JP2021534578A - Chamber cooling equipment and semiconductor processing equipment - Google Patents

Abstract

A chamber cooling device and semiconductor processing equipment are provided, the device including a cooling tank (5), a plurality of cooling pipes (2), and a plurality of water supply pipes (7), wherein the cooling tank (5) is a cooling liquid. Is used to cool the bottom of the chamber, the plurality of cooling pipes (2) are provided in the cooling tank (5), and any of the tube walls of the plurality of cooling pipes (2). Also provided with a discharge port (21), the cooling liquid is ejected through the discharge port (21) to form a rotating water flow, thereby driving the cooling liquid in the cooling tank (5) to generate a rotating turbulent flow. Used for forming, the plurality of water supply pipes (7) are connected to a plurality of cooling pipes (2) in a one-to-one correspondence, and each water supply pipe (7) has an on-off valve (71) and a flow rate. A regulating valve (72) is provided. The chamber cooling device can not only further make the structure more compact and reduce the flow rate loss of the cooling liquid, but also can independently control the flow rate in the plurality of cooling pipes (7), thereby operability. And water flow uniformity can be improved.

Description

The present invention relates to the field of semiconductor manufacturing, and specifically to a chamber cooling device and semiconductor processing equipment.

Chemical Vapor Deposition (hereinafter abbreviated as CVD) technology is a chemical technology for producing solid materials with high purity and excellent performance, and a typical CVD process is one or more wafers. Exposure to different species of precursors, at a given process temperature, causes a chemical reaction and / or chemical decomposition on the surface of the wafer, thereby forming a thin film on the wafer.

In any of the CVD techniques, temperature control, especially the temperature control of the CVD reaction chamber, is one of the very important techniques. At the stage of performing the process, the internal temperature of the reaction chamber is relatively high and can reach 1100 ° C., and even at the process termination stage and the wafer removal stage, the internal temperature of the reaction chamber is as high as 350 ° C. Therefore, the reaction chamber is always kept. Needs to be cooled.

The conventional chamber cooling device uses a coolant distribution device to distribute the coolant to two water supply pipes, and further transports the coolant to multiple drainage pipes at the same time via the two water supply pipes, and multiple drainage pipes. Is used to evenly eject the coolant towards the chamber. However, in actual application, the chamber cooling device inevitably has the following problems.

1. The structure of the coolant distribution device, water supply pipe and drainage pipe is complicated, and the occupied space is large.

2. The coolant is ejected through the coolant distributor, the water supply pipe and the drain pipe in this order, the flow path is relatively long, and the flow velocity loss is relatively large.

3. The flow rate in the plurality of drainage pipes is controlled by the coolant distribution device and cannot be independently controlled. Therefore, the operability is relatively poor and it cannot be ensured that a uniform water flow is obtained.

The present invention aims to solve at least one of the technical problems existing in the prior art and provides a chamber cooling device and a semiconductor processing facility, which makes the structure more compact and reduces the flow rate loss of the cooling liquid. It is possible to control the flow rate in a plurality of cooling pipes independently, thereby improving operability and water flow uniformity.

To achieve the object of the present invention, a chamber cooling device is provided, which includes a cooling tank, a plurality of cooling pipes, and a plurality of water supply pipes.
The cooling tank contains the cooling liquid and is used to cool the bottom of the chamber.
The plurality of cooling pipes are provided in the cooling tank, and discharge ports are provided on any of the tube walls of the plurality of cooling pipes, and the cooling liquid is ejected through the discharge ports to form a rotating water flow. It is used to drive the cooling liquid in the cooling tank to form a rotary turbulence.
The plurality of water supply pipes are connected to the plurality of cooling pipes on a one-to-one basis, and each of the water supply pipes is provided with an on-off valve and a flow rate adjusting valve.

As an option, each cooling pipe has one discharge port, and the injection direction of the discharge port is tangential to its circumference, or
Each of the cooling pipes has a plurality of discharge ports, and is distributed at intervals along different concentric circumferences along the axial direction of the cooling pipes, and the injection direction of each of the discharge ports is tangent to the circumference. The direction.

As an option, the center of each circumference is the center of the cooling tank, and all the outlets are located in the central region of the cooling tank.

As an option, the injection direction of each discharge port is provided diagonally upward with respect to the horizontal plane.

As an option, the range of the angle value between the injection direction of each discharge port and the horizontal plane is 40 ° to 60 °.

As an option, the plurality of said cooling tubes comprises at least one curved tube, or the plurality of said said cooling tubes comprises at least one straight tube.

As an option, the curved pipe includes a straight pipe portion and a curved pipe portion, of which the curved pipe portion is close to the center of the cooling tank and the discharge port is provided on the pipe wall of the curved pipe portion.

As an option, the axis of the straight pipe is provided along any radial direction of the circumference centered on the cooling tank, or the circumference centered on the cooling tank. It is provided so as to intersect the radial direction.

As an option, one end of the water supply pipe is connected to the cooling pipe, and the other end of the water supply pipe penetrates the bottom of the cooling tank and is connected to the cooling liquid source.

As an option, the chamber cooling device further includes a separator.
The separator is provided in the cooling tank, is located above the cooling pipe, and has a through hole in the central region of the separator, and is used to expose at least the discharge port of the cooling pipe. ..

As an option, the chamber cooling device also includes two side plates.
The two side plates are provided so as to face each other in the cooling tank and are located on both sides of the separator, the upper portion of the side plates is higher than the separator, and stoppers are provided on the upper portions of the two side plates. , Used to limit the maximum water level of the cooling liquid located inside the side plate.

As an option, an injection tube is provided inside each of the side plates and above the separator so that the injection tubes of the two side plates are close to each other at both ends of the two side plates and each of the injections. The pipe ejects the cooling liquid toward the side plate on the opposite side, thereby increasing the rotational power of the cooling liquid in the cooling tank.

As an option, the chamber cooling device further includes a bottom plate, and a mounting plate.
The bottom plate is provided in the cooling tank, and a central through groove is provided in the bottom plate so as to penetrate along the thickness thereof.
The mounting plate is laminated on the bottom plate, each of the cooling pipes is fixed to the mounting plate, and each of the water supply pipes penetrates the mounting plate and is connected to the corresponding cooling pipe.

The present invention further provides semiconductor processing equipment, including a reaction chamber and a chamber cooling device provided at the bottom of the reaction chamber, the chamber cooling device using the chamber cooling device.

The present invention has the following beneficial effects.

According to the chamber cooling device provided by the present invention, it is provided with a plurality of cooling pipes in the cooling tank, and a discharge port is provided on any of the tube walls of the plurality of cooling pipes through the discharge port. It is used to eject the cooling liquid to form a rotating water flow, thereby driving the cooling liquid in the cooling tank to form a rotating turbulent flow, thereby improving the heat exchange efficiency and enhancing the cooling effect. be able to. At the same time, a plurality of water supply pipes are connected to the plurality of cooling pipes in a one-to-one correspondence, and each water supply pipe is provided with an on-off valve and a flow rate adjusting valve, whereby the conduction / cutoff and the flow rate of each cooling pipe are provided. It is possible to realize independent control of the size of the water flow, thereby improving the operability and the uniformity of the water flow, and further ensuring the effective formation of the rotational turbulence. Further, the chamber cooling device provided by the present invention omits the coolant distribution device as compared with the prior art, whereby the structure can be further made more compact, and the water supply pipe is directly connected to the cooling pipe. , The flow path of the cooling liquid can be shortened, thereby reducing the flow velocity loss of the cooling liquid.

According to the semiconductor processing equipment provided by the present invention, by using the chamber cooling device provided by the present invention, not only can the structure be further made compact and the flow rate loss of the cooling liquid can be reduced, but also more than one. The flow rate in the cooling pipe can be controlled independently, thereby improving operability and water flow uniformity.

FIG. 1 is a top view of the chamber cooling device from which the separator provided in the embodiment of the present invention has been removed. FIG. 2 is a partial structural view of the chamber cooling device provided by the embodiment of the present invention. FIG. 3 is a top view of the chamber cooling device provided by the embodiment of the present invention. FIG. 4 is a top view of the cooling pipe used in the embodiment of the present invention. FIG. 5 is a radial cross-sectional view of the cooling pipe used in the embodiment of the present invention. FIG. 6 is a structural diagram of a water supply pipe used in an embodiment of the present invention.

In order for those skilled in the art to better understand the technical proposal of the present invention, the chamber cooling device and the semiconductor processing equipment provided by the present invention will be described in detail below with reference to the drawings.

With reference to FIGS. 1 to 6, in the chamber cooling apparatus provided by the embodiment of the present invention, it includes a cooling tank 5, a plurality of cooling pipes 2 and a plurality of water supply pipes 7, of which the cooling tank 5 is cooled. Contains a liquid (eg, coolant or cooling water). Cooling of the chamber is realized by immersing the bottom of the chamber (not shown) in the cooling liquid of the cooling tank 5.

The plurality of cooling pipes 2 are provided in the cooling tank 5, and the discharge ports 21 are provided on each of the pipe walls of the plurality of cooling pipes 2, and the cooling liquid is ejected through the discharge ports 21 to discharge the rotating water flow. Is used to drive the cooling liquid in the cooling tank 5 to form a rotary turbulent flow. The so-called rotational turbulence is a kind of fluid state, and specifically, when the flow velocity of the cooling liquid increases to a certain degree, the laminar flow is destroyed and the rapidly rotating water flow is substantially spiral. It is a state that forms a spiral. The rotary turbulence has a more sufficient heat exchange effect than the laminar flow, whereby the heat exchange efficiency can be improved and the cooling effect can be enhanced.

In this embodiment, each of the cooling pipes 2 has a plurality of discharge ports 21 and is distributed at intervals along the axial direction of the cooling pipes 2 with different concentric circumferences. The injection direction is the tangential direction of the circumference (the direction of the arrow shown in FIG. 1). As an option, each discharge port 21 on each cooling pipe 2 is located on the same circumference with a one-to-one correspondence with each discharge port 21 on the remaining cooling pipe 2. By providing a plurality of discharge ports 21 in each cooling pipe 2, the flow rate of the liquid is increased under the condition that the flow rate of the cooling liquid ejected by each cooling pipe 2 is maintained as it is, thereby forming the above-mentioned rotational turbulence. It is advantageous to do. As an option, the number of discharge ports 21 is five.

In the present embodiment, the injection direction of each discharge port 21 is the tangential direction of the circumference thereof, but the present invention is not limited to this, and in actual application, the injection direction of the discharge port 21 is the circumference. It may deviate to some extent from the tangential direction, and it is sufficient if the effect of finally driving the cooling liquid in the cooling tank 5 to form a rotational turbulence can be achieved.

As an option, the discharge port 21 may be a through hole penetrating the pipe wall along the thickness direction of the pipe wall of the cooling pipe 2, and the axial direction of the through hole is the injection direction of the discharge port 21. Is. In this way, the structure of the cooling pipe 2 can be simplified, and the design of the cooling pipe 2 becomes easy.

As an option, the center of each circumference is the center of the cooling tank 5, and all the discharge ports 21 are located in the central region of the cooling tank 5. Specifically, the first end of each cooling pipe 2 is cooled. Although it is close to the center of the tank 5 and the second end is close to the edge of the cooling tank 5, the discharge port 21 is provided on the pipe wall of the cooling pipe 2 and is close to the first end of the cooling pipe 2. As described above, not only is it advantageous for the direction of water flow uniformity in the cooling tank 5, but also the rotational turbulence formed by all the discharge ports 21 being located in the central region of the cooling tank 5 is generated in the cooling tank 5. It can be located in the central region of the cooling tank 5 to further improve the water flow uniformity in the cooling tank 5.

In addition, in this embodiment, there are a plurality of discharge ports 21 on each cooling pipe 2, but the present invention is not limited to this, and in actual application, there is only one discharge port 21 on each cooling pipe 2. It may be present, and the injection direction of the discharge port 21 may be the tangential direction of the circumference, or may deviate to some extent from the tangential direction of the circumference.

In this embodiment, as shown in FIG. 2, the plurality of water supply pipes 7 are connected to the plurality of cooling pipes 2 in a one-to-one correspondence, and as shown in FIG. 6, an on-off valve is connected to each water supply pipe 7. 71 and a flow rate adjusting valve 72 are provided. The on-off valve 71 is used to conduct or shut off the water supply pipe 7 in which it is located, and the flow rate adjusting valve 72 is used to adjust the flow rate of the cooling liquid in the water supply pipe 7 in which it is located. Thereby, the conduction / cutoff of each cooling pipe 2 and the independent control of the size of the flow rate can be realized, thereby improving the operability and the uniformity of the water flow, and further effectively forming the rotational turbulence. Can be secured.

Further, in the chamber cooling device provided by the present embodiment, as compared with the prior art, each cooling pipe 2 is pulled out independently from the water supply pipe 7, and the structure is further made compact by omitting the coolant distribution device. By directly connecting the water supply pipe 7 to the cooling pipe 2, the flow path of the cooling liquid can be shortened, thereby reducing the flow velocity loss of the cooling liquid.

In this embodiment, as shown in FIG. 5, the axis of each cooling pipe 2 is provided horizontally, and the injection direction of the discharge port 21 is provided diagonally upward with respect to the axis of the cooling pipe 2. In this way, it is possible to avoid the occurrence of a "hollow" state in the rotational turbulence, that is, the absence of cooling liquid in the center of the cooling tank 5. Of course, in an actual application, the axis of each cooling pipe 2 may be inclined upward with respect to the horizontal plane, and at this time, the injection direction of the discharge port 21 is provided diagonally upward with respect to the horizontal plane. The effect can be achieved. Here, the horizontal plane is a plane parallel to the liquid surface.

As an option, the range of the value of the angle c between the injection direction of each discharge port 21 and the horizontal plane is 40 ° to 60 °, preferably 50 °. Within the radius range, it is possible to effectively avoid the occurrence of a "hollow" state in the rotational turbulence.

In practical applications, the shape of the radial cross section of the cooling tube 2 includes circles, triangles, rectangles, hexagons or any other shape, preferably circular. The discharge port 21 may be a through hole penetrating the tube wall of the cooling pipe 2, and the shape of the radial cross section of the through hole includes a circular shape, a triangular shape, a rectangular shape, a hexagonal shape, or any other shape.

In this embodiment, of the plurality of cooling pipes 2, two are curved pipes and the remaining cooling pipes 2 are straight pipes. By providing a mixture of curved pipes and straight pipes, it is advantageous to arrange a large number of cooling pipes 2 in the circumferential direction of the cooling tank 5. Of course, in practical applications, the number of straight tubes and curved tubes may be selected according to specific needs, that is, the plurality of cooling tubes 2 may include at least one curved tube, or may be plural. Cooling pipe 2 may include at least one straight pipe.

Further, as an option, as shown in FIG. 4, the curved pipe includes a straight pipe portion 2a and a curved pipe portion 2b, of which the curved pipe portion 2b is close to the center of the cooling tank 5 and the discharge port 21 is a curved pipe. It is provided on the pipe wall of the portion 2b. By installing a portion close to the center of the cooling tank 5 as a curved pipe portion 2b and installing a portion away from the center of the cooling tank 5 as a straight pipe portion 2a, a large number of cooling pipes 2 are installed in the circumferential direction of the cooling tank 5. It is advantageous to arrange the discharge ports 21 and to design the arrangement of the discharge ports 21.

As an option, the number of cooling pipes 2 is 10. Of course, in actual applications, it may be any other number.

As an option, as shown in FIG. 1, in a straight pipe, its axis may be provided along any radial direction of the circumference centered on the center of the cooling tank 5, or intersect with the radial direction. You may. In other words, the acute angle a between the line connecting one end away from the discharge port 21 of the straight pipe (that is, one end close to the edge of the cooling tank 5) and the center of the cooling tank 5 and the axis of the cooling pipe 2 is. It may be 0 ° or may exhibit an acute angle, which is advantageous for the formation of rotational turbulence.

In this embodiment, as shown in FIG. 2, each water supply pipe 7 is provided vertically, the upper end of the water supply pipe 7 is connected to the cooling pipe 2, and the lower end of the water supply pipe 7 penetrates the bottom of the cooling tank 5. And connected to a cooling liquid source (not shown). Thereby, the cooling pipe can be pulled out independently, the coolant distribution device can be omitted, the structure can be further made compact, and the flow path of the cooling liquid can be shortened, thereby reducing the flow velocity loss. Can be done. Of course, in actual application, the water supply pipe 7 may be provided so as to be inclined with respect to the vertical direction according to specific needs.

In this embodiment, as shown in FIG. 3, the chamber cooling device further includes a separator 3, which is provided in the cooling tank 5 and is located above the cooling pipe 2 and penetrates the central region of the separator 3. The hole 31 is provided and is used to expose at least the discharge port 21 of the cooling pipe 2 so that the central region of the cooling tank 5 is in an open state, and the cooling liquid is passed through the through hole 31. It can overflow and also ensures that there is sufficient water flow in the main hot region of the corresponding chamber, thereby ensuring that the region is sufficiently cooled.

In this embodiment, as shown in FIG. 2, the chamber cooling device further includes two side plates 9 (only one side plate 9 is shown in FIG. 2), and the two side plates 9 face each other in the cooling tank 5. Provided and located on both sides of the separator 3 (separator 3 is not shown in FIG. 2), the upper portion of the side plate 9 is higher than the separator 3, and stoppers 4 are provided on the upper portions of the two side plates 9, respectively. It is used to limit the maximum water level of the cooling liquid located inside the side plate 9.

Specifically, the accommodation space of the cooling tank 5 is divided into a central region and edge regions 51 located on both sides of the central region by two side plates 9, and all the cooling pipes 2 are provided in the central region. In the process of ejecting the cooling liquid by the cooling pipe 2, the water level located in the central region of the cooling tank 5 gradually rises, and when the water level exceeds the stopper 4, the cooling liquid in the central region overflows and the edges on both sides. It flows into the region 51.

In this embodiment, as shown in FIG. 3, two injection pipes 6 are provided inside each side plate 9 and above the separator 3, and the injection pipes 6 of the two side plates 9 are each of the two side plates 9. Close to both ends apart, for example, the injection pipe 6 of the upper side plate 9 in FIG. 3 is close to the right end of the side plate 9, while the injection pipe 6 of the lower side plate 9 is close to the left end of the side plate 9. As described above, the injection pipes 6 on different side plates 9 can be brought close to one diagonal of the cooling tank 5, and each injection pipe 6 ejects the cooling liquid toward the side plates 9 on the opposite side. Is equivalent to ejecting the cooling liquid in the tangential direction of a specific circumference, and similarly, a rotating water flow can be formed, and the rotating water flow formed by the cooling pipe 2 ejecting the cooling liquid in the water flow direction. The rotational power of the cooling liquid in the cooling tank 5 can be further increased only by making the direction substantially the same. As an option, the injection pipe 6 is independently supplied with the cooling liquid by one water supply pipe, and the conduction / cutoff and the magnitude of the flow rate of the injection pipe 6 can be adjusted independently.

As an option, the number of injection pipes 6 provided inside each side plate 9 may be one or more, and the plurality of injection pipes 6 are provided at intervals along the horizontal direction.

In this embodiment, as shown in FIGS. 1 and 2, the chamber cooling device further includes a bottom plate 1 and a mounting plate 8, of which the bottom plate 1 is provided in the cooling tank 5 and its thickness in the bottom plate 1. A central through groove 11 penetrating along the ridge is provided, the mounting plate 8 is laminated on the bottom plate 1, each cooling pipe 2 is fixed to the mounting plate 8, and each water supply pipe 7 penetrates the mounting plate 8. And it is connected to the corresponding cooling pipe 2. The bottom plate 1 and the mounting plate 8 realize the mounting and fixing of the cooling pipe 2.

As another technical proposal, an embodiment of the present invention further provides semiconductor processing equipment, which includes a reaction chamber and a chamber cooling device provided at the bottom of the reaction chamber, wherein the chamber cooling device is the embodiment of the present invention. The above chamber cooling device provided is used.

According to the semiconductor processing equipment provided by the embodiment of the present invention, it is possible to further make the structure more compact and reduce the flow rate loss of the cooling liquid by using the chamber cooling device provided by the embodiment of the present invention. Not only that, the flow rate in the plurality of cooling pipes can be controlled independently, thereby improving the operability and the water flow uniformity.

As can be understood, the above embodiments are merely exemplary embodiments used to illustrate the principles of the invention, but the invention is not limited thereto. A person skilled in the art can make various modifications and improvements without departing from the spirit and purpose of the present invention, and these modifications and improvements also belong to the scope of protection of the present invention.

2 Cooling pipe 2a Straight pipe 2b Curved pipe 21 Discharge port 3 Separator 31 Through hole 5 Cooling tank 51 Edge area 7 Water supply pipe 71 On / off valve 72 Flow control valve 8 Mounting plate 9 Side plate

Claims (14)

A chamber cooling device, including a cooling tank, a plurality of cooling pipes, and a plurality of water supply pipes.
The cooling tank contains the cooling liquid and is used to cool the bottom of the chamber.
The plurality of cooling pipes are provided in the cooling tank, and discharge ports are provided on any of the tube walls of the plurality of cooling pipes, and the cooling liquid is ejected through the discharge ports to form a rotating water flow. It is used to drive the cooling liquid in the cooling tank to form a rotary turbulence.
The chamber cooling device is characterized in that the plurality of water supply pipes are connected to the plurality of cooling pipes in a one-to-one correspondence, and each of the water supply pipes is provided with an on-off valve and a flow rate adjusting valve. Each of the cooling pipes has one discharge port, and the injection direction of the discharge port is tangential to the circumference thereof, or
Each of the cooling pipes has a plurality of discharge ports, and is distributed at intervals along the axial direction of the cooling pipes with different concentric circumferences, and the injection direction of each of the discharge ports is the tangential direction of the circumference. The chamber cooling device according to claim 1, wherein the chamber cooling device is characterized by the above. The chamber cooling device according to claim 2, wherein the center of each circumference is the center of the cooling tank, and all the discharge ports are located in the central region of the cooling tank. The chamber cooling device according to claim 1, wherein the injection direction of each discharge port is provided diagonally upward with respect to a horizontal plane. The chamber cooling device according to claim 4, wherein the range of the value of the angle between the injection direction of each discharge port and the horizontal plane is 40 ° to 60 °. The chamber cooling apparatus according to claim 1, wherein the plurality of cooling pipes include at least one curved pipe, or the plurality of said cooling pipes include at least one straight pipe. The curved pipe includes a straight pipe portion and a curved pipe portion, of which the curved pipe portion is close to the center of the cooling tank and the discharge port is provided on the pipe wall of the curved pipe portion. The chamber cooling device according to claim 6. The axis of the straight pipe is provided along any radial direction of the circumference centered on the center of the cooling tank, or with any radial direction of the circumference centered on the center of the cooling tank. The chamber cooling device according to claim 6, wherein the chamber cooling devices are provided so as to intersect with each other. The chamber cooling according to claim 1, wherein one end of the water supply pipe is connected to the cooling pipe, and the other end of the water supply pipe penetrates the bottom of the cooling tank and is connected to a cooling liquid source. Device. The chamber cooling device further includes a separator.
The separator is provided in the cooling tank, is located above the cooling pipe, and has a through hole in the central region of the separator, and is used to expose at least the discharge port of the cooling pipe. The chamber cooling device according to any one of claims 1 to 9, wherein the chamber cooling device is provided. The chamber cooling device further includes two side plates.
The two side plates are provided opposite to each other in the cooling tank, are located on both sides of the separator, the upper part of the side plates is higher than the separator, and stoppers are provided on the upper portions of the two side plates, respectively. The chamber cooling device according to claim 10, wherein the chamber cooling device is used to limit the maximum water level of the cooling liquid located inside the side plate. An injection tube is provided inside each of the side plates and above the separator, the injection tubes of the two side plates are close to each other at both ends of the two side plates apart from each other, and the injection tubes face each other. The chamber cooling device according to claim 11, wherein the cooling liquid is ejected toward the side plate on the side, thereby increasing the rotational power of the cooling liquid in the cooling tank. The chamber cooling device further includes a bottom plate and a mounting plate.
The bottom plate is provided in the cooling tank, and a central through groove is provided in the bottom plate so as to penetrate along the thickness thereof.
The mounting plate is laminated on the bottom plate, and each of the cooling pipes is fixed to the mounting plate, and each of the water supply pipes penetrates the mounting plate and is connected to the corresponding cooling pipe. The chamber cooling device according to claim 1. A semiconductor processing facility including a reaction chamber and a chamber cooling device provided at the bottom of the reaction chamber.
The semiconductor processing equipment, wherein the chamber cooling device uses the chamber cooling device according to any one of claims 1 to 13.

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