JP2021190500A - Wiring-equipped fiber member and manufacturing method thereof - Google Patents

Abstract

To provide a wiring-equipped fiber member in which fine wiring patterns are provided in high definition.SOLUTION: In a wiring-equipped fiber member, a binder layer is provided on one side of a fiber base material having a flattened surface having a surface roughness (SMD) of 0.5 μm to 2 μm on at least one side, and wiring made of a conductive material is placed on the binder layer.SELECTED DRAWING: Figure 1

Description

The present invention relates to a fiber member with wiring in which wiring made of a conductive material is provided on a fiber base material, and a method for manufacturing the same.

Conventionally, a smart textile technique in which an electrical functional element is provided on a flexible or stretchable fiber base material has been proposed. These are provided with functional elements such as sensors, batteries, heaters, and Pelche elements on a flexible fiber base material, and since extremely thin and flexible products can be realized, the future IoT (Internet of of Things) Things) Very important in society.

For example, the following Patent Document 1 has a structure in which a base layer is provided on a fibrous porous base material, a functional element is arranged on the base layer, and a through connection portion penetrating the fibrous porous base material is provided. It has been disclosed. However, in this structure, the base layer is formed thickly with a resin such as polyurethane or acrylic so as to completely fill the gaps of the fibrous porous base material separately from the fibrous porous base material. Patent Document 1 does not disclose at all a technique for realizing a fiber member with a functional element at low cost while maintaining the texture and flexibility of the fiber material without using these other materials.

In the following Patent Document 2, a plating base layer containing polymer fine particles and a binder is provided on the surface of the non-woven substrate and a part of the inside of the surface, and a metal plating film is provided on the base layer by an electroless plating method. The technology is disclosed. However, this technique is for avoiding that the entire fiber is plated with metal and the texture is deteriorated, and Patent Document 2 does not disclose a technique for producing a high-definition wiring pattern.

The following Patent Document 3 discloses a technique for forming a conductive film on nanofibers deposited in the form of a non-woven fabric in a flexible circuit board, but the same fiber substrate is used at low cost and with high definition. The technique for forming the wiring pattern is not described.

The following Patent Document 4 discloses a method for manufacturing a printing sheet having an optical surface roughness of 20 μm or less by providing a coating layer on one side or both sides of a nonwoven fabric and then performing a calendar treatment. However, the described method relates to a printing sheet for printing packaging materials, posters, etc., and describes a technique for producing high-definition conductive wiring having a thin line width on a fiber. Nana

The following Patent Document 5 relates to a printed substrate having a surface unevenness of 5 to 150 μm, in which a resin layer is provided on at least one side of a polyester-based nonwoven fabric having a fiber diameter of 1 to 30 μm and a texture of 40 to 150 g / m ^2. The technology is disclosed. However, this technique enhances readability when printed using a laser printer, and describes a technique for producing a wiring pattern with a narrow line width or a functional element on a fiber using a conductive material. No.

Japanese Unexamined Patent Publication No. 2017-208492 Japanese Unexamined Patent Publication No. 2018-90881 Japanese Unexamined Patent Publication No. 2015-88536 Japanese Unexamined Patent Publication No. 5-331768 Japanese Unexamined Patent Publication No. 2011-230499

As described above, when wiring or functional elements are conventionally manufactured directly on a fiber base material, the unevenness of the fiber surface is very large, so a highly smooth material such as rubber or elastomer is separately used for the base portion. I needed it. In this case, there is a problem that the cost is high and the flexibility and foldability of the mounting portion are impaired.
Further, when wiring is produced on or in the fiber using the conductive yarn, there are problems that the conductive yarn is expensive and the wiring pattern that can be produced is limited.

Further, conventionally known printing fiber sheets have a fiber surface roughness that is too large for printing a conductive wiring pattern. Therefore, when trying to produce a wiring pattern with a narrow line width using these fibers, There is a problem that disconnection occurs. In particular, when wiring is to be produced by using a coating method such as screen printing using conductive ink, high-definition patterning is difficult because the ink permeates the inside of the fiber.

In view of the level of these techniques, the problem to be solved by the present invention is a technique capable of producing a fine wiring pattern in high definition even when a low-cost fiber base material is used, that is, a fine wiring pattern is in high definition. It is to provide the fiber member with wiring provided in the above, and the manufacturing method thereof.

As a result of sharp studies and repeated experiments in order to solve the above problems, the present inventors reduced the surface roughness of the fiber substrate to the utmost by flattening, and provided a thin binder layer on the surface. As a result, it was unexpectedly found that the above-mentioned problems could be solved, and the present invention was completed.

That is, the present invention is as follows.
[1] A binder layer is provided on one side of a fiber base material having a flattened surface having a surface roughness (SMD) of 0.5 μm to 2 μm on at least one side, and the binder layer is made of a conductive material. A fiber member with wiring, which is characterized by having wiring.
[2] The fiber member with wiring according to the above [1], which has a connecting portion to which a functional element is electrically connected to a part of the wiring made of the conductive material.
[3] The binder material constituting the binder layer is 1.0 g of at least one resin selected from the group consisting of vinyl chloride / vinyl acetate copolymer resin, urethane resin, acrylic resin, and a mixture thereof. The fiber member with wiring according to the above [1] or [2], which comprises / m ^{2 to} 10 g / m ^2.
[4] The fiber member with wiring according to the above [3], wherein the wiring contains at least one kind of the same resin as the resin contained in the binder material constituting the binder layer.
[5] The binder material forming the binder layer, an antistatic agent further comprises at ^{0.1g / m 2 ~0.5g / m 2} , with wire according to any one of [1] to [4] Fiber member.
[6] The fiber member with wiring according to any one of [1] to [5] above, wherein the surface coverage of the binder layer is 10% to 100%.
[7] The fiber member with wiring according to any one of [1] to [6], wherein the minimum line width of the wiring is 1 μm or more and 5 mm or less.
[8] The following steps:
A flattening step of flattening at least one side of a fiber base material to obtain a fiber base material having a surface roughness (SMD) of 0.5 μm to 2 μm;
A binder layer forming step of applying or impregnating a resin solution containing a binder material in a solvent, and then drying and / or cross-linking the solvent to provide a binder layer; and a conductive material on the obtained binder layer. Wiring forming process to form a wiring consisting of
A method for manufacturing a fiber member with wiring, including.
[9] The following steps:
A step of electrically connecting a functional element to a part of the formed wiring to produce a connection portion;
In the production of the connection portion, a step of applying a conductive paste, a step of adhering using a conductive resin or a conductive adhesive, a step of thermally crimping an anisotropic conductive film, and a conductive or non-conductive The step according to the above [8], wherein at least one step selected from the group consisting of a sewing step or a weaving step using a thread, a step of stopping a spelling needle for a stapler, and a step of connecting using a metal snap button is carried out. Manufacturing method of fiber member with wiring.

According to the fiber member with wiring according to the present invention, it is possible to produce a wiring pattern with high accuracy even when a low-cost fiber base material is used. As a result, it is possible to realize a member in which functional elements having various electrical functionalitys are provided on the fiber base material at a very low cost.
Further, since the fiber member with wiring according to the present invention is excellent in flexibility and foldability, it is possible to significantly reduce the size and weight. Therefore, it is suitable for use in various applications that require miniaturization and weight reduction, such as mobile phones, personal computers, in-vehicle parts, mobile bodies such as drones and autonomous mobile robots.
Further, according to the method for manufacturing a fiber member with wiring according to the present invention, it is possible to mass-produce high-definition wiring patterns with a high yield by using a remarkably low-cost manufacturing apparatus.

It is sectional drawing of an example of the fiber member with wiring of this embodiment. It is a top view of an example of the fiber member with wiring of this embodiment. It is sectional drawing of an example of the fiber member with wiring of this embodiment. A functional element and a connection portion sewn with a conductive material are shown. It is the upper surface of an example of the fiber member with wiring of this embodiment. A functional element and a connection portion sewn with a conductive material are shown. It is a perspective view of another example of the fiber member with wiring of this embodiment. A functional element and a snap-on connection are shown. It is a photograph instead of the drawing which compared the state of wiring between the fiber member with wiring (with a binder material) of this embodiment, and the fiber member with wiring without a binder material.

Hereinafter, embodiments of the present invention will be described in detail.
In one embodiment of the present invention, a binder layer is provided on one side of a fiber base material having a flattened surface having a surface roughness (SMD) of 0.5 μm to 2 μm on at least one side, and the binder layer is provided. It is a fiber member with wiring characterized by having a wiring made of a conductive material on the top (see FIGS. 1 and 2).
A connection portion to which a functional element is electrically connected can be provided in a part of the wiring made of the conductive material (see FIGS. 3 and 4).

[Fiber base material]
The surface of the fiber base material is flat with a surface roughness (SMD) of 0.5 μm to 2 μm as a machined surface (see FIGS. 1 and 3, first machined surface) flattened by a flattening process described later. There is no particular limitation as long as it can form a modified surface.
The fiber base material may be any non-woven fabric, woven fabric, knitted fabric, or the like.
Further, the constituent fibers may be either long fibers or short fibers.
The material of the constituent fibers is also not particularly limited. For example, as synthetic fibers, polyester fibers (polyester terephthalate, polypropylene terephthalate, polybutylene terephthalate, polytrimethylene terephthalate, polylactic acid, etc.), nylon fibers (nylon 6, nylon 66, etc.), nylon fibers, etc. ) Etc., examples of the regenerated cellulose fiber include cupra, rayon and the like, and examples of the elastic fiber include urethane fiber and the like, or a composite fiber thereof. Further, if it is a synthetic fiber, a polymer-blended fiber may be used. Alternatively, any material can be used as long as it can form the above-mentioned work surface, such as a cellulosic fiber such as pulp and a carbon fiber.

The polyester-based nonwoven fabric can be manufactured by a spunbond method, a melt blow method, a thermal bond method, a spunlace method, a papermaking method, or the like. In particular, the nonwoven fabric of the spunbond method is preferable because it has high productivity, low cost, excellent heat resistance, thinness, and high strength. Further, the papermaking method is generally preferable from the viewpoint of being able to produce a nonwoven fabric having a small surface roughness, but the productivity is low and the cost is high as compared with the spunbond method.

The polyester-based non-woven fabric preferably has a uniform fiber arrangement of fibers constituting the non-woven fabric between the longitudinal direction (warning direction, vertical direction) and the direction orthogonal to the longitudinal direction (horizontal direction). For example, the ratio of the tensile strength in the vertical direction to the tensile strength in the horizontal direction (vertical direction / horizontal direction) is preferably 0.5 to 8.0, more preferably 2.0 to 7.0, and further. It is preferably 3.0 to 5.0. When the ratio of tensile strength is less than 0.5 or more than 8.0, the low direction of the fiber arrangement is weakened due to the bias of the arrangement of the constituent fibers, and the fibers are easily torn.

Examples of the polymer constituting the polyester fiber constituting the polyester-based nonwoven fabric include polyethylene terephthalate, polypropylene terephthalate, polybutylene terephthalate, polytrimethylene terephthalate and the like. The polyester fiber may be a polyester fiber obtained by polymerizing or copolymerizing isophthalic acid, phthalic acid or the like as an acid component forming an ester. Further, the polyester fiber is a fiber having biodegradability, for example, a fiber made of a polymer of poly (α-hydroxy acid) such as polyglycolic acid or polylactic acid, or a co-weight having these as the main repeating unit. It may be a fiber made of coalesced material. Further, it may be a polyester blend fiber obtained by blending 0.5 to 10% by mass of another polymer such as a polyolephine-based polymer or a polyamide-based polymer with the main component of the polyester resin. Further, although it may be a multi-component fiber in which a plurality of different polymers constitute one fiber, it is preferable that the fiber is composed of a single polymer from the viewpoint of smoothness, durability and the like.

The polyester-based non-woven fabric may be a laminated non-woven fabric, and may have a multilayer structure such as SMS, SMMS, or SMS in which the ultrafine fiber layer (M) of the melt blow method and the fiber layer (S) of the spunbond method are laminated. May be good.
The fiber base material may be a woven or knitted fabric. In the case of a woven fabric, the woven structure is preferably a plain weave (taffeta) structure or a satin structure having good surface smoothness, and a plain weave (taffeta) structure is more preferable from the viewpoint of tear strength. In the case of knitted fabric, either warp knitting or weft knitting may be used, as long as the structure is excellent in flatness and elasticity. The fiber base material made of a woven or knitted fabric can be treated in the same manner as in the case of a non-woven fabric to obtain a fiber base material with wiring of the present invention.

[Fiber diameter]
The average fiber diameter of the fibers on the surface to be processed is preferably 1 to 30 μm, more preferably 2 to 25 μm, and further preferably 3 to 20 μm. If the average diameter of the fibers is less than 1 μm, the strength and productivity tend to decrease. The average fiber diameter (μm) is a value obtained by taking a 500-fold magnified photograph with a microscope, measuring the diameter of any 100 fibers, and using the average value. On the other hand, when the fiber diameter exceeds 30 μm, it is generally difficult to obtain the surface smoothness specified in the present invention, that is, the surface roughness (SMD) of 0.5 μm to 2 μm. The fiber diameter may be composed of fibers having substantially the same fiber diameter for the entire fiber, or long fibers or short fibers having different fiber diameters such as fine fibers and thick fibers may be laminated or mixed. good.

[Thickness of fiber base material, fiber cross section]
The thickness of the fiber base material can be appropriately selected according to the use of the fiber member with wiring. The cross-sectional shape of the fiber is not particularly limited and may be any of a round cross section, a flat cross section, a modified cross section and the like, but it is preferable to use a flat cross section in that the flatness can be further improved. A flat cross-section fiber having a flatness of 1.2 or more is preferable because the flatness after the flattening process can be further enhanced. The flatness is more preferably 2.0 or more, and particularly preferably 3.0 or more and 5.0 or less. The flatness is measured by observing the cross section of the fiber and measuring the length of the major axis and the minor axis.
Flattening = length of major axis / length of minor axis. The cross-sectional shape of the fiber is preferably a shape having no clear unevenness such as a round shape, an elliptical shape, and an I shape from the viewpoints of strength, flatness workability, weather resistance, etc. of the printed substrate.

[Surface roughness of the surface to be machined (SMD)]
The surface roughness (SMD) of the fiber substrate on which the binder layer is arranged needs to be 0.5 μm to 2 μm. With a general fiber base material, it is practically difficult to reduce the surface roughness to less than 0.5 μm by calendar processing. On the other hand, when the surface roughness exceeds 2 μm, the unevenness of the surface becomes large. For example, in the gravure printing process, the binder layer is adhered and formed only on the convex portion, and the thin binder layer is not uniformly formed. The wiring pattern formed in the above is broken and the resistance value is increased. Further, when the unevenness of the surface becomes large, it is necessary to increase the amount of the binder layer, but if this is done, the fiber base material becomes excessively moist and it takes a long time to dry, so that the productivity is lowered and the cost is high. On the other hand, if the amount of the binder layer is small, the wiring resistance value of the obtained fiber member with wiring may increase or disconnection may occur, and the functional element may not function. When the surface roughness is in the range of 0.5 μm to 2 μm, the surface is flattened, the binder layer is thinly arranged on the surface of the fiber base material, and the shape and conductivity of the wiring formed on the binder layer are good. Become.

[Metsuke of fiber base material]
The basis weight of the fiber base material on which the binder layer is arranged can be appropriately selected according to the application as long as the above-mentioned surface smoothness can be obtained, but in the case of polyester-based non-woven fabric, from the viewpoint of rigidity, strength, etc., It is preferably 30 g / m ^{2 or more, and preferably 200 g / m 2} or less from the viewpoint of thickness, flexibility, and flexibility.

[Binder material constituting the binder layer]
As the binder material constituting the binder layer, at least one resin selected from the group consisting of vinyl chloride / vinyl acetate copolymer resin, urethane resin, acrylic resin, and a mixture thereof is used as the weight after drying. preferably includes at ^{0g / m 2 ~10g / m 2} .
If the binder material has a dry mass of ^{less than 1.0 g / m 2} , wiring formation will be poor, while if the binder material has a dry mass of ^{more than 10 g / m 2} , the binder layer will be thick and the surface will be rough. Although the roughness is small and the formability of the wiring is good, the amount of the binder material applied is too large, so that it takes a long drying time after application, the productivity decreases, the cost becomes high, and the stickiness becomes sticky after application. It occurs and becomes a dusted state (a state in which the applied solid component is too much and becomes rough when touched by hand).
Binder materials such as vinyl chloride / vinyl acetate copolymer resin, urethane resin, and acrylic resin have the function of adhering various additives to polyester fibers and the function of improving water resistance against rain because they are solvent-based. Also has.

As described below, when the conductive ink for forming the wiring contains the same resin as the binder material, it is preferable because the adhesiveness can be obtained more firmly. For example, when the binder material constituting the binder layer contains a urethane-based resin, it is preferable that the wiring contains the same resin as the urethane-based resin contained in the binder material.
The binder material is necessary, preferably further comprises an antistatic agent in ^{0.1g / m 2 ~0.5g / m 2} .
Further, the binder material may further contain other additives such as a UV absorber, if necessary.
The binder layer does not need to be provided on the entire surface of the flattened surface of the fiber substrate, and may be present in the region where the wiring is formed on the binder layer. That is, the surface coverage of the binder layer is preferably 10% to 100%, more preferably 30 to 100%. An appropriate coverage can be appropriately selected according to the type of the fiber base material such as a non-woven fabric or a woven fabric.
Further, the binder layer may be two or more layers, may be formed by two or more coating steps, and may be further infiltrated into the inside or the whole of the fiber base material.

[wiring]
In the present specification, the term "wiring made of a conductive material" refers not only to an electric wiring for connecting an electric circuit but also to the whole one having a pattern shape made of a conductive material. Wiring applications include circuit wiring for making electrical connections between elements, various electronic components such as piezoelectric elements, displays, power generation elements, and power storage elements, thermal elements such as heaters and Pelche elements, and antibacterial members. , There is no particular limitation as long as it utilizes the functionality of the conductive material such as an antistatic member.
Wiring made of a conductive material may be configured by using a material having electrical conductivity, and the type of the material is not particularly limited. Examples of the conductive material include various materials such as a metal, a mixture of a metal and an insulator, a semiconductor, a conductive oxide, a conductive polymer, an organic semiconductor, or a mixture thereof. Specifically, as the conductive material, a material having a volume resistivity of 1x10 ^{-8 to 1x10 5} Ω · m or a superconductor having a volume resistivity of 0 can be used. A material having a volume resistivity of 1x10 ^{-8 to 1x10 -5} Ω · m is preferable in that conductivity can be easily obtained at room temperature and conductivity is good.

As the wiring material, it is preferable to use a metal or a composite material containing a metal as a main component because good conductivity can be easily obtained. In particular, metal ink materials such as silver ink, silver paste, copper ink, and copper paste in which metal particles are dispersed in a base material, silver nanoparticles, and copper nano, which can be easily produced by printing. It is preferable to use a metal nanoparticle material such as particles, a plated metal material, a carbon nanotube, a graphene-based material, a graphite-based carbon-based conductive material, or a mixture thereof. Further, conductive polymers such as polythiophene-based, polyaniline-based, polypyrrole-based, and polyacetylene-based polymers can also be used.
Alternatively, as the wiring material, a stretchable conductive material which is a mixture of metal particles and an elastic resin such as silicone or urethane can be used. In particular, when the fiber base material is a base material having elasticity such as knitted fabric, it is preferable to use a stretchable conductive material as the wiring material.

When wiring is intended for electrical connection between elements, the sheet resistance value (surface resistivity) should be 10Ω / □ or less in that the wiring resistance value can be sufficiently lowered to obtain the original characteristics of the circuit. Is more preferable. The film thickness of the wiring may be anything as long as it can exhibit the desired functionality, and when producing the wiring for electrical connection, the film thickness is adjusted so that the desired sheet resistance value can be obtained. do it. When a silver ink material is used as the wiring material, the film thickness of the wiring is, for example, 500 nm or more and 30 μm or less, which is more preferable in that printing can be easily performed and productivity can be improved.

It is preferable to use a plated metal for the wiring because it is easy to obtain a wiring having high conductivity. In this case, a base layer for invoking plating such as a plating catalyst is provided between the wiring and the binder material. An underlayer is formed on the binder material in a desired pattern, and a plated metal is formed in this pattern. As the plating catalyst, an electroless plating catalyst such as a colloid in which palladium and tin or silver and tin are mixed can be used.

The minimum line width of the wiring is preferably 1 μm or more and 5 mm or less. If the line width is less than 1 μm, it becomes difficult to produce by a simple printing method such as screen printing. If the line width exceeds 5 mm, the area required for the entire wiring becomes large, and the advantage of downsizing the wiring portion cannot be sufficiently obtained. As described in the following examples, in the fiber member with wiring of the present embodiment, even if the wire width of the wiring is 100 μm, a fiber member with a high yield and a low wiring resistance can be obtained without disconnection.

[Structure of fiber member with wiring]
As the configuration of the fiber member with wiring, an insulator may be further provided on the upper side of the wiring (opposite to the inside of the fiber base material), or a configuration in which a plurality of fiber members with wiring are stacked may be arbitrary. It can be configured (see Figures 1 and 3). It is preferable to appropriately provide an insulator on the wiring because it is possible to prevent short-circuiting with the electrodes of other electronic members, and to protect the wiring surface from chemical changes such as wear and oxidation. However, it is preferable not to provide the above-mentioned insulator in the portion where the wiring and another element are electrically connected, because electrical contact can be easily obtained.

[Connection between fiber member with wiring and functional element]
In the fiber member with wiring, it is preferable that a functional element is further electrically connected to a part of the wiring in that various functionalities can be exhibited. The material used for this electrical connection (mounting part) may be any material as long as an electrical connection can be secured, for example, solder, low temperature solder, conductive paste, conductive adhesive, and different substances. Anisotropic Conductive Film (ACF), sewn or woven conductive thread, spelling needles for staplers, metal snap buttons, etc. can be used. Alternatively, the connection portion of the fiber member with wiring and the electrode of the functional element may be brought into close contact with each other and sewn or woven with a non-conductive thread. Further, a combination of a plurality of these may be used.
As shown in FIGS. 3 and 4, the use of a conductive thread (conductive material) for the connection portion of the functional element ensures stable electrical contact between the wiring and the functional element and strong adhesion. It is preferable in that it can be obtained. Further, as compared with the case where the high-cost conductive yarn is used for the entire wiring, the use of the conductive yarn is limited to the connection portion, so that there is an advantage that the cost of the entire fiber member can be significantly reduced. In this case, a flexible material capable of sewing or crocheting a conductive thread is used for the connection portion of the functional element. For example, it is preferable that the connecting portion of the functional element is made of a flexible material such as a fiber base material, an elastomer material, paper, or a plastic film in that the conductive thread can be easily sewn or woven. At the interface where the wiring and the functional element come into contact, the surfaces of both of them do not necessarily have to be conductive. For example, even if the surface of the wiring is covered with an insulator layer, if the electrode portion of the functional element and the inside of the wiring are electrically connected by the conductive thread, the connection portion is formed. Can be done.

When a non-conductive thread is used for the connection part (not shown), it is necessary to firmly adhere the conductive parts at the connection part between the wiring and the functional element. Since it can be used, it is preferable in that the cost of the connecting portion can be overwhelmingly reduced. Any thread that does not have conductivity can be used, but mass production and cost reduction can be easily achieved by using threads that are generally used in automatic sewing machines and pattern sewing machines. Is preferable. When using a thread that does not have conductivity, a material that can achieve both conductivity and adhesion, such as a conductive adhesive or an anisotropic conductive film, should be provided between the contact parts between the wiring and the functional element. Is even more preferable. This makes it possible to obtain stronger adhesion and better electrical contact even if a very low cost thread is used for the mounting portion.

It is preferable to use an anisotropic conductive film for the connecting portion because the adhesion and the conductivity of the connecting portion can be easily compatible with each other. Further, when a conductive paste or a conductive adhesive is used, it is particularly preferable because the connection portion can be formed by a very simple method.

As shown in FIG. 5, using a metal snap button for the connection part is a very simple method because it is possible to turn on and off the electrical connection between the functional element and the wiring by removing the snap button. It is very preferable in that the user can remove the functional element. For example, if you do not want to wash the functional element, you can remove the functional element from the snap button and wash other fiber members with wiring, and you can replace and use various functional elements described later. be.

[Functional element]
The functional element is not particularly limited as long as it exhibits a desired function, and may be any one. For example, various sensors (dynamic sensors such as contact sensors, load sensors, pressure sensors, biosensors that measure electrocardiogram, brain waves, blood flow, blood pressure, etc., various in-vehicle instruments, environment such as temperature, humidity, pressure, etc. Sensors, resistance value measuring instruments, ultrasonic sensors, infrared sensors, distance sensors, etc.), batteries, solar cells, vibration power generation, power supply elements such as environmental power generation devices, thermal elements such as heaters and Pelche elements, speakers, Examples thereof include acoustic-related parts such as microphones, light emitting elements such as LEDs, lasers, and displays, display elements, antennas, and combinations thereof.

Alternatively, an insulator may be provided between the two "wiring made of a conductive material" to form a capacitor, which can be used as a functional element. For example, by reading the change in the value of the capacitance, it can be used as a contact sensor or a load sensor. Since these functional elements are made of a flexible base material and have the advantage of having high flexibility, they are used for load measurement in various fields such as various daily necessities such as clothing and sporting goods, medical supplies, and in-vehicle members. Various monitoring elements such as failure prediction and condition monitoring can be formed.

Next, as another embodiment of the present invention, a method for manufacturing a fiber member with wiring will be described.
Other embodiments of the present invention include the following steps:
A flattening step of flattening at least one side of a fiber base material to obtain a fiber base material having a surface roughness (SMD) of 0.5 μm to 2 μm;
A resin solution containing a binder material in a solvent is applied or impregnated on one side of the obtained flattened fiber base material, and then the solvent is dried and / or crosslinked to form a binder layer to provide a binder layer. Step; and a wiring forming step of forming a wiring made of a conductive material on the obtained binder layer;
Is a method for manufacturing a fiber member with wiring.

Yet another embodiment of the invention is described in the following steps:
A binder layer forming step of applying or impregnating at least one surface of a fiber base material with a resin solution containing a binder material in a solvent, and then drying and / or cross-linking the solvent to provide a binder layer;
A flattening step of flattening the surface provided with the binder layer of the fiber base material to obtain a fiber base material having a surface roughness (SMD) of 0.5 μm to 2 μm;
A wiring forming step of forming a wiring made of a conductive material on a binder layer on the obtained flattened surface;
Is a method for manufacturing a fiber member with wiring.

These manufacturing methods are described in the following steps:
A step of electrically connecting a functional element to a part of the formed wiring to produce a connection portion;
In the production of the connection portion, as described above, a step of applying a conductive paste, a step of bonding using a conductive resin or a conductive adhesive, and a step of thermally pressure-bonding an anisotropic conductive film can be included. At least one step selected from the group consisting of a sewing step or a weaving step using a conductive or non-conductive thread, a step of stopping a spelling needle for a stapler, and a step of connecting using a metal snap button. can do.

[Flatration process]
In the flattening step, at least one side of the fiber base material is flattened to obtain a fiber base material having a surface roughness (SMD) of 0.5 μm to 2 μm.
The flattening process is generally called calender process, shriner process, etc., and for example, one type or two or more types of metal roll, metal roll / elastic roll, metal roll / paper roll, metal roll / resin roll, etc. are used. Will be done. The fiber substrate is passed between smooth rolls, and processing is performed by applying both heat and pressure.
The flattening process may be performed on only one side of the fiber base material or on both sides. Depending on the type of fiber base material, if the flattening process is performed on only one side, the base material may warp after the wiring is manufactured. In such a case, it is preferable to perform the flattening process on both sides. Further, when wiring is produced on both sides of the fiber base material, it is necessary to perform flattening processing on both sides. When the wiring is formed on only one side of the fiber base material and the base material does not warp, it is preferable to perform the flattening process only on the surface on which the wiring is to be produced, in that the manufacturing cost can be suppressed.

When the fiber base material is a polyester-based spunbonded nonwoven fabric, the partial thermal pressure-bonding ratio (ratio of the pressure-bonded portion to the total area of the nonwoven fabric) of the nonwoven fabric used for calendar processing is preferably 10 to 35%, more preferably 12 to 30. %, More preferably 15 to 30%. When the partial thermocompression bonding ratio is less than 10%, the number of bonded portions of the fibers is small, and the frictional strength and rigidity of the surface are lowered. On the other hand, when the partial thermocompression bonding ratio exceeds 35%, the number of bonded portions of the fibers increases, and the surface friction strength and rigidity increase, but the tear strength decreases, and the fibers are easily torn and torn.
As the processing conditions for partial thermocompression bonding, for example, the thermocompression bonding temperature is 20 to 60 ° C. lower than the melting point, the pressure is preferably 10 to 700 N / cm, and the more preferable pressure is 50 to 500 N / cm.

Partial thermocompression bonding is performed using embossed rolls and smooth rolls, but the embossed pattern of the embossed rolls is round, oval, rhombic, columnar, square, etc. It is preferable to arrange it. The area of one embossed pattern ^{is preferably 0.3 to 5 mm 2} , more preferably 0.5 to 2 mm 2. The depth of the embossed pattern is preferably 0.01 to 0.6 mm, more preferably 0.03 to 0.4 mm. The distance between the embossed patterns is preferably 0.5 to 10 mm, more preferably 0.8 to 6 mm, and evenly arranged. In particular, it is preferable that the area and depth of one embossed pattern are small and the surface irregularities are small. By performing such partial thermocompression bonding, it is possible to obtain a non-woven fabric having high surface frictional strength by imparting toughness such as tensile strength and tear strength and adhering the constituent fibers to each other.

In the flattening process, more advanced processing is preferable than the conventional flattening process. Specific high-level flattening conditions include, for example, a surface temperature of 120 to 240 ° C., preferably 150 to 220 ° C., and a linear pressure of 400 to 2100 N / cm, preferably 900 to 1800 N / cm. Can be mentioned. A fiber base material made of flat cross-section fibers does not require a high degree of flattening, and is processed under normal flattening conditions, for example, a surface temperature of 120 to 240 ° C. and a linear pressure of 200 to 400 N / cm. The desired surface to be machined can be obtained.

When the polyester-based short fiber non-woven fabric that has been made into paper is subjected to calendar processing to obtain a flat-processed polyester-based non-woven fabric, the same high-level calendar processing conditions as described above can be obtained. It is difficult to increase the thickness of the papermaking fiber nonwoven fabric due to restrictions on the manufacturing method, but by stacking a plurality of papermaking short fiber nonwoven fabrics and performing calendar processing, it is possible to obtain a fiber substrate having an appropriate thickness and a uniform thickness.

[Binder layer forming process]
In the binder layer forming step, the fiber base material is coated or impregnated with a resin solution containing a binder material in a solvent, and then the solvent is dried and / or crosslinked to provide a binder layer. The binder layer forming step also includes a method of dipping the fiber base material into the binder material.
When the fiber base material is, for example, a woven or knitted material, the entire fiber base material may be passed through (dipped) in a resin solution containing a binder material in a solvent and then flattened by calendar processing. ..

The binder material constituting the binder layer and the processing agent (resin solution) containing various additives in the solvent are prepared after adjusting the viscosity of the processing agent in a state where the above components are dissolved or dispersed in the solvent according to the processing method. , Gravure method, gravure offset method, roll coating method, solvent coating method, knife coating method, etc., are applied to the surface of the base material. In the present invention, the gravure method is preferable because it has better productivity than other methods, stable quality, low cost, and the product does not become too hard. However, since it is difficult to apply the gravure method uniformly to a non-woven fabric having low flatness, it is preferable to use the non-woven fabric subjected to the above-mentioned high leveling process, particularly in the case of a partially thermocompression-bonded non-woven fabric.
For example, the concentration and viscosity of the processing agent can be adjusted with a diluting solvent, an additive, a thickener, etc., and the specific viscosity is preferably 50 to 10000 mPa / s / 25 ° C., more preferably 100 to 100. It is 5000 mPa / s / 25 ° C. Further, the processing conditions such as the drying temperature, the cross-linking temperature, and the processing speed are appropriately determined according to the processing method. For example, the temperature is preferably 80 to 200 ° C., more preferably 100 to 180 ° C., and the processing speed is preferably 10 to 200 m / min, more preferably 15 to 150 m / min, and a cylinder dryer or a clip tenter machine. , Drying (removal of diluting solvent) and cross-linking treatment can be performed with a pin tenter machine or the like. The processing agent may be applied in several steps depending on the type of various additives and the like.

[Wiring formation process]
In the wiring forming step, a wiring made of a conductive material is formed on the obtained binder layer.
In the wiring forming step, any method can be used as long as the wiring capable of obtaining conductivity can be produced. For example, a coating method (wet process) such as screen printing using conductive paste or conductive ink, ingot printing, letterpress printing, offset printing, inkjet method, method using a dispenser, and a thin film manufacturing process such as sputtering and vapor deposition (wet process). A dry process), a step of forming a base material for plating with a pattern shape of wiring and then performing electroless plating, or a step of combining a plurality of these steps can be mentioned.
Alternatively, a method (hot press method, hot melt method) in which a conductive foil having a wiring pattern shape is formed in advance and pressure-bonded or thermocompression-bonded onto the binder layer can also be used.

Prior to producing the wiring, the binder layer is uniformly provided with extremely high surface flatness, so that a high-definition wiring pattern can be formed. Specifically, stable conductive performance can be obtained even in the case of thin wiring having a line width of 1 μm to 5 mm.

[Manufacturing of connections between fiber members with wiring and functional elements]
The method for manufacturing a fiber member with wiring described above is a step of electrically connecting a functional element to a part of the wiring formed as described above to produce a connection portion;
In the production of the connection portion, as described above, a step of applying a conductive paste or a conductive ink, a step of bonding using a conductive resin or a conductive adhesive, and an anisotropic conductive film are included. At least one selected from the group consisting of a process of thermal crimping, a process of sewing or weaving using conductive or non-conductive threads, a process of stopping a spelling needle for a stapler, and a process of connecting using a metal snap button. Steps can be carried out.
It is preferable to further provide a step (mounting step) for connecting the wiring and the functional element in that various functionalities of the member can be exhibited. The mounting process is a process of electrically connecting the wiring and the electrode portion of the functional element, and it is necessary to ensure not only the electrical connection but also the adhesion between the wiring at the connection portion and the functional element. It is preferable to make the contact resistance between the wiring and the functional element in the connection portion as small as possible from the viewpoint that the original characteristics of the functional element can be exhibited.
In the production of the connection part, for example, soldering, a method of adhering a conductive paste or a conductive ink to the connection part and then drying the paste or the ink, a method of adhering using a conductive adhesive, or a method of bonding is different. Either a method of applying heat and pressure to connect using a conductive conductive film, or a method in which these are combined can be used. In these methods, it is preferable to apply heat to make the connection because the adhesion of the connection portion can be improved. It is preferable that the treatment temperature in the process of applying heat is lower than the maximum temperature in the process of producing the surface to be processed of the fiber base material in order to prevent the fiber base material from being excessively out of shape. For example, there is a method of forming a conductive paste on the connection part of the wiring, mounting a functional element, and annealing at a lower temperature condition than soldering, such as 40 ° C to 120 ° C, to secure the connection. , It is preferable in that damage to the fiber base material can be prevented.

As another method for manufacturing the connection portion, a method of sewing or knitting the connection portion between the wiring and the functional element using a conductive thread can be used (see FIGS. 3 and 4). In this case, the connection portion of the functional element is made of a flexible material so that it can be sewn or crocheted, and the wiring and the functional element are overlapped at the connecting portion and then sewn or crocheted. As a device for sewing, a sewing machine such as an automatic sewing machine or a pattern sewing machine can be used. In particular, it is preferable to use a pattern sewing machine in that mass production and cost reduction can be easily performed. By using these methods, it is possible to create a structure in which the conductive thread passes through the functional element and the inside of the wiring many times at the connection portion, so that the electrical contact between the wiring and the functional element can be easily and stably taken. It is very preferable because it can be done and the adhesion can be obtained firmly. Further, as compared with the case where the high-cost conductive yarn is used for the entire wiring, since the use of the conductive yarn is limited to the connection portion, there is an advantage that the manufacturing cost of the entire fiber member can be significantly reduced.

As yet another method for manufacturing the connecting portion, it is possible to fabricate the connecting portion by using a method in which the connecting portion of the fiber member with wiring and the electrode of the functional element are brought into close contact with each other and sewn or crocheted with a non-conductive thread. It is preferable in that the cost can be overwhelmingly reduced. In this case, the manufacturing process includes at least a bonding step of firmly contacting the conductive portions at the connection portion between the wiring and the functional element, and a step of sewing or knitting with a non-conductive thread. The order of these steps may be either, but it is preferable to perform a sewing or crocheting step with a thread after the bonding step from the viewpoint of increasing productivity. The bonding step can be performed using a conductive adhesive or an anisotropic conductive film, or can be adhered using a double-sided tape or an elastomer film. Any thread that does not have conductivity can be used, but it is preferable to use a thread that is generally used in an automatic sewing machine or the like because mass production and cost reduction can be easily performed.
When a thread having no conductivity is used, it is also preferable in that it is easy to prevent a short circuit with an adjacent wiring pattern at the start and end of the sewing machine.

As yet another method for manufacturing the connecting portion, a method of adhering the wiring and the functional element with an adhesive material at the connecting portion and then driving a stapler for a stapler can be adopted.
As yet another method for manufacturing the connecting portion, a method of connecting using a metal snap button can be used (see FIG. 5). When a metal snap button is used, a step of electrically connecting a wiring to one component of the snap button and a functional element to the other component is performed. As a result, by removing the snap button, it is possible to turn on and off the electrical connection between the functional element and the wiring, so it is possible to manufacture an element that allows the user to remove the functional element with a very simple method. Very preferable.
As a method for producing the connection portion, any of the methods described above or a method in which a plurality of these are combined may be used.

Hereinafter, examples of the present invention will be described with reference to Examples and Comparative Examples, but the present invention is not limited to these Examples.
The measurement method of each characteristic value used in the following Examples and Comparative Examples was as follows.
(1) Metsuke (g / m ² ): A sample having a length of 20 cm and a width of 25 cm was cut out at three places, the weight was measured, and the average value was converted into the mass per unit (JIS-L-1906).

(2) Thickness (mm): Measurements were arbitrarily made at 10 points under a load of 10 kPa, and the average thereof was shown.

(3) Surface roughness (SMD)
Prepare as a sample to a size of 20 cm × 20 cm from the base material. As the testing machine, a KES-FB4 surface testing machine manufactured by Katou Tech (with an automatic calculation function) is used. The sample is set on the testing machine with a load of 400 g, and the contact for surface roughness detection with a load of 10 g is brought into contact with the sample to start the device. The history of the sample is measured three times each, and the average of them is used as the surface roughness.

(4) Average fiber diameter Arbitrary cuts were taken at 5 points in the thickness direction of the test piece sampled from any position on the non-woven fabric with an optical microscope at a magnification of 500 times and cut at a substantially right angle in the direction crossing the fiber axis. The lengths of the major axis and the minor axis of the fiber cross section are measured for 20 fibers of the above, the cross-sectional area of each fiber is obtained, and the diameter of a circle having the same area is defined as the fiber diameter. The average value of all 100 fibers is taken as the average fiber diameter.

(5) Fiber flatness Using the values of the lengths of the major axis and the minor axis obtained when measuring the average fiber diameter in (4) above, the following equation:
Flattening = flattening is calculated by the length of the major axis / the length of the minor axis.

(6) Electrical Characteristics of Wiring The electrical characteristics of the wiring applied to the fiber member with wiring were judged according to the following evaluation criteria for each of the wiring widths of 2000 μm, 1000 μm, 500 μm, and 100 μm.
(Evaluation criteria)
⊚: Wiring resistance is less than 3Ω.
〇: The wiring resistance is 3Ω or more and less than 10Ω.
Δ: The wiring resistance is 10 Ω or more.
X: The wiring resistance is broken.

[Example 1]
Polyethylene terephthalate (PET, melting point 265 ° C.) is spun from a spinneret for spunbond at a spinning temperature of 300 ° C., and is composed of flat yarn having a flatness of 3.3 (long side 23 μm-7 short side 7 μm) and having a thickness of 95 μm. A thermoplastic fiber web having an average fiber diameter of 14 μm (fiber ratio of 5 μm or less and a fiber ratio of 0%) and a grain size of 45 g / m ^{2 was obtained.} The obtained web is thermocompression-bonded between a pair of uneven embossed rolls and a smooth metal roll under the conditions of a linear pressure of 350 N / cm and a vertical temperature of 225 ° C./220 ° C., and a polyester having a partial thermocompression bonding ratio of 15%. A spunbonded non-woven fabric was obtained.
The obtained spunbonded polyester non-woven fabric was calendar-processed at a linear pressure of 245 N / cm and a surface temperature of 230 ° C. to flatten the polyester ^{with a surface roughness (SMD) of 0.833 μm, a thickness of 70 μm, and a basis weight of 45 g / m 2.} A spunbonded non-woven fabric was obtained. A vinyl chloride / vinyl acetate copolymer resin, a white fine powder, a UV absorber, and an antistatic agent are placed on the entire surface of one side of the obtained polyester spunbonded non-woven fabric in a mixed solvent of methyl ethyl ketone and toluene (mixing ratio 1: 1). A resin solution (solid content concentration 42% by weight) containing the above ^{was applied with a gravure coater at 14.8 ml per m 2} of the non-woven fabric, and then the solvent was dried at 80 ° C. and / or the resin was crosslinked and printed. A fiber base material was prepared in which the binder layer to be the surface ^{was uniformly arranged at 6.22 g / m 2 in terms of solid content.}

Next, screen printing was performed using silver ink on the surface on which the binder layer was formed. As the wiring pattern, the line width was changed to 50 μm, 100 μm, 500 μm, 1 mm, and 2 mm, and the wiring length was 16 mm, which were common. Screen printing was performed using a thermosetting type silver ink (ELEPASTE AF4500 manufactured by Taiyo Ink Mfg. Co., Ltd.), and the paste was annealed at 120 ° C. for 30 minutes to cure. In the case of a thin wiring having a wire width of 100 μm, a volume resistance value similar to that in the case of a thicker wire width was obtained with a binder material. The sheet resistance was 0.019 Ω / □. As a result of measuring the thickness of the wiring with a laser microscope, it was 23 μm. In terms of volume resistivity from this value 4.3x10 ^-5 Ω · cm, and the silver ink manufacturers or resistivity 5x10 ^-5 Ω · cm and comparable to present it the following values were obtained.
Table 1 below shows various physical characteristics of the obtained fiber member with wiring, electrical characteristics of wiring, and the like.

[Comparative Example 1]
A fiber member with wiring was produced in the same manner as in Example 1 except that no calendar processing was performed and the binder layer was not formed. In the case of no binder, the wiring having a wire width of 100 μm had many broken parts, and the wiring could not be conducted. Table 1 below shows various physical characteristics of the obtained fiber member with wiring, electrical characteristics of wiring, and the like.

[Comparative Example 2]
A fiber member with wiring was produced in the same manner as in Example 1 except that the binder layer was not formed. In the case of no binder, the wiring having a wire width of 100 μm had many broken parts, and the wiring could not be conducted. FIG. 6 is a photograph comparing the state of wiring with a line width of 100 μm between the fiber member with wiring (with a binder material) of Example 1 and the fiber member with wiring without a binder material of Comparative Example 2. Table 1 below shows various physical characteristics of the obtained fiber member with wiring, electrical characteristics of wiring, and the like.

[Comparative Example 3]
A fiber member with wiring was produced in the same manner as in Example 1 except that the calendar processing was not performed. Without calendar processing, wiring with a line width of 100 μm had many disconnection points, and it was not possible to obtain continuity of the wiring. Table 1 below shows various physical characteristics of the obtained fiber member with wiring, electrical characteristics of wiring, and the like.

[Example 2]
A nylon 6 multifilament having a total fineness of 22 dtex and 17 filaments was used for the warp and weft, and a raw machine containing a taffeta structure having a warp density of 198 / 吋 and a weft density of 160 / 吋 was prepared by a water jet room.
The obtained woven fabric was spread and subjected to relaxation treatment and scouring continuously at 30 m / min in a treatment tank at 90 ° C. Next, the width is set for the rising width in the wet, and the dry heat is set (preset) at 190 ° C. for 1 minute. A 1-minute dry heat set (finishing set) was applied.
The obtained nylon 6 woven fabric was calendar-processed at a linear pressure of 600 N / cm and a surface temperature of 190 ° C. to flatten the nylon 6 ^{having a surface roughness (SMD) of 0.813 μm, a thickness of 40 μm, and a grain of 35 g / m 2.} Obtained a woven fabric.
A resin solution (solid content) containing a vinyl chloride / vinyl acetate copolymer resin, a UV absorber, and an antistatic agent in a mixed solvent of methyl ethyl ketone and toluene (mixing ratio 1: 1) on the entire surface of the obtained nylon woven fabric. (Concentration 12% by weight) is applied by dipping processing, and then the solvent is dried at 80 ° C. and / or the resin is crosslinked to obtain a binder layer to be a printed surface at 3.42 g / m in terms of solid content. A fiber base material uniformly arranged in No. ^{2 was prepared.}
Next, under exactly the same conditions as in Example 1, screen printing was performed using silver ink on the surface on which the binder layer was formed. In this case as well, even in the case of a thin wiring having a line width of 100 μm, a volume resistance value similar to that in the case where the line width is thicker was obtained. As a result of measuring the conductivity, the volume resistivity was 4.3 × 10 ^-5 Ω · cm, and the sheet resistance value was 0.019 Ω / □.
Table 2 below shows various physical characteristics of the obtained fiber member with wiring, electrical characteristics of wiring, and the like.

[Comparative Example 4]
A fiber member with wiring was produced in the same manner as in Example 2 except that the calendar processing was not performed and the binder layer was not formed. In the case of no binder, the wiring having a line width of 100 μm had a disconnection point, and the wiring could not be conducted. Table 2 below shows various physical characteristics of the obtained fiber member with wiring, electrical characteristics of wiring, and the like.

[Comparative Example 5]
A fiber member with wiring was produced in the same manner as in Example 2 except that the binder layer was not formed. In the case of no binder, the wiring having a line width of 100 μm had a disconnection point, and the wiring could not be conducted. Table 2 below shows various physical characteristics of the obtained fiber member with wiring, electrical characteristics of wiring, and the like.

[Comparative Example 6]
A fiber member with wiring was produced in the same manner as in Example 2 except that the calendar processing was not performed. Without calendar processing, wiring with a line width of 100 μm had many disconnection points, and it was not possible to obtain continuity of the wiring. Table 2 below shows various physical characteristics of the obtained fiber member with wiring, electrical characteristics of wiring, and the like.

The fiber member with wiring according to the present invention enables the production of a high-definition wiring pattern even when a low-cost fiber base material is used. This makes it possible to provide a remarkably low-cost fiber member on which functional elements having various functionalities such as a sensor, a battery, a heater, and a light emitting element are mounted.
Further, the fiber member with wiring according to the present invention has excellent flexibility and foldability, and can be significantly reduced in size and weight. Therefore, mobile phones, personal computers, in-vehicle parts, drones and autonomous mobile robots can be used. It is suitable for use in various applications that require miniaturization and weight reduction, such as mobile objects. Further, it can be used as various monitoring elements such as failure prediction and condition monitoring, and elements for IoT in various fields such as various daily necessities such as clothing and sporting goods, medical supplies, and in-vehicle materials.
Further, according to the method for manufacturing a fiber member with wiring according to the present invention, it is possible to mass-produce high-definition wiring patterns with a high yield by using a remarkably low-cost manufacturing apparatus, and manufacture the above-mentioned various functional elements. A method can be provided.

As an application example of the fiber member with wiring according to the present invention, it can be used in an outdoor bulletin board. For example, after printing with a laser printer, wiring and functional elements can be further formed to make a signboard equipped with functional elements such as sensors even outdoors, and if a light emitting element is inserted, it can also be used as a danger display member or illumination at night. It can be used and can be wrapped around trees and signs. Further, wiring can be provided on the non-woven fabric constituting the in-vehicle airbag and used for monitoring the state of the airbag, and it can be applied to a seat belt, a steering wheel, a dashboard or the like to make a smart textile. Further, there are applications for smart textiles for detecting biological signals, mounting on mats for monitoring people entering and exiting, cushions, cushioning materials, and the like.

1 Fiber base material 2 Binder layer 3 Wiring 4 First machined surface 5 Second machined surface 6 Connection part 7 Functional element 8 Snap button 9 Conductive material

Claims (9)

A binder layer is provided on one side of a fiber base material having a flattened surface having a surface roughness (SMD) of 0.5 μm to 2 μm on at least one side, and wiring made of a conductive material is placed on the binder layer. A fiber member with wiring, characterized by having. The fiber member with wiring according to claim 1, wherein the functional element has a connection portion electrically connected to a part of the wiring made of the conductive material. ^{The binder material constituting the binder layer is 1.0 g / m 2 of} at least one resin selected from the group consisting of vinyl chloride / vinyl acetate copolymer resin, urethane resin, acrylic resin, and a mixture thereof. The fiber member with wiring according to claim 1 or 2, which comprises 10 g / m ^2. The fiber member with wiring according to claim 3, wherein the wiring contains at least one kind of the same resin as the resin contained in the binder material constituting the binder layer. The binder material constituting the binder layer, an antistatic agent further comprises at ^{0.1g / m 2 ~0.5g / m 2} , with wires fiber member according to any one of claims 1 to 4. The fiber member with wiring according to any one of claims 1 to 5, wherein the surface coverage of the binder layer is 10% to 100%. The fiber member with wiring according to any one of claims 1 to 6, wherein the minimum line width of the wiring is 1 μm or more and 5 mm or less. The following steps:
A flattening step of flattening at least one side of a fiber base material to obtain a fiber base material having a surface roughness (SMD) of 0.5 μm to 2 μm;
A binder layer forming step of applying or impregnating a resin solution containing a binder material in a solvent, and then drying and / or cross-linking the solvent to provide a binder layer; and a conductive material on the obtained binder layer. Wiring forming process to form a wiring consisting of
A method for manufacturing a fiber member with wiring, including. The following steps:
A step of electrically connecting a functional element to a part of the formed wiring to produce a connection portion;
In the production of the connection portion, a step of applying a conductive paste, a step of adhering using a conductive resin or a conductive adhesive, a step of thermally crimping an anisotropic conductive film, and a conductive or non-conductive 8. The step according to claim 8, wherein at least one step selected from the group consisting of a sewing step or a weaving step using a thread, a step of stopping a spelling needle for a stapler, and a step of connecting using a metal snap button is carried out. Manufacturing method of fiber member with wiring.

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