TWI752000B - Adhesive sheet for conductive member, conductive member laminate, and image display device - Google Patents

Adhesive sheet for conductive member, conductive member laminate, and image display device Download PDF

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TWI752000B
TWI752000B TW105143084A TW105143084A TWI752000B TW I752000 B TWI752000 B TW I752000B TW 105143084 A TW105143084 A TW 105143084A TW 105143084 A TW105143084 A TW 105143084A TW I752000 B TWI752000 B TW I752000B
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meth
adhesive sheet
mass
adhesive
conductive member
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TW201736540A (en
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山本亮太
新美可保留
吉川秀次郎
稲永誠
內田貴久
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日商三菱化學股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/10Adhesives in the form of films or foils without carriers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202Conductive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Optics & Photonics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Liquid Crystal (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

本發明提供一種不會腐蝕導電構件、例如透明導電層且具有耐發泡可靠性及良好之硬化特性之導電構件用黏著片材、導電構件積層體及圖像顯示裝置。本發明尤其提供一種適合於電漿顯示器(PDP)、液晶顯示器(LCD)、有機EL顯示器(OLED)等使用圖像顯示面板之圖像顯示裝置中貼合透明導電層等導電構件之導電構件用黏著片材。 本發明之導電構件用黏著片材包含黏著劑層,該黏著劑層包含含有(甲基)丙烯酸系共聚物及1,2,3-三唑之黏著劑組合物。The present invention provides an adhesive sheet for conductive members, a laminate of conductive members, and an image display device that do not corrode conductive members, such as transparent conductive layers, and have foam resistance reliability and good hardening properties. In particular, the present invention provides a conductive member suitable for laminating conductive members such as transparent conductive layers in image display devices such as plasma displays (PDPs), liquid crystal displays (LCDs), and organic EL displays (OLEDs) using image display panels. Adhesive sheet. The adhesive sheet for conductive members of the present invention includes an adhesive layer containing an adhesive composition containing a (meth)acrylic copolymer and 1,2,3-triazole.

Description

導電構件用黏著片材、導電構件積層體及圖像顯示裝置Adhesive sheet for conductive member, conductive member laminate, and image display device

本發明係關於一種導電構件用黏著片材及使用該黏著片材之導電構件積層體等。本發明尤其關於一種適合於電漿顯示器(PDP)、液晶顯示器(LCD)、有機EL(Electroluminescence,電致發光)顯示器(OLED)、無機EL顯示器、電泳顯示器(EPD)、干擾調變顯示器(IMOD)等使用圖像顯示面板之圖像顯示裝置中貼合透明導電層等導電構件之導電構件用黏著片材等。The present invention relates to an adhesive sheet for conductive members, a conductive member laminate and the like using the adhesive sheet. The present invention particularly relates to a device suitable for plasma display (PDP), liquid crystal display (LCD), organic EL (Electroluminescence, electroluminescence) display (OLED), inorganic EL display, electrophoretic display (EPD), interference modulation display (IMOD) ) etc. In the image display device using the image display panel, the adhesive sheet for conductive members, etc., which is pasted with conductive members such as transparent conductive layers, etc.

於個人電腦、行動設備終端(PDA)、遊戲機、電視(TV)、汽車導航系統、觸控面板、手寫板等的圖像顯示裝置、例如電漿顯示器(PDP)、液晶顯示器(LCD)、有機EL顯示器(OLED)、無機EL顯示器、電泳顯示器(EPD)、干擾調變顯示器(IMOD)等平面型或使用具有曲面之圖像顯示面板之圖像顯示裝置中,為了確保視認性或防止破損等,未於各構成構件間設置空隙並利用黏著片材或液狀黏著劑將各構成物材間貼合而一體化。 例如,於具備於液晶模組之視認側與表面保護面板之間插入有觸控面板而成之構成之圖像顯示裝置中,於表面保護面板與液晶模組之視認側之間配置黏著片材或液狀黏著劑,將觸控面板與另一構成構件、例如將觸控面板與液晶模組、觸控面板與表面保護面板貼合而一體化。 觸控面板通常具備由摻錫之氧化銦(ITO)、銦-鎵-鋅複合氧化物(IGZO)、摻Ga之氧化鋅(GZO)等金屬氧化物或銀、銅、鉬等金屬材料形成之微細配線或具有由銀奈米線、奈米碳管等形成之透明導電層之上部電極板及下部電極板。又,為了彙集透明導電層所檢測出之手指或觸摸筆等之位置資訊並進行通信,將由金屬材料形成之導體圖案(配線圖案)形成於透明導電層與IC(Integrated Circuit,積體電路)等控制機構之間。該等由各種材料形成之透明導電層或導體圖案通常係以表面與黏著劑相接之方式固定。該透明導電層或導體圖案存在如下顧慮:對腐蝕脆弱,於高溫或濕熱環境下會因黏著材之釋氣或源自溶出成分之酸成分等而腐蝕,視情形會斷線等。 因此,例如於專利文獻1中揭示有含有苯并三唑及/或其衍生物作為金屬腐蝕防止劑之金屬貼附用黏著片材。 又,例如於專利文獻2中揭示有如下黏著劑組合物:其包含將丙烯酸烷氧基烷基酯及具有可交聯之官能基之丙烯酸系單體作為必需成分而構成之丙烯酸系聚合物及交聯劑,並且丙烯酸系聚合物中實質上不包含含羧基單體。揭示有根據該黏著劑組合物,藉由使用特定量之脂肪族系異氰酸酯交聯劑及含有複數個羥基之胺系化合物而抑制黃變,又,藉由使丙烯酸系聚合物採用交聯結構,即便不包含含羧基單體成分,亦可滿足高溫下之耐發泡、剝落性。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2006-45315號公報 [專利文獻2]日本專利特開2009-079203號公報Image display devices such as plasma display (PDP), liquid crystal display (LCD), For organic EL displays (OLED), inorganic EL displays, electrophoretic displays (EPD), interference modulation displays (IMOD) and other flat-type or image display devices using image display panels with curved surfaces, in order to ensure visibility or prevent damage etc., without providing a void between the respective constituent members, and bonding and integrating the respective constituent materials with an adhesive sheet or a liquid adhesive. For example, in an image display device having a structure in which a touch panel is inserted between the viewing side of the liquid crystal module and the surface protection panel, an adhesive sheet is arranged between the surface protection panel and the viewing side of the liquid crystal module Or a liquid adhesive, the touch panel and another component, for example, the touch panel and the liquid crystal module, the touch panel and the surface protection panel are bonded and integrated. The touch panel is usually made of metal oxides such as tin-doped indium oxide (ITO), indium-gallium-zinc composite oxide (IGZO), Ga-doped zinc oxide (GZO), or metal materials such as silver, copper, and molybdenum. The fine wiring may have an upper electrode plate and a lower electrode plate with a transparent conductive layer formed of silver nanowires, carbon nanotubes, or the like. In addition, in order to collect and communicate the position information of a finger or a touch pen detected by the transparent conductive layer, a conductor pattern (wiring pattern) formed of a metal material is formed on the transparent conductive layer, IC (Integrated Circuit), etc. between control agencies. These transparent conductive layers or conductor patterns formed of various materials are usually fixed in such a way that the surfaces are in contact with adhesives. The transparent conductive layer or conductor pattern is vulnerable to corrosion, and may be corroded by outgassing of the adhesive material or acid components derived from eluted components in a high temperature or humid heat environment, and may be disconnected in some cases. Therefore, for example, Patent Document 1 discloses an adhesive sheet for metal sticking containing benzotriazole and/or a derivative thereof as a metal corrosion inhibitor. Moreover, for example, Patent Document 2 discloses an adhesive composition comprising an acrylic polymer composed of an alkoxyalkyl acrylate and an acrylic monomer having a crosslinkable functional group as essential components, and A crosslinking agent, and substantially no carboxyl group-containing monomer is contained in the acrylic polymer. It is disclosed that according to the adhesive composition, yellowing is suppressed by using a specific amount of an aliphatic isocyanate crosslinking agent and an amine compound containing a plurality of hydroxyl groups, and further, by adopting a crosslinked structure for the acrylic polymer, Even if the carboxyl group-containing monomer component is not included, the foaming resistance and peeling resistance at high temperature can be satisfied. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 2006-45315 [Patent Document 2] Japanese Patent Laid-Open No. 2009-079203

[發明所欲解決之問題] 用於圖像顯示裝置之構成構件包含於高溫或高濕環境下經時產生氣體(亦稱為「釋氣」)之構件,故而於利用黏著片材貼合該等圖像顯示裝置之構成構件之情形時,該黏著片材亦需要具有可充分地對抗釋氣之氣壓之耐發泡可靠性。 上述專利文獻1之含有金屬腐蝕防止劑之兩面黏著片材存在金屬腐蝕防止劑於照射紫外線之耐久性試驗中發泡而使光學特性降低等問題點。 根據上述專利文獻2之黏著劑組合物,即便為不包含丙烯酸等含羧基單體之丙烯酸系聚合物,亦可滿足高溫下之耐發泡、剝落性,但由於無法防止作為腐蝕之因素之水分滲入至黏著劑中,故而就金屬腐蝕防止性之觀點而言,未必滿足。 因此,本發明所欲解決之問題在於提供一種不會腐蝕導電構件且具有耐發泡可靠性及良好之硬化特性之導電構件用黏著片材。更具體而言,提供一種即便與透明導電層之導電層面或由金屬材料形成之導體圖案(配線圖案)直接貼合,亦不會腐蝕該等,又,即便隔著絕緣保護膜(鈍化膜)與透明導電層之導電層面貼合,亦不會腐蝕透明導電層之導電構件用黏著片材。 [解決問題之技術手段] 本發明之主要特徵在於具有包含含有(甲基)丙烯酸系共聚物及1,2,3-三唑之黏著劑組合物之黏著劑層。 [發明之效果] 本發明之導電構件用黏著片材可具有針對導電構件之耐腐蝕可靠性,並且亦可具有作為黏著片材之耐發泡可靠性及良好之硬化特性。因此,本發明之導電構件用黏著片材可用作適合貼合具有透明導電層及/或由包含銅或者銀之金屬材料形成之導體圖案之導電構件等各種導電構件。尤其可較佳地用作具有觸控面板之圖像顯示裝置用之黏著片材。[Problems to be Solved by the Invention] The constituent members used in image display devices include members that generate gas (also called "outgassing") over time in a high temperature or high humidity environment. In the case of a constituent member of an image display device, the adhesive sheet is also required to have foaming-resistance reliability that can sufficiently resist the air pressure of outgassing. The double-sided adhesive sheet containing the metal corrosion inhibitor of the above-mentioned Patent Document 1 has problems such that the metal corrosion inhibitor foams in the durability test by irradiation with ultraviolet rays, thereby degrading the optical properties. According to the adhesive composition of the above-mentioned Patent Document 2, even if it is an acrylic polymer that does not contain a carboxyl group-containing monomer such as acrylic acid, the foaming resistance and peeling resistance at high temperatures can be satisfied, but moisture, which is a factor of corrosion, cannot be prevented. Since it penetrates into the adhesive, it is not necessarily satisfactory from the viewpoint of metal corrosion prevention. Therefore, the problem to be solved by the present invention is to provide an adhesive sheet for a conductive member which does not corrode the conductive member and has foaming resistance reliability and good hardening properties. More specifically, even if it is directly attached to a conductive layer of a transparent conductive layer or a conductor pattern (wiring pattern) formed of a metal material, it will not corrode them, and even if an insulating protective film (passivation film) is interposed therebetween. It is attached to the conductive layer of the transparent conductive layer, and will not corrode the adhesive sheet for conductive members of the transparent conductive layer. [MEANS TO SOLVE THE PROBLEM] The main feature of this invention is that it has an adhesive agent layer which consists of an adhesive agent composition containing a (meth)acrylic-type copolymer and 1,2,3-triazole. [Effect of the Invention] The adhesive sheet for conductive members of the present invention can have corrosion resistance reliability for conductive members, foam resistance reliability as an adhesive sheet, and good hardening properties. Therefore, the adhesive sheet for a conductive member of the present invention can be used as a conductive member suitable for bonding various conductive members such as a conductive member having a transparent conductive layer and/or a conductive pattern formed of a metal material including copper or silver. In particular, it can be preferably used as an adhesive sheet for an image display device having a touch panel.

以下,對本發明之實施形態之一例詳細地進行說明。但是,本發明並不限定於下述實施形態。 <導電構件用黏著片材> 本發明之實施形態之一例之導電構件用黏著片材(以下,省略後稱為「本黏著片材」)具有包含含有(甲基)丙烯酸系(共)聚合物及1,2,3-三唑之黏著劑組合物之黏著劑層。 該黏著劑層既可為單層,亦可為多層,又,於為多層之情形時,亦可介存如所謂之基材層之其他層。於黏著劑層為具有其他層之多層構成之情形時,較佳為本黏著片材之表面層為包含上述黏著劑組合物之黏著劑層。 於本黏著片材為多層之情形時,包含上述黏著劑組合物之黏著劑層之厚度並無限定,相對於本黏著片材整體之厚度,較佳為10%以上,更佳為30%以上,進而較佳為50%以上。若包含上述黏著劑組合物之黏著劑層之厚度為上述範圍,則對導電構件之耐腐蝕可靠性、耐發泡可靠性、硬化特性變得良好,故而較佳。 再者,於本發明中,所謂「(共)聚合物」,係包括均聚物及共聚物之意義,所謂「(甲基)丙烯酸酯」係包括丙烯酸酯及甲基丙烯酸酯之意義。 [黏著劑組合物] 本黏著片材所使用之黏著劑組合物(以下,省略後稱為「本組合物」)含有(甲基)丙烯酸系(共)聚合物及1,2,3-三唑。 本組合物亦可進而含有亞磷酸酯化合物、交聯劑、光聚合起始劑、抗氧化劑、其他成分。 本組合物較佳為光硬化性之組合物。 ((甲基)丙烯酸系(共)聚合物) 作為(甲基)丙烯酸系(共)聚合物,例如除(甲基)丙烯酸烷基酯之均聚物以外,亦可列舉藉由將其與具有共聚性之單體成分進行聚合而獲得之共聚物,更佳為列舉包含自(甲基)丙烯酸烷基酯、可與其共聚合之含羧基單體、含羥基單體、含胺基單體、含環氧基單體、含醯胺基單體及其他乙烯基單體中選擇之一種以上之單體作為結構單元之共聚物。 (甲基)丙烯酸系(共)聚合物可藉由常規方法視需要使用聚合起始劑對以下所例示之單體等進行製造。 於(甲基)丙烯酸系(共)聚合物為包含含羧基單體作為結構單元之共聚物之情形時,就獲得優異之黏著物性之觀點而言,(甲基)丙烯酸系(共)聚合物較佳為含有1.2~15質量%之含羧基單體,其中含有1.5質量%以上或者10質量%以下,其中進而較佳為含有2.0質量%以上或者8質量%以下。 作為更具體之(甲基)丙烯酸系(共)聚合物之一例,可列舉由側鏈之碳數為4~18之直鏈或支鏈(甲基)丙烯酸烷基酯(以下亦稱為「共聚性單體A」)與可與其共聚合之自以下之群中選擇之任一種以上之單體成分構成之共聚物。 ・含羧基單體(以下亦稱為「共聚性單體B」) ・巨單體(以下亦稱為「共聚性單體C」) ・側鏈之碳數為1~3之(甲基)丙烯酸酯(以下亦稱為「共聚性單體D」) ・含羥基單體(以下亦稱為「共聚性單體E」) ・其他乙烯基單體(以下亦稱為「共聚性單體F」) 又,作為(甲基)丙烯酸系(共)聚合物之一例,亦可列舉:(a)由包含共聚性單體A、共聚性單體B及/或共聚性單體C之單體成分構成之共聚物或(b)由包含共聚性單體A、共聚性單體B及/或共聚性單體C、共聚性單體D及/或共聚性單體E之單體成分構成之共聚物作為尤佳之例示。 作為上述側鏈之碳數4~18之直鏈或支鏈(甲基)丙烯酸烷基酯(共聚性單體A),例如可列舉:(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸新戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸第三丁基環己酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸十三烷基酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸鯨蠟酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸異硬脂酯、(甲基)丙烯酸山萮酯、(甲基)丙烯酸異𦯉基酯、3,5,5-三甲基環己烷(甲基)丙烯酸酯、(甲基)丙烯酸二環戊酯、(甲基)丙烯酸二環戊烯酯、(甲基)丙烯酸二環戊烯氧基乙酯、(甲基)丙烯酸苄酯等。該等可使用1種,或亦可將2種以上組合使用。 上述共聚性單體A於共聚物之總單體成分中,較佳為含有30質量%以上且90質量%以下,其中,進而較佳為於35質量%以上或者88質量%以下之範圍內含有,其中,尤其進而較佳為於40質量%以上或者85質量%以下之範圍內含有。 作為上述含羧基單體(共聚性單體B),例如可列舉:(甲基)丙烯酸、2-(甲基)丙烯醯氧基乙基六氫鄰苯二甲酸、2-(甲基)丙烯醯氧基丙基六氫鄰苯二甲酸、2-(甲基)丙烯醯氧基乙基鄰苯二甲酸、2-(甲基)丙烯醯氧基丙基鄰苯二甲酸、2-(甲基)丙烯醯氧基乙基順丁烯二酸、2-(甲基)丙烯醯氧基丙基順丁烯二酸、2-(甲基)丙烯醯氧基乙基琥珀酸、2-(甲基)丙烯醯氧基丙基琥珀酸、丁烯酸、反丁烯二酸、順丁烯二酸、伊康酸。該等可使用1種,或亦可將2種以上組合。再者,「(甲基)丙烯酸基」係包括丙烯酸基及甲基丙烯酸基之意義。同樣地,「(甲基)丙烯醯基」係包括丙烯醯基及甲基丙烯醯基之意義。 上述共聚性單體B於共聚物之總單體成分中,較佳為於1.2質量%以上且15質量%以下之範圍內含有,其中,就獲得優異之黏著物性之觀點而言,較佳為於1.5質量%以上或者10質量%以下之範圍內含有,其中,尤佳為於2質量%以上或者8質量%以下之範圍內含有。 上述巨單體(共聚性單體C)係於藉由聚合而成為(甲基)丙烯酸系(共)聚合物時側鏈之碳數成為20以上之單體。藉由使用共聚性單體C,可將(甲基)丙烯酸系(共)聚合物製成接枝共聚物。因此,可根據共聚性單體C與除此以外之單體之選擇或調配比率使接枝共聚物之主鏈與側鏈之特性變化。 作為上述巨單體(共聚性單體C),較佳為骨架成分係由丙烯酸系聚合物或乙烯系聚合物構成者。作為巨單體之骨架成分,例如可列舉上述共聚性單體A、上述共聚性單體B、下述共聚性單體D、下述共聚性單體E等所例示者,該等可單獨使用,或將2種以上組合使用。 巨單體係具有自由基聚合性基或羥基、異氰酸酯基、環氧基、羧基、胺基、醯胺基、硫醇基等官能基者。作為巨單體,較佳為具有可與其他單體共聚合之自由基聚合性基者。自由基聚合性基可含有一個或者兩個以上,其中,尤佳為一個。於巨單體具有官能基之情形時,官能基亦可含有一個或者兩個以上,其中,尤佳為一個。又,既可含有自由基聚合性基與官能基中之任一者,亦可含有兩者。 共聚性單體C之數量平均分子量較佳為500~2萬,其中,較佳為800以上或者8000以下,其中,較佳為1000以上或者7000以下。 巨單體可適當地使用以一般方式製造而成者(例如東亞合成公司製造之巨單體等)。 上述共聚性單體C於共聚物之總單體成分中,較佳為於5質量%以上且30質量%以下之範圍內含有,其中,較佳為於6質量%以上或者25質量%以下之範圍內含有,其中,尤佳為於8質量%以上或者20質量%以下之範圍內含有。 作為上述側鏈之碳數為1~3之(甲基)丙烯酸酯(共聚性單體D),可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丙酯、(甲基)丙烯酸異丙酯等。該等可使用1種,或亦可將2種以上組合。 上述共聚性單體D於共聚物之總單體成分中,較佳為含有0質量%以上且70質量%以下,其中,進而較佳為於3質量%以上或者65質量%以下之範圍內含有,其中,尤其進而較佳為於5質量%以上或者60質量%以下之範圍內含有。 作為上述含羥基單體(共聚性單體E),可列舉:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸2-羥基丁酯等(甲基)丙烯酸羥基烷基酯類。該等可使用1種,或亦可將2種以上組合。 上述共聚性單體E於共聚物之總單體成分中,較佳為含有0質量%以上且30質量%以下,其中,進而較佳為於0質量%以上或者25質量%以下之範圍內含有,其中,尤其進而較佳為於0質量%以上或者20質量%以下之範圍內含有。 作為上述其他乙烯基單體(共聚性單體F),除共聚性單體A~E以外,亦可列舉分子內具有乙烯基之化合物。作為此種化合物,可例示:分子內具有醯胺基或烷氧基烷基等官能基之官能性單體類;以及聚伸烷基二醇二(甲基)丙烯酸酯類;以及乙酸乙烯酯、丙酸乙烯酯及月桂酸乙烯酯等乙烯酯單體;以及苯乙烯、氯苯乙烯、氯甲基苯乙烯、α-甲基苯乙烯及其他取代苯乙烯等芳香族乙烯基單體。該等可使用1種,或亦可將2種以上組合。 上述共聚性單體F於共聚物之總單體成分中,較佳為含有0質量%以上且30質量%以下,其中,進而較佳為於0質量%以上或者25質量%以下之範圍內含有,其中,尤其進而較佳為於0質量%以上或者20質量%以下之範圍內含有。 除上述所揭示者以外,亦可視需要適當地使用:順丁烯二酸酐、伊康酸酐等含酸酐基單體;(甲基)丙烯酸縮水甘油酯、α-乙基丙烯酸縮水甘油酯、(甲基)丙烯酸-3,4-環氧基丁酯等含環氧基單體;(甲基)丙烯酸二甲胺基乙酯、(甲基)丙烯酸二乙胺基乙酯等含胺基(甲基)丙烯酸酯系單體;(甲基)丙烯醯胺、N-第三丁基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N-甲氧基甲基(甲基)丙烯醯胺、N-丁氧基甲基(甲基)丙烯醯胺、雙丙酮(甲基)丙烯醯胺、順丁烯二酸醯胺、順丁烯二醯胺等含有醯胺基或醯亞胺基之單體;乙烯基吡咯啶酮、乙烯基吡啶、乙烯咔唑等雜環系鹼性單體等。 作為(甲基)丙烯酸系(共)聚合物之最典型之例,例如可列舉使(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異硬脂酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸甲酯等單體成分(a)、具有羧基之(甲基)丙烯酸、2-(甲基)丙烯醯氧基乙基六氫鄰苯二甲酸、2-(甲基)丙烯醯氧基丙基六氫鄰苯二甲酸、2-(甲基)丙烯醯氧基乙基鄰苯二甲酸、2-(甲基)丙烯醯氧基丙基鄰苯二甲酸、2-(甲基)丙烯醯氧基乙基順丁烯二酸、2-(甲基)丙烯醯氧基丙基順丁烯二酸、2-(甲基)丙烯醯氧基乙基琥珀酸、2-(甲基)丙烯醯氧基丙基琥珀酸、丁烯酸、反丁烯二酸、順丁烯二酸、伊康酸等單體成分(b)、及具有有機官能基等之(甲基)丙烯酸羥乙酯、(甲基)丙烯酸羥丙酯、(甲基)丙烯酸羥丁酯、(甲基)丙烯酸甘油酯、順丁烯二酸單甲酯、伊康酸單甲酯、乙酸乙烯酯、(甲基)丙烯酸縮水甘油酯、(甲基)丙烯醯胺、(甲基)丙烯腈、氟化(甲基)丙烯酸酯、聚矽氧(甲基)丙烯酸酯等單體成分(c)共聚合所得之(甲基)丙烯酸酯共聚物。 (甲基)丙烯酸系(共)聚合物之質量平均分子量較佳為10萬以上且150萬以下,其中,較佳為15萬以上或者130萬以下,其中,尤佳為20萬以上或者120萬以下。 於欲獲得凝集力較高之黏著組合物之情形時,就分子量越大,越可藉由分子鏈之交聯而獲得凝集力之觀點而言,(甲基)丙烯酸系(共)聚合物之質量平均分子量較佳為70萬以上且150萬以下,尤佳為80萬以上或者130萬以下。另一方面,於欲獲得流動性或應力緩和性較高之黏著組合物之情形時,質量平均分子量較佳為10萬以上且70萬以下,尤佳為15萬以上或者60萬以下。 另一方面,於使黏著片材等成形時不使用溶劑之情形時,由於不易使用分子量較大之聚合物,故而(甲基)丙烯酸系(共)聚合物之質量平均分子量較佳為10萬以上且70萬以下,尤佳為15萬以上或者60萬以下,其中,尤佳為20萬以上或者50萬以下。 (金屬腐蝕防止劑) 本組合物含有1,2,3-三唑。 1,2,3-三唑具有作為對導電構件之導電層之金屬腐蝕防止劑之功能。1,2,3-三唑由於對銅之耐銅腐蝕可靠性及作為黏著片材之耐發泡可靠性優異,因此含有1,2,3-三唑之本組合物可較佳地用作具有透明導電層及由包含銅之金屬材料形成之導體圖案(配線圖案)之導電構件。其原因在於推測藉由於由包含銅之金屬材料形成之導體圖案表面形成銅原子與1,2,3-三唑之分子化學鍵結而成之保護皮膜而防止腐蝕。又,於具有由包含銀之金屬材料形成之導體圖案之導電構件中,亦可同樣地實現利用1,2,3-三唑所得之保護皮膜之效果。 再者,存在1,2,4-三唑作為1,2,3-三唑之異構物。該1,2,4-三唑係熔點約為120℃之固體,另一方面,1,2,3-三唑之熔點約為20℃,於室溫下大致為液體狀態。因此,1,2,3-三唑具有混合於黏著劑組合物中時之分散性優異而可均勻地混合,又,容易母料化等優異之優勢。 於本組合物中,就金屬腐蝕防止劑之滲出或金屬腐蝕防止效果等觀點而言,較佳為以相對於(甲基)丙烯酸系(共)聚合物100質量份為0.01質量份以上且5質量份以下之比率含有1,2,3-三唑,其中,進一步較佳為以0.1質量份以上或者1質量份以下之比率含有1,2,3-三唑,其中,進一步較佳為以0.2質量份以上或者0.5質量份以下之比率含有1,2,3-三唑。 再者,本組合物中亦可將1,2,3-三唑與1,2,4-三唑併用。 (亞磷酸酯化合物) 本組合物可進而含有亞磷酸酯化合物。 亞磷酸酯化合物不僅其本身不具有腐蝕性,而且亦可使羧基等酸成分穩定。因此,藉由於包含特定之(甲基)丙烯酸系(共)聚合物之本組合物中調配亞磷酸酯化合物,即便本組合物包含酸成分,亦可防止作為被黏著體之導電構件之氧化劣化,於本組合物不包含酸成分之情形時,當然可防止作為被黏著體之導電構件之氧化劣化。 因此,若由含有亞磷酸酯化合物之本組合物形成黏著片材,則可具有對導電構件(典型而言,具有包含ITO之透明導電層及/或由包含銅或銀之金屬材料形成之導體圖案之導電構件)之耐腐蝕可靠性,並且可防止導電構件之氧化劣化。因此,例如可較佳地用作具有觸控面板之圖像顯示裝置用之黏著片材。 本組合物可含有之亞磷酸酯化合物並無限定。尤其較佳為下述式(1)所示之亞磷酸酯化合物。 式(1)      P[-OR]3 (式中之R為烴,具體而言,可列舉經取代或未經取代芳香族、脂肪環及烷基等;複數個R可彼此相同,亦可不同,相鄰之複數個R可彼此鍵結而形成飽和或不飽和之環結構) 又,亦可為包含2個以上之上述式(1)所表示之結構單元之化合物。 於包含特定之(甲基)丙烯酸系(共)聚合物及1,2,3-三唑之本組合物中調配上述式(1)所示之各種亞磷酸酯化合物,結果確認到任一亞磷酸酯化合物均顯示出防氧化劣化效果,且確認到尤其是對包含ITO之透明導電層之防氧化劣化效果優異。 作為本組合物所含有之亞磷酸酯化合物,例如可列舉:亞磷酸三苯酯、亞磷酸三(壬基苯基)酯、亞磷酸三甲酚酯、亞磷酸三硬脂酯、亞磷酸三乙酯、亞磷酸三(2-乙基己基)酯、亞磷酸三癸酯、亞磷酸三月桂酯、亞磷酸三(十三烷基)酯、亞磷酸三油酯、亞磷酸二苯酯(2-乙基己基)酯、亞磷酸二苯酯單癸酯、亞磷酸二苯酯單(十三烷基)酯、四苯基二伸丙基二丙二醇二亞磷酸酯、四苯基(四-十三烷基)季戊四醇四亞磷酸酯、四(C12~C15烷基)-4,4-亞異丙基二苯基二亞磷酸酯、亞磷酸三(2,4-二第三丁基苯基)酯、亞磷酸三(4-壬基苯基)酯、3,9-雙(壬基苯氧基)-2,4,8,10-四氧雜-3,9-二磷雜螺[5,5]十一烷、3,9-雙(4-壬基苯氧基)-2,4,8,10-四氧雜-3,9-二磷雜螺[5,5]十一烷、3,9-雙(癸氧基)-2,4,8,10-四氧雜-3,9-二磷雜螺[5,5]十一烷、3,9-雙(十三烷氧基)-2,4,8,10-四氧雜-3,9-二磷雜螺[5,5]十一烷、3,9-雙(硬脂氧基)-2,4,8,10-四氧雜-3,9-二磷雜螺[5,5]十一烷、3,9-雙(2,6-二第三丁基-4-甲基苯氧基)-2,4,8,10-四氧雜-3,9-二磷雜螺[5,5]十一烷、3,9-雙(2,4-二第三丁基苯氧基)-2,4,8,10-四氧雜-3,9-二磷雜螺[5,5]十一烷、3,9-雙{2,4-雙(1-甲基-1-苯基乙基)苯氧基}-2,4,8,10-四氧雜-3,9-二磷雜螺[5,5]十一烷、2,2'-亞甲基雙(4,6-二第三丁基-1-苯基)亞磷酸酯、4,4'-亞異丙基二苯酚C12-15醇亞磷酸酯、二硬脂基季戊四醇二亞磷酸酯、2,4,8,10-四(1,1-二甲基乙基)-6-{(2-乙基己基)氧基}-12H-二苯并[d,g][1,3,2]二氧磷雜八環、2,4,8,10-四(1,1-二甲基乙基)-6-(十三烷氧基)-12H-二苯并[d,g][1,3,2]二氧磷雜八環、1,1'-聯苯-4,4'-二基雙[亞磷酸雙(2,4-二第三丁基苯基)酯]、氫化雙酚A-季戊四醇亞磷酸酯聚合物、氫化雙酚A亞磷酸酯聚合物、亞磷酸二乙酯、亞磷酸雙(2-乙基己基)酯、亞磷酸二月桂酯、亞磷酸二油酯、亞磷酸二苯酯等。 其中,作為本組合物所含有之亞磷酸酯化合物,例如若考慮到與本組合物之相溶性,則較佳為脂肪族亞磷酸酯(例如,作為實施例2-2之亞磷酸酯化合物之亞磷酸三癸酯或實施例2-3之3,9-雙(癸氧基)-2,4,8,10-四氧雜-3,9-二磷雜螺[5.5]十一烷等)。又,若考慮到耐水解性,則較佳為芳香族亞磷酸酯(例如,作為實施例2-1之亞磷酸酯化合物之亞磷酸三(2,4-二第三丁基苯基)酯等)。又,若考慮到溶解性與耐水解性之平衡性,則較佳為亞磷酸二苯酯單(十三烷基)酯等兼具脂肪族酯基與芳香族酯基之亞磷酸酯。 於本組合物中,關於亞磷酸酯化合物之含有比率,就無損黏著性能且可更有效地抑制ITO等之導電構件之氧化劣化之觀點而言,較佳為以相對於(甲基)丙烯酸系(共)聚合物100質量份為0.0001(1×10-4 )質量份以上且2.0質量份以下之比率含有亞磷酸酯化合物,其中,進一步較佳為以0.0005質量份以上或者0.8質量份以下之比率含有亞磷酸酯化合物,其中,進一步較佳為以0.001質量份以上或者0.7質量份以下之比率含有亞磷酸酯化合物,尤其進一步較佳為以0.01質量份以上或者0.6質量份以下之比率含有亞磷酸酯化合物。 (其他金屬腐蝕防止劑) 於本組合物中,除1,2,3-三唑及亞磷酸酯化合物以外,亦可併用1,2,4-三唑、苯并三唑及其衍生物等其他金屬腐蝕防止劑。 (交聯劑) 本組合物亦可視需要包含交聯劑。 例如,作為使上述(甲基)丙烯酸系(共)聚合物進行交聯之方法,可列舉:添加可與導入至(甲基)丙烯酸系(共)聚合物中之羥基或羧基等反應性基化學鍵結之交聯劑,並藉由加熱或熟化使之反應之方法;或添加作為交聯劑之具有2個以上之(甲基)丙烯醯基之多官能(甲基)丙烯酸酯及光聚合起始劑等反應起始劑,並藉由紫外線照射等使之交聯之方法。其中,就不會因反應而消耗本組合物中之羧基等極性官能基而可維持源自極性成分之較高之凝集力或黏著物性之觀點而言,較佳為藉由紫外線等光照射之交聯方法。 作為上述交聯劑,例如可列舉具有選自(甲基)丙烯醯基、環氧基、異氰酸酯基、羧基、羥基、碳二醯亞胺基、㗁唑啉基、氮丙啶基、乙烯基、胺基、亞胺基、醯胺基、N-取代(甲基)丙烯醯胺基、烷氧基矽烷基中之至少1種交聯性官能基之交聯劑,可使用1種,或亦可將2種以上組合使用。再者,交聯性官能基亦可由可脫保護之保護基保護。 其中,就交聯反應之控制之容易性之觀點而言,較佳為多官能(甲基)丙烯酸酯。 作為此種多官能(甲基)丙烯酸酯,例如可列舉:1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、聚伸烷基二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、甘油二(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、三季戊四醇五(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、異氰尿酸三(丙烯醯氧基乙基)酯等紫外線硬化型之多官能單體類,以及聚酯(甲基)丙烯酸酯、環氧(甲基)丙烯酸酯、(甲基)丙烯酸胺基甲酸酯、聚醚(甲基)丙烯酸酯等多官能丙烯酸系低聚物類或多官能丙烯醯胺等。 又,作為具有2種以上之交聯性官能基之交聯劑,例如可列舉:(甲基)丙烯酸縮水甘油酯、α-乙基丙烯酸縮水甘油酯、(甲基)丙烯酸-3,4-環氧丁酯、4-羥基丁基(甲基)丙烯酸酯縮水甘油醚等含環氧基單體;(甲基)丙烯酸2-異氰酸酯基乙酯、異氰酸2-(2-(甲基)丙烯醯氧基乙氧基)乙酯、(甲基)丙烯酸2-(0-[1'-甲基亞丙基胺基]羧基胺基)乙酯、(甲基)丙烯酸2-[(3,5-二甲基吡唑基)羰基胺基]乙酯等含異氰酸酯基或封端異氰酸酯基之單體;乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、3-縮水甘油氧基丙基三甲氧基矽烷、3-(甲基)丙烯醯氧基丙基甲基二乙氧基矽烷、3-(甲基)丙烯醯氧基丙基三乙氧基矽烷、N-2-(胺基乙基)-3-胺基丙基甲基二甲氧基矽烷、3-異氰酸酯基丙基三乙氧基矽烷等各種矽烷偶合劑。 具有2種以上之交聯性官能基之交聯劑亦可採用使一官能基與(甲基)丙烯酸系(共)聚合物反應而鍵結於(甲基)丙烯酸系(共)聚合物所成之結構。藉由採用此種結構,可使例如(甲基)丙烯醯基或乙烯基等雙鍵性之交聯性官能基化學鍵結於(甲基)丙烯酸系(共)聚合物。又,藉由使交聯劑鍵結於(甲基)丙烯酸系(共)聚合物,有可抑制交聯劑之滲出或本黏著片材之意外之塑化之傾向。又,藉由使交聯劑鍵結於(甲基)丙烯酸系(共)聚合物而促進光交聯反應之反應效率,因此有可獲得凝集力更高之硬化物之傾向。 本組合物亦可進而含有可與交聯劑之交聯性官能基反應之單官能單體。作為此種單官能單體,例如可列舉:丙烯酸甲酯等(甲基)丙烯酸烷基酯;(甲基)丙烯酸羥乙酯、(甲基)丙烯酸羥丙酯、(甲基)丙烯酸羥丁酯、聚伸烷基二醇(甲基)丙烯酸酯等含羥基(甲基)丙烯酸酯;(甲基)丙烯酸、2-(甲基)丙烯醯氧基乙基六氫鄰苯二甲酸、2-(甲基)丙烯醯氧基丙基六氫鄰苯二甲酸、2-(甲基)丙烯醯氧基乙基鄰苯二甲酸、2-(甲基)丙烯醯氧基乙基順丁烯二酸、2-(甲基)丙烯醯氧基丙基順丁烯二酸、2-(甲基)丙烯醯氧基乙基琥珀酸、2-(甲基)丙烯醯氧基丙基琥珀酸、丁烯酸、反丁烯二酸、順丁烯二酸、伊康酸等含羧基單體;順丁烯二酸酐、伊康酸酐等含酸酐基單體;(甲基)丙烯酸四氫糠酯、甲氧基聚乙二醇(甲基)丙烯酸酯等含醚基(甲基)丙烯酸酯;(甲基)丙烯醯胺、二甲基(甲基)丙烯醯胺、二乙基(甲基)丙烯醯胺、(甲基)丙烯醯基嗎啉、異丙基(甲基)丙烯醯胺、二甲胺基丙基(甲基)丙烯醯胺、苯基(甲基)丙烯醯胺、N-甲氧基甲基(甲基)丙烯醯胺、N-丁氧基甲基(甲基)丙烯醯胺等(甲基)丙烯醯胺系單體等。 其中,就提高對被黏著體之密接性或濕熱白化抑制之效果之觀點而言,較佳為使用含羥基(甲基)丙烯酸酯或(甲基)丙烯醯胺系單體。 關於交聯劑之含量,就使本組合物之柔軟性與凝集力平衡之觀點而言,較佳為以相對於上述(甲基)丙烯酸系(共)聚合物100質量份而為0.01以上且10質量份以下之比率調配,其中,尤佳為0.05質量份以上或者8質量份以下,其中,尤佳為0.1質量份以上或者5質量份以下。 再者,於本黏著片材為多層之情形時,關於構成黏著片材之層中之中間層或成為基材之層,交聯劑之含量亦可超過上述範圍。中間層或成為基材之層中之交聯劑之含量較佳為以相對於上述(甲基)丙烯酸系(共)聚合物100質量份而為0.01以上且40質量份以下之比率調配,其中,尤佳為1質量份以上或者30質量份以下,其中,尤佳為2質量份以上或者25質量份以下。 (光聚合起始劑) 於藉由光照射進行交聯之情形時,較佳為含有光聚合起始劑。 基於光聚合起始劑之自由基產生機構被分為2大類,有將自身之單鍵裂解並分解而產生自由基之α裂解型、及自系統中之化合物中使氫激發而產生自由基之脫氫型。該等之中,較佳為使用脫氫型光交聯起始劑。 其中,於使用具有(甲基)丙烯醯基之有機系交聯劑作為交聯劑之情形時,尤佳為進而添加光聚合起始劑。原因在於藉由光照射產生自由基而成為系統中之聚合反應之起點。 光聚合起始劑可適當使用目前公知者。其中,就交聯反應之控制之容易性之觀點而言,較佳為感應到波長380 nm以下之紫外線之光聚合起始劑。 另一方面,就可獲得較高之光反應性之方面及所感應之光容易到達至本黏著片材之深部之方面而言,較佳為感應到長於波長380 nm之波長之光之光聚合起始劑。 光聚合起始劑根據自由基產生機構而被分成2大類,大致分成可將光聚合起始劑自身之單鍵裂解分解而產生自由基之裂解型光聚合起始劑、及經光激發之起始劑與系統中之氫供與體形成激發錯合物並可使氫供與體之氫轉移之脫氫型光聚合起始劑。 該等中之裂解型光聚合起始劑於藉由光照射產生自由基時會分解而成為另一化合物,一旦被激發,則會失去作為交聯起始劑之功能。因此,不會以活性種之形式殘存於交聯反應結束後之黏著材中,從而不可能使黏著材產生意外之光劣化等,故而較佳。 另一方面,脫氫型光聚合起始劑於藉由紫外線等活性能量線照射產生自由基之反應時,不會產生如裂解型光聚合起始劑之分解物,因此就反應結束後不易成為揮發成分,從而可降低對被黏著體之損傷之方面而言有用。 作為上述裂解型光聚合起始劑,就對光之感應性較高且反應後成為分解物並脫色之方面而言,較佳為雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦、2,4,6-三甲基苯甲醯基二苯基氧化膦、(2,4,6-三甲基苯甲醯基)乙氧基苯基氧化膦、雙(2,6-二甲氧基苯甲醯基)2,4,4-三甲基戊基氧化膦等醯基氧化膦系光聚合起始劑。 作為上述脫氫型光聚合起始劑,例如可列舉:二苯甲酮、4-甲基-二苯甲酮、2,4,6-三甲基二苯甲酮、4-苯基二苯甲酮、3,3'-二甲基-4-甲氧基二苯甲酮、4-(甲基)丙烯醯氧基二苯甲酮、4-[2-((甲基)丙烯醯氧基)乙氧基]二苯甲酮、4-(甲基)丙烯醯氧基-4'-甲氧基二苯甲酮、2-苯甲醯苯甲酸甲酯、苯甲醯甲酸甲酯、二乙二醇雙(2-苯基-2-側氧基乙酸酯)、4-(1,3-丙烯醯基-1,4,7,10,13-五氧雜十三烷基)二苯甲酮、9-氧硫𠮿

Figure 105143084-A0305-003-019-001
、2-氯-9-氧硫𠮿
Figure 105143084-A0305-003-019-002
、3-甲基-9-氧硫𠮿
Figure 105143084-A0305-003-019-003
、2,4-二甲基-9-氧硫𠮿
Figure 105143084-A0305-003-019-004
蒽醌、2-甲基蒽醌、2-乙基蒽醌、2-第三丁基蒽醌、2-胺基蒽醌、樟腦醌或其衍生物等。 該等之中,較佳為二苯甲酮、4-甲基-二苯甲酮、2,4,6-三甲基二苯甲酮、4-苯基二苯甲酮、3,3'-二甲基-4-甲氧基二苯甲酮、4-(甲基)丙烯醯氧基二苯甲酮、4-[2-((甲基)丙烯醯氧基)乙氧基]二苯甲酮、4-(甲基)丙烯醯氧基-4'-甲氧基二苯甲酮、2-苯甲醯苯甲酸甲基、苯甲醯基甲酸甲基。 再者,上述所列舉之光聚合起始劑既可使用任1種或其衍生物,亦可將該等之2種以上組合使用。 進而,除光聚合起始劑以外,亦可使用增感劑。作為增感劑,並無特別限定,只要為光聚合起始劑所使用之增感劑,則可無問題地使用。例如可列舉:芳香族胺或蒽衍生物、蒽醌衍生物、香豆素衍生物、9-氧硫
Figure 105143084-A0305-003-020-001
衍生物、酞菁衍生物等或二苯甲酮、𠮿酮、9-氧硫𠮿
Figure 105143084-A0305-003-020-002
、米其勒酮、9,10-菲醌等芳香族酮及該等之衍生物等。 再者,光聚合起始劑或增感劑亦可以鍵結於(甲基)丙烯酸系(共)聚合物之狀態包含。作為使光聚合起始劑或增感劑鍵結於(甲基)丙烯酸系(共)聚合物之方法,可採用與使上述交聯劑鍵結於(甲基)丙烯酸系(共)聚合物之情形時相同之方法。 光聚合起始劑之含量並無特別限制,典型而言,尤佳為以相對於(甲基)丙烯酸系(共)聚合物100質量份而為0.1以上且10質量份以下之比率調整,其中,尤佳為以0.2質量份以上或者5質量份以下之比率調整,其中,尤佳為以0.5質量份以上或者3質量份以下之比率調整。其中,亦可因與其他要素之平衡性而超出該範圍。 (抗氧化劑) 除上述以外,本組合物亦可視需要含有抗氧化劑。 作為抗氧化劑,例如可列舉:2,2'-亞甲基雙(4-甲基-6-第三丁基苯酚)、己二醇-雙(3,5-二第三丁基-4-羥基氫化肉桂酸酯)、四[亞甲基(3,5-二第三丁基-4-羥基氫化肉桂酸酯)]甲烷、三乙二醇-雙-3-(3-第三丁基-4-羥基-5-甲基苯基)丙酸酯、1,3,5-三甲基-2,4,6-三(3,5-二第三丁基-4-羥基-苄基)苯、3-(4'-羥基-3',5'-二第三丁基苯酚基)丙酸正十八烷基酯、4,4'-亞甲基雙(2,6-二第三丁基苯酚)、4,4'-亞丁基-雙-(6-第三丁基-3-甲基-苯酚)等受阻酚系抗氧化劑或硫系、胺系等各種抗氧化劑。 (其他成分) 進而,本組合物亦可適當含有通常之黏著劑組合物中所調配之公知之成分。例如,可適當含有光穩定劑、紫外線吸收劑、金屬鈍化劑、防銹劑(上述金屬腐蝕防止劑除外)、抗老化劑、抗靜電劑、吸濕劑、發泡劑、消泡劑、無機粒子、黏度調整劑、黏著賦予樹脂、光敏劑、螢光劑等各種添加劑,或反應觸媒(三級胺系化合物、四級銨系化合物、月桂酸錫化合物等)。 (黏著劑組合物之調整) 本黏著片材所使用之黏著劑組合物(本組合物)係藉由將(甲基)丙烯酸系(共)聚合物、1,2,3-三唑及視需要之其他成分、例如亞磷酸酯化合物、交聯劑等分別以特定量進行混合而獲得。 作為該等之混合方法,並無特別限制,各成分之混合順序亦無特別限定。又,亦可於製造本組合物時添加熱處理步驟,於此情形時,較理想為預先將本組合物之各成分進行混合後進行熱處理。亦可使用將各種混合成分濃縮後母料化而成者。 又,混合時之裝置亦並無特別限制,例如可使用萬能混練機、行星式攪拌機、班布里混合機、捏合機、框式混合機、加壓捏合機、三輥研磨機、雙輥研磨機。亦可視需要使用溶劑進行混合。又,本組合物亦可用作不包含溶劑之無溶劑系。藉由用作無溶劑系,可具備不會殘存溶劑而耐熱性及耐光性增高之優勢。 進而,本組合物亦可以如下方式使用:預先製成包含構成(甲基)丙烯酸系(共)聚合物之單體成分、1,2,3-三唑、光聚合起始劑及其他任意成分之組合物,於將其用作導電構件用黏著片材時,進行光照射以進行聚合反應而生成(甲基)丙烯酸系(共)聚合物。 <導電構件用黏著片材之形態> 本黏著片材除可將本組合物直接塗佈於被黏著體並形成為片狀後使用以外,亦可製成於脫模膜上成型為單層或多層之片狀之附脫模膜之黏著片材。 作為該脫模膜之材質,例如可列舉:聚酯膜、聚烯烴膜、聚碳酸酯膜、聚苯乙烯膜、丙烯酸膜、三乙醯纖維素膜、氟樹脂膜等。該等之中,尤佳為聚酯膜及聚烯烴膜。 脫模膜之厚度並無特別限制。其中,例如就加工性及操作性之觀點而言,較佳為25 μm~500 μm,其中,進而較佳為38 μm以上或者250 μm以下,其中,進而較佳為50 μm以上或者200 μm以下。 再者,本黏著片材亦可採用未如上所述般使用被黏著體或脫模膜而將本組合物直接擠出成形之方法或藉由注入至模具中成形之方法。進而,藉由將本組合物直接填充至導電構件等構件間,亦可製成黏著片材之態樣。 <導電構件用黏著片材之物性> (對導電構件之導電層之防腐效果) 本黏著片材具有對導電構件、尤其是透明導電層或由包含銅之金屬材料形成之導體圖案之防腐性。因此,可將利用以下之(1)~(2)之方法所測得之ITO電阻值之變化率[((Ω/Ω0)-1)×100]設為未達5%,其中,可設為未達3%。又,可將利用以下之(3)~(4)之方法所測得之銅電阻值之變化率[((Ω/Ω0)-1)×100]設為未達20%,其中,可設為未達10%,進而可設為未達5%,尤其可設為未達3%。 (1)將導電構件用黏著劑組合物(本組合物)製膜成厚度150 μm之片狀而製成黏著片材,並將上述黏著片材貼合於包含氧化銦(ITO)之ITO配線形成於玻璃基板上而成之評價用ITO玻璃基板而製作附黏著片材之ITO配線。 (2)預先測定上述附黏著片材之ITO配線中之ITO配線之室溫下之電阻值(Ω0),並於65℃・90%RH環境下將上述附黏著片材之ITO配線保管500小時,測定上述附黏著片材之ITO配線中之ITO配線之上述保管後之電阻值(Ω)。 (3)將導電構件用黏著劑組合物(本組合物)製膜成厚度150 μm之片狀而製成黏著片材,並將上述黏著片材貼合於銅配線形成於玻璃基板上而成之評價用銅玻璃基板而製作附黏著片材之銅配線。 (4)預先測定上述附黏著片材之銅配線中之銅配線之室溫下之電阻值(Ω0),並於65℃・90%RH環境下將上述附黏著片材之銅配線保管500小時,測定上述附黏著片材之銅配線中之銅配線之上述保管後之電阻值(Ω)。 (透明性) 本黏著片材較佳為光學透明。即,較佳為透明黏著片材。此處,所謂「光學透明」,意在總光線透過率為80%以上,較佳為85%以上,更佳為90%以上。 (厚度) 本黏著片材之厚度較佳為10 μm以上且500 μm以下,其中,更佳為15 μm以上或者400 μm以下,其中,尤其進而較佳為20 μm以上或者350 μm以下。 <導電構件用黏著片材之用途> 本黏著片材於例如個人電腦、行動設備終端(PDA)、遊戲機、電視(TV)、汽車導航系統、觸控面板、手寫板等圖像顯示裝置、例如電漿顯示器(PDP)、液晶顯示器(LCD)、有機EL顯示器(OLED)、無機EL顯示器、電泳顯示器(EPD)、干擾調變顯示器(IMOD)等使用圖像顯示面板之圖像顯示裝置中,適合貼合各構成構件、其中導電構件、其中具有透明導電層及/或由包含銅之金屬材料形成之導體圖案之導電構件。又,亦適合貼合包含含有ITO或者IGZO之透明導電層及/或具有由包含銅或銀之金屬材料形成之導體圖案之透明導電層之導電構件。 <導電構件積層體> 本發明之導電構件積層體(以下,亦省略後稱為「本積層體」)可藉由將本黏著片材與導電構件、例如透明導電層之導電層面貼合而獲得。 本積層體只要具有至少將本黏著片材之任一黏著劑層面與透明導電層之導電層面貼合而成之構成即可。 於本黏著片材為兩面黏著片材之情形時,本積層體亦可具有將本黏著片材之兩黏著劑層面與透明導電層之導電層面貼合而成之構成。 上述透明導電層亦可以覆蓋其導電膜之導電層面之方式形成利用烯烴系聚合物、胺基甲酸酯系聚合物、環氧系聚合物、丙烯酸系聚合物、聚矽氧系聚合物、或者無機玻璃等而形成之絕緣保護膜(鈍化膜)。 於此情形時,本黏著片材並未與透明導電層面直接貼合(並未與透明導電層面直接相接)。本黏著片材即便源自本組合物之成分(尤其是酸成分)浸透而自該絕緣膜到達至透明導電層,亦可藉由1,2,3-三唑之作用防止透明導電層腐蝕。尤其是由於1,2,3-三唑之水溶性較高,於本黏著片材於濕熱環境下吸濕時容易移動至透明導電層,故而可實現優異之金屬腐蝕防止效果。 如此,根據本黏著片材,不論有無絕緣保護膜,不僅可實現被黏著體之金屬離子所導致之黏著劑層之變色或變質防止效果,亦可實現針對被黏著體之優異之金屬腐蝕防止效果。 與導電層面貼合所得之本積層體可較佳地用於觸控面板。作為觸控面板,可列舉電阻膜方式、靜電電容方式、電磁感應方式等方式者,較佳為靜電電容方式。 作為上述透明導電層,只要為至少於單面之表層具有導電層者即可,可列舉藉由蒸鍍或濺鍍、塗佈等於透明基材之表層設置有導電物質而成之透明導電層。 透明導電層之導電層所使用之導電物質並無特別限定,具體而言,除氧化銦、銦-鎵-鋅複合氧化物、摻錫之氧化銦(ITO)、氧化鋅、氧化鎵、氧化鈦等金屬氧化物以外,亦可列舉銀、銅、鉬、鋁等金屬材料。其中,可較佳地使用透明性優異之摻錫之氧化銦(ITO)及銦-鎵-鋅複合氧化物(IGZO)。又,就導電性優異之觀點而言,亦可較佳地使用銅或銀。於透明導電層中,作為欲利用導電物質形成圖案之基材,並無特別限定,可列舉玻璃、樹脂膜等。 典型而言,透明導電層至少於單面之表層具有導電層。又,典型而言,於透明導電層以引繞周邊部之方式形成有將銅或銀作為主成分之導體圖案(配線圖案)。1,2,3-三唑對其中之銅之耐腐蝕可靠性較高,因此包含其之本黏著片材可尤其較佳地用於具備由包含銅之金屬材料形成之導體圖案之導電構件。 作為其他本積層體之具體例,例如可列舉:脫模膜/本黏著片材/觸控面板、脫模膜/本黏著片材/保護面板、脫模膜/本黏著片材/圖像顯示面板、圖像顯示面板/本黏著片材/觸控面板、圖像顯示面板/本黏著片材/保護面板、圖像顯示面板/本黏著片材/觸控面板/本黏著片材/保護面板、偏光膜/本黏著片材/觸控面板、偏光膜/本黏著片材/觸控面板/本黏著片材/保護面板等構成。又,於上述構成中,可列舉於本黏著片材與和其相鄰之觸控面板、保護面板、圖像顯示面板、偏光膜等構件之間介置有上述導電層之所有構成。但是,並不限定於該等積層例。 再者,上述觸控面板亦包含使觸控面板功能內置於保護面板而成之結構體或使觸控面板功能內置於圖像顯示面板而成之結構體。 <圖像顯示裝置> 本發明之圖像顯示裝置(以下,亦省略後稱為「本裝置」)至少具有本積層體、圖像顯示面板及表面保護面板作為構成構件。 更具體而言,可列舉將本黏著片材與透明導電層之導電層面貼合而得之本積層體插入至圖像顯示面板與表面保護面板之間之構成之圖像顯示裝置。此時,於圖像顯示面板側亦使用本黏著片材。 作為表面保護面板之材質,除玻璃以外,亦可為丙烯酸系樹脂、聚碳酸酯系樹脂、環烯烴聚合物等脂環式聚烯烴系樹脂、苯乙烯系樹脂、聚氯乙烯系樹脂、酚系樹脂、三聚氰胺系樹脂、環氧系樹脂等塑膠。 圖像顯示面板係由除偏光膜以外之相位差膜等其他光學膜、液晶材料及背光光源系統構成(通常,本組合物或黏著物品對圖像顯示面板之被接著面成為光學膜),根據液晶材料之控制方式而存在STN(Super Twisted Nematic,超扭轉向列)方式或VA(Vertical Aligned,垂直配向)方式或IPS(In-Plane Switching,橫向電場效應)方式等,可為任何方式。 作為本圖像顯示裝置,例如可構成液晶顯示器、有機EL顯示器、無機EL顯示器、電子紙、電漿顯示器及微機電系統(MEMS)顯示器等圖像顯示裝置。 <語句之說明> 於本說明書中,於表述為「X~Y」(X、Y為任意之數字)之情形時,只要未特別說明,則包含「X以上且Y以下」之意義,並且包含「較佳為大於X」或者「較佳為小於Y」之意義。 又,於表述為「X以上」(X為任意之數字)或者「Y以下」(Y為任意之數字)之情形時,包含「較佳為大於X」或者「較佳為未達Y」之意圖。 一般而言,所謂「片材」,於JIS中之定義中,係指較薄、其厚度小於長度與寬度之商且平坦之製品,一般而言,所謂「膜」,係與長度及寬度相比厚度極小且最大厚度被任意地限定之較薄且平坦之製品,通常係指以輥之形供給者(日本工業標準JIS K6900)。然而,片材與膜之交界並不確定,於本發明中,無需於語言上對兩者進行區別,因此,於本發明中,於稱為「膜」之情形時亦包含「片材」,於稱為「片材」之情形時亦包含「膜」。 [實施例] 以下,藉由實施例及比較例進而詳細地進行說明。但是,本發明並不限定於該等實施例。 <(甲基)丙烯酸系(共)聚合物> (甲基)丙烯酸系(共)聚合物使用以下者。 ・A-1:包含丙烯酸2-乙基己酯76質量份、乙酸乙烯酯20質量份及丙烯酸4質量份之共聚物(質量平均分子量40萬) ・A-2:包含丙烯酸丁酯81質量份、甲基丙烯酸甲酯15質量份及丙烯酸4質量份之共聚物(質量平均分子量20萬) <實施例1> [實施例1-1] 向(甲基)丙烯酸系(共)聚合物(A-1)1 kg中添加1,2,3-三唑(大塚化學公司製造)3 g作為金屬腐蝕防止劑、及4-甲基二苯甲酮與2,4,6-三甲基二苯甲酮之混合物(Lamberti公司製造,商品名「Esacure TZT」)15 g作為光聚合起始劑並均勻混合,獲得黏著劑層用樹脂組合物。 將黏著劑層用樹脂組合物夾於經剝離處理之2片聚對苯二甲酸乙二酯膜(三菱樹脂公司製造,商品名「DIAFOIL MRV」,厚度100 μm及三菱樹脂公司製造,商品名「DIAFOIL MRQ」,厚度75 μm)之間,並以黏著片材之厚度成為150 μm之方式賦形成片狀,製作黏著片材積層體。針對該黏著片材積層體,進行下述各種評價。結果示於表1。 [實施例1-2] 向(甲基)丙烯酸系(共)聚合物(A-2)1 kg中添加作為金屬腐蝕防止劑之1,2,3-三唑3 g、作為交聯劑之紫外線硬化樹脂丙氧化季戊四醇三丙烯酸酯(新中村工業股份有限公司,商品名「ATM-4PL」)20 g、作為光聚合起始劑之4-甲基二苯甲酮及2,4,6-三甲基二苯甲酮之混合物(Lamberti公司製造,商品名「Esacure TZT」)15 g,並均勻混合,獲得黏著劑層用樹脂組合物。 繼而,將上述黏著劑層用樹脂組合物以厚度成為150 μm之方式於經剝離處理之聚對苯二甲酸乙二酯膜(三菱樹脂公司製造,商品名「DIAFOIL MRV」,厚度100 μm)上成形為片狀後,被覆經剝離處理之聚對苯二甲酸乙二酯膜(三菱樹脂公司製造,商品名「DIAFOIL MRQ」,厚度75 μm),製作黏著片材積層體。針對該黏著片材積層體,進行下述各種評價。結果示於表1。 [實施例1-3] 使用作為金屬腐蝕防止劑之1,2,3-三唑5 g,除此以外,以與實施例1-2相同之方式製作黏著片材積層體。針對該黏著片材積層體,進行下述各種評價。結果示於表1。 [比較例1-1] 未添加作為金屬腐蝕防止劑之1,2,3-三唑,除此以外,以與實施例1-1相同之方式製作黏著片材積層體。針對該黏著片材積層體,進行下述各種評價。結果示於表1。 [比較例1-2] 使用苯并三唑(城北化學公司製造、商品名「BT120」)5 g代替1,2,3-三唑作為金屬腐蝕防止劑,除此以外,以與實施例1-1相同之方式製作黏著片材積層體。針對該黏著片材積層體,進行下述各種評價。結果示於表1。 [比較例1-3] 使用甲苯并三唑(4-甲基苯并三唑與5-甲基苯并三唑之混合物)(Shipro Kasei公司製造,商品名「SEETEC TT-R」)5 g代替1,2,3-三唑作為金屬腐蝕防止劑,除此以外,以與實施例1-1相同之方式製作黏著片材積層體。針對該黏著片材積層體,進行下述各種評價。結果示於表1。 [比較例1-4] 使用2,5-二巰基-1,3,4-噻二唑(TOYOBO公司製造,商品名「MTD」)5 g代替1,2,3-三唑作為金屬腐蝕防止劑,除此以外,以與實施例1-1相同之方式製作黏著片材積層體。針對該黏著片材積層體,進行下述各種評價。結果示於表1。 <各種評價> (1)耐腐蝕可靠性 於玻璃基板(60 mm×45 mm)上以線寬70 μm、線長度46 mm、線間隔30 μm並以往返10.5次之方式形成將厚度1300 Å之ITO、厚度3000 Å之銅膜依序積層而成之金屬膜之往返線,並且於該往返線之兩末端形成2 mm見方之正方形而形成銅圖案(長度約97 cm),製作耐腐蝕可靠性評價用銅玻璃基板(參照圖1(A))。 將上述實施例及比較例中製作之黏著片材積層體(黏著片材厚度150 μm)之單面之剝離膜剝離,並利用手壓輥將聚對苯二甲酸乙二酯(PET)膜(東洋紡織公司製造,商品名「COSMOSHINE A4100」,125 μm)貼附於其露出面。繼而,將上述附PET膜之黏著片材切成52 mm×45 mm後,將剩下之剝離膜剝離,如圖1(B)所示,以將金屬膜之往返線上被覆之方式利用手壓輥將該黏著片材貼附於耐腐蝕可靠性評價用銅玻璃基板,進而,隔著PET膜,以實施例1-1及比較例1-1~1-4之波長365 nm之累計光量成為3000 mJ/cm2 、實施例1-2及1-3之波長365 nm之累計光量成為2000 mJ/cm2 之方式利用高壓水銀燈照射紫外線,使之進行紫外線交聯,製作耐腐蝕可靠性評價用樣品(附黏著片材之銅配線)(參照圖1(D))。 預先測定該耐腐蝕可靠性評價用樣品(附黏著片材之銅配線)中之銅配線之室溫下之電阻值(Ω0)。 另一方面,將該耐腐蝕可靠性評價用樣品(附黏著片材之銅配線)於65℃・90%RH環境下保管500小時,保管後測定耐腐蝕可靠性評價用樣品(附黏著片材之銅配線)中之銅配線之電阻值(Ω)。 並且,算出銅電阻值、即線末端間電阻值之變化率(%)[((Ω/Ω0)-1)×100],於表1中表示成「電阻值變化」。 關於耐腐蝕可靠性,將電阻值之變化率為20%以上者判定為「×(poor)」,將未達20%者判定為「○(good)」。結果示於表1。 (2)耐發泡可靠性 將實施例及比較例中製作之黏著片材積層體(厚度150 μm)之單面之剝離膜剝離,並利用手動輥貼合於鈉鈣玻璃板(150×200 mm,厚度0.55 mm)。進而,將剩餘之剝離膜剝離,一面使化學強化玻璃板(180×220 mm,厚度0.6 mm)對齊,一面利用手動輥貼合。 繼而,將貼合品於60℃、0.2 MPa環境下進行20分鐘高壓釜處理。使用金屬鹵化物燈照射裝置(牛尾電機公司製造,型號UVC-0516S1,LAMP UVL-8001M3-N),以每照射1次而波長365 nm下之照射量成為3000 mJ/cm2 之方式調整輸送帶速度、放射照度,針對該樣品照射15次後,觀察外觀之變化。 關於耐發泡可靠性,於對外觀進行觀察時,將與紫外線照射前不存在變化者判定為「○(good)」,將產生氣泡者判定為「×(poor)」。結果示於表1。 (3)紫外線硬化特性 (紫外線硬化前儲存彈性模數G') 紫外線硬化前之儲存彈性模數係藉由如下而求出:將將使實施例及比較例中製作之黏著片材以成為1~2 mm厚度之方式積層而成者沖裁成直徑20 mm之圓狀而成者作為測定試樣,並使用流變儀(英弘精機股份有限公司製造之「MARS」),以黏著治具:Φ25 mm平行板、應變:0.5%、頻率:1 Hz、溫度:-50~200℃、升溫速度:3℃/min測定-50℃~200℃下之動態儲存彈性模數G',並讀取125℃下之儲存彈性模數值。結果示於表1。 (紫外線硬化後儲存彈性模數G') 紫外線硬化後之儲存彈性模數係以如下方式進行測定。 利用高壓水銀燈隔著PET膜對實施例及比較例中製作之黏著片材照射紫外線而使之進行紫外線交聯。此時,關於實施例1-1及比較例1-1~1-4,以波長365 nm之累計光量成為3000 mJ/cm2 之方式進行照射,實施例1-2及1-3係以該積層光量成為2000 mJ/cm2 之方式進行照射。將使以如上方式進行紫外線交聯後之黏著片材以成為厚度1~2 mm之方式積層並沖裁成直徑20 mm之圓狀而成者作為測定試樣。 使用流變儀(英弘精機股份有限公司製造,商品名「MARS」)以黏著治具:Φ25 mm平行板、應變:0.5%、頻率:1 Hz、溫度:-50~200℃、升溫速度:3℃/min測定-50℃~200℃下之該測定試樣之動態儲存彈性模數G',並讀取125℃下之儲存彈性模數值,藉此求出紫外線硬化後之儲存彈性模數。結果示於表1。 關於紫外線硬化特性,對紫外線硬化前儲存彈性模數G'與紫外線硬化後儲存彈性模數G'進行比較,將硬化後之值明顯上升者判定為「○(good)」,將值幾乎未變化者判定為「×(poor)」。結果示於表1。 [表1]
Figure 105143084-A0304-0001
(評價結果) 實施例1-1~1-3之黏著片材含有1,2,3-三唑作為金屬腐蝕防止劑,藉此,銅配線之電阻值之變化較少,且耐腐蝕可靠性優異。又,耐發泡可靠性、紫外線硬化特性亦良好。 另一方面,比較例1-1不包含金屬腐蝕防止劑,而耐腐蝕可靠性較差。 比較例1-2雖包含苯并三唑作為金屬腐蝕防止劑,但因苯并三唑之特性而耐發泡可靠性較差。 比較例1-3雖包含甲苯并三唑作為金屬腐蝕防止劑,但因甲苯并三唑之特性而耐發泡可靠性較差。 比較例1-4雖包含二巰基噻二唑作為金屬腐蝕防止劑,但由於二巰基噻二唑會吸收紫外線,故而黏著片材之紫外線硬化特性較差。 根據以上之結果可知,1,2,3-三唑由於熔點約為20℃,且於常溫下幾乎為液體,故而於黏著片材之實際製造步驟中,容易添加至黏著主劑中,又,向黏著主劑之分散性亦優異。 又,亦明確1,2,3-三唑由於水溶性較高,於黏著片材於濕熱環境下吸濕時,容易移動至金屬層(銅配線)之表面,故而可發揮優異之金屬腐蝕防止效果。 又,亦明確1,2,3-三唑由於在波長300~400 nm之分光光度下不存在吸收,故而不會阻礙UV(Ultraviolet,紫外線)硬化特性。 如上所述,發現1,2,3-三唑與先前之金屬腐蝕防止劑相比具有優異之特性,尤其有效地用於導電構件用之黏著片材。 <實施例2> [實施例2-1] 向(甲基)丙烯酸系(共)聚合物(A-1)1 kg中添加丙氧化季戊四醇聚丙烯酸酯(新中村化學工業公司製造,商品名「ATM-4PL」)200 g作為交聯劑、及4-甲基二苯甲酮與2,4,6-三甲基二苯甲酮之混合物(Lamberti公司製造,商品名「Esacure TZT」)10 g作為光聚合起始劑並均勻混合,獲得中間層用樹脂組合物。 將中間層用樹脂組合物夾於經剝離處理之2片聚對苯二甲酸乙二酯膜(三菱樹脂公司製造,商品名「DIAFOIL MRF」,厚度75 μm及三菱樹脂公司製造,商品名「DIAFOIL MRT」,厚度38 μm)之間,並以黏著片材之厚度成為80 μm之方式賦形成片狀,製作中間層用樹脂片(α)。 向(甲基)丙烯酸系(共)聚合物(A-1)1 kg中添加1,2,3-三唑1.5 g作為金屬腐蝕防止劑、亞磷酸三(2,4-二第三丁基苯基)酯(BASF公司製造,商品名「Irgafos 168」)5 g作為亞磷酸酯化合物、及4-甲基二苯甲酮與2,4,6-三甲基二苯甲酮之混合物(Lamberti公司製造、商品名「Esacure TZT」)15 g作為光聚合起始劑並均勻混合,獲得黏著劑層用樹脂組合物。 將上述黏著劑層用樹脂組合物夾於經剝離處理之2片聚對苯二甲酸乙二酯膜(三菱樹脂公司製造,商品名「DIAFOIL MRV」,厚度100 μm及三菱樹脂公司製造,商品名「DIAFOIL MRT」,厚度38 μm)之間,並以黏著片材之厚度成為35 μm之方式賦形成片狀,製作黏著劑層用樹脂片(β)。 進而,將上述黏著劑層用樹脂組合物夾於經剝離處理之2片聚對苯二甲酸乙二酯膜(三菱樹脂公司製造,商品名「DIAFOIL MRQ」,厚度75 μm及三菱樹脂公司製造,商品名「DIAFOIL MRT」,厚度38 μm)之間,並以黏著片材之厚度成為35 μm之方式賦形成片狀,製作黏著劑層用樹脂片(β')。 將上述中間層用片材(α)之兩側之PET膜依序剝離去除,並且將黏著劑層用樹脂片(β)及(β')之一側之PET膜剝離,將所露出之黏著面依序貼合於中間層用片材(β)之兩表面,製作包含(β)/(α)/(β')之積層體。 隔著殘留於上述(β)及(β')之表面之PET膜,以波長365 nm之累計光量成為2000 mJ/cm2 之方式利用高壓水銀燈照射紫外線,使(α)、(β)及(β')進行紫外線交聯,製作黏著片材積層體(厚度150 μm)。針對該黏著片材積層體,進行下述各種評價。結果示於表2。 [實施例2-2] 向(甲基)丙烯酸系(共)聚合物(A-2)1 kg中添加1,2,3-三唑3 g作為金屬腐蝕防止劑、亞磷酸三癸酯(ADEKA公司製造,商品名「Adekastab 3010」)3 g作為亞磷酸酯化合物、季戊四醇三及四丙烯酸酯(東亞合成公司製造,「ARONIXM-306」)20 g作為交聯劑、以及1-羥基-環己基苯基酮(BASF公司製造,Irgacure 184)10 g作為光聚合起始劑並均勻混合,獲得黏著劑層用樹脂組合物。 繼而,將上述黏著劑層用樹脂組合物於經剝離處理之聚對苯二甲酸乙二酯膜(三菱樹脂公司製造,DIAFOIL MRV,厚度100 μm)上以厚度成為150 μm之方式成形為片狀後,被覆經剝離處理之聚對苯二甲酸乙二酯膜(三菱樹脂公司製造,商品名「DIAFOIL MRQ」,厚度75 μm)。隔著經剝離處理之聚對苯二甲酸乙二酯膜,以波長365 nm之累計光量成為1000 mJ/cm2 之方式利用高壓水銀燈照射紫外線使黏著劑層用樹脂組合物進行紫外線交聯,製作黏著片材積層體。針對該黏著片材積層體,進行下述各種評價。結果示於表2。 [實施例2-3] 使用3,9-雙(癸氧基)-2,4,8,10-四氧雜-3,9-二磷雜螺[5.5]十一烷(城北化學公司製造,商品名「JPE-10」)3 g作為亞磷酸酯化合物,除此以外,以與實施例2-2相同之方式製作黏著片材積層體。針對該黏著片材積層體,進行下述各種評價。結果示於表2。 [比較例2-1] 未添加作為金屬腐蝕防止劑之1,2,3-三唑及作為亞磷酸酯化合物之亞磷酸三(2,4-二第三丁基苯基)酯(BASF公司製造,商品名「Irgafos 168」),除此以外,以與實施例2-1相同之方式製作黏著片材積層體。針對該黏著片材積層體,進行下述各種評價。結果示於表2。 [比較例2-2] 未添加作為金屬腐蝕防止劑之1,2,3-三唑,除此以外,以與實施例2-1相同之方式製作黏著片材積層體。針對該黏著片材積層體,進行下述各種評價。結果示於表2。 [比較例2-3] 添加苯并三唑(城北化學公司製造,商品名「BT120」)1.5 g代替1,2,3-三唑作為金屬腐蝕防止劑,且未添加亞磷酸酯化合物,除此以外,以與實施例2-1相同之方式製作黏著片材積層體。針對該黏著片材積層體,進行下述各種評價。結果示於表2。 <各種評價> (1)防氧化劣化性 於玻璃基板(60 mm×45 mm)上以厚度150~200 Å、線寬70 μm、線長度46 mm、線間隔30 μm並以往返10.5次之方式形成氧化銦(ITO)之往返線,並且於該往返線之兩末端形成包含ITO之2 mm見方之正方形而形成ITO圖案(長度約97 cm),製作防氧化劣化性評價用ITO玻璃基板(參照圖1(A))。 將於上述實施例及比較例中製作之黏著片材積層體(厚度150 μm)之單面之剝離膜剝離,並利用手壓輥將PET膜(東洋紡織公司製造,商品名「COSMOSHINE A4100」,125 μm)貼附於其露出面。繼而,將上述附PET膜之黏著片材切成52 mm×45 mm後,將剩餘之剝離膜剝離,如圖1(B)所示,以將ITO之往返線上被覆之方式利用手壓輥將該黏著片材貼附於防氧化劣化性評價用ITO玻璃基板,製作防氧化劣化性評價用樣品(附黏著片材之ITO配線)(參照圖1(C))。 預先測定該防氧化劣化性評價用樣品(附黏著片材之ITO配線)中之ITO配線之室溫下之電阻值(Ω0)。 另一方面,將該防氧化劣化性評價用樣品(附黏著片材之ITO配線)於65℃・90%RH環境下保管500小時,保管後,測定耐防氧化劣化性評價用樣品(附黏著片材之ITO配線)中之ITO配線之電阻值(Ω)。 並且,算出ITO電阻值、即線末端間電阻值之變化率(%)[((Ω/Ω0)-1)×100],於表2中表示成「電阻值變化」。 關於防氧化劣化性,將電阻值之變化率為5%以上者判定為「×(poor)」,將未達5%判定為「○(good)」。結果示於表2。 (2)耐腐蝕可靠性 於玻璃基板(60 mm×45 mm)上以線寬70 μm、線長度46 mm、線間隔30 μm並以往返10.5次之方式形成將厚度1300 Å之ITO、厚度3000 Å之銅膜依序積層而成之金屬膜之往返線,並且於該往返線之兩末端形成2 mm見方之正方形而形成銅圖案(長度約97 cm),製作耐腐蝕可靠性評價用銅玻璃基板(參照圖1(A))。 將於上述實施例及比較例中製作之黏著片材積層體(厚度150 μm)之單面之剝離膜剝離,並利用手壓輥將PET膜(東洋紡織公司製造,商品名「COSMOSHINE A4100」,125 μm)貼附於其露出面。繼而,將上述附PET膜之黏著片材切成52 mm×45 mm後,將剩餘之剝離膜剝離,如圖1(B)所示,以將金屬膜之往返線上被覆之方式利用手壓輥將黏著片材貼附於耐腐蝕可靠性評價用銅玻璃基板,製作耐腐蝕可靠性評價用樣品(附黏著片材之銅配線)(參照圖1(D))。 預先測定該耐腐蝕可靠性評價用樣品(附黏著片材之銅配線)中之銅配線之室溫下之電阻值(Ω0)。 另一方面,將該耐腐蝕可靠性評價用樣品(附黏著片材之銅配線)於65℃・90%RH環境下保管500小時,保管後,測定耐腐蝕可靠性評價用樣品(附黏著片材之銅配線)中之銅配線之電阻值(Ω)。 並且,算出銅電阻值、即線末端間電阻值之變化率(%)[((Ω/Ω0)-1)×100],於表2中表示成「電阻值變化」。 關於耐腐蝕可靠性,將電阻值之變化率為20%以上者判定為「×(poor)」,將未達20%判定為「○(good)」。結果示於表2。 [表2]
Figure 105143084-A0304-0002
(評價結果) 實施例2-1~2-3之黏著片材含有1,2,3-三唑作為金屬腐蝕防止劑,進而包含亞磷酸酯,藉此ITO配線、銅配線均為電阻值之變化較少且耐腐蝕可靠性及防氧化劣化性優異者。 另一方面,比較例2-1均不包含亞磷酸酯化合物及金屬腐蝕防止劑,而耐腐蝕可靠性及防氧化劣化性較差。 比較例2-2由於不包含金屬腐蝕防止劑,故而銅配線之腐蝕尤其顯著。 比較例2-3不包含亞磷酸酯化合物,而對ITO配線之防氧化劣化性較差。 [產業上之可利用性] 本發明之導電構件用黏著片材可具有對導電構件(典型而言,具有透明導電層及/或由包含銅或者銀之金屬材料形成之導體圖案之導電構件)之耐腐蝕可靠性,並且可具有耐發泡可靠性,因此可用作適合貼合各種導電構件之黏著片材。尤其可較佳地用作具有觸控面板之圖像顯示裝置用之黏著片材。Hereinafter, an example of an embodiment of the present invention will be described in detail. However, the present invention is not limited to the following embodiments. <Adhesive sheet for conductive members> An adhesive sheet for conductive members (hereinafter, abbreviated as “the present adhesive sheet”), which is an example of the embodiment of the present invention, contains a (meth)acrylic (co)polymer containing a (meth)acrylic (co)polymer. And the adhesive layer of the adhesive composition of 1,2,3-triazole. The adhesive layer may be a single layer or a multi-layer, and in the case of a multi-layer, other layers such as a so-called base layer may be interposed. When the adhesive layer has a multi-layer structure with other layers, it is preferable that the surface layer of the adhesive sheet is an adhesive layer containing the above-mentioned adhesive composition. When the adhesive sheet is multi-layered, the thickness of the adhesive layer comprising the above-mentioned adhesive composition is not limited, and relative to the overall thickness of the adhesive sheet, preferably 10% or more, more preferably 30% or more , more preferably 50% or more. When the thickness of the adhesive layer containing the said adhesive composition is the said range, since the corrosion resistance reliability with respect to a conductive member, foaming resistance reliability, and hardening characteristics become favorable, it is preferable. In addition, in the present invention, the term "(co)polymer" includes the meaning of homopolymer and copolymer, and the term "(meth)acrylate" includes the meaning of acrylate and methacrylate. [Adhesive composition] The adhesive composition used in the present adhesive sheet (hereinafter, referred to as "the present composition") contains a (meth)acrylic (co)polymer and a 1,2,3-triglyceride azoles. The present composition may further contain a phosphite compound, a crosslinking agent, a photopolymerization initiator, an antioxidant, and other components. The present composition is preferably a photocurable composition. ((Meth)acrylic (co)polymer) As the (meth)acrylic (co)polymer, for example, in addition to the homopolymer of (meth)acrylic acid alkyl ester, by mixing it with A copolymer obtained by polymerizing a monomer component having copolymerizability, more preferably, it includes a carboxyl group-containing monomer, a hydroxyl group-containing monomer, and an amine group-containing monomer that can be copolymerized with an alkyl (meth)acrylate. , One or more monomers selected from epoxy group-containing monomers, amide group-containing monomers and other vinyl monomers as structural units. The (meth)acrylic (co)polymer can be produced by a conventional method using a polymerization initiator as necessary with respect to the monomers and the like exemplified below. In the case where the (meth)acrylic (co)polymer is a copolymer containing a carboxyl group-containing monomer as a structural unit, from the viewpoint of obtaining excellent adhesive properties, the (meth)acrylic (co)polymer It is preferable to contain 1.2 to 15 mass % of the carboxyl group-containing monomer, and among them, 1.5 mass % or more or 10 mass % or less, and more preferably 2.0 mass % or more or 8 mass % or less. As an example of a more specific (meth)acrylic (co)polymer, a linear or branched (meth)acrylic acid alkyl ester (hereinafter also referred to as "" A copolymer composed of the copolymerizable monomer A") and any one or more monomer components selected from the following group which can be copolymerized therewith.・Carboxyl group-containing monomer (hereinafter also referred to as "co-monomer B") ・Macromonomer (hereinafter also referred to as "co-monomer C") ・(methyl group) with 1 to 3 carbons in the side chain Acrylate (hereinafter also referred to as "co-monomer D") ・Hydroxy-containing monomer (hereinafter also referred to as "co-monomer E") ・Other vinyl monomers (hereinafter also referred to as "co-monomer F") ”) Also, as an example of (meth)acrylic-based (co)polymers, (a) monomers comprising comonomer A, comonomer B and/or comonomer C can also be mentioned: A copolymer composed of components or (b) composed of a monomer component comprising comonomer A, comonomer B and/or comonomer C, comonomer D and/or comonomer E Copolymers are particularly preferred. Examples of linear or branched alkyl (meth)acrylates (co-monomer A) having 4 to 18 carbon atoms in the side chain include n-butyl (meth)acrylate and (meth)acrylic acid. Isobutyl, second butyl (meth)acrylate, 3rd butyl (meth)acrylate, amyl (meth)acrylate, isoamyl (meth)acrylate, neopentyl (meth)acrylate, Hexyl (meth)acrylate, cyclohexyl (meth)acrylate, heptyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, n-octyl (meth)acrylate, (meth)acrylate Isooctyl acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, tert-butylcyclohexyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate ester, undecyl (meth)acrylate, lauryl (meth)acrylate, tridecyl (meth)acrylate, tetradecyl (meth)acrylate, cetyl (meth)acrylate ester, stearyl (meth)acrylate, isostearyl (meth)acrylate, behenyl (meth)acrylate, iso(meth)acrylate, 3,5,5-trimethyl ring Hexane (meth)acrylate, dicyclopentyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, benzyl (meth)acrylate esters, etc. These may be used by 1 type, or may be used in combination of 2 or more types. The above-mentioned copolymerizable monomer A is preferably contained in the total monomer component of the copolymer in an amount of 30% by mass or more and 90% by mass or less, and more preferably in a range of 35% by mass or more or 88% by mass or less. Among them, it is more preferable to contain in the range of 40 mass % or more or 85 mass % or less. Examples of the carboxyl group-containing monomer (co-monomer B) include (meth)acrylic acid, 2-(meth)acryloyloxyethylhexahydrophthalic acid, and 2-(meth)propylene Acrylooxypropyl hexahydrophthalic acid, 2-(meth)acryloyloxyethyl phthalic acid, 2-(meth)acryloyloxypropyl phthalic acid, 2-(methyl) base) acryloyloxyethyl maleic acid, 2-(meth)acryloyloxypropyl maleic acid, 2-(meth)acryloyloxyethyl succinic acid, 2-(meth)acryloyloxyethyl maleic acid Meth)acrylooxypropylsuccinic acid, crotonic acid, fumaric acid, maleic acid, itonic acid. These may be used by 1 type, or may combine 2 or more types. In addition, "(meth)acrylic group" is the meaning which includes an acryl group and a methacrylic group. Likewise, "(meth)acryloyl" includes acryl and methacryloyl meanings. The above-mentioned copolymerizable monomer B is preferably contained in the range of 1.2 mass % or more and 15 mass % or less in the total monomer component of the copolymer, and among them, from the viewpoint of obtaining excellent adhesive properties, it is preferably It is contained in the range of 1.5 mass % or more or 10 mass % or less, and especially, it is especially preferable to contain in the range of 2 mass % or more or 8 mass % or less. The above-mentioned macromonomer (co-monomer C) is a monomer having 20 or more carbon atoms in a side chain when it is polymerized to form a (meth)acrylic (co)polymer. By using the comonomer C, a (meth)acrylic-type (co)polymer can be made into a graft copolymer. Therefore, the characteristics of the main chain and the side chain of the graft copolymer can be changed according to the selection or compounding ratio of the comonomer C and other monomers. As said macromonomer (copolymerizable monomer C), the thing which a skeleton component consists of an acrylic polymer or a vinyl polymer is preferable. Examples of the skeleton component of the macromonomer include those exemplified by the above-mentioned comonomer A, the above-mentioned comonomer B, the following comonomer D, and the following comonomer E, and these can be used alone. , or a combination of two or more. The macromonomer system has a radical polymerizable group or a functional group such as a hydroxyl group, an isocyanate group, an epoxy group, a carboxyl group, an amine group, an amide group, and a thiol group. The macromonomer is preferably one having a radically polymerizable group that can be copolymerized with other monomers. The radically polymerizable group may contain one or two or more, and among them, one is particularly preferable. When the macromonomer has a functional group, the functional group may contain one or two or more, among them, one is particularly preferred. Moreover, either one of a radical polymerizable group and a functional group may be contained, and both may be contained. The number average molecular weight of the comonomer C is preferably 500 to 20,000, and among them, preferably 800 or more or 8,000 or less, and among them, 1,000 or more or 7,000 or less. As the megamonomer, one produced by a general method (eg, a megamonomer manufactured by Toa Gosei Co., Ltd., etc.) can be appropriately used. The above-mentioned comonomer C is preferably contained in the range of 5 mass % or more and 30 mass % or less in the total monomer component of the copolymer, and preferably 6 mass % or more or 25 mass % or less. In particular, it is preferably contained within the range of 8 mass % or more or 20 mass % or less. Examples of the (meth)acrylate (co-monomer D) having 1 to 3 carbon atoms in the side chain include methyl (meth)acrylate, ethyl (meth)acrylate, and (meth)acrylic acid. n-propyl ester, isopropyl (meth)acrylate, etc. These may be used by 1 type, or may combine 2 or more types. The above-mentioned copolymerizable monomer D is preferably contained in the total monomer component of the copolymer in an amount of 0 mass % or more and 70 mass % or less, and more preferably contained in a range of 3 mass % or more or 65 mass % or less. Among them, it is more preferable to contain in the range of 5 mass % or more or 60 mass % or less. As said hydroxyl-containing monomer (copolymerizable monomer E), 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, Hydroxyalkyl (meth)acrylates such as 2-hydroxybutyl (meth)acrylate. These may be used by 1 type, or may combine 2 or more types. The above-mentioned copolymerizable monomer E is preferably contained in the total monomer component of the copolymer in an amount of 0 mass % or more and 30 mass % or less, and more preferably contained in a range of 0 mass % or more or 25 mass % or less. Among them, it is more preferable to contain in the range of 0 mass % or more or 20 mass % or less. As said other vinyl monomer (copolymerizable monomer F), the compound which has a vinyl group in a molecule|numerator other than the copolymerizable monomers A-E can also be mentioned. Examples of such compounds include functional monomers having functional groups such as amide groups and alkoxyalkyl groups in the molecule; polyalkylene glycol di(meth)acrylates; and vinyl acetate , vinyl propionate and vinyl laurate and other vinyl ester monomers; and styrene, chlorostyrene, chloromethyl styrene, α-methyl styrene and other substituted styrene and other aromatic vinyl monomers. These may be used by 1 type, or may combine 2 or more types. The above-mentioned copolymerizable monomer F is preferably contained in the total monomer component of the copolymer in an amount of 0 mass % or more and 30 mass % or less, and more preferably contained in a range of 0 mass % or more or 25 mass % or less. Among them, it is more preferable to contain in the range of 0 mass % or more or 20 mass % or less. In addition to those disclosed above, it can also be appropriately used as needed: acid anhydride group-containing monomers such as maleic anhydride and itaconic anhydride; glycidyl (meth)acrylate, glycidyl α-ethacrylate, Epoxy group-containing monomers such as acrylic acid-3,4-epoxybutyl acrylate; amine group-containing monomers such as dimethylaminoethyl (meth)acrylate, base) acrylate monomers; (meth)acrylamide, N-tert-butyl (meth)acrylamide, N-methylol (meth)acrylamide, N-methoxymethyl (Meth) acrylamide, N-butoxymethyl (meth) acrylamide, diacetone (meth) acrylamide, maleic acid amide, maleic acid amide, etc. containing amide Monomers of amine group or imide group; heterocyclic basic monomers such as vinylpyrrolidone, vinylpyridine, vinylcarbazole, etc. The most typical examples of (meth)acrylic (co)polymers include 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, decyl (meth)acrylate, Monomer components (a) such as isostearyl (meth)acrylate, butyl (meth)acrylate, ethyl (meth)acrylate, and methyl (meth)acrylate, (meth)acrylic acid having a carboxyl group, 2-(meth)acryloyloxyethylhexahydrophthalic acid, 2-(meth)acryloyloxypropylhexahydrophthalic acid, 2-(meth)acryloyloxyethyl Phthalic acid, 2-(meth)acryloyloxypropylphthalic acid, 2-(meth)acryloyloxyethylmaleic acid, 2-(meth)acryloyloxy Propyl maleic acid, 2-(meth)acryloyloxyethylsuccinic acid, 2-(meth)acryloyloxypropylsuccinic acid, crotonic acid, fumaric acid, maleic acid Monomer components (b) such as olefinic acid and itonic acid, and hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, ( Glyceryl Meth)acrylate, Monomethyl Maleate, Monomethyl Iconate, Vinyl Acetate, Glycidyl (Meth)acrylate, (Meth)Acrylamide, (Meth)Acrylonitrile , Fluorinated (meth)acrylate, polysiloxane (meth)acrylate and other monomer components (c) (meth)acrylate copolymer obtained by copolymerization. The mass average molecular weight of the (meth)acrylic (co)polymer is preferably 100,000 or more and 1.5 million or less, among them, 150,000 or more or 1.3 million or less, and especially preferably 200,000 or more or 1.2 million the following. In the case of obtaining an adhesive composition with a higher cohesive force, from the viewpoint that the larger the molecular weight, the more the cohesive force can be obtained by the cross-linking of the molecular chain, the (meth)acrylic (co)polymer has a higher molecular weight. The mass average molecular weight is preferably 700,000 or more and 1.5 million or less, and particularly preferably 800,000 or more or 1.3 million or less. On the other hand, in the case of obtaining an adhesive composition with high fluidity or stress relaxation, the mass average molecular weight is preferably 100,000 or more and 700,000 or less, and particularly preferably 150,000 or more or 600,000 or less. On the other hand, when a solvent is not used when forming an adhesive sheet or the like, since it is difficult to use a polymer with a relatively large molecular weight, the mass average molecular weight of the (meth)acrylic (co)polymer is preferably 100,000 Not less than 700,000 and not more than 700,000, preferably not less than 150,000 or not more than 600,000, and especially preferably not less than 200,000 or not more than 500,000. (Metal Corrosion Inhibitor) The present composition contains 1,2,3-triazole. 1,2,3-triazole functions as a metal corrosion inhibitor for the conductive layer of the conductive member. Since 1,2,3-triazole is excellent in copper corrosion resistance reliability against copper and foaming resistance reliability as an adhesive sheet, the composition containing 1,2,3-triazole can be preferably used as A conductive member having a transparent conductive layer and a conductor pattern (wiring pattern) formed of a metal material including copper. The reason for this is presumably that corrosion is prevented by forming a protective film formed by chemical bonding of copper atoms and molecules of 1,2,3-triazole on the surface of the conductor pattern formed of the metal material containing copper. Moreover, the effect of the protective film obtained by 1,2,3-triazole can be similarly achieved in the electrically conductive member which has a conductor pattern formed by the metal material containing silver. Furthermore, 1,2,4-triazole exists as an isomer of 1,2,3-triazole. The 1,2,4-triazole is a solid with a melting point of about 120°C. On the other hand, the 1,2,3-triazole has a melting point of about 20°C and is in a substantially liquid state at room temperature. Therefore, 1,2,3-triazole has the advantages of being excellent in dispersibility when mixed in an adhesive composition, and being able to be uniformly mixed, and being easy to be master batched. In the present composition, from the viewpoint of the bleed-out of the metal corrosion inhibitor or the effect of preventing metal corrosion, etc., it is preferably 0.01 part by mass or more and 5 parts by mass relative to 100 parts by mass of the (meth)acrylic (co)polymer. 1,2,3-triazole is contained in a ratio of not more than parts by mass, and it is more preferable to contain 1,2,3-triazole in a ratio of 0.1 part by mass or more or less than or equal to 1 part by mass, among which it is more preferable to contain 1,2,3-triazole 1,2,3-triazole is contained in the ratio of 0.2 mass part or more or 0.5 mass part or less. In addition, 1,2,3-triazole and 1,2,4-triazole may be used together in this composition. (Phosphite Compound) The present composition may further contain a phosphite compound. The phosphite compound itself is not corrosive, but also stabilizes acid components such as carboxyl groups. Therefore, by formulating a phosphite compound in the present composition containing a specific (meth)acrylic (co)polymer, even if the present composition contains an acid component, the oxidative deterioration of the conductive member as an adherend can be prevented , in the case where the composition does not contain an acid component, the oxidative deterioration of the conductive member as the adherend can of course be prevented. Therefore, if an adhesive sheet is formed from the present composition containing a phosphite compound, it can have a conductive member (typically, a transparent conductive layer containing ITO and/or a conductor formed of a metal material containing copper or silver) The corrosion-resistant reliability of the conductive member of the pattern), and the oxidative deterioration of the conductive member can be prevented. Therefore, for example, it can be preferably used as an adhesive sheet for an image display device having a touch panel. The phosphite compound that can be contained in the composition is not limited. Particularly preferred is a phosphite compound represented by the following formula (1). Formula (1) P[-OR] 3 (R in the formula is a hydrocarbon, specifically, substituted or unsubstituted aromatics, aliphatic rings and alkyl groups, etc. can be listed; a plurality of Rs may be the same or different from each other, and a plurality of adjacent Rs may be bonded to each other junction to form a saturated or unsaturated ring structure) and it may be a compound containing two or more structural units represented by the above formula (1). As a result of blending various phosphite compounds represented by the above formula (1) in this composition containing a specific (meth)acrylic (co)polymer and 1,2,3-triazole, it was confirmed that any of the phosphites All of the phosphoric acid ester compounds exhibited an oxidative deterioration preventive effect, and it was confirmed that the oxidative deterioration preventive effect was particularly excellent for the transparent conductive layer containing ITO. Examples of the phosphite compound contained in the composition include triphenyl phosphite, tris(nonylphenyl) phosphite, tricresyl phosphite, tristearyl phosphite, and triethyl phosphite. ester, tris(2-ethylhexyl) phosphite, tridecyl phosphite, trilauryl phosphite, tris(tridecyl) phosphite, trioleyl phosphite, diphenyl phosphite (2 -Ethylhexyl) ester, diphenyl phosphite monodecyl, diphenyl phosphite mono(tridecyl) ester, tetraphenyl dipropylene glycol diphosphite, tetraphenyl (tetra- Tridecyl) pentaerythritol tetraphosphite, tetra(C12~C15 alkyl)-4,4-isopropylidene diphenyl diphosphite, tris(2,4-di-tert-butylbenzene phosphite) yl) ester, tris(4-nonylphenyl) phosphite, 3,9-bis(nonylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro [5,5]Undecane, 3,9-bis(4-nonylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5,5]deca Monoalkane, 3,9-bis(decyloxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5,5]undecane, 3,9-bis(decyl) Trialkoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5,5]undecane, 3,9-bis(stearyloxy)-2,4 ,8,10-Tetraoxa-3,9-diphosphaspiro[5,5]undecane, 3,9-bis(2,6-di-tert-butyl-4-methylphenoxy) -2,4,8,10-Tetraoxa-3,9-diphosphaspiro[5,5]undecane, 3,9-bis(2,4-di-tert-butylphenoxy)- 2,4,8,10-Tetraoxa-3,9-diphosphaspiro[5,5]undecane, 3,9-bis{2,4-bis(1-methyl-1-phenyl) Ethyl)phenoxy}-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5,5]undecane, 2,2'-methylenebis(4,6 -Di-tert-butyl-1-phenyl) phosphite, 4,4'-isopropylidene diphenol C12-15 alcohol phosphite, distearyl pentaerythritol diphosphite, 2,4,8 ,10-Tetrakis(1,1-dimethylethyl)-6-{(2-ethylhexyl)oxy}-12H-dibenzo[d,g][1,3,2]phosphorus Heterooctacycle, 2,4,8,10-tetrakis(1,1-dimethylethyl)-6-(tridecyloxy)-12H-dibenzo[d,g][1,3, 2] Dioxaphosphacyclo, 1,1'-biphenyl-4,4'-diylbis[bis(2,4-di-tert-butylphenyl) phosphite], hydrogenated bisphenol A- Pentaerythritol phosphite polymer, hydrogenated bisphenol A phosphite polymer, diethyl phosphite, bis(2-ethylhexyl) phosphite, dilauryl phosphite, dioleyl phosphite, diphosphite Phenyl esters, etc. Among them, as the phosphite compound contained in the present composition, for example, in consideration of compatibility with the present composition, an aliphatic phosphite (for example, as one of the phosphite compounds of Example 2-2) is preferred. Tridecyl phosphite or 3,9-bis(decyloxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane of Example 2-3, etc. ). Furthermore, in consideration of hydrolysis resistance, an aromatic phosphite (for example, tris(2,4-di-tert-butylphenyl) phosphite which is the phosphite compound of Example 2-1) is preferable Wait). Moreover, considering the balance of solubility and hydrolysis resistance, the phosphite which has both aliphatic ester group and aromatic ester group, such as diphenyl phosphite mono(tridecyl) ester, is preferable. In the present composition, the content ratio of the phosphite compound is preferably a (meth)acrylic-based compound from the viewpoint that the adhesive property is not impaired and the oxidative deterioration of conductive members such as ITO can be suppressed more effectively. (Total) 100 parts by mass of polymer is 0.0001 (1×10 -4 ) The phosphite compound is contained in a ratio of not less than 2.0 parts by mass and not more than 0.0005 part by mass or not more than 0.8 part by mass; and it is more preferably 0.001 part by mass. The phosphite compound is contained in a ratio of 0.7 parts by mass or more, and more preferably, the phosphite compound is contained in a ratio of 0.01 mass part or more or 0.6 mass part or less. (Other metal corrosion inhibitor) In this composition, in addition to 1,2,3-triazole and phosphite compound, 1,2,4-triazole, benzotriazole and derivatives thereof, etc. may be used in combination Other metal corrosion inhibitors. (Cross-linking agent) The present composition may also contain a cross-linking agent as necessary. For example, as a method of crosslinking the above-mentioned (meth)acrylic (co)polymer, the addition of a reactive group such as a hydroxyl group or a carboxyl group which can be introduced into the (meth)acrylic (co)polymer can be mentioned. A chemically bonded crosslinking agent, and a method of reacting it by heating or aging; or adding a polyfunctional (meth)acrylate having two or more (meth)acryloyl groups as a crosslinking agent and photopolymerization A method of reacting initiators such as initiators, and crosslinking them by ultraviolet irradiation or the like. Among them, from the viewpoint of not consuming polar functional groups such as carboxyl groups in the composition due to the reaction and maintaining high cohesive force and adhesive properties derived from polar components, it is preferable to irradiate with light such as ultraviolet rays. cross-linking method. Examples of the above-mentioned crosslinking agent include a group selected from the group consisting of a (meth)acryloyl group, an epoxy group, an isocyanate group, a carboxyl group, a hydroxyl group, a carbodiimide group, an oxazoline group, an aziridine group, and a vinyl group. , amine group, imino group, amide group, N-substituted (meth)acrylamido group, alkoxysilyl group at least one kind of crosslinking functional group crosslinking agent, you can use one kind, or Two or more types may be used in combination. Furthermore, the crosslinkable functional group may be protected by a deprotectable protecting group. Among them, polyfunctional (meth)acrylates are preferred from the viewpoint of the ease of control of the crosslinking reaction. Examples of such polyfunctional (meth)acrylates include 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9- Nonanediol di(meth)acrylate, polyalkylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, glycerol di(meth)acrylate, pentaerythritol tri(meth)acrylate base) acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tripentaerythritol penta(meth)acrylate, trimethylolpropane tri(meth)acrylate, isocyanuric acid UV-curable polyfunctional monomers such as tri(acrylooxyethyl) ester, polyester (meth)acrylate, epoxy (meth)acrylate, (meth)acrylate urethane , polyether (meth)acrylate and other multifunctional acrylic oligomers or multifunctional acrylamide, etc. Moreover, as a crosslinking agent which has two or more types of crosslinkable functional groups, for example, glycidyl (meth)acrylate, glycidyl α-ethacrylate, and (meth)acrylic acid-3,4- Epoxy butyl ester, 4-hydroxybutyl (meth)acrylate glycidyl ether and other epoxy group-containing monomers; (meth)acrylate 2-isocyanatoethyl ester, isocyanate 2-(2-(methyl) ) Acryloyloxyethoxy)ethyl ester, (meth)acrylic acid 2-(0-[1'-methylpropylideneamino]carboxyamino)ethyl ester, (meth)acrylic acid 2-[( 3,5-Dimethylpyrazolyl)carbonylamino]ethyl ester and other monomers containing isocyanate groups or blocked isocyanate groups; vinyltrimethoxysilane, vinyltriethoxysilane, 3-glycidoxy propylpropyltrimethoxysilane, 3-(meth)acryloyloxypropylmethyldiethoxysilane, 3-(meth)acryloyloxypropyltriethoxysilane, N-2- Various silane coupling agents such as (aminoethyl)-3-aminopropylmethyldimethoxysilane and 3-isocyanatopropyltriethoxysilane. The crosslinking agent having two or more types of crosslinkable functional groups can also be bonded to the (meth)acrylic (co)polymer by reacting one functional group with the (meth)acrylic (co)polymer. into the structure. By adopting such a structure, a double-bonded crosslinkable functional group such as a (meth)acryloyl group or a vinyl group can be chemically bonded to the (meth)acrylic (co)polymer. Moreover, by making a crosslinking agent couple|bond with a (meth)acrylic-type (co)polymer, it exists in the tendency which can suppress the exudation of a crosslinking agent and the unintended plasticization of this adhesive sheet. Moreover, since the reaction efficiency of a photocrosslinking reaction is accelerated|stimulated by making a crosslinking agent couple|bond with a (meth)acrylic-type (co)polymer, there exists a tendency for the hardened|cured material with higher cohesion to be obtained. The present composition may further contain a monofunctional monomer that can react with the crosslinkable functional group of the crosslinking agent. Examples of such monofunctional monomers include alkyl (meth)acrylates such as methyl acrylate; hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, and hydroxybutyl (meth)acrylate. Esters, polyalkylene glycol (meth)acrylates and other hydroxyl-containing (meth)acrylates; (meth)acrylic acid, 2-(meth)acryloyloxyethylhexahydrophthalic acid, 2 -(Meth)acryloyloxypropylhexahydrophthalic acid, 2-(meth)acryloyloxyethylphthalic acid, 2-(meth)acryloyloxyethylmaleic acid Diacid, 2-(meth)acryloyloxypropylmaleic acid, 2-(meth)acryloyloxyethylsuccinic acid, 2-(meth)acryloyloxypropylsuccinic acid , crotonic acid, fumaric acid, maleic acid, itonic acid and other carboxyl group-containing monomers; maleic anhydride, itaconic acid anhydride and other acid anhydride group-containing monomers; (meth)acrylic acid tetrahydrofurfur ester, methoxy polyethylene glycol (meth)acrylate and other ether group-containing (meth)acrylates; (meth)acrylamide, dimethyl (meth)acrylamide, diethyl (meth)acrylate base) acrylamide, (meth) acryl morpholine, isopropyl (meth) acrylamide, dimethylaminopropyl (meth) acrylamide, phenyl (meth) acrylamide , (meth) acrylamide monomers such as N-methoxymethyl (meth) acrylamide, N-butoxymethyl (meth) acrylamide, etc. Among them, it is preferable to use a hydroxyl group-containing (meth)acrylate or a (meth)acrylamide-based monomer from the viewpoint of improving the adhesiveness to the adherend or the effect of suppressing whitening under moist heat. The content of the crosslinking agent is preferably 0.01 or more with respect to 100 parts by mass of the above-mentioned (meth)acrylic (co)polymer from the viewpoint of balancing the flexibility and cohesive force of the present composition. The ratio of 10 parts by mass or less is blended, and among them, 0.05 parts by mass or more or 8 parts by mass or less is particularly preferable, and among them, 0.1 parts by mass or more or 5 parts by mass or less is particularly preferable. Furthermore, when the present adhesive sheet is a multilayer, the content of the crosslinking agent may exceed the above-mentioned range for the intermediate layer among the layers constituting the adhesive sheet or the layer that becomes the base material. The content of the crosslinking agent in the intermediate layer or the layer to be the base material is preferably prepared at a ratio of 0.01 to 40 parts by mass relative to 100 parts by mass of the (meth)acrylic (co)polymer described above, wherein , 1 part by mass or more or 30 parts by mass or less is particularly preferable, and among them, 2 parts by mass or more or 25 parts by mass or less is particularly preferable. (Photopolymerization initiator) In the case of crosslinking by light irradiation, it is preferable to contain a photopolymerization initiator. Radical generating mechanisms based on photopolymerization initiators are classified into two categories: α-cleavage types that generate radicals by cleaving and decomposing their own single bonds, and α-cleaving types that generate radicals by exciting hydrogen from compounds in the system. Dehydrogenation type. Among these, it is preferable to use a dehydrogenation type photocrosslinking initiator. Among them, when an organic crosslinking agent having a (meth)acryloyl group is used as the crosslinking agent, it is particularly preferable to further add a photopolymerization initiator. The reason is that radicals are generated by light irradiation and become the starting point of the polymerization reaction in the system. As the photopolymerization initiator, a conventionally known one can be appropriately used. Among them, from the viewpoint of the ease of control of the crosslinking reaction, a photopolymerization initiator that is sensitive to ultraviolet rays having a wavelength of 380 nm or less is preferred. On the other hand, in terms of obtaining higher photoreactivity and in terms of easily reaching the deep part of the present adhesive sheet by the sensed light, it is preferable to sense the initiation of photopolymerization of light with a wavelength longer than 380 nm agent. Photopolymerization initiators are divided into two categories according to the free radical generating mechanism. They are roughly divided into cleavage-type photopolymerization initiators that can cleavage and decompose the single bond of the photopolymerization initiator itself to generate free radicals, and photopolymerization initiators that are excited by light. The initiator and the hydrogen donor in the system form an excited complex and can transfer the hydrogen of the hydrogen donor to a dehydrogenation type photopolymerization initiator. The cleavage-type photopolymerization initiator among these will decompose into another compound when a radical is generated by light irradiation, and once excited, it will lose its function as a crosslinking initiator. Therefore, it is preferable that the adhesive material does not remain in the form of active species in the adhesive material after the cross-linking reaction is completed, and the adhesive material cannot be unexpectedly degraded by light. On the other hand, the dehydrogenation-type photopolymerization initiator does not generate a decomposition product such as a cleavage-type photopolymerization initiator during the reaction of generating radicals by irradiation with active energy rays such as ultraviolet rays, so it is not easy to become a Volatile components are useful in reducing damage to adherends. As the above-mentioned cleavage-type photopolymerization initiator, bis(2,4,6-trimethylbenzyl) is preferable in terms of having high sensitivity to light and being a decomposed product after the reaction and decolorizing -Phenylphosphine oxide, 2,4,6-trimethylbenzyldiphenylphosphine oxide, (2,4,6-trimethylbenzyl)ethoxyphenylphosphine oxide, bis( Acrylophosphine oxide-based photopolymerization initiators such as 2,6-dimethoxybenzyl) 2,4,4-trimethylpentylphosphine oxide. Examples of the above-mentioned dehydrogenation type photopolymerization initiator include benzophenone, 4-methyl-benzophenone, 2,4,6-trimethylbenzophenone, and 4-phenyldiphenyl Methanone, 3,3'-dimethyl-4-methoxybenzophenone, 4-(meth)acryloyloxybenzophenone, 4-[2-((meth)acryloyloxybenzoate (methyl)ethoxy]benzophenone, 4-(meth)acryloyloxy-4'-methoxybenzophenone, methyl 2-benzylbenzoate, methyl benzylcarboxylate, Diethylene glycol bis(2-phenyl-2-oxyacetate), 4-(1,3-propenyl-1,4,7,10,13-pentaoxatridecyl) Benzophenone, 9-oxysulfur𠮿
Figure 105143084-A0305-003-019-001
, 2-chloro-9-oxysulfur
Figure 105143084-A0305-003-019-002
, 3-methyl-9-oxothio
Figure 105143084-A0305-003-019-003
, 2,4-dimethyl-9-oxothio
Figure 105143084-A0305-003-019-004
Anthraquinone, 2-methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, 2-aminoanthraquinone, camphorquinone or derivatives thereof, etc. Among these, benzophenone, 4-methyl-benzophenone, 2,4,6-trimethylbenzophenone, 4-phenylbenzophenone, 3,3' -Dimethyl-4-methoxybenzophenone, 4-(meth)acryloyloxybenzophenone, 4-[2-((meth)acryloyloxy)ethoxy]di Benzophenone, 4-(meth)acryloyloxy-4'-methoxybenzophenone, methyl 2-benzylbenzoate, methyl benzylcarboxylate. In addition, any one of the photopolymerization initiators listed above or a derivative thereof may be used, or two or more of these may be used in combination. Furthermore, in addition to the photopolymerization initiator, a sensitizer may also be used. It does not specifically limit as a sensitizer, As long as it is a sensitizer used for a photopolymerization initiator, it can be used without a problem. For example, aromatic amine or anthracene derivatives, anthraquinone derivatives, coumarin derivatives, 9-oxosulfur
Figure 105143084-A0305-003-020-001
Derivatives, phthalocyanine derivatives, etc. or benzophenone, ketone, 9-oxothio
Figure 105143084-A0305-003-020-002
, Michler's ketone, 9,10-phenanthrenequinone and other aromatic ketones and their derivatives. In addition, a photopolymerization initiator or a sensitizer may be contained in the state which couple|bonded with a (meth)acrylic-type (co)polymer. As a method of binding a photopolymerization initiator or a sensitizer to a (meth)acrylic (co)polymer, a method of binding the above-mentioned crosslinking agent to the (meth)acrylic (co)polymer can be used. the same method in the case of The content of the photopolymerization initiator is not particularly limited, but typically, it is preferably adjusted at a ratio of 0.1 to 10 parts by mass relative to 100 parts by mass of the (meth)acrylic (co)polymer, wherein , is preferably adjusted at a ratio of 0.2 parts by mass or more or 5 parts by mass or less, and especially preferably adjusted at a ratio of 0.5 parts by mass or more or 3 parts by mass or less. Among them, it can also exceed this range due to the balance with other elements. (Antioxidant) In addition to the above, the present composition may optionally contain an antioxidant. Examples of antioxidants include 2,2'-methylenebis(4-methyl-6-tert-butylphenol), hexanediol-bis(3,5-di-tert-butyl-4- Hydroxyhydrocinnamate), Tetrakis[methylene(3,5-di-tert-butyl-4-hydroxyhydrocinnamate)]methane, Triethylene glycol-bis-3-(3-tert-butyl -4-Hydroxy-5-methylphenyl)propionate, 1,3,5-trimethyl-2,4,6-tris(3,5-di-tert-butyl-4-hydroxy-benzyl) ) benzene, n-octadecyl 3-(4'-hydroxy-3',5'-di-tert-butylphenolyl)propionate, 4,4'-methylenebis(2,6-di- Hindered phenol-based antioxidants such as tributylphenol), 4,4'-butylene-bis-(6-tert-butyl-3-methyl-phenol), and various antioxidants such as sulfur-based and amine-based antioxidants. (Other components) Furthermore, this composition may suitably contain the well-known component mix|blended with the normal adhesive composition. For example, light stabilizers, ultraviolet absorbers, metal deactivators, rust inhibitors (excluding the above-mentioned metal corrosion inhibitors), antiaging agents, antistatic agents, moisture absorbing agents, foaming agents, antifoaming agents, inorganic Various additives such as particles, viscosity modifiers, adhesion imparting resins, photosensitizers, fluorescent agents, etc., or reaction catalysts (tertiary amine compounds, quaternary ammonium compounds, tin laurate compounds, etc.). (Adhesion of Adhesive Composition) The adhesive composition (this composition) used in this adhesive sheet is prepared by mixing (meth)acrylic (co)polymer, 1,2,3-triazole and The other components required, for example, a phosphite compound, a crosslinking agent, etc. are respectively mixed in a specific amount, and it is obtained. It does not specifically limit as these mixing methods, and also does not specifically limit the mixing order of each component. In addition, a heat treatment step may be added during the production of the present composition, and in this case, it is preferable to perform heat treatment after mixing each component of the present composition in advance. It is also possible to use those obtained by concentrating various mixed components and then making them into master batches. In addition, the apparatus for mixing is not particularly limited. For example, a universal kneader, a planetary mixer, a Banbury mixer, a kneader, a frame mixer, a pressure kneader, a three-roll mill, and a two-roll mill can be used. machine. A solvent can also be used for mixing if desired. Moreover, this composition can also be used as a solventless system which does not contain a solvent. By using it as a solvent-free system, it has the advantage of improving heat resistance and light resistance without residual solvent. Furthermore, this composition can also be used by preliminarily preparing the monomer components constituting the (meth)acrylic (co)polymer, 1,2,3-triazole, a photopolymerization initiator, and other optional components. When the composition is used as an adhesive sheet for a conductive member, a (meth)acrylic (co)polymer is generated by performing a polymerization reaction by light irradiation. <The form of the adhesive sheet for conductive members> The adhesive sheet can be used by directly applying the composition to the adherend and forming it into a sheet, and it can also be used as a single layer or a single layer on a release film. Multilayer sheet-like adhesive sheet with release film. As a material of this release film, a polyester film, a polyolefin film, a polycarbonate film, a polystyrene film, an acrylic film, a triacetyl cellulose film, a fluororesin film etc. are mentioned, for example. Among these, a polyester film and a polyolefin film are especially preferable. The thickness of the release film is not particularly limited. Among them, for example, from the viewpoints of workability and workability, it is preferably 25 μm to 500 μm, more preferably 38 μm or more or 250 μm or less, and still more preferably 50 μm or more or 200 μm or less. . In addition, the present adhesive sheet may be formed by a method of directly extruding the composition without using an adherend or a mold release film as described above, or a method of molding by injection into a mold. Furthermore, it can also be made into the form of an adhesive sheet by directly filling this composition between members, such as a conductive member. <Properties of the adhesive sheet for conductive members> (Anti-corrosion effect on conductive layers of conductive members) This adhesive sheet has corrosion resistance to conductive members, especially transparent conductive layers or conductor patterns formed of metallic materials containing copper. Therefore, the rate of change [((Ω/Ω0)−1)×100] of the resistance value of ITO measured by the following methods (1) to (2) can be set to be less than 5%. is less than 3%. In addition, the rate of change [((Ω/Ω0)−1)×100] of the copper resistance value measured by the following methods (3) to (4) may be set to be less than 20%, and the is less than 10%, further less than 5%, especially less than 3%. (1) The adhesive composition for conductive members (the present composition) is formed into a film with a thickness of 150 μm to form an adhesive sheet, and the above-mentioned adhesive sheet is bonded to ITO wiring containing indium oxide (ITO). The ITO glass substrate for evaluation formed on the glass substrate was used to produce the ITO wiring of the adhesive sheet. (2) The resistance value (Ω0) at room temperature of the ITO wiring with the above-mentioned adhesive sheet was measured in advance, and the above-mentioned ITO wiring with the adhesive sheet was stored for 500 hours in an environment of 65°C and 90% RH. , and measured the resistance value (Ω) of the ITO wiring after the above storage in the above-mentioned ITO wiring with the adhesive sheet. (3) The adhesive composition for conductive members (the present composition) is formed into a film with a thickness of 150 μm to form an adhesive sheet, and the above-mentioned adhesive sheet is bonded to a copper wiring to form a glass substrate. The evaluation made the copper wiring of the adhesive sheet with the copper glass substrate. (4) Preliminarily measure the resistance value (Ω0) of the copper wiring in the above-mentioned copper wiring with the adhesive sheet at room temperature, and store the above-mentioned copper wiring with the adhesive sheet for 500 hours in an environment of 65°C・90%RH , and measured the resistance value (Ω) of the copper wiring after the above storage in the copper wiring with the adhesive sheet. (Transparency) The present adhesive sheet is preferably optically transparent. That is, a transparent adhesive sheet is preferable. Here, "optically transparent" means that the total light transmittance is 80% or more, preferably 85% or more, and more preferably 90% or more. (Thickness) The thickness of the present adhesive sheet is preferably 10 μm or more and 500 μm or less, more preferably 15 μm or more or 400 μm or less, and especially more preferably 20 μm or more or 350 μm or less. <Application of the adhesive sheet for conductive members> The adhesive sheet is used in image display devices such as personal computers, mobile device terminals (PDA), game consoles, televisions (TV), car navigation systems, touch panels, handwriting pads, etc. For example, in image display devices using image display panels such as plasma display (PDP), liquid crystal display (LCD), organic EL display (OLED), inorganic EL display, electrophoretic display (EPD), interference modulation display (IMOD), etc. , suitable for bonding each constituent member, a conductive member therein, a conductive member having a transparent conductive layer therein and/or a conductive pattern formed of a metal material including copper. Furthermore, it is also suitable for bonding a conductive member including a transparent conductive layer containing ITO or IGZO and/or a transparent conductive layer having a conductive pattern formed of a metal material containing copper or silver. <Conductive member layered product> The conductive member layered product of the present invention (hereinafter, also abbreviated as “the present layered product”) can be obtained by laminating the present adhesive sheet with a conductive member such as a conductive layer of a transparent conductive layer . The layered product may have a structure in which at least any one of the adhesive layers of the adhesive sheet and the conductive layer of the transparent conductive layer are bonded together. When the adhesive sheet is a double-sided adhesive sheet, the laminate may also have a structure formed by laminating the two adhesive layers of the adhesive sheet and the conductive layer of the transparent conductive layer. The above-mentioned transparent conductive layer can also be formed by covering the conductive layer of the conductive film using olefin-based polymers, urethane-based polymers, epoxy-based polymers, acrylic-based polymers, polysiloxane-based polymers, or Insulating protective film (passivation film) formed of inorganic glass, etc. In this case, the adhesive sheet is not directly attached to the transparent conductive layer (not directly connected to the transparent conductive layer). This adhesive sheet can prevent the transparent conductive layer from being corroded by the action of 1,2,3-triazole even if the component (especially the acid component) derived from the composition penetrates and reaches the transparent conductive layer from the insulating film. In particular, due to the high water solubility of 1,2,3-triazole, it is easy to move to the transparent conductive layer when the adhesive sheet absorbs moisture in a humid and hot environment, so it can achieve excellent metal corrosion prevention effect. In this way, according to the present adhesive sheet, regardless of the presence or absence of the insulating protective film, not only the effect of preventing discoloration or deterioration of the adhesive layer caused by the metal ions of the adherend, but also the excellent metal corrosion preventing effect of the adherend can be realized. . The laminate obtained by laminating with the conductive layer can be preferably used for a touch panel. Examples of the touch panel include a resistive film method, an electrostatic capacitance method, an electromagnetic induction method, and the like, and an electrostatic capacitance method is preferred. As the above-mentioned transparent conductive layer, as long as it has a conductive layer on the surface layer of at least one side, there can be mentioned a transparent conductive layer formed by vapor deposition, sputtering, and coating, and a conductive material is provided on the surface layer of a transparent substrate. The conductive material used in the conductive layer of the transparent conductive layer is not particularly limited, specifically, except indium oxide, indium-gallium-zinc composite oxide, tin-doped indium oxide (ITO), zinc oxide, gallium oxide, titanium oxide In addition to metal oxides such as the like, metal materials such as silver, copper, molybdenum, and aluminum can also be used. Among them, tin-doped indium oxide (ITO) and indium-gallium-zinc composite oxide (IGZO) with excellent transparency can be preferably used. Moreover, from a viewpoint of being excellent in electroconductivity, copper or silver can also be used suitably. In the transparent conductive layer, it does not specifically limit as a base material to be patterned with a conductive substance, Glass, a resin film, etc. are mentioned. Typically, the transparent conductive layer has a conductive layer on at least one surface layer. Moreover, the conductor pattern (wiring pattern) containing copper or silver as a main component is typically formed in the transparent conductive layer so that a peripheral part may be drawn. 1,2,3-triazole has high reliability in corrosion resistance to copper contained therein, and thus the present adhesive sheet containing it can be particularly preferably used for a conductive member having a conductor pattern formed of a metal material containing copper. Specific examples of other present laminates include, for example, release film/ present pressure-sensitive adhesive sheet/touch panel, release film/ present pressure-sensitive adhesive sheet/protective panel, release film/ present pressure-sensitive adhesive sheet/image display Panel, image display panel/this adhesive sheet/touch panel, image display panel/this adhesive sheet/protective panel, image display panel/this adhesive sheet/touch panel/this adhesive sheet/protective panel , polarizing film/adhesive sheet/touch panel, polarizing film/adhesive sheet/touch panel/adhesive sheet/protective panel, etc. Moreover, among the above-mentioned structures, all structures in which the above-mentioned conductive layer is interposed between the present adhesive sheet and adjacent members such as a touch panel, a protective panel, an image display panel, and a polarizing film are exemplified. However, it is not limited to these laminated examples. Furthermore, the above-mentioned touch panel also includes a structure in which a touch panel function is built into a protective panel, or a structure in which a touch panel function is built in an image display panel. <Image Display Device> The image display device of the present invention (hereinafter, also abbreviated as "the device" hereinafter) includes at least the present laminate, an image display panel, and a surface protection panel as constituent members. More specifically, an image display device of a configuration in which the present laminate obtained by laminating the present adhesive sheet and the conductive layer of the transparent conductive layer is inserted between the image display panel and the surface protection panel. In this case, the present adhesive sheet is also used on the image display panel side. As the material of the surface protection panel, in addition to glass, alicyclic polyolefin-based resins such as acrylic resins, polycarbonate-based resins, and cycloolefin polymers, styrene-based resins, polyvinyl chloride-based resins, and phenol-based resins may be used. Resin, melamine resin, epoxy resin and other plastics. The image display panel is composed of other optical films such as retardation films other than polarizing films, liquid crystal materials, and a backlight light source system (usually, the adhesive surface of the composition or the adhesive article to the image display panel becomes an optical film), according to There are STN (Super Twisted Nematic, super twisted nematic) method, VA (Vertical Aligned, vertical alignment) method, IPS (In-Plane Switching, lateral electric field effect) method, etc., as the control method of the liquid crystal material, and can be any method. As the image display device, for example, image display devices such as liquid crystal displays, organic EL displays, inorganic EL displays, electronic paper, plasma displays, and microelectromechanical systems (MEMS) displays can be configured. <Explanation of Statements> In this specification, when it is expressed as "X to Y" (X and Y are arbitrary numbers), unless otherwise specified, the meaning of "more than X and less than Y" is included, and includes The meaning of "preferably larger than X" or "preferably smaller than Y". Also, when it is expressed as "more than X" (X is an arbitrary number) or "less than Y" (Y is an arbitrary number), it includes "preferably greater than X" or "preferably less than Y" intention. Generally speaking, the so-called "sheet", in the definition in JIS, refers to a thin, flat product whose thickness is less than the quotient of length and width. A thin and flat product whose specific thickness is extremely small and whose maximum thickness is arbitrarily defined is usually referred to as a supply in the form of a roll (Japanese Industrial Standard JIS K6900). However, the boundary between the sheet and the film is not certain. In the present invention, there is no need to distinguish between the two in terms of language. Therefore, in the present invention, "sheet" is also included in the case of "film", "Film" is also included when referred to as "sheet". [Examples] Hereinafter, the examples and comparative examples will be further described in detail. However, the present invention is not limited to these Examples. <(Meth)acrylic (co)polymer> The following are used for the (meth)acrylic (co)polymer.・A-1: A copolymer containing 76 parts by mass of 2-ethylhexyl acrylate, 20 parts by mass of vinyl acetate, and 4 parts by mass of acrylic acid (mass average molecular weight: 400,000) ・A-2: Contains 81 parts by mass of butyl acrylate , a copolymer of 15 parts by mass of methyl methacrylate and 4 parts by mass of acrylic acid (mass average molecular weight: 200,000) <Example 1> [Example 1-1] To (meth)acrylic (co)polymer (A) -1) Add 3 g of 1,2,3-triazole (manufactured by Otsuka Chemical Co., Ltd.) as a metal corrosion inhibitor, 4-methylbenzophenone and 2,4,6-trimethyldiphenyl to 1 kg 15 g of a ketone mixture (manufactured by Lamberti, trade name "Esacure TZT") was uniformly mixed as a photopolymerization initiator to obtain a resin composition for an adhesive layer. The resin composition for an adhesive layer was sandwiched between two peeled polyethylene terephthalate films (manufactured by Mitsubishi Plastics Co., Ltd., trade name "DIAFOIL MRV", thickness 100 μm and Mitsubishi Plastics Co., Ltd. product name "DIAFOIL MRV"). DIAFOIL MRQ”, thickness 75 μm), and shape the adhesive sheet into a sheet shape so that the thickness of the adhesive sheet becomes 150 μm, to produce an adhesive sheet laminate. The following various evaluations were performed about this adhesive sheet laminate. The results are shown in Table 1. [Example 1-2] To 1 kg of the (meth)acrylic (co)polymer (A-2) were added 3 g of 1,2,3-triazole as a metal corrosion inhibitor and 3 g as a crosslinking agent UV curable resin pentaerythritol triacrylate propoxylate (Shin Nakamura Co., Ltd., trade name "ATM-4PL") 20 g, 4-methylbenzophenone and 2,4,6- 15 g of a mixture of trimethylbenzophenone (manufactured by Lamberti, trade name "Esacure TZT") was uniformly mixed to obtain a resin composition for an adhesive layer. Next, the above-mentioned resin composition for an adhesive layer was applied to a peel-treated polyethylene terephthalate film (manufactured by Mitsubishi Plastics, trade name "DIAFOIL MRV", thickness 100 μm) so as to have a thickness of 150 μm. After molding into a sheet, a peel-treated polyethylene terephthalate film (manufactured by Mitsubishi Plastics, trade name "DIAFOIL MRQ", thickness 75 μm) was coated to prepare an adhesive sheet laminate. The following various evaluations were performed about this adhesive sheet laminate. The results are shown in Table 1. [Example 1-3] An adhesive sheet laminate was produced in the same manner as in Example 1-2, except that 5 g of 1,2,3-triazole as a metal corrosion inhibitor was used. The following various evaluations were performed about this adhesive sheet laminate. The results are shown in Table 1. [Comparative Example 1-1] An adhesive sheet laminate was produced in the same manner as in Example 1-1, except that 1,2,3-triazole as a metal corrosion inhibitor was not added. The following various evaluations were performed about this adhesive sheet laminate. The results are shown in Table 1. [Comparative Example 1-2] 5 g of benzotriazole (manufactured by Johoku Chemical Co., Ltd., trade name "BT120") was used in place of 1,2,3-triazole as the metal corrosion inhibitor, and the same procedures as in Example 1 were used. -1 The adhesive sheet laminate was produced in the same manner. The following various evaluations were performed about this adhesive sheet laminate. The results are shown in Table 1. [Comparative Example 1-3] Tolutriazole (a mixture of 4-methylbenzotriazole and 5-methylbenzotriazole) (manufactured by Shipro Kasei, trade name "SEETEC TT-R") 5 g was used Except having replaced 1,2,3-triazole as a metal corrosion inhibitor, it carried out similarly to Example 1-1, and produced the adhesive sheet laminated body. The following various evaluations were performed about this adhesive sheet laminate. The results are shown in Table 1. [Comparative Example 1-4] 5 g of 2,5-dimercapto-1,3,4-thiadiazole (manufactured by TOYOBO, trade name "MTD") was used instead of 1,2,3-triazole as metal corrosion prevention A pressure-sensitive adhesive sheet laminate was produced in the same manner as in Example 1-1, except that The following various evaluations were performed about this adhesive sheet laminate. The results are shown in Table 1. <Various evaluations> (1) Corrosion resistance reliability A glass substrate (60 mm × 45 mm) with a line width of 70 μm, a line length of 46 mm, and a line interval of 30 μm was formed with a thickness of 1300 Å in 10.5 round trips. ITO and copper films with a thickness of 3000 Å are sequentially laminated to form a round-trip wire of a metal film, and a 2 mm square square is formed at the two ends of the round-trip wire to form a copper pattern (about 97 cm in length) to make corrosion-resistant reliability. The copper glass substrate for evaluation (refer FIG. 1(A)). The single-sided release film of the adhesive sheet laminates (adhesive sheet thickness 150 μm) produced in the above examples and comparative examples was peeled off, and the polyethylene terephthalate (PET) film ( Toyobo Co., Ltd., trade name "COSMOSHINE A4100", 125 μm) was attached to the exposed surface. Then, after the above-mentioned adhesive sheet with PET film was cut into 52 mm × 45 mm, the remaining release film was peeled off, as shown in Figure 1(B), and the back and forth lines of the metal film were covered by hand pressure. The adhesive sheet was attached to the copper glass substrate for corrosion resistance reliability evaluation by a roller, and further, the cumulative light intensity of Example 1-1 and Comparative Examples 1-1 to 1-4 with a wavelength of 365 nm was obtained through a PET film. 3000 mJ/cm 2 , the cumulative light intensity of the wavelength 365 nm in Examples 1-2 and 1-3 is 2000 mJ/cm 2 In this way, ultraviolet rays were irradiated with a high-pressure mercury lamp to conduct ultraviolet crosslinking, and a sample for corrosion resistance reliability evaluation (copper wiring with an adhesive sheet) was produced (refer to FIG. 1(D) ). The resistance value (Ω0) at room temperature of the copper wiring in the sample for corrosion resistance reliability evaluation (copper wiring with adhesive sheet) was measured in advance. On the other hand, this sample for corrosion resistance reliability evaluation (copper wiring with adhesive sheet) was stored in an environment of 65°C and 90% RH for 500 hours, and after storage, the sample for corrosion resistance reliability evaluation (adhesive sheet attached) was measured. The resistance value (Ω) of the copper wiring in the copper wiring). Then, the copper resistance value, that is, the change rate (%) of the resistance value between the wire ends [((Ω/Ω0)−1)×100] was calculated, and shown in Table 1 as “resistance value change”. Regarding the reliability of corrosion resistance, those with a change rate of resistance value of 20% or more were judged as "x (poor)", and those less than 20% were judged as "○ (good)". The results are shown in Table 1. (2) Reliability of foaming resistance Peel off the single-sided release film of the adhesive sheet laminates (thickness 150 μm) produced in the examples and comparative examples, and stick them on a soda lime glass plate (150×200) by a manual roller. mm, thickness 0.55 mm). Furthermore, the remaining release film was peeled off, and the chemically strengthened glass plates (180×220 mm, thickness 0.6 mm) were aligned, and were bonded together by a manual roller. Next, the bonded product was subjected to an autoclave treatment at 60° C. and a 0.2 MPa environment for 20 minutes. Using a metal halide lamp irradiation device (manufactured by Ushio Electric Co., Ltd., model UVC-0516S1, LAMP UVL-8001M3-N), the irradiation dose at a wavelength of 365 nm was 3000 mJ/cm per irradiation. 2 The speed of the conveyor belt and the irradiance were adjusted in this way, and the change in appearance was observed after irradiating the sample for 15 times. Regarding the reliability of foaming resistance, when the appearance was observed, it was judged as "○ (good)" if there was no change from that before the ultraviolet irradiation, and it was judged as "x (poor)" if bubbles were generated. The results are shown in Table 1. (3) Ultraviolet Curing Properties (Storage Elastic Modulus G' Before Ultraviolet Curing) The storage elastic modulus before ultraviolet curing was obtained by setting the adhesive sheets prepared in Examples and Comparative Examples to be 1 ~2 mm thickness, and punched out into a circular shape with a diameter of 20 mm as a measurement sample, and used a rheometer (“MARS” manufactured by Eiko Seiki Co., Ltd.) to adhere to the jig: Φ25 mm parallel plate, strain: 0.5%, frequency: 1 Hz, temperature: -50~200℃, heating rate: 3℃/min, measure the dynamic storage elastic modulus G' at -50℃~200℃, and read Storage elastic modulus values at 125°C. The results are shown in Table 1. (Storage elastic modulus G' after ultraviolet curing) The storage elastic modulus after ultraviolet curing was measured as follows. The adhesive sheets produced in Examples and Comparative Examples were irradiated with ultraviolet rays through a PET film by a high-pressure mercury lamp to conduct ultraviolet crosslinking. At this time, with respect to Example 1-1 and Comparative Examples 1-1 to 1-4, the cumulative light intensity at a wavelength of 365 nm was 3000 mJ/cm 2 The irradiation was carried out in the same way as in Examples 1-2 and 1-3, and the light intensity of the laminated layer was 2000 mJ/cm. 2 irradiated in a manner. The adhesive sheet after UV-crosslinking as described above was laminated so as to have a thickness of 1 to 2 mm, and was punched out into a circular shape with a diameter of 20 mm as a measurement sample. Using a rheometer (manufactured by Eiko Seiki Co., Ltd., trade name "MARS") to adhere to a jig: Φ25 mm parallel plate, strain: 0.5%, frequency: 1 Hz, temperature: -50 to 200°C, heating rate: 3 ℃/min Measure the dynamic storage elastic modulus G' of the test sample at -50℃~200℃, and read the storage elastic modulus value at 125℃, thereby obtaining the storage elastic modulus after ultraviolet curing. The results are shown in Table 1. Regarding the ultraviolet curing characteristics, the storage elastic modulus G' before ultraviolet curing and the storage elastic modulus G' after ultraviolet curing were compared, and the value after curing was determined as "○ (good)", and the value was almost unchanged. Those who are judged as "× (poor)". The results are shown in Table 1. [Table 1]
Figure 105143084-A0304-0001
(Evaluation Results) The adhesive sheets of Examples 1-1 to 1-3 contained 1,2,3-triazole as a metal corrosion inhibitor, whereby the resistance value of the copper wiring changed less and the corrosion resistance was reliable. Excellent. In addition, the foaming resistance reliability and ultraviolet curing properties were also favorable. On the other hand, Comparative Example 1-1 did not contain a metal corrosion inhibitor, and was inferior in corrosion resistance reliability. Although Comparative Example 1-2 contains benzotriazole as a metal corrosion inhibitor, the foaming resistance reliability is poor due to the characteristics of benzotriazole. Although Comparative Example 1-3 contains tolutriazole as a metal corrosion inhibitor, the foaming resistance reliability is poor due to the characteristics of tolutriazole. Although the comparative example 1-4 contains dimercaptothiadiazole as a metal corrosion inhibitor, since dimercaptothiadiazole absorbs an ultraviolet-ray, the ultraviolet-ray hardening property of an adhesive sheet is inferior. From the above results, it can be seen that 1,2,3-triazole has a melting point of about 20°C and is almost liquid at room temperature, so it is easy to be added to the main adhesive in the actual manufacturing process of the adhesive sheet. The dispersibility to the main adhesive agent is also excellent. In addition, it is also clear that 1,2,3-triazole, due to its high water solubility, can easily move to the surface of the metal layer (copper wiring) when the adhesive sheet absorbs moisture in a humid and hot environment, so it can exhibit excellent metal corrosion prevention. Effect. In addition, it is also clear that 1,2,3-triazole does not absorb UV (Ultraviolet) curing properties because it does not absorb at the spectrophotometric wavelength of 300 to 400 nm. As described above, it was found that 1,2,3-triazole has excellent properties compared with the previous metal corrosion inhibitors, and is particularly effective for use in adhesive sheets for conductive members. <Example 2> [Example 2-1] To 1 kg of (meth)acrylic (co)polymer (A-1) was added pentaerythritol propoxylated polyacrylate (manufactured by Shin-Nakamura Chemical Industry Co., Ltd., trade name ""ATM-4PL") 200 g as a cross-linking agent, and a mixture of 4-methylbenzophenone and 2,4,6-trimethylbenzophenone (manufactured by Lamberti, trade name "Esacure TZT") 10 g was used as a photopolymerization initiator and uniformly mixed to obtain a resin composition for an intermediate layer. The resin composition for the intermediate layer was sandwiched between two peeled polyethylene terephthalate films (manufactured by Mitsubishi Plastics, trade name "DIAFOIL MRF", thickness 75 μm and manufactured by Mitsubishi Plastics, trade name "DIAFOIL MRF" MRT”, thickness 38 μm), and shape the adhesive sheet into a sheet shape so that the thickness of the adhesive sheet becomes 80 μm, to produce a resin sheet (α) for the intermediate layer. To 1 kg of (meth)acrylic (co)polymer (A-1), 1.5 g of 1,2,3-triazole was added as a metal corrosion inhibitor, tris(2,4-di-tert-butylphosphite) Phenyl) ester (manufactured by BASF, trade name "Irgafos 168") 5 g as a phosphite compound, and a mixture of 4-methylbenzophenone and 2,4,6-trimethylbenzophenone ( 15 g of Lamberti Co., Ltd. (trade name "Esacure TZT") was used as a photopolymerization initiator and mixed uniformly to obtain a resin composition for an adhesive layer. The above-mentioned resin composition for an adhesive layer was sandwiched between two peeled polyethylene terephthalate films (manufactured by Mitsubishi Plastics Corporation, trade name "DIAFOIL MRV", thickness 100 μm and manufactured by Mitsubishi Plastics Corporation, trade name "DIAFOIL MRT", thickness 38 μm), and extruded into a sheet shape so that the thickness of the adhesive sheet became 35 μm, to produce a resin sheet (β) for the adhesive layer. Further, the above-mentioned resin composition for an adhesive layer was sandwiched between two peeled polyethylene terephthalate films (manufactured by Mitsubishi Plastics, trade name "DIAFOIL MRQ", thickness 75 μm and manufactured by Mitsubishi Plastics, Trade name "DIAFOIL MRT", thickness 38 μm), and shape the adhesive sheet into a sheet shape so that the thickness of the adhesive sheet becomes 35 μm, to produce a resin sheet (β') for the adhesive layer. The PET films on both sides of the above-mentioned intermediate layer sheet (α) are sequentially peeled off and removed, and the PET films on one side of the adhesive layer resin sheets (β) and (β') are peeled off, and the exposed adhesive film is peeled off. The surfaces were sequentially bonded to both surfaces of the sheet (β) for an intermediate layer, and a laminate containing (β)/(α)/(β') was produced. Through the PET film remaining on the surface of the above (β) and (β'), the cumulative light intensity at a wavelength of 365 nm is 2000 mJ/cm 2 In this way, a high-pressure mercury lamp is used to irradiate ultraviolet rays to cross-link (α), (β) and (β') with ultraviolet rays, and an adhesive sheet laminate (thickness 150 μm) is produced. The following various evaluations were performed about this adhesive sheet laminate. The results are shown in Table 2. [Example 2-2] To 1 kg of (meth)acrylic (co)polymer (A-2) was added 3 g of 1,2,3-triazole as a metal corrosion inhibitor, tridecyl phosphite ( ADEKA Corporation, trade name "Adekastab 3010") 3 g as a phosphite compound, pentaerythritol tri- and tetraacrylate (manufactured by Toagosei Co., Ltd., "ARONIXM-306") 20 g as a crosslinking agent, and 1-hydroxy-ring 10 g of hexyl phenyl ketone (manufactured by BASF, Irgacure 184) was uniformly mixed as a photopolymerization initiator to obtain a resin composition for an adhesive layer. Next, the above-mentioned resin composition for an adhesive layer was formed into a sheet shape so as to have a thickness of 150 μm on a peel-treated polyethylene terephthalate film (manufactured by Mitsubishi Plastics, DIAFOIL MRV, thickness 100 μm). Then, a peeling-treated polyethylene terephthalate film (manufactured by Mitsubishi Plastics, trade name "DIAFOIL MRQ", thickness 75 μm) was coated. Through the peeled polyethylene terephthalate film, the cumulative light intensity at a wavelength of 365 nm becomes 1000 mJ/cm 2 In this method, ultraviolet rays are irradiated with a high-pressure mercury lamp to cross-link the resin composition for an adhesive layer with ultraviolet rays to produce an adhesive sheet laminate. The following various evaluations were performed about this adhesive sheet laminate. The results are shown in Table 2. [Example 2-3] Using 3,9-bis(decyloxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane (manufactured by Johoku Chemical Co., Ltd. , trade name "JPE-10") 3 g was used as a phosphite compound, and the adhesive sheet laminate was produced in the same manner as in Example 2-2. The following various evaluations were performed about this adhesive sheet laminate. The results are shown in Table 2. [Comparative Example 2-1] 1,2,3-triazole as a metal corrosion inhibitor and tris(2,4-di-tert-butylphenyl) phosphite (BASF Corporation) as a phosphite compound were not added An adhesive sheet laminate was produced in the same manner as in Example 2-1, except that the product was manufactured under the trade name "Irgafos 168". The following various evaluations were performed about this adhesive sheet laminate. The results are shown in Table 2. [Comparative Example 2-2] An adhesive sheet laminate was produced in the same manner as in Example 2-1, except that 1,2,3-triazole as a metal corrosion inhibitor was not added. The following various evaluations were performed about this adhesive sheet laminate. The results are shown in Table 2. [Comparative Example 2-3] 1.5 g of benzotriazole (manufactured by Johoku Chemical Co., Ltd., trade name "BT120") was added as a metal corrosion inhibitor instead of 1,2,3-triazole, and no phosphite compound was added, except Otherwise, an adhesive sheet laminate was produced in the same manner as in Example 2-1. The following various evaluations were performed about this adhesive sheet laminate. The results are shown in Table 2. <Various evaluations> (1) Oxidative degradation resistance on a glass substrate (60 mm×45 mm) with a thickness of 150 to 200 Å, a line width of 70 μm, a line length of 46 mm, and a line interval of 30 μm, with 10.5 round trips A round-trip line of indium oxide (ITO) was formed, and 2 mm square squares containing ITO were formed at both ends of the round-trip wire to form an ITO pattern (about 97 cm in length), and an ITO glass substrate for evaluation of oxidation degradation resistance was produced (refer to Figure 1(A)). The single-sided release film of the adhesive sheet laminates (thickness 150 μm) produced in the above examples and comparative examples was peeled off, and a PET film (manufactured by Toyobo Co., Ltd., trade name “COSMOSHINE A4100”) 125 μm) attached to its exposed surface. Then, after the above-mentioned adhesive sheet with PET film was cut into 52 mm × 45 mm, the remaining release film was peeled off, as shown in Figure 1(B), and the ITO reciprocating line was covered with a hand pressing roller. This adhesive sheet was attached to the ITO glass substrate for oxidative degradation resistance evaluation, and the sample for oxidative degradation resistance evaluation (ITO wiring to which the adhesive sheet was attached) was produced (see FIG. 1(C) ). The resistance value (Ω0) at room temperature of the ITO wiring in the sample for evaluation of the oxidation deterioration resistance (the ITO wiring with the adhesive sheet) was measured in advance. On the other hand, the sample for evaluation of oxidative deterioration resistance (the ITO wiring of the adhesive sheet) was stored in an environment of 65°C and 90% RH for 500 hours. After storage, the sample for evaluation of oxidative deterioration resistance (adhesion to The resistance value (Ω) of the ITO wiring in the ITO wiring of the sheet). Then, the ITO resistance value, that is, the change rate (%) of the resistance value between the wire ends [((Ω/Ω0)−1)×100] was calculated, and shown in Table 2 as “resistance value change”. Regarding the oxidation degradation resistance, the resistance value change rate of 5% or more was judged as "x (poor)", and less than 5% was judged as "○ (good)". The results are shown in Table 2. (2) Corrosion resistance reliability On a glass substrate (60 mm × 45 mm), a line width of 70 μm, a line length of 46 mm, a line interval of 30 μm, and 10.5 round trips were used to form ITO with a thickness of 1300 Å and a thickness of 3000 μm. A round-trip line of the metal film formed by laminating copper films of Å in sequence, and forming a 2 mm square square at both ends of the round-trip wire to form a copper pattern (about 97 cm in length), making a copper glass for corrosion resistance reliability evaluation substrate (refer to FIG. 1(A) ). The single-sided release film of the adhesive sheet laminates (thickness 150 μm) produced in the above examples and comparative examples was peeled off, and a PET film (manufactured by Toyobo Co., Ltd., trade name “COSMOSHINE A4100”) 125 μm) attached to its exposed surface. Then, after the above-mentioned adhesive sheet with PET film was cut into 52 mm×45 mm, the remaining release film was peeled off, as shown in FIG. An adhesive sheet was attached to the copper glass substrate for corrosion resistance reliability evaluation, and the sample for corrosion resistance reliability evaluation (copper wiring with an adhesive sheet) was produced (refer FIG.1(D)). The resistance value (Ω0) at room temperature of the copper wiring in the sample for corrosion resistance reliability evaluation (copper wiring with adhesive sheet) was measured in advance. On the other hand, this sample for corrosion resistance reliability evaluation (copper wiring with adhesive sheet) was stored in an environment of 65°C and 90% RH for 500 hours, and after storage, the sample for corrosion resistance reliability evaluation (adhesive sheet attached) was measured. The resistance value (Ω) of the copper wiring in the copper wiring of the material). Then, the copper resistance value, that is, the change rate (%) of the resistance value between the wire ends [((Ω/Ω0)−1)×100] was calculated, and shown in Table 2 as “resistance value change”. Regarding the reliability of corrosion resistance, a resistance value change rate of 20% or more was determined as "x (poor)", and less than 20% was determined as "○ (good)". The results are shown in Table 2. [Table 2]
Figure 105143084-A0304-0002
(Evaluation Result) The adhesive sheets of Examples 2-1 to 2-3 contained 1,2,3-triazole as a metal corrosion inhibitor, and further contained phosphite, so that the ITO wiring and the copper wiring were both equal in resistance value. Those with few changes and excellent in corrosion resistance reliability and oxidation degradation resistance. On the other hand, Comparative Example 2-1 did not contain a phosphite compound and a metal corrosion inhibitor, but was inferior in corrosion resistance reliability and oxidative degradation resistance. Since the comparative example 2-2 does not contain a metal corrosion inhibitor, the corrosion of copper wiring is especially remarkable. Comparative Example 2-3 did not contain a phosphite compound, but had poor oxidative degradation resistance to ITO wiring. [Industrial Applicability] The adhesive sheet for a conductive member of the present invention can have a conductive member (typically, a conductive member having a transparent conductive layer and/or a conductive pattern formed of a metal material containing copper or silver) Corrosion-resistant reliability and foaming-resistant reliability, so it can be used as an adhesive sheet suitable for laminating various conductive components. In particular, it can be preferably used as an adhesive sheet for an image display device having a touch panel.

圖1係用以於下述實施例中對耐腐蝕可靠性之評價試驗方法進行說明之圖,(A)係防氧化劣化性評價用ITO玻璃基板之ITO圖案之俯視圖或耐腐蝕可靠性評價用銅玻璃基板之銅圖案之俯視圖,(B)係表示於防氧化劣化性評價用ITO玻璃基板上被覆有黏著片材之狀態之俯視圖或表示於耐腐蝕可靠性評價用銅玻璃基板上被覆有黏著片材之狀態之俯視圖,(C)係防氧化劣化性評價用樣品之剖視圖,(D)係耐腐蝕可靠性評價用樣品之剖視圖。1 is a diagram for explaining the evaluation test method of corrosion resistance reliability in the following examples, (A) is a plan view of an ITO pattern of an ITO glass substrate for evaluation of oxidative deterioration resistance or for evaluation of corrosion resistance reliability The top view of the copper pattern of the copper glass substrate, (B) is a top view showing the state where the adhesive sheet is covered on the ITO glass substrate for evaluation of oxidative deterioration resistance, or the copper glass substrate for corrosion resistance reliability evaluation is covered with an adhesive. A plan view of the state of the sheet, (C) is a cross-sectional view of a sample for evaluation of oxidative degradation resistance, and (D) is a cross-sectional view of a sample for corrosion resistance reliability evaluation.

Claims (13)

一種導電構件用黏著片材,其包含黏著劑層,該黏著劑層包含含有(甲基)丙烯酸系共聚物及1,2,3-三唑之黏著劑組合物,且1,2,3-三唑之含量相對於(甲基)丙烯酸系共聚物100質量份為0.01質量份以上且5質量份以下。 An adhesive sheet for a conductive member, comprising an adhesive layer, the adhesive layer comprising an adhesive composition containing a (meth)acrylic copolymer and 1,2,3-triazole, and 1,2,3- Content of triazole is 0.01 mass part or more and 5 mass parts or less with respect to 100 mass parts of (meth)acrylic-type copolymers. 如請求項1之導電構件用黏著片材,其中上述黏著劑組合物含有亞磷酸酯化合物。 The adhesive sheet for conductive members according to claim 1, wherein the adhesive composition contains a phosphite compound. 如請求項2之導電構件用黏著片材,其中上述亞磷酸酯化合物包含選自脂肪族亞磷酸酯、芳香族亞磷酸酯以及具有脂肪族酯基及芳香族酯基之亞磷酸酯之任一種以上。 The adhesive sheet for conductive members according to claim 2, wherein the phosphite compound includes any one selected from the group consisting of aliphatic phosphites, aromatic phosphites, and phosphites having an aliphatic ester group and an aromatic ester group above. 如請求項1或2之導電構件用黏著片材,其中上述(甲基)丙烯酸系共聚物包含含羧基單體作為結構單元。 The adhesive sheet for conductive members according to claim 1 or 2, wherein the (meth)acrylic copolymer contains a carboxyl group-containing monomer as a structural unit. 如請求項4之導電構件用黏著片材,其中上述(甲基)丙烯酸系共聚物含有1.2~15質量%之含羧基單體。 The adhesive sheet for conductive members according to claim 4, wherein the (meth)acrylic copolymer contains 1.2 to 15% by mass of the carboxyl group-containing monomer. 如請求項1或2之導電構件用黏著片材,其中上述黏著劑組合物係具有光硬化性之組合物。 The adhesive sheet for conductive members according to claim 1 or 2, wherein the adhesive composition is a photocurable composition. 如請求項1或2之導電構件用黏著片材,其中上述黏著劑組合物包含交聯劑。 The adhesive sheet for conductive members according to claim 1 or 2, wherein the above-mentioned adhesive composition contains a crosslinking agent. 如請求項1或2之導電構件用黏著片材,其中上述導電構件具有透明導電層。 The adhesive sheet for a conductive member according to claim 1 or 2, wherein the conductive member has a transparent conductive layer. 如請求項8之導電構件用黏著片材,其中上述透明導電層具有絕緣保護膜。 The adhesive sheet for conductive members according to claim 8, wherein the transparent conductive layer has an insulating protective film. 如請求項1或2之導電構件用黏著片材,其中上述導電構件具有包含摻錫之氧化銦之透明導電層及/或由包含銅之金屬材料形成之導體圖案。 The adhesive sheet for a conductive member according to claim 1 or 2, wherein the conductive member has a transparent conductive layer containing tin-doped indium oxide and/or a conductor pattern formed of a metal material containing copper. 一種導電構件積層體,其具有將如請求項1至10中任一項之導電構件用黏著片材與導電構件貼合而成之構成。 A conductive member laminate having a configuration in which the conductive member adhesive sheet according to any one of claims 1 to 10 is bonded to the conductive member. 一種圖像顯示裝置,其包含如請求項11之導電構件積層體、圖像顯示面板及表面保護面板作為構成構件。 An image display device comprising the conductive member laminate according to claim 11, an image display panel, and a surface protection panel as constituent members. 一種導電構件用黏著劑組合物,其含有(甲基)丙烯酸系共聚物及1,2,3-三唑,且1,2,3-三唑之含量相對於(甲基)丙烯酸系共聚物100質量份為0.01質量份以上且5質量份以下。An adhesive composition for conductive members, comprising a (meth)acrylic copolymer and 1,2,3-triazole, and the content of 1,2,3-triazole is relative to the (meth)acrylic copolymer 100 parts by mass is 0.01 part by mass or more and 5 parts by mass or less.
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