JP2021196276A - Inspection jig and inspection device - Google Patents

Abstract

To provide an inspection jig and an inspection device that allow a circuit board and a heater block to electrically connect to each other without connecting the circuit board and the heater block to each other by a wire, while suppressing thermal influence that the circuit board receives from the heater block.SOLUTION: An inspection jig 10 of the present invention includes: a substrate 30 having a terminal 35 electrically connected to a device D; and a conductive heater block 40 for heating the device D by contacting the device D. The inspection device 10 for making the device D conductive while heating the device D, includes: a conductive external block 20 arranged at an interval from the heater block 40; and a conductive unit 31b provided on one surface of the substrate 30, the conductive unit 31b making the heater block 40 and the external block 20 conductive.SELECTED DRAWING: Figure 2

Description

The present invention relates to an inspection jig and an inspection device used for energizing and inspecting a device to be inspected while heating it.

For devices made of semiconductor elements such as FETs, inspections such as burn-in inspection are performed in which the device to be inspected is attached to an inspection jig and driven in a state of being heated to a predetermined temperature to detect an element that malfunctions (burn-in inspection). For example, see Patent Document 1 below).

Japanese Unexamined Patent Publication No. 5-36793

In this type of inspection, if the inspection target is a device that operates at high frequencies, it is necessary to stabilize the ground while heating the device to be inspected.

Therefore, it is conceivable to provide a heater block that contacts and heats the device on a circuit board that supplies power to the device, and connects this heater block to a reference potential to stabilize the ground of the device. However, when the heater block is provided on the circuit board, not only the device to be inspected but also the electronic components provided on the circuit board are heated by the heat of the heater block, so that the electronic components mounted on the circuit board are likely to deteriorate. Become.

By arranging the circuit board and the heater block apart from each other and connecting the ground line provided on the circuit board and the heater block by wiring, the circuit board is less likely to be affected by the heat of the heater block. However, in such a case, it is necessary to wire and connect the circuit board and the heater block, which complicates the structure of the inspection jig and requires assembling man-hours. In addition, the long ground line and high impedance can cause the device under inspection to operate at unintended high frequencies.

The present invention has been made in view of the above points, and the circuit board and the heater block are electrically connected without wiring and connecting the circuit board and the heater block while suppressing the thermal influence of the heater block on the circuit board. It is an object of the present invention to provide an inspection jig and an inspection apparatus capable of performing the inspection.

The inspection jig according to the present invention includes a substrate provided with terminals electrically connected to the device and a conductive heater block that contacts the device to heat the device, and is used to energize the device while heating it. The inspection jig includes a conductive outer block arranged at a distance from the heater block and a conductive portion provided on one surface of the substrate, and the conductive portion includes the heater block and the external block. Is conductive.

The inspection device according to the present invention is an inspection device that energizes a device attached to the inspection jig while heating the device. The inspection jig is in contact with a substrate provided with a terminal electrically connected to the device and the device. A conductive heater block for heating the device, a conductive external block arranged at a distance from the heater block, and a conductive portion provided on one surface of the substrate, wherein the conductive portion is described as described above. It conducts the heater block and the external block.

According to the present invention, it is possible to electrically connect the circuit board and the heater block in a stable low impedance state without wiring and connecting the circuit board and the heater block while suppressing the thermal influence of the heater block on the circuit board. ..

Perspective view of the inspection jig according to the first embodiment of the present invention. An exploded perspective view of the inspection jig shown in FIG. Cross-sectional perspective view of the inspection jig of FIG. Top view of the inspection jig socket of FIG. 1 with the socket removed. Enlarged sectional view of the main part of the inspection jig shown in FIG. Perspective view of the inspection jig according to the modified example of the first embodiment of the present invention. Enlarged sectional view of the main part of the inspection jig of FIG. An exploded perspective view of the inspection jig according to the second embodiment of the present invention. Sectional drawing of the inspection jig of FIG. Top view of the inspection jig of FIG.

(First Embodiment)
Hereinafter, the first embodiment of the present invention will be described with reference to FIGS. 1 to 5.

The inspection jig 10 of the present embodiment is provided in one or a plurality of inspection devices for performing reliability inspection such as burn-in inspection, and energizes the device D to be inspected while heating it.

The inspection jig 10 includes a frame-shaped support base 12 having an opening 11 formed in the central portion, an external block 20 mounted on the support base 12 so as to close the opening 11, and an external block 20. It includes a socket substrate 30 placed on the upper surface and a heater block 40 that contacts and heats the device D.

As shown in FIG. 2, the outer block 20 includes a substantially plate-shaped base plate 21 provided on the upper surface of the support base 12 so as to cover the opening 11, and a pair of ground plates 22 attached to the upper surface of the base plate 21. To be equipped. The base plate 21 and the ground plate 22 constituting the outer block 20 are made of a conductive metal material such as copper or an alloy thereof.

The base plate 21 is provided with an elongated rectangular slit 23 extending in a predetermined first direction X. The base plate 21 is provided so as to be overlapped with the support base 12 so that the slit 23 communicates vertically with the opening 11 of the support base 12, and is fixed to the support base 12 by bolts or the like. The base plate 21 supports the circuit board 31 of the socket board 30 mounted on the upper surface thereof.

A plurality of columnar spacers 25 extending downward from the support base 12 through the opening 11 are provided on the lower surface of the base plate 21. At the lower end of the columnar spacer 25, a bottom plate 26 arranged in parallel with the base plate 21 is attached below the support base 12.

A mounting recess 24 recessed downward is provided on the upper surface of the base plate 21. The mounting recesses 24 are provided at two locations at intervals in the second direction Y perpendicular to the first direction X so as to face each other with the slit 23 interposed therebetween. A ground plate 22 is provided on the bottom surface of the mounting recess 24 so as to overlap with each other.

As shown in FIGS. 2 and 4, the pair of ground plates 22 are arranged in the mounting recess 24 at intervals in the second direction Y so as to form a gap S above the slit 23 of the base plate 21, and are arranged by bolts or the like. It is fixed.

At the tip of the pair of ground plates 22 facing the gap S, a plurality of protrusions 27 protruding toward the facing ground plates 22 (that is, toward the second direction Y) are spaced apart from each other in the first direction X (this). In the embodiment, there are two places) protruding. The protrusion 27 of one ground plate 22 is provided so as to face the protrusion 27 of the other ground plate 22 facing the gap S across the gap S in the second direction Y (see FIG. 4). An inclined surface 27a that is inclined so as to become thinner toward the front end is provided on the lower surface of the protrusion 27 of the ground plate 22.

Further, the pair of ground plates 22 are provided with a connector 28 to which an inspection signal and a reference potential (ground potential) are input from the outside of the inspection jig 10 such as a control unit of the inspection device.

A socket substrate 30 is provided on the upper surface of such a ground plate 22. The socket board 30 is electrically connected to the connector 28 provided on the ground plate 22, and the inspection signal and the reference potential are transmitted from the outside.

The socket board 30 includes a circuit board 31 mounted on the upper surface of the ground plate 22, and a socket portion 32 mounted on the upper surface of the circuit board 31.

The circuit board 31 is a printed circuit board on which a signal pattern 31a and a ground pattern 31b are formed and an electronic component 31c such as a capacitor is mounted (see FIG. 5). The circuit board 31 is provided with a substrate through hole 31d at a position above the gap S formed between the pair of ground plates 22.

The signal pattern 31a is electrically connected to the central conductor 28a of the connector 28 provided on the ground plate 22, and transmits an inspection signal input to the connector 28 from the outside to the device D to be inspected via the socket portion 32.

The ground pattern 31b is electrically connected to the outer conductor 28b of the connector 28 together with the ground plate 22, and transmits the reference potential input to the connector 28 from the outside to the device D via the heater block 40.

In this embodiment, the ground plate 22 is electrically connected to the outer conductor 28b of the connector 28. Further, the ground pattern 31b is provided on the lower surface of the circuit board 31 so as to be in contact with the ground plate 22 and the heater block 40, and the external conductor 28b of the connector 28 electrically connected to the ground plate 22 is the ground plate 22 and the outer conductor 28b. It is electrically connected to the heater block 40 via the ground pattern 31b.

The connector 28 can be provided at an arbitrary position on the ground plate 22, but as shown in FIG. 4, the connector 28 is located on the ground plate 22 so that the device D is located on a straight line connecting the connectors 28 in a plan view. It is preferable that the connector is provided in.

Further, the ground pattern 31b is preferably provided on the lower surface of the circuit board 31 so as to be in surface contact with the ground plate 22 and the heater block 40. For example, the signal pattern 31a, the electronic component 31c, etc. are provided on the lower surface of the circuit board 31. It is preferable that it is provided in the entire region that does not interfere with.

The socket portion 32 electrically connects the lower socket 33 fixed to the upper surface of the circuit board 31, the upper socket 34 provided on the upper side of the lower socket 33, the signal pattern 31a of the circuit board 31, and the electrode of the device D. It is provided with a terminal 35.

The lower socket 33 has a concave portion 33a recessed downward on the upper surface thereof, and a lower socket through hole 33b is formed in the central portion of the concave portion 33a. The lower socket through hole 33b communicates vertically with the substrate through hole 31d of the circuit board 31, the gap S formed between the pair of ground plates 22, the slit 23 of the base plate 21, and the opening 11 of the support base 12. is doing.

A plurality of terminals 35 are provided on the bottom surface of the recess 33a around the socket through hole 33b. The lower end of the terminal 35 penetrates the lower socket 33 and is electrically connected to the signal pattern 31a of the circuit board 31.

A middle plate 37 having an opening 37a having a shape and a size capable of accommodating the device D is provided in the recess 33a of the lower socket 33. The middle plate 37 covers the terminal 35 from above so that the upper end portion of the terminal 35 provided in the recess 33a projects inward from the peripheral edge portion of the opening 37a.

The upper socket 34 is connected to the lower socket 33 via a hinge 36 so as to open and close the upper surface opening of the recess 33a. The upper socket 34 has an upper socket through hole 34a that communicates vertically with the lower socket through hole 33b and a frame shape that protrudes downward from the peripheral edge of the upper socket through hole 34a in a state where the upper surface opening of the lower socket 33 is closed. The ridge 34b is provided.

When the device D is housed in the opening 37a of the middle plate 37, the upper end of the terminal 35 protruding from the peripheral edge of the opening 37a comes into contact with the electrode provided on the lower surface of the device D. .. As a result, the device D is electrically connected to the signal pattern 31a of the circuit board 31 via the terminal 35. Then, when the upper surface opening of the recess 33a of the lower socket 33 is closed by the upper socket 34, the ridge 34b provided in the upper socket 34 presses the device D downward and the terminal 35 and the second protrusion of the heater block 40 described later are projected. It is brought into close contact with the portion 45.

As shown in FIGS. 2, 3 and 5, the heater block 40 includes a block body 41 made of a conductive metal material such as copper or an alloy thereof, a heater 42 for heating the block body 41, and a block body 41. It is provided with a thermocouple 43 for detecting the temperature of the above.

The block body 41 has a narrow width in the second direction Y and extends in the first direction X so that it can be inserted into a gap S formed between a slit 23 provided in the base plate 21 and a pair of ground plates 22. A protruding portion 44 and a second protruding portion 45 projecting upward from the first protruding portion 44 are provided. The block main body 41 is provided with a second protruding portion 45 shorter than the first protruding portion 44 in the first direction and Y in the second direction Y, and a stepped portion is provided between the first protruding portion 44 and the second protruding portion 45. 46 is formed.

In the block body 41, the first protrusion 44 is inserted from below into the gap S formed between the slit 23 of the base plate 21 and the pair of ground plates 22, and the second protrusion 45 is the substrate through hole 31d and the bottom. It is fixed to the upper surface of the bottom plate 26 via a heat-resistant spacer so that it can be inserted into the socket through hole 33b from below.

When the block main body 41 is fixed to the bottom plate 26 in this way, the first protruding portion 44 is arranged at a predetermined interval without contacting the protrusion 27 of the base plate 21 or the ground plate 22, and the step portion 46 of the block main body 41 is a substrate. At the peripheral edge of the through hole 31d, the ground pattern 31b provided on the lower surface of the circuit board 31 is in surface contact with the ground pattern 31b. That is, the ground pattern 31b of the circuit board 31 is provided so as to straddle the step portion 46 of the ground plate 22 and the block main body 41, and functions as a conductive portion that conducts the ground plate 22 and the block main body 41.

Further, the second protruding portion 45 is arranged at a predetermined interval without contacting the circuit board 31 or the lower socket 33, and the tip of the second protruding portion 45 projects upward from the bottom surface of the recess 33a of the lower socket 33. , Contact the lower surface of the device D housed in the opening 37a of the middle plate 37. As a result, the ground pattern 31b that contacts the step portion 46 and the device D that contacts the tip of the second protrusion 45 are electrically connected via the block main body 41.

As shown in FIG. 2, the upper surface of the first protruding portion 44 of the block main body 41 avoids contact with the terminal 35 protruding downward from the circuit board 31 of the socket board 30 around the second protruding portion 45. A recess 48 is provided.

In the inspection jig 10 of the present embodiment, as shown in FIG. 3, the upper socket 34 is opened with respect to the lower socket 33, the device D is accommodated in the opening 37a of the middle plate 37, and then the upper socket 34 is closed and lowered. By closing the opening on the upper surface of the socket 33, the device D is set in the inspection jig 10. The device D set in the inspection jig 10 in this way is pressed downward by the ridge 34b provided on the upper socket 34, and comes into close contact with the tip of the second protrusion 45 of the terminal 35 and the heater block 40.

Then, in the inspection jig 10, the heater power is supplied to the heater 42 from the control unit of the inspection device (not shown), and the inspection signal and the reference potential are input to the central conductor 28a and the outer conductor 28b of the connector 28, respectively.

As a result, the heater 42 provided in the heater block 40 heats the device D from the tip of the second protrusion 45 by heating the block main body 41 so that the temperature detected by the thermocouple 43 becomes a predetermined temperature. Energize while energizing. That is, the inspection signal input to the central conductor 28a of the connector 28 is input to the electrode of the device D via the signal pattern 31a of the circuit board 31 and the terminal 35 of the socket portion 32, and the reference potential input to the external conductor 28b. Is input to the lower surface of the device D via the ground plate 22 of the external block 20, the ground pattern 31b of the circuit board 31, and the block body 41 of the heater block 40, so that the device D is energized according to a predetermined condition.

In the inspection jig 10 having the above configuration, the heater block 40 that contacts and heats the device D is arranged at a predetermined interval from the base plate 21 and the ground plate 22, so that the heat of the heater block 40 is grounded. It is difficult to transmit to the socket board 30 mounted on the plate 22, and thermal deterioration of the electronic component 31c mounted on the circuit board 31 can be suppressed.

Further, in the inspection jig 10 of the present embodiment, since the ground plate 22 and the heater block 40 arranged at predetermined intervals are conducted by the ground pattern 31b provided on the circuit board 31, the heater block 40 and the inspection jig 10 are connected to each other. The heater block 40 and the ground plate 22 can be electrically connected by a simple structure without wiring and connecting the ground plate 22.

Further, in the inspection jig 10 of the present embodiment, since the ground plate 22 and the heater block 40 abut on and support the lower surface of the circuit board 31, the circuit board 31 can be easily and firmly fixed.

Moreover, by providing the ground pattern 31b on the lower surface of the circuit board 31 supported by the ground plate 22 and the heater block 40, it becomes easy to secure the contact area between the ground pattern 31b and the ground plate 22 and the heater block 40, and the ground pattern 31b Impedance can be reduced. Therefore, even when a high-frequency inspection signal is input, the device D can be properly inspected in a stable operating state by suppressing impedance mismatch and the like.

Further, in the inspection jig 10 of the present embodiment, the ground pattern 31b of the circuit board 31 is in contact with the block body 41 at the peripheral edge of the substrate through hole 31d into which the second protrusion 45 is inserted, and is close to the device D. At the position, the block main body 41 is electrically connected to the ground pattern 31b of the circuit board 31. Therefore, the impedance of the ground pattern 31b can be reduced, and even when a high-frequency inspection signal is input, the impedance mismatch can be suppressed and the device D can be properly inspected in a stable operating state.

Further, in the present embodiment, the protrusions 27 are provided at the tips of the pair of ground plates 22 so that the distance between the ground plates 22 and the first protrusions 44 is partially close to each other, so that the impedance of the ground pattern 31b is reduced. It is possible to prevent the heat from the heater block 40 from being transferred to the circuit board 31 via the ground plate 22.

(Example of modification of the first embodiment)
Next, a modified example of the first embodiment described above will be described with reference to FIGS. 6 to 7.

In this modification, a convex contact 49 protruding upward from the upper surface of the first protruding portion 44 of the heater block 40 is inserted into the through hole 31e provided in the circuit board 31 of the socket board 30. When the convex contact 49 is inserted into the through hole 31e from below, it is electrically connected to the ground pattern 31b provided on the circuit board 31.

In such a modification example, when the convex contact 49 is inserted into the through hole 31e of the circuit board 31, the circuit board 31 is positioned with respect to the heater block 40, so that the circuit board 31 is positioned accurately in the heater block 40. It can be provided, and the terminal provided on the socket substrate 30 can be brought into contact with the electrode of the device D with high accuracy, and the second protruding portion 45 can be brought into contact with the desired position of the device D to be heated.

In this modified example, it is preferable that the convex contact 49 has a tapered shape that becomes thinner toward the tip (upper end), such as a cone or a polygonal pyramid, because the positioning accuracy of the circuit board 31 is improved.

Further, in this modification, as shown in FIG. 7, a heat insulating sheet 39 for suppressing heat conduction from the heater block 40 to the circuit board 31 is provided between the first protruding portion 44 of the heater block 40 and the circuit board 31. You may. That is, a heat insulating sheet 39 is provided between the first protruding portion 44 and the circuit board 31 so that the through hole 39a penetrating the heat insulating sheet 39 communicates with the through hole 31e of the circuit board 31, and the through hole 39a of the heat insulating sheet 39 is provided. By inserting the convex contact 49 into the through hole 31e of the circuit board 31 from below, the convex contact 49 is electrically connected to the ground pattern 31b provided on the circuit board 31. In such a case, in addition to the operation and effect of the above-described modification, heat conduction from the heater block 40 to the circuit board 31 can be suppressed, and deterioration of the electronic component 31c mounted on the circuit board 31 can be suppressed.

(Second Embodiment)
Next, the second embodiment of the present invention will be described with reference to FIGS. 8 to 10.

In the inspection jig 110 of the present embodiment, the configuration of the circuit board 131 for transmitting the inspection signal and the reference potential to the device D and the block main body 141 for contacting and heating the device D is the inspection cure of the first embodiment described above. It is different from the tool 10. The same or corresponding configurations as those in the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIG. 8, the circuit board 131 is a printed circuit board on which a signal pattern 131a and a ground pattern 131b are formed and an electronic component 131c such as a capacitor is mounted. The circuit board 131 is placed on the upper surface of the pair of ground plates 22 so as to straddle the gap S formed between the pair of ground plates 22, and the substrate through hole 131d is provided above the gap S.

The signal pattern 131a is electrically connected to the central conductor 28a of the connector 28 provided on the ground plate 22, and transmits an inspection signal input to the connector 28 from the outside to the device D to be inspected. In the present embodiment, one end of the signal pattern 131a is electrically connected to the central conductor 28a of the connector 28 provided on the ground plate 22, and the other end is terminated at the peripheral edge of the substrate through hole 131d. The other end of the signal pattern 131a located at the peripheral edge of the substrate through hole 131d functions as a terminal that is in contact with the electrode of the device D accommodated in the substrate through hole 131d and is electrically connected.

The ground pattern 131b is electrically connected to the outer conductor 28b of the connector 28 together with the ground plate 22. Further, the ground pattern 131b is provided on the lower surface of the circuit board 131 so as to be in contact with the ground plate 22 and the heater block 140.

The ground pattern 131b is preferably provided on the lower surface of the circuit board 131 so as to be in surface contact with the ground plate 22 and the heater block 140. For example, the signal pattern 131a, the electronic component 131c, etc. are provided on the lower surface of the circuit board 131. It is preferable that it is provided in the entire region that does not interfere with.

As shown in FIGS. 8 to 10, the block main body 141 constituting the heater block 140 can be inserted into a gap S formed between a slit 23 provided in the base plate 21 and a pair of ground plates 22. A first protrusion 144 extending in the first direction X with a narrow width in the two directions Y is provided.

The first protruding portion 144 is provided with a constricted portion 150 recessed in the second direction Y so as to be away from the ground plate 22 at a position facing the ground plate 22 in the second direction Y. In the first protruding portion 144, the portion narrowed in the second direction Y by the constricted portion 150 is vertically overlapped with the substrate through hole 131d provided in the circuit board 131 and the mounting portion 151 on which the device D is mounted. Become.

The first protruding portion 144 is inserted from below into the gap S formed between the slit 23 of the base plate 21 and the pair of ground plates 22 so that the constricted portion 150 and the substrate through hole 131d of the circuit board 131 overlap each other vertically. The upper surface of the first protruding portion 144 comes into surface contact with the ground pattern 131b provided on the lower surface of the circuit board 131.

In this state, the first protrusions 144 are arranged at predetermined intervals without contacting the base plate 21 and the ground plate 22. Further, the mounting portion 151 covers the substrate through hole 131d of the circuit board 131 from below, and is a first protruding portion at a position away from the mounting portion 151 in the first direction X, that is, at the peripheral portion of the substrate through hole 131d. The upper surface of 144 comes into surface contact with the ground pattern 131b provided on the lower surface of the circuit board 131.

Then, the block main body 141 is fixed to the upper surface of the bottom plate 26 via a spacer having heat resistance in such a state.

In the present embodiment, the circuit board 131 is fixed to the first protruding portion 144 of the block main body 141 by a fixing tool 152 such as a screw at a position away from the mounting portion 151 in the first direction X. The fixture 152 fixes the circuit board 131 to the first protrusion 144, and first projects the ground pattern 131b provided on the lower surface of the circuit board 131 at a position away from the mounting portion 151 in the first direction X. It functions as a pressing member that is pressed against the upper surface of the portion 144.

In such an inspection jig 110 of the present embodiment, as shown in FIGS. 9 and 10, when the device D is housed in the substrate through hole 131d of the circuit board 131, the lower surface of the device D becomes the second heater block 140. 1 It comes into surface contact with the mounting portion 151 provided on the protruding portion 144. Further, the electrode of the device D comes into contact with the end portion of the signal pattern 131a provided on the peripheral edge portion of the substrate through hole 131d of the circuit board 131.

Then, in the inspection jig 110, the heater power is supplied to the heater 42 from the control unit of the inspection device (not shown), and the inspection signal and the reference potential are input to the central conductor 28a and the outer conductor 28b of the connector 28, respectively.

As a result, the heater 42 provided in the heater block 140 heats the block main body 141 so that the temperature detected by the thermocouple 43 becomes a predetermined temperature, thereby causing the device from the mounting portion 151 of the first protruding portion 144. Energize while heating D. That is, the inspection signal input to the central conductor 28a of the connector 28 is input to the electrode of the device D via the signal pattern 131a of the circuit board 131, and the reference potential input to the external conductor 28b is the ground of the external block 20. The device D is energized according to a predetermined condition by being input to the lower surface of the device D via the plate 22, the ground pattern 131b of the circuit board 131, and the block main body 141 of the heater block 140.

Even with the inspection jig 110 having the above configuration, the heat of the heater block 140 is difficult to be transferred to the circuit board 131 mounted on the ground plate 22, and the circuit board 131 is difficult to transfer, as in the inspection jig 10 of the first embodiment described above. It is possible to suppress thermal deterioration of the electronic component 131c mounted on the.

Further, the heater block 140 and the ground plate 22 can be electrically connected while securing a contact area without wiring and connecting the heater block 140 and the ground plate 22, and the impedance of the ground pattern 131b can be obtained by a simple structure. The reference potential can be input to the device D while keeping the size small.

Further, in the inspection jig 110 of the present embodiment, the ground pattern 131b provided on the lower surface of the circuit board 131 is in contact with the block body 141 on the first direction X side of the substrate through hole 131d, and is located near the device D. The block body 141 is electrically connected to the ground pattern 131b of the circuit board 131. Therefore, the impedance of the ground pattern 131b can be reduced, and the device D can be inspected while suppressing noise generation even when a high-frequency inspection signal is input. Moreover, in the present embodiment, since the fixture 152 presses the ground pattern 131b provided on the lower surface of the circuit board 131 against the block main body 141, the contact resistance can be reduced.

Further, in the present embodiment, since the constricted portion 150 is provided between the mounting portion 151 on which the device D is mounted and the ground plate 22 in the block main body 141, the distance between the ground plate 22 and the block main body 141 is provided. The heat of the heater block 140 is less likely to be transferred to the circuit board 131 mounted on the ground plate 22, and deterioration of the electronic component 131c provided on the circuit board 131 can be suppressed.

(Other embodiments)
Although the embodiments of the present invention have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other embodiments, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and variations thereof are included in the scope of the invention described in the claims and the equivalent scope thereof, as are included in the scope and gist of the invention.

10 ... Inspection jig, 11 ... Opening, 12 ... Support stand, 20 ... External block, 21 ... Base plate, 22 ... Ground base, 23 ... Slit, 24 ... Mounting recess, 25 ... Columnar spacer, 26 ... Bottom plate, 27 ... Projection, 28 ... Connector, 28a ... Center conductor, 28b ... External conductor, 30 ... Socket board, 31 ... Circuit board, 31a ... Signal pattern, 31b ... Ground pattern, 31c ... Electronic components, 31d ... Board through hole, 31e ... Through Hole, 32 ... Socket part, 33 ... Lower socket, 33a ... Recess, 33b ... Lower socket through hole, 34 ... Upper socket, 34a ... Upper socket through hole, 34b ... Spike, 35 ... Terminal, 36 ... Hinge, 37 ... Middle plate, 37a ... Opening, 40 ... Heater block, 41 ... Block body, 42 ... Heater, 43 ... Thermocouple, 44 ... First protrusion, 45 ... Second protrusion, 46 ... Step

Claims (10)

In an inspection jig provided with a substrate provided with terminals electrically connected to the device and a conductive heater block that contacts the device and heats the device, and energizes the device while heating it.
An inspection method in which a conductive outer block arranged at a distance from the heater block and a conductive portion provided on one surface of the substrate are provided, and the conductive portion conducts the heater block and the external block. Ingredients. The inspection jig according to claim 1, wherein the heater block and the external block abut on one surface of the substrate to support the substrate. The substrate has through holes and
At least one of the heater block and the device is inserted into the through hole and the heater block comes into contact with the device.
The inspection jig according to claim 1 or 2, wherein the conductive portion is provided at least a part of the peripheral portion of the through hole. The substrate has through holes and
The heater block includes a protrusion that is inserted through the through hole and projects from one side to the other side of the substrate.
The inspection jig according to any one of claims 1 to 3, wherein the tip of the protrusion contacts the device. The inspection jig according to any one of claims 1 to 4, wherein a reference potential is input to the device via the external block, the conductive portion, and the heater block. The substrate comprises a first through hole.
The inspection jig according to any one of claims 1 to 5, wherein the heater block is inserted into the first through hole and has a convex contact that is electrically connected to the conductive portion provided on the substrate. The inspection jig according to claim 6, further comprising a heat insulating sheet provided between the substrate and the heater block and formed with a second through hole through which the convex contact is inserted. The heater block and the external block are arranged at intervals in a direction parallel to one surface so as to face one surface of the substrate.
The inspection jig according to any one of claims 1 to 7, wherein the heater block is provided with a constricted portion between a portion in contact with the device and the external block so as to be separated from the external block. The inspection jig according to claim 8, wherein a pressing member for pressing the substrate against the heater block is provided in a direction orthogonal to the direction in which the heater block and the external block face each other. In an inspection device that energizes the device attached to the inspection jig while heating it.
The inspection jig includes a substrate provided with terminals electrically connected to the device, a conductive heater block that contacts the device and heats the device, and a conductive heater block that is spaced apart from the heater block. An inspection device including an external block and a conductive portion provided on one surface of the substrate, wherein the conductive portion conducts the heater block and the external block.

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