、光硬化型接着剤組成物が良好な導電性を発揮する。イオン液体の種類は、融点が150℃以下のもの、好ましくは融点が100℃以下のもの、特に好ましくは常温(25℃、1気圧)で液体であるものであれば、特に制限はされない。
[(E1) Ionic liquid]
The photocurable adhesive composition of the present invention in the first aspect contains an ionic liquid. The ionic liquid is a salt that exists in a liquid state, and in the present invention, the photocurable adhesive composition exhibits good conductivity by containing the ionic liquid. The type of ionic liquid is not particularly limited as long as it has a melting point of 150 ° C. or lower, preferably a melting point of 100 ° C. or lower, and particularly preferably a liquid at room temperature (25 ° C., 1 atm).
好ましいイオン液体の例として、以下の構造式:
(式中、R、R’、R”及びR’’’は、各々独立して、水素、ハロゲン特にフッ素により置換されていてもよい、アルキル基、芳香族基又は複素環基であり、
X-は、各構造のカチオン部分のカウンターアニオンであり、好ましくは、BF4
-、PF6
-、SO4R-、N(SO2R)2
-、Cl-、Br-(ここで、Rは、上記定義のとおりである)からなる群より選択され、より好ましくは、BF4
-、PF6
-、N(SO2CF3)2
-、Cl-、Br-からなる群より選択される)
で示されるような化合物のうち、イオン液体としての性質を示すものが挙げられる。
As an example of a preferred ionic liquid, the following structural formula:
(In the formula, R, R', R "and R''' are alkyl groups, aromatic groups or heterocyclic groups which may be independently substituted with hydrogen, halogen, particularly fluorine, respectively.
X - is a counter anion of the cation moiety of each structure, preferably BF 4- , PF 6- , SO 4 R- , N (SO 2 R) 2- , Cl- , Br- ( where R). Is selected from the group consisting of (as defined above), and more preferably selected from the group consisting of BF 4- , PF 6- , N (SO 2 CF 3 ) 2- , Cl- , Br-. )
Among the compounds shown in the above, those showing the properties as an ionic liquid can be mentioned.
イオン液体の例としては、1,3-ジメチルイミダゾリウムメチルスルフェート、1-エチル-3-メチルイミダゾリウムビス(ペンタフルオロエチルスルフォニル)イミド、1-エチル-3-メチルイミダゾリウムブロミド等のイミダゾリウム塩誘導体;3-メチル-1-プロピルピリジミウムビス(トリフルオロメチルスルフォニル)イミド、1-ブチル-3-メチルピリジニウムビス(トリフルオロメチルスルフォニル)イミド等のピリジニウム塩誘導体;テトラブチルアンモニウムヘプタデカフルオロオクタンスルフォネート、テトラフェニルアンモニウムメタンスルフォネート等のアルキルアンモニウム誘導体;テトラブチルフォスフォニウムメタンスルフォネート等のホスホニウム塩誘導体;ポリアルキレングリコールと過塩素酸リチウムの複合体等の複合化導電性付与剤等を示すことができる。 Examples of ionic liquids include imidazoliums such as 1,3-dimethylimidazolium methylsulfate, 1-ethyl-3-methylimidazolium bis (pentafluoroethylsulfonyl) imide, and 1-ethyl-3-methylimidazolium bromide. Salt derivative; Pyridinium salt derivative such as 3-methyl-1-propylpyridimiumbis (trifluoromethylsulfonyl) imide, 1-butyl-3-methylpyridiniumbis (trifluoromethylsulfonyl) imide; tetrabutylammonium heptadecafluoro Alkylammonium derivatives such as octansulfonate and tetraphenylammonium methanesulfonate; phosphonium salt derivatives such as tetrabutylphosphonium methanesulfonate; composite conductivity of polyalkylene glycol and lithium perchlorate composites, etc. It is possible to indicate an imparting agent or the like.
イオン液体の量は、組成物全体に対して好ましくは0.1~30質量部、さらに好ましくは0.1~20質量部の範囲である。この範囲とすることで、接着剤としての機能を損なうことなく、より良好な導電性を与えることができる。 The amount of the ionic liquid is preferably in the range of 0.1 to 30 parts by mass, more preferably 0.1 to 20 parts by mass with respect to the entire composition. Within this range, better conductivity can be provided without impairing the function as an adhesive.
本発明の第2の態様では、本発明は、(A)(メタ)アクリレートオリゴマー、(B)単官能の(メタ)アクリレートモノマー、(C)可塑剤、(D)光反応開始剤、及び(E2)金属塩を含む、光硬化型接着剤組成物である。(A)~(D)成分に関しては、先に説明したとおりの例示、好ましい態様等が同様に適用される。 In a second aspect of the invention, the invention comprises (A) (meth) acrylate oligomers, (B) monofunctional (meth) acrylate monomers, (C) plasticizers, (D) photoreactive initiators, and (D) photoreactive initiators. E2) A photocurable adhesive composition containing a metal salt. As for the components (A) to (D), the examples and preferred embodiments as described above are similarly applied.
[(E2)金属塩]
第2の態様における、本発明の光硬化型接着剤組成物は、金属塩を含有する。金属塩は、前記(A)~(D)成分に対して均一に分散し、組成物全体の透明性を損なわないものであれば、その種類は特に制限されない。金属種の例としては、リチウム、ナトリウムのような1族元素(アルカリ金属)、カルシウム、ストロンチウムのような2族元素、チタン、ニッケル、パラジウム、オスミウムのような遷移金属など、金属元素を幅広く用いることができる。金属種のカウンターイオンの例としては、ハロゲン、スルホンアミド、酢酸イオンのような有機アニオン種などを用いることができる。カウンターアニオンの好ましい例は、RCOO-、BF4
-、PF6
-、SO4R-、NO3
-、N(SO2R)2
-、C(SO2R)3
-、N(SO2R)(COR)-、-O3S(R)3SO3
-、Cl-、ClO4
-、Br-、I-、AlCl4
-、Al2Cl7
-、AsF6
-、SbF6
-、NbF6
-、TaF6
-、(CN)2N-(ここで、Rは、イオン液体の項において定義したものと同じである)からなる群より選択され、より好ましくは、BF4
-、PF6
-、N(SO2CF3)2
-、N(SO2C2F5)2
-、Cl-、Br-からなる群より選択される)
[(E2) Metal salt]
The photocurable adhesive composition of the present invention in the second aspect contains a metal salt. The type of the metal salt is not particularly limited as long as it is uniformly dispersed in the components (A) to (D) and does not impair the transparency of the entire composition. As examples of metal species, a wide range of metal elements are used, such as group 1 elements (alkali metals) such as lithium and sodium, group 2 elements such as calcium and strontium, and transition metals such as titanium, nickel, palladium and osmium. be able to. As an example of the counter ion of the metal species, an organic anion species such as halogen, sulfonamide, and acetate ion can be used. Preferred examples of counter anions are RCOO- , BF 4- , PF 6- , SO 4 R- , NO 3- , N (SO 2 R) 2- , C (SO 2 R) 3- , N (SO 2 R). ) (COR) - , - O 3 S (R) 3 SO 3- , Cl- , ClO 4- , Br- , I- , AlCl 4- , Al 2 Cl 7- , AsF 6- , SbF 6- , NbF It is selected from the group consisting of 6- , TaF 6- , (CN) 2 N- ( where R is the same as defined in the section on ionic liquids), more preferably BF 4- , PF 6- . - , N (SO 2 CF 3 ) 2- , N (SO 2 C 2 F 5 ) 2- , Cl- , Br- Selected from the group)
金属塩の例としては、酢酸ナトリウム、アルギン酸ナトリウム、リグニンスルホン酸ナトリウム、トルエンスルホン酸ナトリウム、LiCF3SO3、Li(CF3SO2)2N、Li(C2F5SO2)2N、Li(C4F9SO2)2N、Li(CF3SO2)3C、KO3S(CF2)3SO3K,LiO3S(CF2)3SO3Kを示すことができるが、上記金属とカウンターイオンの組み合わせであれば得に限定されない。 Examples of metal salts include sodium acetate, sodium alginate, sodium lignin sulfonate, sodium toluene sulfonate, LiCF 3 SO 3 , Li (CF 3 SO 2 ) 2 N, Li (C 2 F 5 SO 2 ) 2 N, Li (C 4 F 9 SO 2 ) 2 N, Li (CF 3 SO 2 ) 3 C, KO 3 S (CF 2 ) 3 SO 3 K, LiO 3 S (CF 2 ) 3 SO 3 K can be shown. However, if it is a combination of the above metal and counter ion, it is not limited to a profit.
金属塩の量は、組成物全体に対して好ましくは0.1~30質量部、さらに好ましくは0.1~20質量部の範囲である。この範囲とすることで、接着剤としての機能を損なうことなく、より良好な導電性を与えることができる。 The amount of the metal salt is preferably in the range of 0.1 to 30 parts by mass, more preferably 0.1 to 20 parts by mass with respect to the entire composition. Within this range, better conductivity can be provided without impairing the function as an adhesive.
本発明の光硬化型接着剤組成物は、第1の態様及び第2の態様ともに、当業者に公知の添加剤を含有することができる。 The photocurable adhesive composition of the present invention can contain additives known to those skilled in the art in both the first aspect and the second aspect.
本発明の光硬化型接着剤組成物は、さらに、接着付与剤を含有することができる。接着付与剤として、シランカップリング剤、例えば、ビニルトリメトキシシラン、2-(3,4-エポキシシクロヘキシル)エチルトリメトキシシラン、3-グリシドキシプロピルトリメトキシシラン、3-グリシドキシプロピルメチルジエトキシシラン、3-グリシドキシプロピルトリエトキシシラン、p-スチリルトリメトキシシラン、3-メタクリロキシプロピルメチルジメトキシシラン、3-メタクリロキシプロピルトリメトキシシラン、3-メタクリロキシプロピルメチルジエトキシシラン、3-メタクリロキシプロピルトリエトキシシラン、3-アクリロキシプロピルトリメトキシシラン、N-2-(アミノエチル)-3-アミノプロピルメチルジメトキシシラン、N-2-(アミノエチル)-3-アミノプロピルトリメトキシシラン、N-2-(アミノエチル)-3-アミノプロピルトリエトキシシラン、3-アミノプロピルトリメトキシシラン、3-アミノプロピルトリエトキシシラン、3-トリエトキシシリル-N-(1,3-ジメチル-ブチリデン)プロピルアミン、N-フェニル-3-アミノプロピルトリメトキシシラン、3-ウレイドプロピルトリエトキシシラン、3-クロロプロピルトリメトキシシラン、3-メルカプトプロピル、メチルジメトキシシラン、3-メルカプトプロピルトリメトキシシラン、ビス(トリエトキシシリルプロピル)テトラスルフィド、3-イソシアネートプロピルトリエトキシシランなどを例示できる。これらの接着付与剤の1種類又は2種類以上を使用できる。接着付与剤の量は、組成物全体に対して、好ましくは10質量部以下、より好ましくは1質量部以下である。 The photocurable adhesive composition of the present invention can further contain an adhesive-imparting agent. As the adhesion imparting agent, a silane coupling agent such as vinyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldi Ethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3- Methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N-2- (aminoethyl) -3-aminopropyltrimethoxysilane, N-2- (Aminoethyl) -3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) Propylamine, N-phenyl-3-aminopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-chloropropyltrimethoxysilane, 3-mercaptopropyl, methyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, bis ( Examples thereof include triethoxysilylpropyl) tetrasulfide and 3-isopropylpropyltriethoxysilane. One or more of these adhesives can be used. The amount of the adhesive-imparting agent is preferably 10 parts by mass or less, more preferably 1 part by mass or less, based on the entire composition.
本発明の光硬化型接着剤組成物は、さらに、酸化防止剤を含有することもできる。酸化防止剤としては、BHT、2,4-ビス-(n-オクチルチオ)-6-(4-ヒドロキシ-3,5-ジ-t-ブチルアニリノ)-1,3,5-トリアジン、ペンタエリスリチル・テトラキス[3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート]、2,2-チオ-ジエチレンビス[3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート]、トリエチレングリコール-ビス[3-(3-t-ブチル-5-メチル-4-ヒドロキシフェニル)プロピオネート]、1,6-ヘキサンジオール-ビス[3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート]、オクタデシル-3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート、N,N’-ヘキサメチレンビス(3,5-ジ-t-ブチル-4-ヒドロキシ-ヒドロシンナマミド)、1,3,5-トリメチル-2,4,6-トリス(3,5-ジ-t-ブチル-4-ヒドロキシベンジル)ベンゼン、トリス-(3,5-ジ-t-ブチル-4-ヒドロキシベンジル)-イソシアヌレート、オクチル化ジフェニルアミン、2,4,-ビス[(オクチルチオ)メチル]-O-クレゾール、イソオクチル-3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート、ジブチルヒドロキシトルエンを例示できる。これらの酸化防止剤は1種類又は2種類以上を使用できる。酸化防止剤の量は、組成物全体に対して、好ましくは0.1~10質量部、より好ましくは0.5~3質量部である。 The photocurable adhesive composition of the present invention may further contain an antioxidant. Antioxidants include BHT, 2,4-bis- (n-octylthio) -6- (4-hydroxy-3,5-di-t-butylanilino) -1,3,5-triazine, pentaerythrityl. Tetrakiss [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate], 2,2-thio-diethylenebis [3- (3,5-di-t-butyl-4-hydroxyphenyl) Propionate], triethylene glycol-bis [3- (3-t-butyl-5-methyl-4-hydroxyphenyl) propionate], 1,6-hexanediol-bis [3- (3,5-di-t-) Butyl-4-hydroxyphenyl) propionate], octadecyl-3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate, N, N'-hexamethylenebis (3,5-di-t-butyl) -4-Hydroxy-hydrocinnamamide), 1,3,5-trimethyl-2,4,6-tris (3,5-di-t-butyl-4-hydroxybenzyl) benzene, Tris- (3,5) -Di-t-butyl-4-hydroxybenzyl) -isocyanurate, octylated diphenylamine, 2,4-bis [(octylthio) methyl] -O-cresol, isooctyl-3- (3,5-di-t-) Examples thereof include butyl-4-hydroxyphenyl) propionate and dibutylhydroxytoluene. One type or two or more types of these antioxidants can be used. The amount of the antioxidant is preferably 0.1 to 10 parts by mass, more preferably 0.5 to 3 parts by mass with respect to the entire composition.
本発明の光硬化型接着剤組成物は、接着すべき材料の構造によって接着面に塗布した接着組成物の一部に光が当たらない場合には、光が当たるところは光で硬化させ、光の当たらないところは有機過酸化物を添加して熱で硬化させるような、光硬化と熱硬化の併用タイプの接着組成物にすることもできる。有機過酸化物の例としてケトンパーオキサイド系、パーオキシケタール系、ハイドロパーオキサイド系、ジアルキルパーオキサイド系、ジアシルパーオキサイド系、パーオキシエステル系、パーオキシジカーボネート系などが例示できる。これらの有機化酸化物は、1種類又は2種類以上を使用できる。これらの有機化酸化物は1種類又は2種類以上を使用でき、その量は、組成物全体に対して、好ましくは0.1~10質量部、より好ましくは0.5~3質量部である。上記の有機過酸化物の硬化促進剤として、ナフテン酸金属錯体、ジメチルアニリン、4級アンモニウム塩、リン酸エステル類を使用できる。 In the photocurable adhesive composition of the present invention, when a part of the adhesive composition applied to the adhesive surface is not exposed to light due to the structure of the material to be adhered, the part exposed to the light is cured by light, and the light is applied. It is also possible to make an adhesive composition of a combined type of photo-curing and heat-curing, in which an organic peroxide is added and the adhesive is cured by heat. Examples of organic peroxides include ketone peroxides, peroxyketals, hydroperoxides, dialkyl peroxides, diacyl peroxides, peroxyesters, and peroxydicarbonates. As these organic oxides, one kind or two or more kinds can be used. One kind or two or more kinds of these organic oxides can be used, and the amount thereof is preferably 0.1 to 10 parts by mass, more preferably 0.5 to 3 parts by mass with respect to the entire composition. .. As the curing accelerator for the above organic peroxide, a naphthenic acid metal complex, dimethylaniline, a quaternary ammonium salt, and phosphoric acid esters can be used.
本発明の光硬化型接着剤組成物は、低い抵抗値を有することで高い帯電防止性を発揮することができる。本発明の光硬化型接着剤組成物は、好ましくは1.0×1011Ω・cm以下の体積抵抗値を有し、より好ましくは、1.0×1010Ω・cm以下の体積抵抗値を有する。 The photocurable adhesive composition of the present invention can exhibit high antistatic properties by having a low resistance value. The photocurable adhesive composition of the present invention preferably has a volume resistance value of 1.0 × 10 11 Ω · cm or less, and more preferably a volume resistance value of 1.0 × 10 10 Ω · cm or less. Has.
本発明の光硬化型接着剤組成物は、光学表示体又はタッチセンサーにおける接着剤として使用することができる。たとえば、光学表示パネルとタッチパネルとの貼り合せ、光学表示パネルと保護パネルとの貼り合せ、タッチパネルと保護パネルとの貼り合せ、光学表示パネルと光学表示パネルとの貼り合せ、光学表示パネルと視差バリアとの貼り合せ用として用いることができる。貼り合わせは、通常の方法によって行うことができる。 The photocurable adhesive composition of the present invention can be used as an adhesive in an optical display or a touch sensor. For example, the optical display panel and the touch panel are bonded, the optical display panel and the protective panel are bonded, the touch panel and the protective panel are bonded, the optical display panel and the optical display panel are bonded, and the optical display panel and the parallax barrier are bonded. It can be used for bonding with. The bonding can be performed by a usual method.
本発明は、前記の光硬化型接着剤組成物で貼り合わせた、光学表示体又はタッチセンサーにも関係する。これらの貼り合わせ体は、例えば、テレビ、デジタルカメラ、携帯電話、パソコン、モニター、テレビなどの電子機器に組み込むことができる。 The present invention also relates to an optical display or a touch sensor bonded with the above-mentioned photocurable adhesive composition. These laminated bodies can be incorporated into electronic devices such as televisions, digital cameras, mobile phones, personal computers, monitors, and televisions.
本発明を以下の実施例により説明するが、本発明はこれらの実施例に限定されない。実施例及び比較例で用いた試薬は、以下のとおりである。
UA10000B:ポリエーテルウレタンアクリレート
LA:ラウリルアクリレート
FA513AS:ジシクロペンタニルアクリレート
4HBA:4-ヒドロキシブチルアクリレート
I-TPO:ルシリンTPO(2,4,6-トリメチルベンゾイルフェニルエトキシホスフィンオキサイド)
I-184:イルガキュア184(1-ヒドロキシーシクロヘキシルーフェニル-ケトン)
DINCH:ジイソノニルシクロヘキサン-1,2-ジカルボキシレート
ニカノールH:以下の構造式で示される化合物
KE-311:水添ロジンエステル
IL-P14:ピリジニウムカチオン系イオン液体
IL-A12:アンモニウムカチオン系イオン液体
IL-AP3:ホスホニウムカチオン系イオン液体
IL-IM1:イミダゾリニウムカチオン系イオン液体
IL-MA2:アクリル変性アンモニウムカチオン系イオン液体
IL-MA3:アクリル変性アンモニウムカチオン系イオン液体
EF-N115:リチウムビス(トリフルオロメチルスルホニル)イミド(三菱マテリアル電子化成(株)製)
The present invention will be described with reference to the following examples, but the present invention is not limited to these examples. The reagents used in Examples and Comparative Examples are as follows.
UA10000B: Polyether Urethane Acrylate LA: Lauryl Acrylate FA513AS: Dicyclopentanyl Acrylate 4HBA: 4-Hydroxybutyl Acrylate I-TPO: Lucillin TPO (2,4,6-trimethylbenzoylphenylethoxyphosphine oxide)
I-184: Irgacure 184 (1-hydroxy-cyclohexyl-phenyl-ketone)
DINCH: Diisononylcyclohexane-1,2-dicarboxylate Nicanor H: Compound represented by the following structural formula
KE-311: Hydrogenated rosin ester IL-P14: Pyridinium cation-based ionic liquid IL-A12: Ammonium cation-based ionic liquid IL-AP3: Phosphonium-cationic ionic liquid IL-IM1: Imidazolinium cation-based ionic liquid IL-MA2: Acrylic-modified ammonium cationic ionic liquid IL-MA3: Acrylic-modified ammonium cationic ionic liquid EF-N115: Lithium bis (trifluoromethylsulfonyl) imide (manufactured by Mitsubishi Materials Electronics Co., Ltd.)
(実施例1~10及び比較例1~3)
表1に示した成分を表1に示した量(質量基準)で配合して実施例1~10及び比較例1~3の光硬化型接着剤組成物を得た。得られた組成物に紫外線を照射することで硬化物を得た。紫外線照射はアイグラフィックス社製アイグランテージを使用し、400mW/cm2の照度で3000mJ/cm2の照射を行った。硬化物を試験機に取り付け抵抗値を測定した。測定は日置産業社製超絶縁計SM-8220を使用し、100Vにて試験を行った。得られた抵抗値から以下の計算式:
ρv=(R×A)/L
(式中、ρvは体積抵抗率、Rは抵抗値、Aは断面積、Lは長さを表す)
に従い体積抵抗率を算出した。実施例及び比較例での各成分の配合及び体積抵抗率の測定結果を、以下の表1に示す。
(Examples 1 to 10 and Comparative Examples 1 to 3)
The components shown in Table 1 were blended in an amount (mass basis) shown in Table 1 to obtain photocurable adhesive compositions of Examples 1 to 10 and Comparative Examples 1 to 3. A cured product was obtained by irradiating the obtained composition with ultraviolet rays. For the ultraviolet irradiation, Eye Grantage manufactured by Eye Graphics Co., Ltd. was used, and irradiation of 3000 mJ / cm 2 was performed with an illuminance of 400 mW / cm 2 . The cured product was attached to the testing machine and the resistance value was measured. The measurement was carried out at 100 V using a super insulation meter SM-8220 manufactured by Hioki Sangyo Co., Ltd. From the obtained resistance value, the following formula:
ρv = (R × A) / L
(In the formula, ρv is the resistivity, R is the resistance value, A is the cross section, and L is the length.)
The volume resistivity was calculated according to the above. The composition of each component and the measurement results of the volume resistivity in Examples and Comparative Examples are shown in Table 1 below.
(硬化収縮率)
実施例1~10及び比較例1~3の組成物の液及び硬化物の比重を比重カップにより測定し、その比から硬化収縮率を算出した。
(Curing shrinkage rate)
The specific densities of the liquids and cured products of the compositions of Examples 1 to 10 and Comparative Examples 1 to 3 were measured by a specific gravity cup, and the curing shrinkage rate was calculated from the ratios.
実施例1~10及び比較例1~3の組成物を、測定部の長さが30mm、幅5mm、厚み1mmのダンベル型の硬化物試験片とし、ミネベア社製引張圧縮試験機テクノグラフTG-2kNを使用し、10mm/minの速さで引張試験を行い、弾性率を得た。 The compositions of Examples 1 to 10 and Comparative Examples 1 to 3 were used as dumbbell-shaped cured product test pieces having a measuring section length of 30 mm, a width of 5 mm, and a thickness of 1 mm. A tensile test was performed at a speed of 10 mm / min using 2 kN to obtain an elastic modulus.
本発明の光硬化型接着剤組成物は、硬化収縮率、弾性率が小さく接着剤として優れた物性を保ち、かつイオン液体又は金属塩のような電離してイオン種を生じるような化合物を含有しない従来の組成物(比較例)と比較して、大きく体積抵抗値が低下していることが明らかとなった。このため、本発明の光硬化型接着剤組成物は、帯電防止性に優れた接着剤として、液晶パネルの貼り合わせ等に有用な材料であることが示された。 The photocurable adhesive composition of the present invention contains a compound having a low curing shrinkage and elasticity, maintaining excellent physical properties as an adhesive, and ionizing to form an ionic species such as an ionic liquid or a metal salt. It was clarified that the volume resistance value was significantly reduced as compared with the conventional composition (comparative example). Therefore, it has been shown that the photocurable adhesive composition of the present invention is a useful material for bonding liquid crystal panels and the like as an adhesive having excellent antistatic properties.
Claims (7)
(B)単官能の(メタ)アクリレートモノマー、
(C)可塑剤、
(D)光反応開始剤、及び
(E1)イオン液体を含む、光硬化型接着剤組成物。 (A) (meth) acrylate oligomer,
(B) Monofunctional (meth) acrylate monomer,
(C) Plasticizer,
A photocurable adhesive composition comprising (D) a photoreaction initiator and (E1) an ionic liquid.
(B)単官能の(メタ)アクリレートモノマー、
(C)可塑剤、
(D)光反応開始剤、及び
(E2)金属塩を含む、光硬化型接着剤組成物。 (A) (meth) acrylate oligomer,
(B) Monofunctional (meth) acrylate monomer,
(C) Plasticizer,
A photocurable adhesive composition comprising (D) a photoreaction initiator and (E2) a metal salt.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017080487 | 2017-04-14 | ||
JP2017080487 | 2017-04-14 | ||
JP2018023993A JP7075109B2 (en) | 2017-04-14 | 2018-02-14 | Photo-curing adhesive composition |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018023993A Division JP7075109B2 (en) | 2017-04-14 | 2018-02-14 | Photo-curing adhesive composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2022066273A true JP2022066273A (en) | 2022-04-28 |
Family
ID=64282708
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018023993A Active JP7075109B2 (en) | 2017-04-14 | 2018-02-14 | Photo-curing adhesive composition |
JP2022026491A Pending JP2022066273A (en) | 2017-04-14 | 2022-02-24 | Photocurable adhesive composition |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018023993A Active JP7075109B2 (en) | 2017-04-14 | 2018-02-14 | Photo-curing adhesive composition |
Country Status (1)
Country | Link |
---|---|
JP (2) | JP7075109B2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110128996B (en) * | 2019-06-06 | 2021-08-20 | 杭州之江新材料有限公司 | Sealant, preparation method and application thereof and vehicle |
WO2023132214A1 (en) * | 2022-01-07 | 2023-07-13 | 株式会社カネカ | Curable composition and cured product |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008032852A (en) * | 2006-07-26 | 2008-02-14 | Lintec Corp | Adhesive for bonding optical functional film, the optical functional film and method for manufacturing the same |
JP2010254970A (en) * | 2009-03-31 | 2010-11-11 | Nippon Synthetic Chem Ind Co Ltd:The | Active energy ray curable resin composition, adhesive agent and adhesive sheet obtained from the same |
JP2012041499A (en) * | 2010-08-23 | 2012-03-01 | Kaneka Corp | Photocurable composition and image display device using the same |
JP2013542458A (en) * | 2010-09-13 | 2013-11-21 | スリーエム イノベイティブ プロパティズ カンパニー | Display panel substrate assembly and apparatus and method for forming a display panel substrate assembly |
JP2014534986A (en) * | 2011-09-28 | 2014-12-25 | スリーエム イノベイティブ プロパティズ カンパニー | Method for coating a rigid substrate with a liquid and optically transparent adhesive |
JP2016035046A (en) * | 2014-08-01 | 2016-03-17 | 三星エスディアイ株式会社Samsung SDI Co.,Ltd. | Adhesive composition, optical member and adhesive sheet |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5304922B1 (en) | 2012-05-09 | 2013-10-02 | デクセリアルズ株式会社 | Manufacturing method of image display device |
JP5994618B2 (en) | 2012-12-14 | 2016-09-21 | デクセリアルズ株式会社 | Photocurable resin composition and method for producing image display device using the same |
JP2015200698A (en) | 2014-04-04 | 2015-11-12 | 日東電工株式会社 | Transparent resin layer, polarizing film with adhesive layer, and image display device |
JP6528103B2 (en) | 2015-04-06 | 2019-06-12 | 協立化学産業株式会社 | Photocurable adhesive composition |
JP6481167B2 (en) | 2015-04-09 | 2019-03-13 | 協立化学産業株式会社 | Photocurable adhesive composition |
-
2018
- 2018-02-14 JP JP2018023993A patent/JP7075109B2/en active Active
-
2022
- 2022-02-24 JP JP2022026491A patent/JP2022066273A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008032852A (en) * | 2006-07-26 | 2008-02-14 | Lintec Corp | Adhesive for bonding optical functional film, the optical functional film and method for manufacturing the same |
JP2010254970A (en) * | 2009-03-31 | 2010-11-11 | Nippon Synthetic Chem Ind Co Ltd:The | Active energy ray curable resin composition, adhesive agent and adhesive sheet obtained from the same |
JP2012041499A (en) * | 2010-08-23 | 2012-03-01 | Kaneka Corp | Photocurable composition and image display device using the same |
JP2013542458A (en) * | 2010-09-13 | 2013-11-21 | スリーエム イノベイティブ プロパティズ カンパニー | Display panel substrate assembly and apparatus and method for forming a display panel substrate assembly |
JP2014534986A (en) * | 2011-09-28 | 2014-12-25 | スリーエム イノベイティブ プロパティズ カンパニー | Method for coating a rigid substrate with a liquid and optically transparent adhesive |
JP2016035046A (en) * | 2014-08-01 | 2016-03-17 | 三星エスディアイ株式会社Samsung SDI Co.,Ltd. | Adhesive composition, optical member and adhesive sheet |
Also Published As
Publication number | Publication date |
---|---|
JP7075109B2 (en) | 2022-05-25 |
JP2018178078A (en) | 2018-11-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101823196B1 (en) | Photocurable resin composition for laminating optically functional material | |
JP2012046658A (en) | Photocurable adhesive composition for pasting optical display or touch sensor and optical display or touch sensor pasted by using the same | |
JP2022066273A (en) | Photocurable adhesive composition | |
JP6286703B2 (en) | Optical member pressure-sensitive adhesive composition, optical member pressure-sensitive adhesive film and surface protective film | |
KR102374775B1 (en) | Polarizing film and manufacturing method thereof, optical film and image display device | |
CN109072015B (en) | Active energy ray-curable adhesive composition, laminated polarizing film and method for producing same, laminated optical film, and image display device | |
WO2018235696A1 (en) | Photocurable adhesive sheet, image display device constituent laminate, image display device production method, and method for preventing corrosion of conductive member | |
KR102607576B1 (en) | Adhesive composition | |
TWI752000B (en) | Adhesive sheet for conductive member, conductive member laminate, and image display device | |
WO2019026762A1 (en) | Adhesive sheet, layered body for constituting image display device, and image display device | |
JP2015048402A (en) | Shading conductive resin composition and cured product | |
JP5957115B2 (en) | Photo-curing adhesive composition for bonding optical display or touch sensor and optical display or touch sensor bonded using the same | |
JP2019178225A (en) | Liquid crystal panel sealant resin composition, and film liquid crystal panel with edges sealed with that liquid crystal panel sealant resin composition | |
KR20140102118A (en) | Adhesive composition, and adhesive film, surface-protective adhesive film, optical film using the same | |
JP2019163478A (en) | Surface protective film | |
JP2018076515A (en) | Adhesive composition for optical member, adhesive film for optical member and surface protective film | |
JP2017119858A (en) | Adhesive sheet for conductive member, conductive member laminate, and image display device | |
JP2018022052A (en) | Liquid crystal sealant and liquid crystal display cell using the same | |
JP6302509B2 (en) | Photo-curing adhesive composition for bonding optical display or touch sensor and optical display or touch sensor bonded using the same | |
JP2020172573A (en) | Photocurable adhesive composition | |
KR102234124B1 (en) | Adhesive composition | |
WO2016104525A1 (en) | Photocurable resin composition, and image display device and method for manufacturing same | |
JP5994296B2 (en) | Photocurable resin composition, image display device using the same, and method for manufacturing image display device | |
JP2019167452A (en) | Photocurable adhesive composition | |
KR20100128144A (en) | Curable resin composition and liquid crystal display device using the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220224 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220224 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20221227 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20230620 |