WO2017199594A1

WO2017199594A1 - Wiring structure and electronic device

Info

Publication number: WO2017199594A1
Application number: PCT/JP2017/013298
Authority: WO
Inventors: 真央勝原
Original assignee: ソニー株式会社
Priority date: 2016-05-20
Filing date: 2017-03-30
Publication date: 2017-11-23
Also published as: JP2017208492A

Abstract

A wiring structure of an embodiment of the present disclosure is provided with: a fibrous porous base material; a first ground layer formed on one surface of the fibrous porous base material; and a first electrically conductive layer that is provided on the first ground layer and has a penetrating connecting part that penetrates the fibrous porous base material.

Description

Wiring structure and electronic equipment

The present disclosure relates to, for example, a wiring structure provided on a fibrous porous base material having elasticity and an electronic apparatus including the wiring structure.

In recent years, wearable devices that can be worn on the arm or installed in clothing are being developed. In a wearable device, wiring is often formed on a porous substrate having elasticity such as cloth. As a method for forming a wiring on a cloth, there are a method using a conductive fiber and a printing method using a conductive paste. For example, Patent Document 1 discloses a stretchable circuit board in which a conductive pattern is formed of a conductive paste containing an uncrosslinked elastomer and conductive fine particles.

JP 2014-236103 A

However, the general wiring forming method as described above has a problem that it is difficult to produce a fine wiring pattern on a porous substrate such as a cloth.

It is desirable to provide a wiring structure and an electronic device that can form a fine wiring pattern.

A wiring structure according to an embodiment of the present disclosure is provided on a fibrous porous substrate, a first foundation layer formed on one surface of the fibrous porous substrate, and the first foundation layer. And a first conductive layer having a through connection portion that penetrates the fibrous porous substrate.

An electronic apparatus according to an embodiment of the present disclosure includes a functional element and the wiring structure according to the embodiment of the present disclosure.

In the wiring structure according to one embodiment of the present disclosure and the electronic device according to one embodiment, the first conductive layer is provided on one surface of the fibrous porous base material via the first base layer, thereby providing a gap between the fibers. The spread of the transmitted conductive layer can be suppressed.

According to the wiring structure of one embodiment of the present disclosure and the electronic device of one embodiment, since the first conductive layer is provided on one surface of the fibrous porous base material via the first underlayer, the fiber The spread of the conductive layer that has passed through the gap is suppressed, and a fine conductive pattern can be formed.

In addition, the effect described here is not necessarily limited, and may be any effect described in the present disclosure.

It is a cross-sectional schematic diagram showing an example of the wiring structure which concerns on one embodiment of this indication. It is a plane schematic diagram explaining an example of the wiring structure shown in FIG. It is a plane schematic diagram explaining the other example of the wiring structure shown in FIG. It is a plane schematic diagram explaining the other example of the wiring structure shown in FIG. It is a plane schematic diagram explaining the other example of the wiring structure shown in FIG. It is a plane schematic diagram explaining the other example of the wiring structure shown in FIG. It is a cross-sectional schematic diagram showing the other example of the wiring structure which concerns on one embodiment of this indication. It is a cross-sectional schematic diagram explaining the manufacturing process of the wiring structure shown in FIG. It is a cross-sectional schematic diagram following FIG. 8A. It is a cross-sectional schematic diagram following FIG. 8B. It is a cross-sectional schematic diagram showing an example of the wiring structure which concerns on the modification of this indication. It is a cross-sectional schematic diagram explaining the manufacturing process of the wiring structure shown in FIG. It is a cross-sectional schematic diagram following FIG. 10A. It is a cross-sectional schematic diagram following FIG. 10B. It is a cross-sectional schematic diagram following FIG. 10C. It is a cross-sectional schematic diagram following FIG. 11A. It is a cross-sectional schematic diagram showing the other example of the wiring structure which concerns on the modification of this indication. 12 is a perspective view illustrating an example of an appearance of application example 1. FIG. 12 is a perspective view illustrating an example of an appearance of application example 2. FIG. 22 is a perspective view illustrating another example of the appearance of application example 2. FIG.

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The description will be given in the following order.
1. Embodiment (Example in which wiring is formed on a porous substrate through an underlayer)
1-1. Configuration of wiring structure 1-2. Manufacturing method of wiring structure 1-3. Action / Effect Modified example (example in which wiring is formed on both sides of porous substrate)
2-1. Configuration of wiring structure 2-2. 2. Manufacturing method of wiring structure Application examples

<1. Embodiment>
FIG. 1 illustrates a cross-sectional configuration of a wiring structure (wiring structure 1) according to an embodiment of the present disclosure. FIG. 2 shows a planar configuration of the wiring structure 1, and the cross section of the wiring structure 1 shown in FIG. 1 corresponds to the line II in FIG. This wiring structure 1 is useful, for example, when wiring is formed on a stretchable substrate such as cloth. In the wiring structure 1 of the present embodiment, a wiring layer 13 is formed on the surface (surface S1) of the porous substrate 11 with a base layer 12 interposed. The wiring layer 13 has a through connection portion 13 X that penetrates to the back surface (surface S 2) side of the porous substrate 11 through the opening 12 A provided in the base layer 12. 1 and 2 schematically illustrate an example of the configuration of the wiring structure 1, and may differ from actual dimensions and shapes.

(1-1. Configuration of wiring structure)
The porous substrate 11 is a porous substrate having elasticity, and fibrous materials (for example,

fibers

11A and 11B) having a sufficient length with respect to the fiber diameter (diameter) are gathered and randomly overlapped. For example, it is a cloth-like three-dimensional structure formed. Here, the cloth is an aggregate formed through a work of combining a plurality of fibers such as weaving and combing, and a cloth formed through a work of knitting by combining one or a plurality of fibers, or one It is an intertwined fiber. Specific examples include woven fabrics, knitted fabrics (knitted fabrics), laces, felts, and nonwoven fabrics. Examples of the constituent material of the porous substrate 11 include synthetic plastics such as polyester (PEs), polyethylene (PE), nylon, acrylic, polyurethane, and polytetrafluoroethylene (PTFE). Other examples include recycled fibers such as acetate rayon and cupra, natural fiber materials such as cotton, silk, hemp, and wool, and mixed materials thereof. In the present embodiment, as shown in FIG. 2, for example, a plurality of fibers 11A extending in the X-axis direction and a plurality of fibers 11B extending in the Z-axis direction are alternately intersected to form a porous material. The substrate 11 will be described as an example. The film thickness W (hereinafter simply referred to as thickness) of the porous substrate 11 in the Y-axis direction is, for example, 10 μm or more and 1000 μm or less. In addition, as shown in FIG. 1, the thickness W of the porous substrate 11 in the present embodiment includes, for example, a fiber 11A and two fibers 11B that sandwich the fiber 11A alternately from above and below. If that is the case.

The underlayer 12 flattens the surface of the porous substrate 11 and prevents the conductive material from spreading when forming the wiring layer 13, and provides fine wiring (for example, wiring 13 A, 13 B, 13 C, 13 D). It is for forming. As a material for the underlayer 12, for example, a material having stretchability is preferably used. Examples of such materials include polyurethane resin, acrylic, polyacetal (POM), polyethylene (PE), polypropylene (PP), polystyrene (PS), polyvinyl chloride (PVC), polyester (PEs), and polyamide (PA). , Polycarbonate (PC), phenol resin, epoxy resin, melamine resin, urea resin and silicone resin, or copolymers thereof. Among these, by using a thermoplastic resin such as thermoplastic polyurethane, the base layer 12 can be formed by thermally transferring a sheet-like base resin, and the manufacturing process can be simplified. The thickness of the foundation layer 12 is, for example, 10 μm or more and 500 μm or less.

For example, as shown in FIG. 2, the underlayer 12 may be patterned together with the patterns of the wirings 13 A, 13 B, 13 C, and 13 D, or as shown in FIG. 3, It may be provided on the entire surface. Alternatively, as shown in FIGS. 4, 5, and 6, it may be roughly patterned as long as it is formed at least between the porous substrate 11 and the wirings 13 A, 13 B, 13 C, 13 D. Good. The underlayer 12 can be formed by thermally transferring a sheet-like underlayer resin as described above, but in the sheet, the wiring layer 13 is located at a position where it penetrates to the back surface (surface S2) side of the porous substrate 11. It is preferable that an opening (for example, the opening 12A) is provided in advance.

For example, as shown in FIG. 2 and the like, the wiring layer 13 includes a plurality of wirings, for example, wirings 13A, 13B, 13C, and 13D, and one end of each of the wirings 13A, 13B, 13C, and 13D, For example, electrodes constituting the various sensors (sensor 120) are formed, and the other end is connected to, for example, a control unit (control unit 130) that controls the various sensors (see FIG. 13 for both). In addition, the wiring layer 13 is formed with a through connection portion 13 X that penetrates the porous substrate 11.

The through connection portion 13X penetrates the porous base material 11, and for example, a portion penetrating to the back surface (surface S2) side of the porous base material 11 can be used as the electrode 13Y constituting the various sensors. . Further, the through connection portion 13X includes, for example, a wiring layer 13 formed on the front surface (surface S1) side of the porous substrate 11, and a wiring layer (for example, formed on the back surface (S2) side of the porous substrate 11) , And can be used as a through electrode for electrically connecting the wiring layer 23). The through connection portion 13 X is formed, for example, by soaking the wiring material constituting the wiring layer 13 into the porous substrate 11. Specifically, the porous substrate 11 has a gap (pore 11a) continuous from the front surface S1 to the back surface S2 due to its structure. The through-connecting portion 13X is formed by allowing the wiring material to permeate through the pores 11a by capillary action. For this reason, the through-connection portion 13X is configured to include the porous base material 11 therein, and the porous base material 11 in the through-connection portion 13X and the porous base material 11 in other regions are, for example, It has substantially the same density. Thereby, the mechanical strength of the penetration connection part 13X improves, and durability improves. Further, as shown in FIG. 7, a base layer 15 is formed in advance at a corresponding position (for example, around the through-connection portion 13X) on the back surface S2 side of the porous substrate 11 where the through-connection portion 13X is formed. You may make it do. Thereby, it is possible to reduce the spread of the through-connection portion 13X on the back surface S2 side of the porous base material 11. The underlayer 15 may be provided on the entire back surface (surface S2) of the porous substrate 11.

The wiring layer 13 is formed of a conductive wiring material. Specific wiring materials include, for example, poly (3,4-ethylenedioxythiophene) doped with polystyrene sulfonic acid (PPS) (PEDOT-PSS), PEDOT doped with p-toluenesulfonic acid (TsO) (PEDOT) -TsO) and other conductive polymers, silver nanoparticles, metal nanoparticles such as copper nanoparticles, metal nanowires such as silver nanowires and copper nanowires, metal pastes, carbon electrode materials such as carbon nanotubes, graphene and graphite, or These mixed materials are mentioned.

As a method for forming the wiring layer 13, for example, it is desirable to use a printing process such as screen printing, inkjet, gravure offset printing, reverse offset printing, flexographic printing, nanoimprinting, and dispenser. In addition, elastic metal wiring such as meandering metal wiring may be transferred. In that case, the through-connecting portion 13X is formed by patterning conductive ink separately by a process such as dispenser or inkjet.

The protective layer 14 is for preventing corrosion and oxidation of the wiring layer 13 formed on the porous substrate 11. The protective layer 14 is formed of, for example, an epoxy resin, an acrylic resin, an imide resin, or a parylene resin. The thickness of the protective layer 14 should just be able to coat | cover the wiring layer 13, for example, is 1 micrometer or more and 100 micrometers or less.

(1-2. Manufacturing method of wiring structure)
A manufacturing process of the wiring structure 1 of the present embodiment will be described with reference to FIGS. 8A to 8C. In addition, the manufacturing method demonstrated here is an example, and you may make it manufacture using another method.

First, for example, a polyethylene cloth is prepared as the porous substrate 11. Subsequently, for example, as shown in FIG. 8A, a polyurethane sheet (thickness 20 μm) having an opening 12A formed at a position where the through-connecting portion 13X is formed by punching, for example, as the base layer 12, is formed by, for example, thermal lamination. Then, it is transferred onto the porous substrate 11 to form the underlayer 12. Next, after preparing an ink solution containing, for example, a silver nanoparticle-containing polymer (PE873 manufactured by DuPont), as shown in FIG. 8B, using this ink solution, for example, the underlayer 12 and the opening are formed by screen printing. A wiring pattern is printed on the hole 12A. The wiring pattern exhibits conductivity by heating and drying, and the wiring layer 13 and the through connection portion 13X are formed.

The ink solution is preferably adjusted for viscosity and surface energy. For the solvent of the ink solution, it is preferable to use an appropriate organic solvent in order to adjust the permeability to the porous substrate 11 (here, polyethylene cloth). What does not melt | dissolve and the contact angle with respect to the porous base material 11 will be 90 degrees or less is desirable. Specifically, for example, when a polyurethane base layer is formed on a polyester fiber, it is preferable to use a petroleum solvent such as toluene and xylene.

Finally, as shown in FIG. 8C, a protective layer 14 (PE773 manufactured by DuPont) that covers the wiring layer 13 is formed on the surface S1 side of the porous substrate 11 by, for example, spray coating. Thereby, the wiring structure 1 of the present embodiment is completed.

In addition, the penetration connection part 13X penetrated to the back surface S2 side of the porous substrate 11 can be used as an electrode (electrode 13Y) of an electrochemical sensor, for example, by modifying the surface as necessary. .

(1-3. Action and effect)
As described above, wearable devices that can be worn on the arm or installed on clothing have been developed in recent years, and the development of a method for producing a fine wiring pattern on a stretchable porous substrate such as a fabric is desired. It is rare.

On the other hand, in the wiring structure 1 of the present embodiment, the wiring layer 13 is formed on the surface (surface S1) of the porous substrate 11 via the base layer 12. Thereby, the spread of the conductive material in the process of forming the wiring layer 13 is suppressed, and a fine wiring pattern can be formed.

In addition, development of a technique for forming a multilayer wiring structure using a porous substrate is also desired. As a technology for forming a multilayer wiring structure using a porous substrate, for example, after forming a wiring pattern on the cloth, a through hole is formed in the cloth, and a conductive material is embedded in the through hole to form a back surface extraction electrode. Several methods have been reported. However, this method is difficult to industrialize. Moreover, since the back surface extraction electrode formed by this method has a conductive material unevenly distributed in the through holes, the mechanical characteristics of the back surface extraction electrode are greatly different from those of the surrounding fabric. As a result, cracks are likely to occur in the electrode (through electrode) portion in the through hole, and the reliability is expected to decrease.

In contrast, in the present embodiment, the through-connection portion 13X that includes the porous substrate 11 and penetrates from the front surface (surface S1) to the back surface (surface S2) of the porous substrate 11 is formed. Thereby, the flexibility and mechanical strength of the through-connecting portion 13X are ensured, and the reliability can be improved.

Furthermore, since the opening 12A is formed in advance at the position where the through connection portion 13X is formed when the base layer 12 is formed, the manufacturing process can be simplified.

Next, a modified example of the present disclosure will be described. In addition, the same code | symbol is attached | subjected to the component corresponding to the wiring structure 1 of the said embodiment, and description is abbreviate | omitted.

<2. Modification>
(2-1. Configuration of wiring structure)
FIG. 9 illustrates a cross-sectional configuration of a wiring structure (wiring structure 2) according to a modified example of the present disclosure. In the wiring structure 2 of this modification, a base layer 22 is provided on the front surface (surface S1) and the back surface (surface S2) of the porous substrate 11, and the wiring layer 13 (surface S1 side) is provided on the base layer 22. And the wiring layer 23 (surface S2 side) is formed respectively. The wiring layer 13 and the wiring layer 23 are electrically connected through the through connection portion 13X. A protective layer 14 and a protective layer 24 for protecting the wiring layer 13 and the wiring layer 23 are provided on the front surface (surface S1) and the back surface (surface S2) of the porous substrate 11, respectively. FIG. 9 schematically shows an example of the configuration of the wiring structure 2 and may differ from actual dimensions and shapes.

The wiring layer 23 on the back surface (S2) side is provided via the base layer 22 as shown in FIG. Similar to the base layer 12 of the above-described embodiment, the base layer 22 flattens the surface of the porous substrate 11 and prevents the conductive material from spreading when forming the wiring layer 23. It is for forming. Examples of the material of the underlayer 22 include polyurethane resin, acrylic, polyacetal (POM), polyethylene (PE), polypropylene (PP), polystyrene (PS), polyvinyl chloride (PVC), polyester (PEs), polyamide (PA ), Polycarbonate (PC), phenol resin, epoxy resin, melamine resin, urea resin and silicone resin, or copolymers thereof. The underlayer 22 may be formed, for example, by thermally transferring a polyurethane sheet to the surface (surface S1) and the back surface (surface S2) of the porous substrate 11, respectively, like the underlayer 12 in the above embodiment. Although details will be described later, for example, both the front surface (surface S1) and the back surface (surface S2) of the porous substrate 11 are collectively formed by spraying and infiltrating the porous substrate 11 with a solution containing the above materials. can do. The thickness of the foundation layer 22 is sufficient if the surface of the porous substrate 11 can be planarized. For example, the thickness of the front surface (surface S1) and the back surface (surface S2) is preferably 10 μm or more and 1000 μm or less, respectively.

The wiring layer 23 is formed of a wiring material having the same conductivity as that of the wiring layer 13. As described above, the wiring layer 23 is electrically connected to the wiring layer 13 via the through-connection portion 13X provided in the opening 22A formed in the base layer 22.

The protective layer 24 is for preventing corrosion and oxidation of the wiring layer 23 and is formed of the same material as that of the protective layer 14. The thickness of the protective layer 24 is, for example, 1 μm or more and 100 μm or less, similarly to the protective layer 14.

(2-2. Manufacturing method of wiring structure)
A manufacturing process of the wiring structure 2 of this modification will be described with reference to FIGS. 10A to 11B. In addition, the manufacturing method demonstrated here is an example, and you may make it manufacture using another method.

First, for example, a polyethylene cloth is prepared as the porous substrate 11, and as shown in FIG. 10A, the PVA aqueous solution is infiltrated into the formation position of the through connection portion 13X using, for example, a dispenser or an inkjet, and the mask 31 is attached. Form. Subsequently, as shown in FIG. 10B, the polyurethane resin solution is sprayed onto the porous base material 11 by, for example, spray coating, and permeated into the porous base material 11, and then the polyurethane resin is dried and solidified. As a result, the base layer 22 is collectively formed on the front surface (surface S1) and the back surface (surface S2) of the porous substrate 11. Next, as shown in FIG. 10C, the mask 31 is removed to form the opening 22A.

Subsequently, for example, after preparing an ink solution containing a silver nanoparticle-containing polymer (PE873 manufactured by DuPont), as shown in FIG. 11A, using this ink solution, for example, by screen printing, the underlayer 22 and A wiring pattern is printed on the opening 22A. The wiring pattern exhibits conductivity by heating and drying, and the wiring layer 13 and the through connection portion 13X are formed. Next, the protective layer 14 (DuPont PE773) covering the wiring layer 13 is formed by, for example, spray coating.

Subsequently, as shown in FIG. 11B, the porous substrate 11 is turned over, and the wiring layer 23 is formed on the base layer 22 on the back surface (S2) side by using the same method as the wiring layer 13 described above. Finally, a protective layer 24 (PE773 manufactured by DuPont) covering the wiring layer 23 is formed by, for example, spray coating, whereby the wiring structure 2 shown in FIG. 9 is completed.

In addition, you may make it provide the base layer 22 in a part of back surface (surface S2) of the porous base material 11, as shown, for example in FIG. Specifically, for example, the base layer 12 shown in FIG. 2 may be patterned along a wiring pattern constituting the wiring layer 23. In that case, similarly to the above-described embodiment, a polyurethane sheet in which the opening 12A (and the opening 22A) is formed on each of the display surface (surface S1) side and the back surface (surface S2) is formed by, for example, thermal lamination. And the underlayer 12 and the underlayer 22 may be formed separately.

As described above, in this modification, the porous base material 22 is connected to the wiring layer 13 formed on the front surface (surface S1) side through the through connection portion 13X via the base layer 22. 11 on the back surface (surface S2). This makes it possible to form a multilayer wiring structure using a porous substrate having elasticity.

<3. Application example>
Next, an application example of an electronic apparatus provided with the

wiring structures

1 and 2 described in the above embodiment and modifications will be described. However, the configuration of the electronic device described below is merely an example, and the configuration can be changed as appropriate. The

wiring structures

1 and 2 are applied to a part of various electronic devices or clothing items, for example, a so-called wearable device such as a watch (watch), a bag, clothes, a hat, glasses and shoes. It is possible, and the type of the electronic device is not particularly limited.

(Application example 1)
FIG. 13 shows the appearance of the garment 110. The garment 110 includes, for example, various sensors 120 that detect or measure sweating, body temperature, sweat components, epidermal gas, blood sugar, and the like, a control unit 130 that controls the sensor 120, and a wiring 140 that connects the sensor 120 and the control unit. I have. Note that a circuit 150 may be provided in the middle of the wiring 140 between the sensor 120 and the control unit 130. The electrode and the wiring 140 constituting the sensor 120 are configured by the wiring structure 1 (or the wiring structure 2).

(Application example 2)
FIG. 14A and FIG. 14B represent the appearance of a bag. The bag includes a cloth storage unit 210 and a handle 220, for example. A display body 230 including a display body such as an electrophoretic element is attached to the storage unit 210, for example. Various characters and designs are displayed on the storage unit 210 by the display body 230. The display body 230 may be attached not only to the storage unit 210 but also to the handle 220. For example, by applying a voltage, the display body 230 can change the design of the storage unit 210 from the example of FIG. 14A to the example of FIG. 14B. The wiring structure 1 (or the wiring structure 2) can be applied to a wiring that connects a control unit that controls display. Electronic devices that are useful in fashion applications can be realized.

As described above, the present disclosure has been described with the embodiment and the modification. However, the present disclosure is not limited to the aspect described in the embodiment and the like, and various modifications are possible. For example, it is not necessary to include all the constituent elements described in the above embodiments and the like, and other constituent elements may be included. Moreover, the material and thickness of the component mentioned above are examples, and are not limited to what was described. Moreover, in the said embodiment etc., although the cloth 11A was shown as an example for the porous base material 11 by the two fibers 11B being alternately clamped from the upper direction and the downward direction, it is not restricted to this. The porous substrate 11 may be used by stacking two or more of the above-mentioned cloths, or may be a non-woven fabric in which a plurality of fibers are folded as described above.

In addition, the effect described in this specification is an illustration to the last, and is not limited, Moreover, there may exist another effect.

In addition, this indication can also take the following structures.
(1)
A fibrous porous substrate;
A first underlayer formed on one surface of the fibrous porous substrate;
A first conductive layer provided on the first base layer and having a through-connection portion penetrating the fibrous porous substrate;
Wiring structure with
(2)
A second conductive layer electrically connected to the first conductive layer via the through-connecting portion is provided on the other surface opposite to the one surface of the fibrous porous substrate. The wiring structure according to (1).
(3)
The wiring structure according to (1) or (2), wherein the first base layer is patterned and has an opening in the through-connection portion.
(4)
The wiring structure according to any one of (1) to (3), wherein the through connection portion includes the fibrous porous substrate therein.
(5)
The density of the fibrous porous base material contained in the inside of the through-connecting portion and the density of the fibrous porous base material in other regions are substantially the same as described in (4). Wiring structure.
(6)
The wiring structure according to any one of (2) to (5), wherein the fibrous porous substrate has pores continuous from the one surface to the other surface.
(7)
The wiring structure according to any one of (2) to (6), wherein the fibrous porous substrate has a second underlayer on the other surface.
(8)
The wiring structure according to (7), wherein the second base layer is provided around the through connection portion.
(9)
The wiring structure according to (7) or (8), wherein the second conductive layer is provided on the other surface of the fibrous porous substrate via the second base layer.
(10)
The wiring structure according to any one of (1) to (9), wherein the fibrous porous substrate has elasticity.
(11)
The wiring structure according to any one of (7) to (10), wherein the first base layer and the second base layer have elasticity.
(12)
A functional element, and a wiring structure electrically connected to the functional element,
The wiring structure is
A fibrous porous substrate;
A first underlayer formed on one surface of the fibrous porous substrate;
A first conductive layer provided on the first base layer and having a through-connection portion penetrating the fibrous porous substrate;
With electronic equipment.

This application claims priority based on Japanese Patent Application No. 2016-101036 filed on May 20, 2016 at the Japan Patent Office. The entire contents of this application are hereby incorporated by reference. Incorporated into.

Those skilled in the art will envision various modifications, combinations, subcombinations, and changes, depending on design requirements and other factors, which are within the scope of the appended claims and their equivalents. It is understood that

Claims

A fibrous porous substrate;
A first underlayer formed on one surface of the fibrous porous substrate;
A first conductive layer provided on the first base layer and having a through-connection portion penetrating the fibrous porous substrate;
Wiring structure with
A second conductive layer electrically connected to the first conductive layer via the through-connecting portion is provided on the other surface opposite to the one surface of the fibrous porous substrate. The wiring structure according to claim 1.
The wiring structure according to claim 1, wherein the first underlayer is patterned and has an opening in the through-connection portion.
The wiring structure according to claim 1, wherein the through-connection portion includes the fibrous porous substrate therein.
5. The wiring according to claim 4, wherein the density of the fibrous porous substrate included in the through connection portion and the density of the fibrous porous substrate in other regions are substantially the same. Construction.
The wiring structure according to claim 2, wherein the fibrous porous substrate has pores continuous from the one surface to the other surface.
The wiring structure according to claim 2, wherein the fibrous porous substrate has a second underlayer on the other surface.
The wiring structure according to claim 7, wherein the second base layer is provided around the through connection portion.
The wiring structure according to claim 7, wherein the second conductive layer is provided on the other surface of the fibrous porous substrate via the second underlayer.
The wiring structure according to claim 1, wherein the fibrous porous substrate has stretchability.
The wiring structure according to claim 7, wherein the first underlayer and the second underlayer have elasticity.
A functional element, and a wiring structure electrically connected to the functional element,
The wiring structure is
A fibrous porous substrate;
A first underlayer formed on one surface of the fibrous porous substrate;
A first conductive layer provided on the first base layer and having a through-connection portion penetrating the fibrous porous substrate;
With electronic equipment.