JP2022028945A - Manufacturing method of laminated varistor, and laminated varistor - Google Patents

Manufacturing method of laminated varistor, and laminated varistor Download PDF

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JP2022028945A
JP2022028945A JP2021198992A JP2021198992A JP2022028945A JP 2022028945 A JP2022028945 A JP 2022028945A JP 2021198992 A JP2021198992 A JP 2021198992A JP 2021198992 A JP2021198992 A JP 2021198992A JP 2022028945 A JP2022028945 A JP 2022028945A
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external electrode
glass component
laminated varistor
sintered body
particle size
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沙也佳 松本
Sayaka Matsumoto
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Panasonic Intellectual Property Management Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminated varistor, which has simplified steps.
SOLUTION: The manufacturing method of the laminated varistor includes: a first step of preparing a sintered body that has an internal electrode; a second step of forming first external electrodes on side faces of the sintered body using a first silver paste that contains a first silver powder; and a third step of forming a second external electrode over the first external electrode using a second silver paste that contains a second silver powder and glass component. A 50% particle size in the particle size distribution of the second silver powder is three times or more of a 50% particle size in the particle size distribution of the first silver powder.
SELECTED DRAWING: Figure 1
COPYRIGHT: (C)2022,JPO&INPIT

Description

本発明は、各種電子機器をサージから保護するための積層バリスタの製造方法に関するものである。 The present invention relates to a method for manufacturing a laminated varistor for protecting various electronic devices from surges.

近年回路保護部品として表面実装用の電子部品として積層セラミックバリスタが開発されている。これらの電子部品は外部電極を持ち、この外部電極をはんだによって配線基板に電気的機械的に接続する。この外部電極のはんだへの濡れ性は外部電極表面に金属成分以外の成分の有無によって大きく左右され、この表面状態をできるだけ金属成分のみにするために様々な検討がされている。 In recent years, laminated ceramic varistor has been developed as an electronic component for surface mounting as a circuit protection component. These electronic components have an external electrode, which is electrically and mechanically connected to the wiring board by soldering. The wettability of the external electrode to the solder is greatly affected by the presence or absence of components other than the metal component on the surface of the external electrode, and various studies have been conducted to make this surface state as much as possible with the metal component.

なお、この出願の発明に関連する先行技術文献情報としては、例えば、特許文献１が知られている。 As the prior art document information related to the invention of this application, for example, Patent Document 1 is known.

特開平９－２７４０５号公報Japanese Unexamined Patent Publication No. 9-27405

しかしながら、外部電極の表層にガラス成分が存在するとはんだ濡れ性が低下する可能性がある。そのため外部電極の表面にめっき層を形成することが行われているが、積層バリスタの外部電極にめっきを行おうとすると、その素体にもめっきが付着するため、外部電極以外の部分に絶縁膜を設けておく必要があり、工程の煩雑化につながっていた。 However, the presence of a glass component on the surface layer of the external electrode may reduce the solder wettability. Therefore, a plating layer is formed on the surface of the external electrode, but when plating is performed on the external electrode of the laminated varistor, the plating also adheres to the element body, so that the insulating film is applied to the part other than the external electrode. It was necessary to provide the above, which led to the complication of the process.

本発明は、内部電極を有する焼結体を準備する第１工程と、第１銀粉を含む第１銀ペーストを用いて、焼結体の側面の一部を覆うように第１外部電極を形成する第２工程と、第２銀粉とガラス成分とを含む第２銀ペーストを用いて、第１外部電極の少なくとも一部を覆うように第２外部電極を形成する第３工程と、を備えた積層バリスタの製造方法であって、第２銀粉の粒度分布の５０％粒径は、第１銀粉の粒度分布の５０％粒径の３倍以上である。 In the present invention, the first step of preparing a sintered body having an internal electrode and the first silver paste containing the first silver powder are used to form a first external electrode so as to cover a part of the side surface of the sintered body. The second step of forming the second external electrode so as to cover at least a part of the first external electrode by using the second silver paste containing the second silver powder and the glass component is provided. In the method for producing a laminated varistor, the 50% particle size of the particle size distribution of the second silver powder is three times or more the 50% particle size of the particle size distribution of the first silver powder.

以上のように行うことにより、第１の外部電極と内部電極との接合を強固にできるとともに、第１の銀粉と第２の銀粉の粒径が異なることで、焼成時の銀粒子成長速度が異なり、第２の銀ペースト中のガラス成分が第１の外部電極内に拡散する。このことにより第２の外部電極表面に存在するガラスを減らすことができ、第２の外部電極の上にめっき層を形成しなくても第２の外部電極に直接はんだ付けあるいは第２の外部電極にはんだディップを行うことができ、工程の簡略化を図ることができる。 By performing as described above, the bonding between the first external electrode and the internal electrode can be strengthened, and the particle sizes of the first silver powder and the second silver powder are different, so that the silver particle growth rate during firing can be increased. Unlike, the glass component in the second silver paste diffuses into the first external electrode. This can reduce the amount of glass present on the surface of the second external electrode, and can be directly soldered to the second external electrode or the second external electrode without forming a plating layer on the second external electrode. Soldering dip can be performed, and the process can be simplified.

本発明の一実施の形態における積層バリスタの断面図Sectional drawing of laminated varistor in one Embodiment of this invention 本発明の一実施の形態における別の積層バリスタの断面図Sectional drawing of another laminated varistor in one Embodiment of this invention

以下、本発明の一実施の形態における積層バリスタについて、図面を参照しながら説明する。 Hereinafter, the laminated varistor according to the embodiment of the present invention will be described with reference to the drawings.

図１は本発明の一実施の形態における積層バリスタの断面図である。 FIG. 1 is a cross-sectional view of a laminated varistor according to an embodiment of the present invention.

焼結体１１は、酸化亜鉛に酸化ビスマス等を添加し、可塑剤、バインダ等を混合し、シート成形したあと、内部電極用ペーストを印刷し、積層後、個片化した後、約９００℃で焼成することによって得られる。内部電極用ペーストは、銀粉にバインダ等を混ぜたものであり、これを素体と同時焼成することにより内部電極１３を構成し、バリスタ層１２と内部電極１３とを交互に積層した焼結体１１を得る。この焼結体１１を研磨剤と混ぜて面取りすることにより、角部の面取りを行なうとともに、内部電極１３を焼結体１１側面に露出させる。焼結体１１の大きさは、幅約７ｍｍ、長さ約８ｍｍ、高さ約４ｍｍとなっている。この焼結体１１に含まれるガラス成分は、約０．４ｗｔ％となっている。 In the sintered body 11, bismuth oxide or the like is added to zinc oxide, a plasticizer, a binder or the like is mixed, a sheet is formed, a paste for an internal electrode is printed, laminated, individualized, and then at about 900 ° C. Obtained by firing in. The paste for the internal electrode is a mixture of silver powder and a binder or the like, and the internal electrode 13 is formed by simultaneous firing with the prime field, and the varistor layer 12 and the internal electrode 13 are alternately laminated to form a sintered body. Get 11. By chamfering the sintered body 11 by mixing it with an abrasive, the corners are chamfered and the internal electrode 13 is exposed on the side surface of the sintered body 11. The size of the sintered body 11 is about 7 mm in width, about 8 mm in length, and about 4 mm in height. The glass component contained in the sintered body 11 is about 0.4 wt%.

次に内部電極１３が露出した側面がそろうように焼結体１１を整列させ、露出した内部電極１３を覆うように第１の銀ペーストを印刷し、約８００℃で焼成することにより第１の外部電極１４を形成する。第１の銀ペーストは、第１の銀粉にバインダおよび可塑剤を加えたものを用いている。第１の銀粉は粒度分布の５０％粒径が約０．７μｍの銀粉からなっている。 Next, the sintered bodies 11 are aligned so that the exposed side surfaces of the internal electrodes 13 are aligned, the first silver paste is printed so as to cover the exposed internal electrodes 13, and the first silver paste is fired at about 800 ° C. The external electrode 14 is formed. The first silver paste uses the first silver powder to which a binder and a plasticizer are added. The first silver powder is composed of silver powder having a particle size distribution of about 0.7 μm, which is 50% of the particle size distribution.

このように露出した内部電極１３の上に銀からなる第１の外部電極１４を直接形成するため、内部電極１３と第１の外部電極１４との電気的接続を安定なものとすることができる。第１の外部電極１４の厚さは、約１０μｍとなっている。また第１の外部電極１４は印刷により形成するため、ほぼ焼結体１１の側面のみに設けられている。内部電極１３どうしに挟まれたバリスタ層１２は、電気的特性を決定する重要な領域となる。第１の外部電極１４に銀粉にバインダ等を混ぜたペーストを用いているため、余計なものがこの領域に拡散することを防ぎ、電気的特性を安定化することができる。 Since the first external electrode 14 made of silver is directly formed on the exposed internal electrode 13, the electrical connection between the internal electrode 13 and the first external electrode 14 can be stabilized. .. The thickness of the first external electrode 14 is about 10 μm. Further, since the first external electrode 14 is formed by printing, it is provided almost only on the side surface of the sintered body 11. The varistor layer 12 sandwiched between the internal electrodes 13 is an important region for determining the electrical characteristics. Since a paste obtained by mixing silver powder with a binder or the like is used for the first external electrode 14, it is possible to prevent unnecessary substances from diffusing into this region and stabilize the electrical characteristics.

次に第２の銀ペーストを第１の外部電極１４を覆うように塗布し、乾燥後、約８００℃で焼き付けることにより第２の外部電極１５を形成する。第２の外部電極１５の最大厚さは約２０μｍとなっている。第２の銀ペーストは、第２の銀粉にバインダ、可塑剤、およびガラスフリットを加えたものを用いている。ガラスフリットの量は、約１５ｗｔ％としている。また第２の銀粉は粒度分布の５０％粒径が約２．１μｍの銀粉からなっている。このように第２の銀粉の粒度分布の５０％粒径を、第１の銀粉の粒度分布の５０％粒径の３倍以上とすることにより、焼成時の銀粒子成長速度が異なり、第２の銀ペースト中のガラス成分が第１の外部電極１４内に拡散する。 Next, the second silver paste is applied so as to cover the first external electrode 14, dried, and then baked at about 800 ° C. to form the second external electrode 15. The maximum thickness of the second external electrode 15 is about 20 μm. The second silver paste uses a second silver powder to which a binder, a plasticizer, and a glass frit are added. The amount of glass frit is about 15 wt%. The second silver powder is composed of silver powder having a 50% particle size distribution of about 2.1 μm. By setting the 50% particle size of the second silver powder particle size distribution to be three times or more the 50% particle size of the first silver powder particle size distribution, the silver particle growth rate at the time of firing is different, and the second silver particle growth rate is different. The glass component in the silver paste of No. 1 diffuses into the first external electrode 14.

このようにすることにより、第２の外部電極１５を形成したあとの、断面から観察した第１の外部電極１４のガラス成分の割合は約２０％、第２の外部電極１５のガラス成分の割合は約６％となっている。このように第１の外部電極１４のガラス成分の割合を、第２の外部電極１５のガラス成分の割合の２倍以上とすることにより、第２の外部電極１５表面のガラス成分をほとんどなくすことができ、はんだ付け性の良い積層バリスタを得ることができる。 By doing so, the ratio of the glass component of the first external electrode 14 observed from the cross section after forming the second external electrode 15 is about 20%, and the ratio of the glass component of the second external electrode 15 is about 20%. Is about 6%. By setting the ratio of the glass component of the first external electrode 14 to twice or more the ratio of the glass component of the second external electrode 15 in this way, the glass component on the surface of the second external electrode 15 is almost eliminated. It is possible to obtain a laminated varistor with good solderability.

なお、焼結体１１に含まれるガラス成分が多すぎると、第２の銀ペースト中のガラスが十分に焼結体１１のほうに移動することができないため、焼結体１１はガラス成分を３ｗｔ％以下とすることが望ましい。 If the glass component contained in the sintered body 11 is too large, the glass in the second silver paste cannot sufficiently move toward the sintered body 11, so that the sintered body 11 contains 3 wt of the glass component. It is desirable to be less than%.

図２は本発明の一実施の形態における別の積層バリスタの断面図である。 FIG. 2 is a cross-sectional view of another laminated varistor according to an embodiment of the present invention.

図１の積層バリスタの第２の外部電極１５にはんだディップを行うことによりはんだ１６の層を形成し、リード端子１８を接続する。このリード端子１８は鉄またはリン青銅の板を所定の形状に打ち抜いた後、Ｌ字状に折り曲げたものを用いている。またこのリード端子１８には、ニッケル、および錫のめっき層が形成され、外部電極と当接する領域にははんだ層１７が設けられている。このようにして、リード端子１８と外部電極とを当接させ、レーザ等で加熱してはんだ層１７を溶かし、外部電極にリード端子１８を接続し、リード端子付の積層バリスタを得ることができる。このようにすることにより、積層バリスタの形状が大きくなっても、ヒートサイクルに強い積層バリスタを得ることができる。 A layer of solder 16 is formed by performing a solder dip on the second external electrode 15 of the laminated varistor of FIG. 1, and a lead terminal 18 is connected to the layer. The lead terminal 18 is made by punching an iron or phosphor bronze plate into a predetermined shape and then bending it into an L shape. Further, a nickel and tin plating layer is formed on the lead terminal 18, and a solder layer 17 is provided in a region in contact with an external electrode. In this way, the lead terminal 18 and the external electrode are brought into contact with each other, heated by a laser or the like to melt the solder layer 17, and the lead terminal 18 is connected to the external electrode to obtain a laminated varistor with a lead terminal. .. By doing so, even if the shape of the laminated varistor becomes large, it is possible to obtain a laminated varistor that is resistant to heat cycles.

本発明に係る積層バリスタの製造方法は、素体表面に絶縁膜を形成しなくてもはんだ付け性の良い積層バリスタを得ることができ、産業上有用である。 The method for manufacturing a laminated varistor according to the present invention is industrially useful because a laminated varistor having good solderability can be obtained without forming an insulating film on the surface of the prime field.

１１ 焼結体
１２ バリスタ層
１３ 内部電極
１４ 第１の外部電極
１５ 第２の外部電極
１６ はんだ
１７ はんだ層
１８ リード端子 11 Sintered body 12 Varistor layer 13 Internal electrode 14 First external electrode 15 Second external electrode 16 Solder 17 Solder layer 18 Lead terminal

Claims (6)

内部電極を有する焼結体を準備する第１工程と、
第１銀粉を含む第１銀ペーストを用いて、前記焼結体の側面の一部を覆うように第１外部電極を形成する第２工程と、
第２銀粉とガラス成分とを含む第２銀ペーストを用いて、前記第１外部電極の少なくとも一部を覆うように第２外部電極を形成する第３工程と、
を備えた積層バリスタの製造方法であって、
前記第２銀粉の粒度分布の５０％粒径は、前記第１銀粉の粒度分布の５０％粒径の３倍以上である積層バリスタの製造方法。 The first step of preparing a sintered body having an internal electrode and
The second step of forming the first external electrode so as to cover a part of the side surface of the sintered body by using the first silver paste containing the first silver powder, and the second step.
A third step of forming the second external electrode so as to cover at least a part of the first external electrode by using the second silver paste containing the second silver powder and the glass component.
It is a manufacturing method of a laminated varistor equipped with
A method for producing a laminated varistor, wherein the 50% particle size of the particle size distribution of the second silver powder is three times or more the 50% particle size of the particle size distribution of the first silver powder. 前記第３工程は、前記第２外部電極に含まれる前記ガラス成分の一部を、前記第１外部電極内に拡散させる工程を含み、
前記第３工程後における、前記第１外部電極に含まれる前記ガラス成分の割合は、前記第２外部電極に含まれるガラス成分の割合の２倍以上である請求項１記載の積層バリスタの製造方法。 The third step includes a step of diffusing a part of the glass component contained in the second external electrode into the first external electrode.
The method for manufacturing a laminated varistor according to claim 1, wherein the ratio of the glass component contained in the first external electrode after the third step is at least twice the ratio of the glass component contained in the second external electrode. .. 前記焼結体に含まれる前記ガラス成分の割合は、３ｗｔ％以下である請求項１または２に記載の積層バリスタの製造方法。 The method for producing a laminated varistor according to claim 1 or 2, wherein the ratio of the glass component contained in the sintered body is 3 wt% or less. 焼結体と、
前記焼結体の内部に設けられた内部電極と、
前記焼結体の側面の一部を覆うように設けられ、銀を含む第１外部電極と、
前記第１外部電極の少なくとも一部を覆うように設けられ、銀を含む第２外部電極と
を備えた積層バリスタであって、
前記第１外部電極および前記第２外部電極は、同じガラス成分を含み、
前記第１外部電極に含まれる前記ガラス成分の割合は、前記第２外部電極に含まれる前記ガラス成分の割合の２倍以上である積層バリスタ。 Sintered body and
The internal electrodes provided inside the sintered body and
A first external electrode provided so as to cover a part of the side surface of the sintered body and containing silver,
A laminated varistor provided so as to cover at least a part of the first external electrode and provided with a second external electrode containing silver.
The first external electrode and the second external electrode contain the same glass component and contain the same glass component.
A laminated varistor in which the proportion of the glass component contained in the first external electrode is at least twice the proportion of the glass component contained in the second external electrode. 前記第１外部電極に含まれる前記ガラス成分は、前記第２外部電極から拡散したものである請求項４記載の積層バリスタ。 The laminated varistor according to claim 4, wherein the glass component contained in the first external electrode is diffused from the second external electrode. 前記焼結体に含まれる前記ガラス成分の割合は、３ｗｔ％以下である請求項４記載の積層バリスタ。 The laminated varistor according to claim 4, wherein the ratio of the glass component contained in the sintered body is 3 wt% or less.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62264613A (en) * 1986-05-12 1987-11-17 日本電気株式会社 Laminated ceramic capacitor
JPH11102835A (en) * 1997-09-26 1999-04-13 Tdk Corp Laminated ceramic electronic component and manufacture thereof
JP2002217054A (en) * 2001-01-15 2002-08-02 Tdk Corp Electronic component and manufacturing method thereof
JP2010123647A (en) * 2008-11-18 2010-06-03 Panasonic Corp Ceramics electronic component, and electronic apparatus using the same
JP2019179812A (en) * 2018-03-30 2019-10-17 パナソニックＩｐマネジメント株式会社 Manufacturing method of multilayer varistor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62264613A (en) * 1986-05-12 1987-11-17 日本電気株式会社 Laminated ceramic capacitor
JPH11102835A (en) * 1997-09-26 1999-04-13 Tdk Corp Laminated ceramic electronic component and manufacture thereof
JP2002217054A (en) * 2001-01-15 2002-08-02 Tdk Corp Electronic component and manufacturing method thereof
JP2010123647A (en) * 2008-11-18 2010-06-03 Panasonic Corp Ceramics electronic component, and electronic apparatus using the same
JP2019179812A (en) * 2018-03-30 2019-10-17 パナソニックＩｐマネジメント株式会社 Manufacturing method of multilayer varistor

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