JP2021530384A5 - - Google Patents

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Publication number
JP2021530384A5
JP2021530384A5 JP2021502988A JP2021502988A JP2021530384A5 JP 2021530384 A5 JP2021530384 A5 JP 2021530384A5 JP 2021502988 A JP2021502988 A JP 2021502988A JP 2021502988 A JP2021502988 A JP 2021502988A JP 2021530384 A5 JP2021530384 A5 JP 2021530384A5
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JP
Japan
Prior art keywords
carrier
layer
build platform
photocurable resin
blank layer
Prior art date
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JP2021502988A
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English (en)
Japanese (ja)
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JP7353352B2 (ja
JPWO2020016815A5 (https=
JP2021530384A (ja
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Priority claimed from PCT/IB2019/056131 external-priority patent/WO2020016815A1/en
Publication of JP2021530384A publication Critical patent/JP2021530384A/ja
Publication of JPWO2020016815A5 publication Critical patent/JPWO2020016815A5/ja
Publication of JP2021530384A5 publication Critical patent/JP2021530384A5/ja
Application granted granted Critical
Publication of JP7353352B2 publication Critical patent/JP7353352B2/ja
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JP2021502988A 2018-07-20 2019-07-17 オブジェクトを層ごとにビルドアップする方法及びこのような方法を実行するための3d印刷装置 Active JP7353352B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP18184626.2 2018-07-20
EP18184626 2018-07-20
PCT/IB2019/056131 WO2020016815A1 (en) 2018-07-20 2019-07-17 A method of layerwise building up an object and a 3d printing device for performing such a method

Publications (4)

Publication Number Publication Date
JP2021530384A JP2021530384A (ja) 2021-11-11
JPWO2020016815A5 JPWO2020016815A5 (https=) 2022-08-02
JP2021530384A5 true JP2021530384A5 (https=) 2022-08-02
JP7353352B2 JP7353352B2 (ja) 2023-09-29

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Application Number Title Priority Date Filing Date
JP2021502988A Active JP7353352B2 (ja) 2018-07-20 2019-07-17 オブジェクトを層ごとにビルドアップする方法及びこのような方法を実行するための3d印刷装置

Country Status (5)

Country Link
US (1) US11559938B2 (https=)
EP (1) EP3823813B1 (https=)
JP (1) JP7353352B2 (https=)
CN (1) CN112437719B (https=)
WO (1) WO2020016815A1 (https=)

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