KR102304356B1 - Patch type textile antenna with improved wash durability and method of manufacturing same - Google Patents

Abstract

The present invention relates to a patch-type textile antenna and a method for manufacturing the same. The patch-type textile antenna includes: a dielectric-containing dielectric layer (200); a ground layer (100) including a first fabric base material (120) formed on the lower surface of the dielectric layer (200) and a first conductive portion (110) formed on the lower surface of the first fabric base material (120) and including a conductor; a first sealing layer (400) formed on the surface of the ground layer (100) and including a sealing material for sealing the ground layer (100); a radiation layer (300) including a second fabric base material (320) formed on the upper surface of the dielectric layer (200) and a second conductive portion (310) formed on the upper surface of the second fabric base material (320) and including a conductor; and a second sealing layer (500) formed on the surface of the radiation layer (300) and including a sealing material for sealing the radiation layer (300). The patch-type textile antenna of the present invention has low wettability and high water repellency. In addition, the antenna is excellent in wash durability and its performance hardly declines after washing.

Description

Patch-type fiber antenna with improved washing durability and manufacturing method thereof

The present invention relates to a patch-type fiber antenna and a method for manufacturing the same, and more particularly, to a patch-type fiber antenna by screen-printing conductive ink on a textile substrate and using the same as a ground layer and a radiation layer of the antenna.

With the development of wearable-related technologies and industries, fiber-type antenna-related technologies are being researched and reported. A wearable antenna is preferably a patch type, which minimizes radiation in the direction of the human body. In the case of a patch type antenna, a planar conductive layer is laminated. The manufacturing method of screen-printing the conductive ink is advantageous for manufacturing a large area planar conductive layer in a quick and simple process, but the washing durability of the manufactured conductive layer must be solved.

The method of manufacturing a fiber-type antenna by printing conductive ink is advantageous for mass production because it enables a fast production process, but there is a problem in that the physical impact generated during the washing process and durability to detergents are weak due to the characteristics of conductive ink.

An object of the present invention is to provide a patch-type fiber antenna with low wettability and high water repellency.

Another object of the present invention is to provide a patch-type fiber antenna having excellent washing durability and a method for manufacturing the same.

According to an aspect of the present invention, a dielectric layer comprising a dielectric (dielectric layer, 200); A ground layer including a first fabric base 120 formed on a lower surface of the dielectric layer 200 and a first conductive part 110 formed on a lower surface of the first fabric base 120 and including a conductor layer, 100); a first sealing layer 400 formed on the surface of the ground layer 100 and including a sealing material for sealing the ground layer 100 ; A radiation layer including a second fabric base 320 formed on the upper surface of the dielectric layer 200 and a second conductive part 310 formed on the upper surface of the second fabric base 320 and including a conductor layer, 300); and a second sealing layer 500 formed on the surface of the radiation layer 300 and including a sealing material for sealing the radiation layer 300 .

In addition, the sealing material of the first sealing layer 400 and the second sealing layer 500 may include a first elastic polymer.

In addition, the first elastic polymer is polyurethane, polyether urethane, polyester urethane, styrene-butadiene-styrene (SBS) block copolymer, styrene-ethylene-butylene -Styrene (styrene-ethylene-butylene-styrene, SEBS) block copolymer, styrene-isoprene-styrene (SIS) block copolymer, styrene-butadiene rubber (SBR), butadiene rubber (BR) , isobutylene isoprene rubber (IIR), ethylene propylene rubber (EPR), ethylene-propylene diene monomer rubber (EPDM), isoprene rubber (IR) , isobutylene rubber (IR), acryl rubber, acrylonitrile butadiene rubber (ABR), epichlorohydrin rubber, neoprene (neoprene, polychloroprene), Contains at least one selected from the group consisting of silicone rubber, polydimethylsiloxane (PDMS), ecoflex, fluoro silicone rubber, and vinyl methyl silicone rubber can do.

In addition, the sealing material of the first sealing layer 400 and the second sealing layer 500 may include a thermoplastic polymer elastomer.

In addition, the thermoplastic polymer elastomer is polyurethane, polyether urethane rubber, polyester urethane, styrene-butadiene-styrene (SBS) block copolymer, styrene-ethylene-butylene -Styrene (styrene-ethylene-butylene-styrene, SEBS) block copolymer, styrene-isoprene-styrene (SIS) block copolymer, styrene-butadiene rubber (SBR), butadiene rubber (BR) , isobutylene isoprene rubber (IIR), ethylene propylene rubber (EPR), ethylene-propylene diene monomer rubber (EPDM), isoprene rubber (IR) , isobutylene rubber (IR), acrylic rubber (acryl rubber), acrylonitrile-butadiene rubber (acrylonitrile butadiene rubber, ABR) and at least one selected from the group consisting of epichlorohydrin rubber (epichlorohydrin rubber) may include.

In addition, the thickness of the first encapsulation layer 400 and the second encapsulation layer 500 may each independently be 50 to 300 μm.

In addition, the dielectric may include a second elastic polymer.

In addition, the dielectric may be a porous dielectric including pores.

In addition, the second elastic polymer is neoprene (neoprene, polychloroprene), styrene-butadiene-styrene (styrene-butadiene-styrene, SBS) block copolymer, styrene-ethylene-butylene-styrene (styrene-ethylene-butylene-styrene, SEBS) ) block copolymer, styrene-isoprene-styrene (SIS) block copolymer, styrene-butadiene rubber (SBR), butadiene rubber (BR), isobutylene isoprene rubber, IIR), ethylene propylene rubber (EPR), ethylene-propylene diene monomer rubber (EPDM), isoprene rubber (IR), isobutylene rubber (IR), acrylic rubber, acrylonitrile butadiene rubber (ABR), polyurethane, polyether urethane, polyester urethane, epichlorohydrin rubber, Contains at least one selected from the group consisting of silicone rubber, polydimethylsiloxane (PDMS), ecoflex, fluoro silicone rubber, and vinyl methyl silicone rubber can do.

Also, the second elastic polymer may include neoprene.

In addition, the first fabric base 120 and the second fabric base 320 each independently include warp and weft yarns, and the warp and weft yarns each independently include a bundle of yarns, and the yarn bundle The plurality of yarns may be included in the form of a bundle.

In addition, the yarn may be one selected from the group consisting of a flat yarn and a round yarn.

Also, the yarn may be a flat yarn.

In addition, the arithmetic mean roughness of the ground layer 100 and the radiation layer 300 may be 4 to 9 μm, respectively.

In addition, the flat yarn may have an aspect ratio (a/b) of 5 to 7 of the longest diameter (a) to the shortest diameter (b) of the vertical cut surface in the longitudinal direction.

In addition, the first conductive part 110 and the second conductive part 310 may further include a conductor impregnated in the first fabric base 120 and the second fabric base 320 .

In addition, the yarn is polyethylene terephthalate (PET, polyethylene terephthalate), nylon (nylon), polyamide (polyamide), polyvinylidene fluoride (polyvinylidene fluoride), polypropylene (polypropylene), polyethylene (polyethylene), polysulfone (polysulfone) ), from the group consisting of polytetrafluoroethylene, polyimide, polyethylene naphthalate (PEN, poly(ethylene naphthalate)), cotton, rayon, and silk. It may include one or more selected.

In addition, each of the conductors is independently one or more selected from the group consisting of silver (Ag), gold (Au), copper (Cu), platinum (Pt), palladium (Pd), ruthenium (Ru), and aluminum (Al). may include.

Also, the thickness of the dielectric layer 200 may be 1 to 3 mm.

In addition, the patch-type fiber antenna has a first adhesive layer 600 and a second adhesive layer (600) between the dielectric layer 200 and the first sealing layer 400 and between the dielectric layer 200 and the second sealing layer 500, respectively. 700) may be further included.

In addition, the patch-type fiber antenna may further include an SMA (Subminiature version A) connector 800 coupled to the ground layer 100 .

According to another aspect of the present invention, (a) placing a screen mesh on a textile substrate and screen-printing a conductive ink including a conductor on the textile substrate; (b) forming a conductive part including a conductor on the textile substrate by drying the textile substrate on which the conductive ink is printed, thereby manufacturing a textile substrate/conducting part; (c) manufacturing a first fabric base 120/first conducting part 110 and a second fabric base 320/second conducting part 310 using the fabric base/conducting part; (d) positioning a sealing material on the first textile substrate 120 and the first conductive portion 110 of the first textile substrate 120 / first conductive part 110, respectively, and heat-sealing the sealing material to the first Forming a first sealing layer 400 on the surface of the fabric base 120 / first conductive part 110; (e) positioning a sealing material on the second textile substrate 320 and the second conductive portion 310 of the second textile substrate 320/second conductive portion 310, respectively, and heat-sealing the sealing material to heat-seal the second forming a second sealing layer 500 on the surface of the fabric base 320/second conductive part 310; and (f) the first fabric base 120/first conductive part 110 on which the first sealing layer 400 is formed and the second fabric base 320/second conductive part on which the second sealing layer 500 is formed. Manufacturing a patch-type fiber antenna comprising; placing the fabric base of 310 on the lower and upper surfaces of the dielectric layer 200 to face the dielectric layer 200 including the dielectric, respectively, and manufacturing the patch-type fiber antenna 10 A method is provided.

The patch-type fiber antenna of the present invention has an effect of low wettability and high water repellency.

In addition, the patch-type fiber antenna of the present invention has excellent washing durability, and the antenna performance is not significantly deteriorated even after washing.

1 is a side view of a patch-type fiber antenna according to an embodiment of the present invention.
2 is a side view of a patch-type fiber antenna according to another embodiment of the present invention.
3 is a front view of the patch-type fiber antenna of the present invention, (a) is a front (front), (b) is a front view along the back (backside).
4, (a) is Device Example 2-1, (b) is Device Comparative Example 3-1, (c) is Device Comparative Example 3-2, (d) is Device Example 2-2 An image of a patch-type fiber antenna.
5 is an optical microscope image of a flat yarn and a round yarn prepared according to Preparation Examples 1-1 and 1-2.
6 is a 3D digital microscope image of the surface of the fabric substrate prepared according to Preparation Examples 2-1 and 2-2, and the image inserted in FIG. 6 is the surface morphology observed by FE-SEM.
7 is an FE-SEM image of a cross-section of a fabric substrate prepared according to Preparation Examples 2-1 and 2-2.
8 is a 3D virtual image of a fabric base manufactured according to Preparation Examples 2-1 and 2-2.
FIG. 9 is a surface roughness profile according to the arrow shown in FIG. 8 .
10 is a 3D digital microscope image of a flat yarn fabric substrate printed with silver ink prepared according to Examples 1-1 to 1-4.
11 is a 3D digital microscope image of a circular yarn fabric substrate printed with silver ink prepared according to Examples 2-1 to 2-4.
12 is a 3D microscope image of a flat yarn fabric substrate printed with silver ink prepared according to Examples 1-1 to 1-4.
13 is a 3D microscope image of a circular yarn fabric substrate printed with silver ink prepared according to Examples 2-1 to 2-4.
14 is a FE-SEM image of a cross-section of a flat yarn fabric substrate printed with silver ink prepared according to Examples 1-1 to 1-4.
15 is an FE-SEM image of a cross-section of a circular yarn fabric substrate printed with silver ink prepared according to Examples 2-1 to 2-4.
16 is an SEM and EDS image of a cross-section of a flat yarn fabric substrate printed with silver ink prepared according to Example 1-1.
17 is an SEM and EDS image of a cross-section of a circular yarn fabric substrate printed with silver ink prepared according to Example 2-1.
18 is a graph showing the sheet resistance of the fabric base prepared according to Examples 1-1 to 1-4 and 2-1 to 2-4.
19 is a repeated bending test measurement image, (a) is an initial state, (b) is an image of a point at which the radius of curvature becomes 3 mm after bending.
20 is a graph showing the sheet resistance before and after the bending test of the fabric base prepared according to Examples 1-1 to 1-4 and 2-1 to 2-4.
21 is a 3D digital microscope image of 70 mesh and 120 mesh.
22 (a) and (b) are images before and after washing of the patch-type fiber antenna in the LoRa region prepared according to Device Comparative Example 1 and Device Example 1, respectively.
23 (a) and (b) are images before and after washing of the patch-type fiber antenna of the BLE region prepared according to Device Comparative Example 2 and Device Example 2-1, respectively.

Since the present invention can apply various transformations and can have various embodiments, specific embodiments are illustrated and described in detail in the detailed description. However, this is not intended to limit the present invention to specific embodiments, and it should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention. In describing the present invention, if it is determined that a detailed description of a related known technology may obscure the gist of the present invention, the detailed description thereof will be omitted.

In addition, terms including an ordinal number such as first, second, etc. to be used below may be used to describe various elements, but the elements are not limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component.

Also, when it is stated that a component is “on another component,” “formed on another component,” “located on another component,” or “stacked on another component,” the It should be understood that other components may be formed by being directly attached to the front surface or one surface on the surface of the other components, and may be positioned or stacked, but other components may be further present in the middle.

The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It should be understood that this does not preclude the existence or addition of numbers, steps, operations, components, parts, or combinations thereof.

1 and 2 are side views of a patch-type fiber antenna according to an embodiment of the present invention, respectively. 3 is a front view of the patch-type fiber antenna of the present invention, (a) is a front (front), (b) is a front view along the back (backside).

Hereinafter, the patch-type fiber antenna of the present invention will be described with reference to FIGS. 1 to 3 .

The present invention provides a patch-type fiber antenna (10) including a ground layer (100), a dielectric layer (200), a radiation layer (300), a first sealing layer (400) and a second sealing layer (500).

dielectric layer 200

The patch-type fiber antenna of the present invention may include a dielectric layer ( 200 ), and the dielectric layer ( 200 ) may include a dielectric.

The dielectric may include a second elastic polymer.

The dielectric may be a porous dielectric including pores.

The second elastic polymer is neoprene (neoprene, polychloroprene), styrene-butadiene-styrene (styrene-butadiene-styrene, SBS) block copolymer, styrene-ethylene-butylene-styrene (styrene-ethylene-butylene-styrene, SEBS) Block copolymer, styrene-isoprene-styrene (SIS) block copolymer, styrene-butadiene rubber (SBR), butadiene rubber (BR), isobutylene isoprene rubber (IIR) ), ethylene propylene rubber (EPR), ethylene propylene diene monomer rubber (EPDM), isoprene rubber (IR), isobutylene rubber (IR), acrylic acryl rubber, acrylonitrile butadiene rubber (ABR), polyurethane, polyether urethane, polyester urethane, epichlorohydrin rubber, silicone At least one selected from the group consisting of rubber (silicone rubber), polydimethylsiloxane (PDMS), ecoflex (ecoflex), fluoro silicone rubber and vinyl methyl silicone rubber (vinyl methyl silicone rubber) It may include, preferably, neoprene (neoprene).

The thickness of the dielectric layer 200 may be 1 to 3 mm. If the thickness is less than 1 mm, the performance of the antenna is deteriorated, which is not preferable, and if it exceeds 3 mm, flexibility and elasticity as a wearable device are deteriorated, which is not preferable.

ground layer (100)

The patch-type fiber antenna of the present invention includes a ground layer (100), the ground layer (100) is a first fabric base 120 formed on the lower surface of the dielectric layer (200), the first fabric base A first conductive part 110 formed on the lower surface of the 120 and including a conductor may be included.

first sealing layer 400

The patch-type fiber antenna of the present invention includes a first sealing layer 400 , the first sealing layer 400 is formed on the surface of the ground layer 100 , and for sealing the ground layer 100 . It may include a sealing material.

Emissive layer (300)

The patch-type fiber antenna of the present invention includes a radiation layer (300), the radiation layer (300) is formed on the upper surface of the dielectric layer (200) a second fabric base 320, and the second fabric base It may include a second conductive part 310 formed on the upper surface of the 320 and including a conductor.

second sealing layer 500

The patch-type fiber antenna of the present invention includes a second sealing layer (500), the second sealing layer (500) is formed on the surface of the radiation layer (300), for sealing the radiation layer (300) It may include a sealing material.

The sealing material of the first sealing layer 400 and the second sealing layer 500 may include a first elastic polymer.

The first elastic polymer is polyurethane, polyether urethane, polyester urethane, styrene-butadiene-styrene (SBS) block copolymer, styrene-ethylene-butylene- Styrene (styrene-ethylene-butylene-styrene, SEBS) block copolymer, styrene-isoprene-styrene (SIS) block copolymer, styrene-butadiene rubber (SBR), butadiene rubber (BR), isobutylene-isoprene rubber (IIR), ethylene propylene rubber (EPR), ethylene-propylene diene monomer rubber (EPDM), isoprene rubber (IR), isobutylene rubber (IR), acryl rubber, acrylonitrile butadiene rubber (ABR), epichlorohydrin rubber, neoprene (polychloroprene), silicone At least one selected from the group consisting of rubber (silicone rubber), polydimethylsiloxane (PDMS), ecoflex (ecoflex), fluoro silicone rubber and vinyl methyl silicone rubber (vinyl methyl silicone rubber) can

The sealing material of the first sealing layer 400 and the second sealing layer 500 may include a thermoplastic polymer elastomer.

The thermoplastic polymer elastomer is polyurethane, polyether urethane rubber, polyester urethane, styrene-butadiene-styrene (SBS) block copolymer, styrene-ethylene-butylene- Styrene (styrene-ethylene-butylene-styrene, SEBS) block copolymer, styrene-isoprene-styrene (SIS) block copolymer, styrene-butadiene rubber (SBR), butadiene rubber (BR), isobutylene-isoprene rubber (IIR), ethylene propylene rubber (EPR), ethylene-propylene diene monomer rubber (EPDM), isoprene rubber (IR), At least one selected from the group consisting of isobutylene rubber (IR), acryl rubber, acrylonitrile butadiene rubber (ABR) and epichlorohydrin rubber may include

The thickness of the first sealing layer 400 and the second sealing layer 500 may each independently be 50 to 300 μm, preferably 100 to 200 μm, and more preferably 130 to 150 μm. If the thickness is less than 50 μm, the sealing layer is melted by the detergent (surfactant) used for washing when washing, and there is a problem in that the film is damaged by physical damage while the washing machine is running. If it exceeds, the sealing layer is safe during washing, but it is not preferable because the thickness of the final sample to be made becomes too thick and a problem of poor flexibility occurs.

The first fabric base 120 and the second fabric base 320 each independently include warp and weft yarns, and the warp and weft yarns each independently include a bundle of yarns, and the yarn bundle is A plurality of yarns may be included in the form of a bundle.

The yarn may be one selected from the group consisting of a flat yarn and a round yarn, and preferably a flat yarn.

The arithmetic mean roughness of the ground layer 100 and the radiation layer 300 may be 4 to 9 μm, respectively. When the arithmetic average flatness is less than 4 μm, it is difficult to achieve because it has a limitation of having a minimum flatness when it becomes a woven fabric due to the nature of the fiber.

The flat yarn may have an aspect ratio (a/b) of 5 to 7 of the longest diameter (a) to the shortest diameter (b) of the vertical cut surface in the longitudinal direction.

The first conductive part 110 and the second conductive part 310 may further include a conductor impregnated in the first fabric base 120 and the second fabric base 320 .

The thread is polyethylene terephthalate (PET, polyethylene terephthalate), nylon (nylon), polyamide (polyamide), polyvinylidene fluoride (polyvinylidene fluoride), polypropylene (polypropylene), polyethylene (polyethylene), polysulfone (polysulfone), 1 selected from the group consisting of polytetrafluoroethylene, polyimide, polyethylene naphthalate (PEN, poly(ethylene naphthalate)), cotton, rayon, and silk It may include more than one species, preferably PET.

Each of the conductors is independently selected from the group consisting of silver (Ag), gold (Au), copper (Cu), platinum (Pt), palladium (Pd), ruthenium (Ru), and aluminum (Al). It may include, preferably silver (Ag).

Referring to FIG. 2 , the patch-type fiber antenna includes a first adhesive layer 600 and between the dielectric layer 200 and the first sealing layer 400 and between the dielectric layer 200 and the second sealing layer 500 , respectively. A second adhesive layer 700 may be further included.

The patch-type fiber antenna may further include an SMA (Subminiature version A) connector 800 coupled to the ground layer 100 .

Hereinafter, a method for manufacturing a patch-type fiber antenna of the present invention will be described.

first, on the fabric screen mesh A conductive ink comprising a conductor is placed and screen-printed onto the textile substrate (step a).

The screen mesh may be 70 to 120 mesh. If the screen mesh is less than 70 mesh, it is difficult to apply the ink evenly, which is not preferable, and if it exceeds 120 mesh, metal particles having conductivity are too much filtered into the mesh, which is not preferable because the resistance of the applied conductive layer may increase.

Next, the conductive ink is printed By drying the fabric base, the on the fabric containing conductors conduction department Formed to fabric base / conduction department prepared (step b).

Between steps (a) and (b), before the conductive ink is dried, a screen mesh is placed on the fabric substrate and the conductive ink including a conductor is screen-printed 1 to 5 times consecutively (a') may additionally include.

Next, the fabric base / conduction department Using the first fabric base 120 / first conduction unit (110) and the second fabric base 320/second conductive part 310 is prepared (step c).

The first fabric base 120 and the second fabric base 320 each independently include warp and weft yarns, and the warp and weft yarns each independently include a bundle of yarns, and the yarn bundle is A plurality of yarns may be included in the form of a bundle.

The yarn may be a flat yarn.

The method of manufacturing the patch-type fiber antenna may further include the step (a") of manufacturing the yarn by a melting spinning process.

Next, the first fabric base 120 / first of the conduction unit 110 The first fabric base 120 and the first conduction unit on 110 each sealing material position, and sealing material heat-sealed The first fabric base 120 / first of the conduction unit 110 on the surface first sealing layer 400 form (step d).

Next, the second fabric base 320 / second of the conduction unit 310 The second fabric base 320 and the second conduction unit 310 on each sealing material position, and sealing material heat-sealed The second fabric base 320 / second of the conduction unit 310 on the surface second sealing layer 500 form (step e).

Finally, the first The sealing layer 400 Formed first fabric base 120 / first conduction unit (110) and the second The sealing layer 500 is Formed second fabric base 320 / second of the conduction unit 310 Each of the textile substrates contains a dielectric dielectric layer 200 remind to face of the dielectric layer 200 The patch-type fiber antenna 10 is manufactured by positioning it on the lower surface and upper surface (step f).

The patch-type fiber antenna 10 is the same as the description of the patch-type fiber antenna 10 of the present invention described above, and therefore, specific details thereof will be referred to.

[Example]

Hereinafter, the present invention will be described in more detail by way of examples. However, this is for illustrative purposes only, and the scope of the present invention is not limited thereto.

Preparation Example 1: Preparation of yarn

Preparation Example 1-1: flat yarn

Intrinsic Viscosity (I.V.) 0.63 polyester chips were purchased from Hyosung Co. as a raw material for melt spinning of flat yarn. The melt spinning process consists of drying, melting, extruding, quenching, stretching/heat setting and winding.

First, the chips were dried at 100° C. for 10 minutes and then further dried at 180° C. for 2 hours. The drying process prevents degradation of the polymer by hydrolysis when heated to high temperatures during the spinning process, and eliminates the difference in molecular weight between lots. After the chip was melted at 290°C, the flat yarn was extruded through 12 I-holes of a spinneret (TMT, TMT-MS-LAB-3) under 100 MPa. In order to uniformly cool the flat yarn extruded from the nozzle, a cooling process was performed by blowing air at 16° C. at a constant speed of 0.45 m/sec. Drawing and heat-setting processes were performed to impart properties such as orientation, fineness, strength and elongation to the flat yarn. Finally, the stretched flat yarn was wound at 3,780 rpm.

Preparation Example 1-2: round yarn

Prototype yarn (75d/48f, PET) was purchased from Toray Chemical Inc. and used.

The optical microscope images of the flat yarn and the round yarn prepared according to Preparation Examples 1-1 and 1-2 are shown in FIG. 5, and the fineness, tensile strength, elongation, and unevenness are shown in FIG. It is shown in Table 1 below.

manufacturing example Fineness
(Denier) Tensile Strength
(g/d) Elongation
(%) Unevenness
(U, % ) 1-1 (flat yarn) 78.8 3.25 13.64 1.78 1-2 (round yarn) 74.2 18.80 4.72 1.77

manufacturing example 2: Manufacture of fabric base

Preparation Example 2-1: flat yarn fabric

The flat yarn of Preparation Example 1-1 was woven into a balanced plain weave using a rapier loom (Donier, PVS-2C-2200). The number of picks per inch, or wefts per inch, is 108.

Preparation Example 2-2: round yarn fabric

The circular yarn of Preparation Example 1-2 was woven into a balanced plain weave using a rapier loom (Donier, PVS-2C-2200). The number of picks per inch, or wefts per inch, is 108.

Before describing the examples, a screen mesh having 70 openings per inch (70 mesh) and a screen mesh having 120 openings per inch (120 mesh) were purchased from Riso Kagaku Co., respectively. The images of 70 mesh and 120 mesh are shown in FIG. 21, and they are made of polyester.

Silver conductive ink was purchased from Henkel Co. (Electrodag® 479SS ™) and stored at 4°C. The silver content is 74.6% by weight, the density is 2.56 kg/L, and the viscosity is 12,000 mPa·s (cP).

Example 1: Preparation of a flat yarn fabric substrate printed with silver (Ag) ink

Example One- 1: 70 Use mesh, perform screen printing once

A computerized screen maker (Riso Kagaku, GOCCOPRO QS2536) was used to design and fabricate ^{rectangular patterns (52×52 mm 2} and 66×66 mm ^{2 ) on the mesh frame.}

Before screen printing, the silver conductive ink was preheated at room temperature for 1 hour and then stirred by hand for 1 minute using a steel spoon. A 70 mesh was placed on the top of the flat yarn fabric base prepared according to Preparation Example 2-1, and silver ink was applied to one end of the 70 mesh, and then printed once using an SP5080EP automatic screen printer. At this time, the squeeze height was 5 mm and the scan speed was 0.06 m/s.

The printed silver conductive ink was dried in a convection oven at 120° C. for 10 minutes to prepare a flat yarn fabric substrate printed with silver (Ag) ink.

Example 1-2: 70 mesh used, screen printing performed twice

^{Rectangular patterns (52×52 mm 2} and 66×66 mm ² ) were designed and fabricated on the mesh frame using a computer screen maker (Riso Kagaku, GOCCOPRO QS2536).

Before screen printing, the silver conductive ink was preheated at room temperature for 1 hour and then stirred by hand for 1 minute using a steel spoon. A 70 mesh was placed on the top of the flat yarn fabric base prepared according to Preparation Example 2-1, and silver ink was applied to one end of the 70 mesh, and then printed twice using an SP5080EP automatic screen printer. In the second printing, the second printing is performed before the first printed silver ink is completely dried. At this time, the squeeze height was 5 mm and the scan speed was 0.06 m/s.

The printed silver conductive ink was dried in a convection oven at 120° C. for 10 minutes to prepare a flat yarn fabric substrate printed with silver (Ag) ink.

Example 1-3: Using 120 mesh, screen printing performed once

A flat yarn fabric substrate printed with silver (Ag) ink was prepared in the same manner as in Example 1-1 except that 120 mesh was used instead of 70 mesh.

Example 1-4: Using 120 mesh, screen printing performed twice

A flat yarn fabric substrate printed with silver (Ag) ink was prepared in the same manner as in Example 1-2 except that 120 mesh was used instead of 70 mesh.

Example 2: Preparation of circular yarn fabric substrate printed with silver (Ag) ink

Example 2-1: Using 70 mesh, screen printing performed once

Silver (Ag) in the same manner as in Example 1-1 except for using the round yarn fabric base prepared according to Preparation Example 2-2 instead of using the flat yarn fabric base prepared according to Preparation Example 2-1 ) A circular yarn fabric substrate printed with ink was prepared.

Example 2-2: Using 70 mesh, screen printing performed twice

Silver (Ag ) A circular yarn fabric substrate printed with ink was prepared.

Example 2-3: Using 120 mesh, screen printing performed once

Silver (Ag Ag ) A circular yarn fabric substrate printed with ink was prepared.

Example 2-4: Using 120 mesh, screen printing performed twice

Silver (Ag ) A circular yarn fabric substrate printed with ink was prepared.

device example 1: containing neoprene as a dielectric LoRa of the realm patch type Fabrication of fiber antennas

Referring to FIG. 22 (b), the TPU film (120 μm) of Ceylon was placed on the upper and lower surfaces of the flat yarn fabric substrate printed with silver ink prepared according to Examples 1-4, respectively, and heat-sealed to seal it. . At this time, for the thermal fusion, Assems' Coating & Laminating (AFM-700LT) equipment was used. The conditions were sealed by wrapping and sealing the thermoplastic TPU film in the upper and lower layers with a flat yarn fabric substrate printed with silver ink therebetween at a temperature of 120° C. and a speed of 2 m/min. The sealed flat yarn fabric substrate printed with silver ink was attached to the upper and lower surfaces of 3 mm thick neoprene using a thin double-sided adhesive film, respectively. The SMA connector was attached to the antenna through the through hole of the antenna using conductive epoxy. The epoxy was cured at 60-70° C. for 15 minutes to prepare a patch-type fiber antenna in the LoRa (Long Range) region.

The patch-type fiber antenna in the LoRa region is designed to transmit a signal with an operating frequency of 868 MHz, and the optimized waterproof antenna size at 868 MHz is 149 mm x 150 mm (width x height), and the patch size is 149 mm x 128 mm (width x length). .

device example 2: containing neoprene as dielectric BLE of the realm patch type Fabrication of fiber antennas

Device Example 2-1: Use of TPU film

Referring to (a) of FIG. 4 , a patch-type fiber antenna in the BLE (Bluetooth Low Energy) region was manufactured in the same manner as in Device Example 1.

The patch-type fiber antenna of the BLE area is designed to transmit a Bluetooth signal having an operating frequency of 2.4 GHz, and the size of the waterproof antenna optimized for 2.4 GHz is 43 mm x 52 mm and the patch size is 43 mm x 44 mm.

Device Example 2-2: Lamination Polymer Use

Referring to (d) of FIG. 4, by screen-printing Dycotec's lamination polymer on both sides with the flat yarn fabric substrate printed with silver ink prepared according to Examples 1-4 interposed therebetween, at a temperature of 120° C. for 20 minutes. It was coated and sealed by drying. At this time, the screen printing conditions were printing the polymer at a speed of 2 m/min, and drying was performed in a convection oven. The sealed flat yarn fabric substrate printed with silver ink was attached to the upper and lower surfaces of 3 mm thick neoprene using a thin double-sided adhesive film, respectively. The SMA connector was attached to the antenna through the through hole of the antenna using conductive epoxy. The epoxy was cured at 60-70° C. for 15 minutes to prepare a patch-type fiber antenna in the BLE region.

Device comparison example 1: containing felt as a dielectric LoRa of the realm patch type Fabrication of fiber antennas

Instead of using 3mm thick neoprene, 1mm thick felt (Ozfelt yarn, hard felt product, raw material is made of wool and other animal hairs by using moisture, heat, pressure, etc. to melt). A patch-type fiber antenna in the LoRa region was manufactured in the same manner as in Device Example 1, except that cloth) was used.

Device comparison example 2: containing felt as dielectric BLE of the realm patch type Fabrication of fiber antennas

Instead of using 3mm thick neoprene, 1mm thick felt (Ozfelt yarn, hard felt product, raw material is made of wool and other animal hairs by using moisture, heat, pressure, etc. to melt). A patch-type fiber antenna of the BLE region was manufactured in the same manner as in Device Example 2-1 except for using a cloth).

Device comparison example 3: ground floor and the radiation layer not completely sealed BLE of the realm patch type Fabrication of fiber antennas

Device Comparative Example 3-1

Referring to Figure 4 (b), the flat yarn fabric substrate prepared according to Examples 1-4 printed with silver (Ag) ink using a thin double-sided adhesive film 3mm thick neoprene (Neoprene) upper and lower surfaces attached to Ceylon's TPU film (120 μm) was placed on the upper surface of the textile substrate attached to the top surface of the neoprene and the lower surface of the textile substrate attached to the lower surface of the neoprene, respectively, and heat-sealed to seal the entire antenna. At this time, for the thermal fusion, Assems' Coating & Laminating (AFM-700LT) equipment was used. Conditions were sealed by wrapping the thermoplastic TPU film on the upper and lower layers with the entire antenna interposed therebetween at a speed of 2 m/min at a temperature of 120 °C. The SMA connector was attached to the antenna through the through hole of the antenna using conductive epoxy. The epoxy was cured at 60-70° C. for 15 minutes to prepare a patch-type fiber antenna in the BLE region.

Device Comparative Example 3-2

Referring to FIG. 4(c), the flat yarn fabric substrate prepared according to Examples 1-4 printed with silver (Ag) ink was coated with a thin double-sided adhesive film on the upper and lower surfaces of Neoprene with a thickness of 3 mm. attached to Dycotec's lamination polymer was screen-printed only on the exposed side of the fabric base attached to the top and bottom surfaces of neoprene and coated by drying at a temperature of 120° C. for 20 minutes. At this time, the screen printing conditions were printing the polymer at a speed of 2 m/min, and drying was performed in a convection oven. The SMA connector was attached to the antenna through the through hole of the antenna using conductive epoxy. The epoxy was cured at 60-70° C. for 15 minutes to prepare a patch-type fiber antenna in the BLE region.

[Test Example]

The morphology of the fabric substrate before and after screen printing was measured with a 3D digital microscope (Hirox, RH-2000) and a field-emission scanning electron microscope (FE-SEM) (Hitachi, SU8010).

A surface profilometer (Mitutoyo, Absolute) was used to measure the topography of fabric substrates.

The sheet resistance of all samples was measured using a 4-point probe conductivity meter (Dasoleng, RSD-16) and a software program (Daesoleng, FPP RS8).

Test Example 1: Morphology analysis of fabric substrates

6 is a 3D digital microscope image of the surface of the fabric substrate prepared according to Preparation Examples 2-1 and 2-2, and the image inserted in FIG. 6 is the surface morphology observed by FE-SEM. Referring to FIG. 6 , it was confirmed that the flat yarn fabric base had a smoother and more uniform structure than the round yarn fabric base. In addition, it was confirmed that the flat yarn fabric substrate had smaller pores at the same density with 108 warp threads and 108 weft threads at ^{2.54 cm 2 .}

7 is an FE-SEM image of a cross-section of a fabric substrate prepared according to Preparation Examples 2-1 and 2-2. Referring to FIG. 7 , it was confirmed that the flat yarns were horizontally stacked at each warp or weft yarn to form a flatter surface than the circular yarn fabric base.

8 is a 3D virtual image of the fabric base manufactured according to Preparation Examples 2-1 and 2-2, and FIG. 9 is a surface roughness profile according to the arrow shown in FIG. Referring to FIGS. 8 and 9 , it was confirmed that the flat yarn fabric substrate had a smoother surface roughness.

The average values of Ra (arithmetic mean height) and Rz (maximum height of profile), which are the average roughness values of flat and round yarn fabric bases, and thickness (t) obtained by measuring 10 times at random locations on each fabric base are shown in the table below. 2 is shown.

Roughness, Ra
[μm] Roughness, Rz
[μm] t
[μm] manufacturing example 2-1
( flat yarn fabric) 11.1 (± 0.8) 60.9 (± 4.3) 106.6 (± 2.9) manufacturing example 2-2
(Circular yarn fabric base) 14.4 (± 1.4) 62.3 (± 7.9) 107.9 (± 2.6)

Referring to Table 2, although Ra and Rz of the flat yarn fabric base are 25% and 7% lower than that of the round yarn fabric base, respectively, it can be seen that the thickness of the fabric is not significantly different from each other.

Test Example 2: Morphology Analysis of Silver Ink Printed Fabric Substrate

10 and 11 show a flat yarn fabric substrate printed with silver ink prepared according to Examples 1-1 to 1-4, and a circular yarn fabric printed with silver ink prepared according to Examples 2-1 to 2-4, respectively. 3D digital microscope image of the substrate.

12 and 13 show a flat yarn fabric substrate printed with silver ink prepared according to Examples 1-1 to 1-4, and a circular yarn fabric printed with silver ink prepared according to Examples 2-1 to 2-4, respectively. 3D microscopic image of the substrate.

Comparison of flat yarn fabric base and round yarn fabric base

Referring to FIGS. 10 and 11 , if the mesh size and number of printing are the same, it was confirmed that the flat yarn fabric exhibited a more uniform surface shape with fewer pores than the round yarn fabric. For example, when the ink is printed one time with 70 mesh, the round yarn fabric has more voids than the flat yarn fabric. In the case of flat yarn fabric, the conductive ink is uniformly printed without noticeable voids, except for one-time printing with 70 mesh. On the other hand, circular yarn fabrics show more voids for all conditions.

12 and 13, it was confirmed that the printed flat yarn fabric substrate showed a smoother surface profile than the printed circular yarn fabric substrate. This result proves that the surface roughness of the non-printed fabric substrate greatly affects the uniformity of the printing area.

70 mesh and 120 mesh comparison

The effect of mesh size on the surface roughness of the printing area was investigated using two sizes of screen mesh. The size of the mesh was defined by the number of holes per inch. That is, a 70 mesh has 70 openings per inch in both the x and y axes. 21 is a 3D digital microscope image of 70 mesh and 120 mesh. Referring to FIG. 21 , in the case of 70 mesh, the size of the opening is about 280x280 μm ² and the diameter of the mesh wire is about 75 μm. For 120 mesh, the size of the opening is about 155x155 μm ² and the diameter of the mesh wire is about 55 μm.

As long as the substrate is the same and the number of prints is constant, it is observed that the printing area when the silver conductive ink is screen printed with 70 mesh has more voids than when printed with 120 mesh. One of the reasons is that the ink is very viscous like ketchup (5-20 Pa·s), so a relatively thick mesh wire of 70 mesh forms many unprinted areas. Ink penetrating through the opening does not reach the adjacent opening and therefore does not merge with the ink penetrating from the adjacent opening. In the case of a 120 mesh 55 μm mesh wire, it is highly probable that the infiltrated silver ink will connect to each other to form a seamless conductive network.

In addition to the thickness of the mesh wire, the opening size of the mesh can affect the surface morphology of the screen printing pattern. As can be seen from the 3D microscope images of FIGS. 12 and 13 , the screen printed pattern of 120 mesh produces a more uniform surface than the pattern printed with 70 mesh. As the size of the openings is smaller, agglomerates of silver particles are filtered out and remain on the mesh, allowing the conductive paste to pass through and a more elaborate pattern is formed. Therefore, 120 mesh is more suitable for forming a uniform conductive pattern than 70 mesh.

Compare the number of prints

In order to investigate the effect of the number of printing on the surface morphology of the fabric substrate, silver conductive ink was printed once or twice. Referring to FIGS. 10 to 13 , it can be confirmed that the conductive pattern printed twice has a smaller number of pores and a smaller amplitude in the topography than the pattern printed once. This is because the ink added from repeated printing fills the voids and grooves of the preceding underlying layer, increasing the surface flatness.

Considering all parameters, the conductive pattern printed twice on a flat yarn fabric with 120 mesh shows the highest surface flatness.

The surface roughness values of Ra and Rz of the fabric base prepared according to Examples 1-1 to 1-4 and 2-1 to 2-2, the thickness (t) of the printed fabric, and the sheet resistance (mΩ/sq.) are shown below. Table 3 shows. All data were obtained with an average of 10 times the measurements.

Example mesh type number of prints Roughness, Ra
[μm] Roughness, Rz
[μm] t
[μm] sheet resistance
[mΩ/sq.] 1-1 70 One 8.5 (± 0.8) 54.3 (± 9.3) 142 (±7) 60 (±4) 1-2 70 2 7.4 (± 1.9) 39.7 (± 8.7) 153 (±7) 30 (±1) 1-3 120 One 6.7 (± 1) 37.7 (± 5.9) 142 (±5) 31 (±3) 1-4 120 2 4.2 (± 2.2) 22.6 (± 11.7) 146 (±7) 16 (±3) 2-1 70 One 10.3 (± 1.1) 55.9 (± 6.5) 159 (±14) 134 (±15) 2-2 70 2 10.2 (± 0.6) 53.7 (± 9.7) 165 (±5) 37 (±8) 2-3 120 One 10.4 (± 0.5) 59.7 (± 6.7) 156 (±5) 40 (±3) 2-4 120 2 9.3 (± 1) 45.7 (± 4) 162 (±3) 24 (±4)

Referring to Table 3, the circular yarn fabric substrate does not show a large change in surface roughness even if the printing process is engineered. Also, the thickness of the two types of fabric substrates is similar to each other before screen printing (see Table 2), but the round yarn fabric is approximately 10% thicker than the flat yarn fabric after printing.

14 and 15 show a cross-section of a flat yarn fabric substrate printed with silver ink prepared according to Examples 1-1 to 1-4, and a circular yarn printed with silver ink prepared according to Examples 2-1 to 2-4, respectively. This is an FE-SEM image of a cross-section of a fabric substrate.

16 and 17 are SEM and EDS images of a cross-section of a flat yarn fabric substrate printed with silver ink prepared according to Example 1-1 and a cross-section of a circular yarn fabric substrate printed with silver ink prepared according to Example 2-1, respectively; am.

Referring to FIGS. 14 to 17 , it was confirmed that the printing surface became smoother when the density of the mesh was high and the number of printing was increased. It can be seen that the cross-section of the printed fabric replicates the surface topography of the thread bundle beneath the printed ink layer. Therefore, flat yarn fabrics are more advantageous for forming a smooth surface in printing than round yarn fabrics.

Also, the silver conductive ink penetrates into the gaps between the round yarns rather than the gaps between the flat yarns. Flat yarn fabrics have a laminated structure that is effective in preventing ink from flowing down and penetrating into microscopic crevices. In other words, the laminated structure of the flat yarn allows the ink to remain on the surface of the fabric until it dries, creating a much smoother surface.

Test Example 3: Sheet resistance analysis

Sheet resistances were compared to analyze how different surface morphologies of fabrics affect the electrical conductivity of printed patterns. Prior to measuring the sheet resistance, the total thickness of the printed conductive fabric was obtained to determine the correction factor of the 4-point probe method. Here, the thickness is taken as the total thickness of the fabric sample. As the conductive ink penetrates the fibrous tissue, the fabric structure forms an electrically conductive composite.

Taking into account the 4-point probe and the measured printing fabric size, a geometric correction factor of 4.532 was utilized, and the sheet resistance was calculated using Equation (1) below.

Rs = 4.532 Х V / I (1)

where V is the voltage measured by the two internal probes and I is the current applied through the two external probes. The sheet resistance is independent of the sample size and film thickness.

The sheet resistance of the printed pattern as a function of the type of fabric substrate, the mesh size and the number of prints is shown in FIG. 18 and summarized in Table 2 above as topological properties. Referring to FIG. 18 and Table 2, it was confirmed that the flat yarn fabric (60 mΩ/sq.) exhibited a much lower sheet resistance than the circular yarn fabric (134 mΩ/sq.) when printed once with 70 mesh. The pores of the circular yarn fabric inhibit the flow of electric charges in the conductive path, and thus act as an important factor in lowering the electrical properties. However, when the mesh size is reduced to 120 mesh and the number of prints is doubled, the difference in electrical resistance between the two fabrics is greatly reduced. The sheet resistance of the circular yarn fabric printed with two printing conditions, (1) 120 mesh once, and (2) 70 mesh twice is less than 30% of the sheet resistance of the circular yarn fabric printed once with 70 mesh. This means that the mesh size and number of prints greatly affect the electrical properties as well as the fabric properties. The flat yarn fabric printed twice with 120 mesh showed a minimum average sheet resistance of 16 (± 3) mΩ/sq.

Test Example 4: Repeated bending test

Repeated bending tests were performed to confirm the mechanical stability. 19 is a repeated bending test measurement image, (a) is an initial state, (b) is an image of a point at which the radius of curvature becomes 3 mm after bending. Referring to Figure 19, a custom device with two clamps holding the sample for repeated bending tests was used. One clamp does not move, the other moves back and forth with a motor (oriental motor, EAS6X-E015-AZACD-3). The distance between the two clamps varied from 5.5 cm to 2.5 cm, resulting in a radius of curvature of 3 mm, and bending of each sample was repeated 1,000 times.

The sheet resistance before and after the bending test of the fabric substrates prepared according to Examples 1-1 to 1-4 and 2-1 to 2-4 is shown in FIG. 20 and Table 4 below.

Example mesh Kinds number of prints sheet resistance
[ mΩ / sq .] Sheet resistance after bending
[ mΩ / sq .] 1-1 70 One 60 (±4) 74 (±4) 1-2 70 2 30 (±1) 33 (±2) 1-3 120 One 31 (±3) 33 (±3) 1-4 120 2 16 (±3) 17 (±3) 2-1 70 One 134 (±15) 157 (±15) 2-2 70 2 37 (±8) 38 (±8) 2-3 120 One 40 (±3) 44 (±5) 2-4 120 2 24 (±4) 27 (±6)

Referring to FIG. 20 and Table 4, it was confirmed that there was no significant change in the sheet resistance of the printed fabric after the repeated bending test, thereby ensuring flexibility and reliability.

Test Example 5: Image analysis before/after washing

22 (a) and (b) are images before and after washing of the patch-type fiber antenna in the LoRa region prepared according to Device Comparative Example 1 and Device Example 1, respectively. Referring to FIG. 22 , (a) felt was used as an intermediate dielectric layer in Device Comparative Example 1, and (b) Neoprene was used as an intermediate dielectric layer in Device Example 1. In (a), the radiation layer and the dielectric layer coated with the conductive ink were dried after washing, but due to the characteristic of the felt, the wettability was high, and the absorbed water could not escape, so the antenna element was wet. However, in (b), it was confirmed that the neoprene fabric has low wettability and has a waterproof property, so it dries quickly even after washing. When it is wet due to the characteristics of an electronic device such as an antenna, electrical performance is deteriorated.

23 (a) and (b) are images before and after washing of the patch-type fiber antenna of the BLE region prepared according to Device Comparative Example 2 and Device Example 2-1, respectively. Referring to FIG. 23 , (a) felt was used as an intermediate dielectric layer in Device Comparative Example 2, and (b) Neoprene was used as an intermediate dielectric layer in Device Example 2-1. In (a), the radiation layer and the dielectric layer coated with the conductive ink were dried after washing, but the wettability of the felt was high, so the absorbed water could not escape, so the antenna element was kept wet. However, in (b), it was confirmed that the neoprene fabric has low wettability and has a waterproof property, so it dries quickly even after washing. Similarly, when wet due to the characteristics of an electronic device such as an antenna, electrical performance is deteriorated.

Test Example 6: Analysis of antenna performance before/after washing

Resonance frequency, gain, and efficiency of the patch-type fiber antennas prepared according to Device Examples 1 and 2-1 and Device Comparative Examples 1 and 2 before and after washing are shown in Table 5 below. It was.

Dielectric Material Frequency Washing Resonance frequency Gain Efficiency Efficiency after washing Felt_
1mm Device Comparative Example 1 868MHz Before 916MHz 0.41 15.5 -90% After 883MHz -9.12 1.51 Device Comparative Example 2 2.4GHz Before 2.40GHz 2.8 25.92 -66% After 2.34GHz -2.66 8.7 Neoprene_
3mm Device Example 1 868MHz Before 805MHz 4.93 52.17 -3% After 820MHz 4.83 50.88 Device Example 2-1 2.4GHz Before 2.21GHz 7.12 72.21 -12% After 2.21GHz 6.58 63.64

Referring to Table 5, as can be seen in the images before and after washing in FIGS. 22 and 23, it can be seen that the performance degradation when the fiber-type antenna element is not completely dried after washing is confirmed. When Felt was used as an intermediate dielectric, the antenna element was not completely dried, and it was confirmed that the performance of LoRa and BLE at this time was reduced by 90% and 66%, respectively. However, when the intermediate dielectric was used as neoprene, it dried quickly due to the low wettability and waterproof properties of the fabric, and it was confirmed that the performance change before and after washing was reduced by 3% in LoRa and 12% in BLE, respectively. 22, 23 and Table 5, it was possible to confirm the correlation between the wettability of the device and the electrical performance after washing.

Test Example 7: Washing Durability Test

The washing durability of the patch-type fiber antennas prepared according to Device Examples 2-1 and 2-2 and Device Comparative Examples 3-1 and 3-2 was tested. For the washing durability test method, Canmore washing machine (room temperature water, WOB, natural drying, 10 times) was used, and the washing durability test environment was an environmental temperature of 20±1℃ and an environmental humidity of 60±5% R.T. As a result of the washing durability test, TPU film (120μm) was placed on the front/rear side of the fabric base, that is, on the upper and lower surfaces of the fabric base, when washed 10 times according to the KS washing standard. Example 2-1 had no moisture permeation and had the best physical durability. In Device Example 2-2 and Device Comparative Examples 3-1 and 3-2, problems in that moisture penetrated or suffered physical damage were found. Therefore, as in Device Example 2-1, it was confirmed that the method of placing the TPU film on the front/rear side of the fabric base, that is, on the upper and lower surfaces of the fabric base, and sealing it by heat sealing was the most suitable method for washing.

In the above, although preferred embodiments of the present invention have been described, those of ordinary skill in the art can add, change, delete or It will be possible to variously modify and change the present invention by addition, etc., which will also be included within the scope of the present invention. For example, each component described as a single type may be implemented in a dispersed form, and likewise components described as distributed may be implemented in a combined form. The scope of the present invention is indicated by the following claims rather than the above detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts should be interpreted as being included in the scope of the present invention. do.

10: patch type fiber antenna
100: ground layer
110: first conduction unit
120: first fabric base
200: dielectric layer
300: radiation layer
310: second conduction unit
320: second fabric base
400: first sealing layer
500: second sealing layer
600: first adhesive layer
700: second adhesive layer
800: SMA connector

Claims (20)

a dielectric layer including a dielectric (dielectric layer, 200);
A ground layer including a first fabric base 120 formed on a lower surface of the dielectric layer 200 and a first conductive part 110 formed on a lower surface of the first fabric base 120 and including a conductor layer, 100);
a first sealing layer 400 formed on a surface of the ground layer 100 and including a sealing material for sealing the ground layer 100 ;
A radiation layer including a second fabric base 320 formed on the upper surface of the dielectric layer 200 and a second conductive part 310 formed on the upper surface of the second fabric base 320 and including a conductor layer, 300); and
a second sealing layer 500 formed on the surface of the emission layer 300 and including a sealing material for sealing the emission layer 300;
A patch-type fiber antenna comprising a (10). According to claim 1,
The patch-type fiber antenna, characterized in that the sealing material of the first sealing layer (400) and the second sealing layer (500) comprises a first elastic polymer. 3. The method of claim 2,
The first elastic polymer is polyurethane, polyether urethane, polyester urethane, styrene-butadiene-styrene (SBS) block copolymer, styrene-ethylene-butylene- Styrene (styrene-ethylene-butylene-styrene, SEBS) block copolymer, styrene-isoprene-styrene (SIS) block copolymer, styrene-butadiene rubber (SBR), butadiene rubber (BR), isobutylene-isoprene rubber (IIR), ethylene propylene rubber (EPR), ethylene-propylene diene monomer rubber (EPDM), isoprene rubber (IR), isobutylene rubber (IR), acryl rubber, acrylonitrile butadiene rubber (ABR), epichlorohydrin rubber, neoprene (polychloroprene), silicone Rubber (silicone rubber), polydimethylsiloxane (PDMS), ecoflex (ecoflex), fluoro silicone rubber (fluoro silicone rubber) and vinyl methyl silicone rubber (vinyl methyl silicone rubber) containing at least one selected from the group consisting of A patch-type fiber antenna, characterized in that. 3. The method of claim 2,
A patch-type fiber antenna, characterized in that the sealing material of the first sealing layer (400) and the second sealing layer (500) includes a thermoplastic polymer elastomer. 5. The method of claim 4,
The thermoplastic polymer elastomer is polyurethane, polyether urethane rubber, polyester urethane, styrene-butadiene-styrene (SBS) block copolymer, styrene-ethylene-butylene- Styrene (styrene-ethylene-butylene-styrene, SEBS) block copolymer, styrene-isoprene-styrene (SIS) block copolymer, styrene-butadiene rubber (SBR), butadiene rubber (BR), isobutylene-isoprene rubber (IIR), ethylene propylene rubber (EPR), ethylene-propylene diene monomer rubber (EPDM), isoprene rubber (IR), At least one selected from the group consisting of isobutylene rubber (IR), acryl rubber, acrylonitrile butadiene rubber (ABR) and epichlorohydrin rubber Patch-type fiber antenna comprising a. 5. The method of claim 4,
A patch-type fiber antenna, characterized in that the thickness of the first sealing layer (400) and the second sealing layer (500) is each independently 50 to 300 μm. According to claim 1,
The patch-type fiber antenna, characterized in that the dielectric includes a second elastic polymer. 8. The method of claim 7,
The patch-type fiber antenna, characterized in that the dielectric is a porous dielectric including pores. 8. The method of claim 7,
The second elastic polymer is neoprene (neoprene, polychloroprene), styrene-butadiene-styrene (styrene-butadiene-styrene, SBS) block copolymer, styrene-ethylene-butylene-styrene (styrene-ethylene-butylene-styrene, SEBS) Block copolymer, styrene-isoprene-styrene (SIS) block copolymer, styrene-butadiene rubber (SBR), butadiene rubber (BR), isobutylene isoprene rubber (IIR) ), ethylene propylene rubber (EPR), ethylene propylene diene monomer rubber (EPDM), isoprene rubber (IR), isobutylene rubber (IR), acrylic acryl rubber, acrylonitrile butadiene rubber (ABR), polyurethane, polyether urethane, polyester urethane, epichlorohydrin rubber, silicone Rubber (silicone rubber), polydimethylsiloxane (PDMS), ecoflex (ecoflex), fluoro silicone rubber (fluoro silicone rubber) and vinyl methyl silicone rubber (vinyl methyl silicone rubber) containing at least one selected from the group consisting of A patch-type fiber antenna, characterized in that. 10. The method of claim 9,
The patch-type fiber antenna, characterized in that the second elastic polymer comprises neoprene (neoprene). According to claim 1,
The first fabric base 120 and the second fabric base 320 each independently include warp and weft yarns,
The warp and weft yarns each independently include a bundle of yarns,
The patch type fiber antenna, characterized in that the yarn bundle includes a plurality of yarns in the form of a bundle. 12. The method of claim 11,
The patch type fiber antenna, characterized in that the yarn is one selected from the group consisting of a flat yarn and a round yarn. 13. The method of claim 12,
The patch type fiber antenna, characterized in that the yarn is a flat yarn. 14. The method of claim 13,
An arithmetic mean roughness of the ground layer (100) and the radiation layer (300) is 4 to 9 μm, respectively. 14. The method of claim 13,
The flat yarn (flat yarn) is a patch-type fiber antenna, characterized in that the aspect ratio (aspect ratio, a/b) of the longest diameter (a) to the shortest diameter (b) of the vertical cut surface in the longitudinal direction is 5 to 7. According to claim 1,
The patch-type fiber antenna, characterized in that the first conductive part (110) and the second conductive part (310) further include a conductor impregnated in the first textile substrate (120) and the second textile substrate (320). According to claim 1,
A patch-type fiber antenna, characterized in that the thickness of the dielectric layer (200) is 1 to 3 mm. According to claim 1,
The patch-type fiber antenna is provided with a first adhesive layer 600 and a second adhesive layer 700 between the dielectric layer 200 and the first sealing layer 400 and between the dielectric layer 200 and the second sealing layer 500, respectively. ) A patch-type fiber antenna, characterized in that it further comprises. According to claim 1,
The patch-type fiber antenna further comprises a (Subminiature version A) connector (800) coupled to the ground layer (100). (a) placing a screen mesh on a textile substrate and screen-printing a conductive ink including a conductor on the textile substrate;
(b) forming a conductive part including a conductor on the textile substrate by drying the textile substrate on which the conductive ink is printed, thereby manufacturing a textile substrate/conducting part;
(c) manufacturing a first fabric base 120/first conducting part 110 and a second fabric base 320/second conducting part 310 using the fabric base/conducting part;
(d) positioning a sealing material on the first textile substrate 120 and the first conductive portion 110 of the first textile substrate 120 / first conductive part 110, respectively, and heat-sealing the sealing material to the first Forming a first sealing layer 400 on the surface of the fabric base 120 / first conductive part 110;
(e) positioning a sealing material on the second textile substrate 320 and the second conductive portion 310 of the second textile substrate 320/second conductive portion 310, respectively, and heat-sealing the sealing material to heat-seal the second forming a second sealing layer 500 on the surface of the fabric base 320/second conductive part 310; and
(f) the first fabric base 120 / first conductive part 110 on which the first sealing layer 400 is formed and the second fabric base 320 / second conductive part on which the second sealing layer 500 is formed ( Manufacturing the patch-type fiber antenna 10 by positioning the fabric base of 310 on the lower and upper surfaces of the dielectric layer 200 to face the dielectric layer 200 including the dielectric, respectively;
A method of manufacturing a patch-type fiber antenna comprising a.

Images