JP2021518656A5 - - Google Patents
Info
- Publication number
- JP2021518656A5 JP2021518656A5 JP2020549056A JP2020549056A JP2021518656A5 JP 2021518656 A5 JP2021518656 A5 JP 2021518656A5 JP 2020549056 A JP2020549056 A JP 2020549056A JP 2020549056 A JP2020549056 A JP 2020549056A JP 2021518656 A5 JP2021518656 A5 JP 2021518656A5
- Authority
- JP
- Japan
- Prior art keywords
- model
- nanowire
- weighing system
- semiconductor structure
- measurement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862643322P | 2018-03-15 | 2018-03-15 | |
| US62/643,322 | 2018-03-15 | ||
| US16/352,776 US11036898B2 (en) | 2018-03-15 | 2019-03-13 | Measurement models of nanowire semiconductor structures based on re-useable sub-structures |
| US16/352,776 | 2019-03-13 | ||
| PCT/US2019/022370 WO2019178424A1 (en) | 2018-03-15 | 2019-03-14 | Measurement models of nanowire semiconductor structures based on re-usable sub-structures |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021518656A JP2021518656A (ja) | 2021-08-02 |
| JP2021518656A5 true JP2021518656A5 (enExample) | 2022-03-18 |
| JP7161543B2 JP7161543B2 (ja) | 2022-10-26 |
Family
ID=67905716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020549056A Active JP7161543B2 (ja) | 2018-03-15 | 2019-03-14 | 再使用型サブ構造に依拠したナノワイヤ半導体構造の計測モデル |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11036898B2 (enExample) |
| JP (1) | JP7161543B2 (enExample) |
| KR (1) | KR102477026B1 (enExample) |
| CN (1) | CN111837230B (enExample) |
| TW (1) | TWI781300B (enExample) |
| WO (1) | WO2019178424A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113196176B (zh) * | 2018-12-21 | 2024-12-20 | Asml荷兰有限公司 | 用于计量的方法和装置 |
| US11867595B2 (en) | 2019-10-14 | 2024-01-09 | Industrial Technology Research Institute | X-ray reflectometry apparatus and method thereof for measuring three dimensional nanostructures on flat substrate |
| US11579099B2 (en) * | 2019-10-14 | 2023-02-14 | Industrial Technology Research Institute | X-ray reflectometry apparatus and method thereof for measuring three dimensional nanostructures on flat substrate |
| US11644412B2 (en) * | 2020-08-02 | 2023-05-09 | Aizhong Zhang | Thin film spectroellipsometric imaging |
| CN113175992B (zh) * | 2021-04-25 | 2023-01-06 | 南京大学 | 一种纳米锥光谱分析器件及光谱分析方法 |
| US12567165B2 (en) * | 2022-02-02 | 2026-03-03 | Fei Company | Critical dimension measurement in 3D with geometric models |
| TWI814579B (zh) | 2022-09-13 | 2023-09-01 | 財團法人工業技術研究院 | 用以量測平整基板上之三維奈米結構的x射線反射儀設備及方法 |
| US12493004B2 (en) | 2022-09-28 | 2025-12-09 | Industrial Technology Research Institute | Method for determining parameters of three dimensional nanostructure and apparatus applying the same |
| US12587274B2 (en) | 2023-03-28 | 2026-03-24 | Quantum Generative Materials Llc | Satellite optimization management system based on natural language input and artificial intelligence |
| US12379672B2 (en) | 2023-05-11 | 2025-08-05 | Kla Corporation | Metrology of nanosheet surface roughness and profile |
| US12510590B2 (en) | 2023-06-30 | 2025-12-30 | Kla Corporation | Metrology in the presence of CMOS under array (CuA) structures utilizing an effective medium model with physical modeling |
| US12380367B2 (en) | 2023-06-30 | 2025-08-05 | Kla Corporation | Metrology in the presence of CMOS under array (CuA) structures utilizing machine learning and physical modeling |
| US12372882B2 (en) | 2023-06-30 | 2025-07-29 | Kla Corporation | Metrology in the presence of CMOS under array (CUA) structures utilizing an effective medium model with classification of CUA structures |
| US20250053096A1 (en) * | 2023-08-07 | 2025-02-13 | Kla Corporation | Flexible Measurement Models For Model Based Measurements Of Semiconductor Structures |
| US12603701B2 (en) | 2023-12-27 | 2026-04-14 | Quantum Generative Materials Llc | Distributed satellite constellation management and control system |
| US12368503B2 (en) | 2023-12-27 | 2025-07-22 | Quantum Generative Materials Llc | Intent-based satellite transmit management based on preexisting historical location and machine learning |
| US12627372B2 (en) | 2023-12-27 | 2026-05-12 | Quantum Generative Materials Llc | Advanced mission control predictive systems for low earth orbit semi-autonomous satellites |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6734967B1 (en) | 1995-01-19 | 2004-05-11 | Kla-Tencor Technologies Corporation | Focused beam spectroscopic ellipsometry method and system |
| US5608526A (en) | 1995-01-19 | 1997-03-04 | Tencor Instruments | Focused beam spectroscopic ellipsometry method and system |
| US5859424A (en) | 1997-04-08 | 1999-01-12 | Kla-Tencor Corporation | Apodizing filter system useful for reducing spot size in optical measurements and other applications |
| US6429943B1 (en) | 2000-03-29 | 2002-08-06 | Therma-Wave, Inc. | Critical dimension analysis with simultaneous multiple angle of incidence measurements |
| WO2002025708A2 (en) | 2000-09-20 | 2002-03-28 | Kla-Tencor-Inc. | Methods and systems for semiconductor fabrication processes |
| US6895075B2 (en) | 2003-02-12 | 2005-05-17 | Jordan Valley Applied Radiation Ltd. | X-ray reflectometry with small-angle scattering measurement |
| WO2003054475A2 (en) | 2001-12-19 | 2003-07-03 | Kla-Tencor Technologies Corporation | Parametric profiling using optical spectroscopic systems |
| US6816570B2 (en) | 2002-03-07 | 2004-11-09 | Kla-Tencor Corporation | Multi-technique thin film analysis tool |
| US7478019B2 (en) | 2005-01-26 | 2009-01-13 | Kla-Tencor Corporation | Multiple tool and structure analysis |
| US7430051B2 (en) | 2005-10-12 | 2008-09-30 | Sematech Inc. | Methods for characterizing semiconductor material using optical metrology |
| US7567351B2 (en) | 2006-02-02 | 2009-07-28 | Kla-Tencor Corporation | High resolution monitoring of CD variations |
| US7596422B2 (en) | 2007-01-12 | 2009-09-29 | Tokyo Electron Limited | Determining one or more profile parameters of a structure using optical metrology and a correlation between profile models and key profile shape variables |
| US7755764B2 (en) | 2007-01-26 | 2010-07-13 | Kla-Tencor Corporation | Purge gas flow control for high-precision film measurements using ellipsometry and reflectometry |
| US7907264B1 (en) | 2007-09-07 | 2011-03-15 | Kla-Tencor Corporation | Measurement of thin film porosity |
| US7929667B1 (en) | 2008-10-02 | 2011-04-19 | Kla-Tencor Corporation | High brightness X-ray metrology |
| US9228943B2 (en) | 2011-10-27 | 2016-01-05 | Kla-Tencor Corporation | Dynamically adjustable semiconductor metrology system |
| US20130110477A1 (en) * | 2011-10-31 | 2013-05-02 | Stilian Pandev | Process variation-based model optimization for metrology |
| US8879073B2 (en) | 2012-02-24 | 2014-11-04 | Kla-Tencor Corporation | Optical metrology using targets with field enhancement elements |
| US8749179B2 (en) | 2012-08-14 | 2014-06-10 | Kla-Tencor Corporation | Optical characterization systems employing compact synchrotron radiation sources |
| US9581430B2 (en) | 2012-10-19 | 2017-02-28 | Kla-Tencor Corporation | Phase characterization of targets |
| US8860937B1 (en) | 2012-10-24 | 2014-10-14 | Kla-Tencor Corp. | Metrology systems and methods for high aspect ratio and large lateral dimension structures |
| US10769320B2 (en) | 2012-12-18 | 2020-09-08 | Kla-Tencor Corporation | Integrated use of model-based metrology and a process model |
| US9291554B2 (en) | 2013-02-05 | 2016-03-22 | Kla-Tencor Corporation | Method of electromagnetic modeling of finite structures and finite illumination for metrology and inspection |
| US10101670B2 (en) | 2013-03-27 | 2018-10-16 | Kla-Tencor Corporation | Statistical model-based metrology |
| US9875946B2 (en) | 2013-04-19 | 2018-01-23 | Kla-Tencor Corporation | On-device metrology |
| CN110058495A (zh) | 2013-05-21 | 2019-07-26 | Asml荷兰有限公司 | 检查方法和设备、用于在其中使用的衬底及器件制造方法 |
| US9915522B1 (en) | 2013-06-03 | 2018-03-13 | Kla-Tencor Corporation | Optimized spatial modeling for optical CD metrology |
| US9383661B2 (en) | 2013-08-10 | 2016-07-05 | Kla-Tencor Corporation | Methods and apparatus for determining focus |
| US10935893B2 (en) | 2013-08-11 | 2021-03-02 | Kla-Tencor Corporation | Differential methods and apparatus for metrology of semiconductor targets |
| US9778213B2 (en) | 2013-08-19 | 2017-10-03 | Kla-Tencor Corporation | Metrology tool with combined XRF and SAXS capabilities |
| US9846132B2 (en) | 2013-10-21 | 2017-12-19 | Kla-Tencor Corporation | Small-angle scattering X-ray metrology systems and methods |
| US9553033B2 (en) | 2014-01-15 | 2017-01-24 | Kla-Tencor Corporation | Semiconductor device models including re-usable sub-structures |
| CN107533020B (zh) * | 2015-04-28 | 2020-08-14 | 科磊股份有限公司 | 计算上高效的基于x射线的叠盖测量系统与方法 |
| US10458912B2 (en) | 2016-08-31 | 2019-10-29 | Kla-Tencor Corporation | Model based optical measurements of semiconductor structures with anisotropic dielectric permittivity |
| US11333621B2 (en) | 2017-07-11 | 2022-05-17 | Kla-Tencor Corporation | Methods and systems for semiconductor metrology based on polychromatic soft X-Ray diffraction |
-
2019
- 2019-03-13 US US16/352,776 patent/US11036898B2/en active Active
- 2019-03-14 KR KR1020207029592A patent/KR102477026B1/ko active Active
- 2019-03-14 WO PCT/US2019/022370 patent/WO2019178424A1/en not_active Ceased
- 2019-03-14 JP JP2020549056A patent/JP7161543B2/ja active Active
- 2019-03-14 CN CN201980018185.XA patent/CN111837230B/zh active Active
- 2019-03-15 TW TW108108973A patent/TWI781300B/zh active
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