JP2021190438A - Component mounting device - Google Patents

Abstract

To clearly recognize a hole that serves as the reference for the mounting position of a component on a substrate with high contrast, and perform the component mounting operation to mount components on the substrate with high accuracy while ensuring model switchability.SOLUTION: A component mounting device 100 comprises a substrate transport section 19 that holds and transports a substrate 11, a table 59 that is disposed below the substrate transport section 19, a light emitting section that is disposed above the table 59 and locally illuminates a specific area of the substrate 11 brought in by the substrate transport section 19 from below, and a support that supports the light emitting section from below at one end and is detachably attached to the table 59 at the other end.SELECTED DRAWING: Figure 2

Description

The present disclosure relates to a component mounting device.

Conventionally, a component mounting device for mounting components on a board has been known, and is used in the manufacture of various mounting boards. Some of these component mounting devices require high accuracy for mounting components on the board, and the components taken out from the component supply unit are temporarily placed on the temporary placement stage and recognized by the recognition camera. After that, there is an example in which the parts are picked up again and mounted on the board. (See, for example, Patent Document 1).

As a component that requires high accuracy in the mounting position of the component on such a substrate, for example, there is a light emitting component that emits light having directivity such as an LED (Light Emitting Diode). For light-emitting components with such directivity, if the LED is mounted at a position (or in a posture) deviated from the mounting target position on the board, the required illuminance may not be obtained, so the component is mounted on the board. The alignment of the components with respect to the substrate is especially important.

As described above, as a method for highly accurate alignment of a component with respect to the substrate when the component is mounted on the board, a hole (penetration) penetrating in the thickness direction in the vicinity of the mounting position of the component on the board has been conventionally performed. A technique is known in which a hole) is provided, the through hole is recognized (imaged) by a recognition camera from above the substrate, and a component is mounted on the substrate based on the recognized through hole.

JP-A-2015-119134

However, when a specific region provided on the substrate (for example, the region where the through hole of the substrate is located) is recognized by the recognition camera from above the substrate, the opening contour of the hole to be recognized may be recognized from above depending on the state of the upper surface of the substrate. There was a problem that it was difficult to correctly recognize the shape of the hole because it did not shine uniformly due to the lighting of. It is also conceivable to equip a light source that illuminates the board over a wide range in order to align the parts, but if the size of the board transported to the parts mounting device changes, the size of the light source must be changed each time. It is possible that it must be done. In such a case, the work of changing the light source increases, and the property of being able to flexibly support boards of various sizes (models) and aligning parts on the board (hereinafter referred to as "model switchability") deteriorates. There was a problem.

This disclosure was devised in view of the above-mentioned conventional situation, and clearly recognizes the position of a hole (through hole) that serves as a mounting reference for components mounted on a board with high contrast, while ensuring model switchability. It is an object of the present invention to provide a component mounting device that performs component mounting processing for mounting components on a substrate with high accuracy.

The present disclosure relates to a substrate transport unit that holds and transports a substrate, a table that is arranged below the substrate transport unit, and a specific substrate that is arranged above the table and carried by the substrate transport unit. Provided is a component mounting device including a light emitting portion that locally irradiates a region from below, and a support that one end supports the light emitting portion from below and the other end is detachably mounted on the table. do.

According to the present disclosure, the position of a hole (through hole) that serves as a reference for mounting a component on a board can be clearly recognized with high contrast, and a component for mounting the component on the board while ensuring model switchability. The loading process can be performed with high accuracy.

Top view of the component mounting device according to the first embodiment A perspective view of the main part showing the board transport part shown in FIG. 1 together with the mounting head. A perspective view of a table with support pins, reflective light emitting pins, and a light source. Cross-sectional view of the substrate where the lower surface of a specific area is illuminated by a light emitting pin Perspective view of reflective light emitting pin Cross-sectional view of the substrate where the lower surface of a specific area is illuminated by the reflective light emitting pin. Perspective view of light guide diffusion type light emitting pin Cross-sectional view of the substrate where the lower surface of a specific area is illuminated by the light guide diffusion type light emitting pin. Cross-sectional view of the substrate where the lower surface of a specific area is illuminated by the light guide diffusion type light emitting pin. Perspective view of self-luminous light emitting pin Cross-sectional view of a substrate in which the lower surface of a specific area is illuminated by a self-luminous light emitting pin. Cross-sectional view of a substrate in which the lower surface of a specific area is illuminated by a self-luminous light emitting pin. Cross-sectional view of a substrate in which the lower surface of a specific region is irradiated with a reflective light emitting pin in the component mounting device according to the second embodiment. Perspective view of the reflective light emitting pin shown in FIG. Top view of reflective light emitting pins and support pins placed on the table Perspective view of reflective light emitting pin Perspective view of the reflective light emitting pin according to the modified example Side view of the reflective light emitting pin and the reflective pin arranged on the table Perspective view of reflective pins Perspective view of the reflective pin according to the modified example Perspective view of reflective light emitting pin, reflective pin and reflective pin arranged on the table Plan view of reflective light emitting pins and reflective pins arranged on the table

Hereinafter, embodiments in which the component mounting device according to the present disclosure is specifically disclosed will be described in detail with reference to the drawings as appropriate. However, more detailed explanation than necessary may be omitted. For example, detailed explanations of already well-known matters and duplicate explanations for substantially the same configuration may be omitted. This is to avoid unnecessary redundancy of the following description and to facilitate the understanding of those skilled in the art. It should be noted that the accompanying drawings and the following description are provided for those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the claims.

(Embodiment 1)
First, the component mounting device according to the first embodiment will be described.

FIG. 1 is a plan view of the component mounting device 100 according to the first embodiment. The component mounting device 100 is a device for mounting components 15 (see FIG. 2) such as LEDs with reference to a board hole 13 provided so as to penetrate the board 11 in the thickness direction. The component 15 is not limited to the LED. The component mounting device 100 includes a base 17, a board transport section 19, a component supply section 21, a head moving mechanism 23, a transfer head 25, a mounting head 27, a component camera 29, a temporary placement stage 31, and a support pin 33 (see FIG. 2). ), Reflective light emitting pin 35 (see FIG. 2), which is a light emitting pin, and the like.

The substrate transport unit 19 has a pair of conveyors 39 extending in the left-right direction (in the X-axis direction) as seen from the operator 37. The pair of conveyors 39 are arranged so as to face each other in the front-rear direction (in the Y-axis direction) as seen from the operator 37. The substrate transport unit 19 carries in the substrate 11 supplied (conveyed) from the outside (see the arrow A shown in FIG. 1), and positions the substrate 11 at a predetermined position. The substrate transport unit 19 supports and transports a pair of parallel both end edges of the substrate 11 from below by a pair of conveyors 39. The distance between the pair of conveyors 39 can be freely changed by the width adjusting mechanism 41 (see FIG. 2) according to the dimensions in the width direction (Y-axis direction) of the board 11 to be carried.

The parts supply unit 21 is composed of a plurality of parts feeders 43. Each of the plurality of parts feeders 43 supplies the parts 15 to the parts supply port 45. In the first embodiment, the parts feeder 43 comprises, for example, a tape feeder. However, the parts feeder 43 is not limited to the tape feeder.

The head moving mechanism 23 includes a fixed beam 47 extending in the Y-axis direction on the base, a front moving beam 49 extending in the X-axis direction and one end being supported by the fixed beam 47, and a rear moving beam 51. I have. The transfer head 25 is attached to the front moving beam 49, and the mounting head 27 is attached to the rear moving beam 51.

The head moving mechanism 23 moves the transfer head 25 in the horizontal plane by moving the front moving beam 49 in the Y-axis direction with respect to the fixed beam 47 and moving the transfer head 25 along the front moving beam 49. Let me. Further, the head moving mechanism 23 moves the rear moving beam 51 with respect to the fixed beam 47 in the Y-axis direction and moves the mounting head 27 along the rear moving beam 51 to move the mounting head 27 in the horizontal plane. Move with.

The component camera 29 is provided in the area between the board transport section 19 and the component supply section 21 on the base. The component camera 29 has the image pickup optical axis directed upward, and the component 15 picked up from the temporary placement stage 31 by the mounting head 27 is imaged from below.

FIG. 2 is a perspective view of a main part showing the substrate transport portion 19 shown in FIG. 1 together with the mounting head 27. The substrate 11 in FIG. 2 is drawn by cutting out a part for convenience of explanation. The transfer head 25 and the mount head 27 each include a plurality of nozzles 53 extending downward. Each nozzle 53 attracts the component 15 at the lower end. In the first embodiment, as an example, the transfer head 25 and the mounting head 27 are provided with nozzles 53 (16 in total) arranged in an array of 8 × 2 (8 in the X-axis direction and 2 in the Y-axis direction), respectively. However, the number and arrangement of nozzles 53 are not limited in each of the transfer head 25 and the mounting head 27. The transfer head 25 picks up the component 15 supplied by the component feeder 43 to the component supply port 45 by the nozzle 53, and mounts the component 15 on the temporary placement stage 31. The mounting head 27 sucks and picks up the component 15 mounted on the temporary placement stage 31 by the nozzle 53, and mounts the component 15 at a predetermined position (that is, the component mounting position) on the board positioned by the board transport unit 19.

The mounting head 27 is provided with a recognition camera 55 (FIG. 1). The recognition camera 55 has the image pickup optical axis directed downward and moves integrally with the mounting head 27. When the recognition camera 55 picks up the component 15 temporarily placed on the temporary placement stage 31 by the mounting head 27, the recognition camera 55 takes an image of the component 15 from above before that. When the component 15 picked up by the mounting head 27 is mounted on the board 11, the recognition camera 55 takes an image of the board hole 13 provided at the component mounting position of the component 15 from above.

When the recognition camera 55 images the substrate hole 13 from above, the component mounting device 100 irradiates the substrate 11 with light from below the substrate 11 to illuminate the substrate 11 from the lower surface, and the recognition camera 55 clearly captures the substrate hole 13 ( It has at least one light emitting pin to enable recognition).

A table 59 that can be raised and lowered by an elevating cylinder 57 is provided below the substrate transport unit 19 that holds and conveys the substrate 11.

FIG. 3 is a perspective view of the table 59 in which the support pin 33, the reflective light emitting pin 35, and the light source 61 are arranged. The component mounting device 100 according to the first embodiment has a light emitting unit 63 and a support 65. The light emitting unit 63 is arranged on the upper part of a table 59 having a rectangular shape, for example, and locally irradiates a specific region 67 (see FIG. 4) of the substrate 11 carried in by the substrate transport unit 19 from below. In the support 65, one end 69 supports the light emitting portion 63 from below, and the other end 71 is detachably attached to the table 59. The table 59 may have a square shape.

The light emitting portion 63 and the support 65 are integrated into a vertically long pin shape. Here, the light emitting unit 63 integrated into a vertically long pin shape and the support 65 form a light emitting pin. In the first embodiment, the light emitting unit 63 and the support 65 are reflective light emitting pins 35 which are light emitting pins.

In the component mounting device 100, one or more support pins 33 that support the lower surface of the substrate 11 are arranged on the upper part of the table 59. The support pin 33 has a base end portion 73 (see FIG. 3) detachably attached to the table 59. The support pin 33 has a base end portion 73 mounted on the table 59 and stands upright, and supports the substrate 11 by receiving it from the lower surface side.

In the component mounting device 100 according to the first embodiment, a plurality of holes 75 are provided in the table 59. The other end 71 of the support 65 of the reflective light emitting pin 35 or the base end 73 of the support pin 33 is detachably attached to the table 59 by being inserted into any of these holes 75.

The component mounting device 100 further includes a light source 61 that irradiates light toward the light emitting unit 63. As the light source 61, for example, an LED or the like can be used. The light source 61 is not limited to the LED. The light source 61 is configured by, for example, arranging a plurality of LEDs linearly along one side of a pair of parallel sides (for example, long sides) of a table 59 (see FIG. 3). These LEDs are covered by a diffuser.

FIG. 4 is a cross-sectional view of the substrate 11 in which the lower surface of the specific region 67 is irradiated with the light emitting pin. In the reflective light emitting pin 35, the light emitting unit 63 includes a light guide body 77 (see FIG. 5) that guides the light from the light source 61 (see FIG. 3) upward. In this case, the light guide body 77 is formed in an inverted conical shape by, for example, a resin material. The light guide body 77 incidents light from the light source 61 from a conical surface and emits light upward from a flat portion at the upper end. The flat surface portion has, for example, a rough surface portion on the surface, so that the light propagating through the light guide body 77 is diffused and emitted.

The light guide 77 causes the light from the light source 61 to enter the conical surface and emits light upward from the flat surface portion, thereby locally guiding the light from the light source 61 to the lower surface of the specific region 67 of the substrate 11. can do.

The specific region 67 of the substrate 11 includes a substrate hole 13 penetrating in the thickness direction of the substrate 11. The flat surface portion of the light emitting portion 63 is arranged so as to face the substrate hole 13. The inside of the substrate hole 13 is brightly illuminated by irradiating the light emitting portion 63 with the lower surface of the specific region 67. On the other hand, the substrate 11 becomes dark because the upper surface is shaded by the light, and the recognition camera 55 arranged above the substrate 11 has a higher peripheral edge of the substrate hole 13 than when the upper surface of the substrate 11 is simply illuminated. It can be recognized by contrast.

FIG. 5 is a perspective view of the reflective light emitting pin 35. In the first embodiment, the light emitting pin is a reflected light type reflective light emitting pin 35 in which the light emitting unit 63 reflects the light from the light source 61 and illuminates the lower surface of the specific region 67 of the substrate 11. The reflection type light emitting pin 35 is provided with a light receiving unit 79 in the light emitting unit 63. The light receiving portion 79 is made of, for example, an inverted conical transparent resin material or the like. A light source 61 is installed on the table 59 arranged above the base 17 and the like. Since the conical surface of the light receiving unit 79 faces downward, for example, the light receiving unit 79 can efficiently receive light from the light source 61 on the diagonally lower side installed on the table 59.

In the light receiving portion 79, the apex portion facing downward is supported by the support 65. The support 65 has a cylindrical portion 81. The cylindrical portion 81 is made of, for example, a rigid metal material, and supports the light receiving portion 79 coaxially. The support 65 has a base column portion 83 having a diameter larger than that of the column portion 81 at the other end portion 71 of the column portion 81. The base pillar portion 83 is made of, for example, a metal material, and its lower surface can be freely mounted on the table 59.

FIG. 6 is a cross-sectional view of the substrate 11 in which the lower surface of the specific region 67 is illuminated by the reflective light emitting pin 35. In the reflective light emitting pin 35, the fitting shaft 85 is vertically installed on the lower surface of the base pillar portion 83. The table 59 is provided with a plurality of holes 75 for erecting support pins 33 for supporting the substrate 11 at regular intervals in the surface direction (XY directions). The reflective light emitting pin 35 is mounted at a predetermined position on the table 59 according to the specific region 67 of the substrate 11 by fitting the fitting shaft 85 of the base pillar portion 83 into the hole 75.

FIG. 7 is a perspective view of the light guide diffusion type light emitting pin 87. In the first embodiment, the light emitting pin may be a light guide diffusion type light emitting pin as shown in FIG. 7. The light guide diffusion type light emitting pin constitutes the light guide diffusion type light emitting pin 87. The light guide diffusion type light emitting pin 87 guides and diffuses the light from the light source 61 to illuminate the lower surface of the specific region 67 of the substrate 11.

The light guide diffusion type light emitting pin 87 has a light distribution unit 89 in which the light emitting unit 63 is composed of a light guide body 77 (see FIG. 8B). The light distribution unit 89 is made of, for example, a flat cylindrical transparent resin material or the like. The light distribution unit 89 may be provided with a diffusion plate 91 on the flat surface portion at the upper end. The light distribution unit 89 may have an inverted conical shape, for example (see FIG. 8A). Further, the light distribution unit 89 may include an optical element such as a concave lens (broken line portion in FIG. 7) in order to enhance the effect of diffusing the light from the light source.

As the diffuser plate 91, for example, a lens diffuser plate (LSD: Light Shipping Diffusers) can be used. The LSD can be formed, for example, in the form of a sheet or a film. The LSD is provided with a minute and random lens array, and has a diffusion function capable of distributing light only in a required range (light distribution angle). The diffuser plate 91 can be used in combination with any of the reflected light type light emitting unit 63, the light guide diffusion type light emitting unit 63, and the self-luminous type light emitting unit 63.

For the light distribution of the light emitting unit 63, an optical element such as a general concave lens or a convex lens may be used in addition to the diffuser plate 91 such as LSD, and further, these optical elements and LSD may be used in combination to emit light. Diffusion shaping may be used.

The lower surface of the light distribution unit 89 is supported by the support 65. The support 65 has a columnar light guide portion 93. The light guide unit 93 is made of, for example, a transparent resin material, and supports the light distribution unit 89 coaxially. The support 65 has a base pillar portion 83 having a diameter larger than that of the light guide portion 93 at the other end portion 71 of the light guide portion 93. The lower surface of the base pillar portion 83 can be freely mounted on the table 59. The light guide diffusion type light emitting pin 87 is an inverted conical light collecting pin made of a transparent resin material or the like, for example, having the fitting shaft 85 extended to the lower end of the fitting shaft 85 made of a transparent resin material or the like. It has a part 95.

8A and 8B are cross-sectional views of a substrate 11 in which the lower surface of a specific region 67 is illuminated by a light guide diffusion type light emitting pin 87. The light distribution unit 89 of FIG. 8A has an inverted conical shape, and the light distribution unit 89 of FIG. 8B has a cylindrical shape. As described above, the outer shape of the light distribution portion 89 may be an inverted conical shape that spreads in the light emitting direction, or may be a cylindrical shape. The light guide diffusion type light emitting pin 87 is mounted at a predetermined position on the table 59 according to the specific region 67 of the substrate 11 by fitting the fitting shaft 85 of the base pillar portion 83 into the hole 75 of the table 59. To.

The light collecting unit 95 projects below the lower surface of the table 59. A base 17 and the like are arranged below the table 59. A light source 61 is installed on the base 17. That is, in the case of the light guide diffusion type light emitting pin 87, the light source 61 is provided on the base 17 or the like below the table 59. The light guide diffusion type light emitting pin 87 receives the light from the light source 61 by the light condensing unit 95 protruding from the lower surface of the table 59, and propagates the captured light to the light distribution unit 89 by the light guide unit 93. .. The light guided from the light guide unit 93 to the light distribution unit 89 is emitted upward from the flat surface portion of the light distribution unit 89. The light guide diffusion type light emitting pin 87 is provided with a diffusion plate 91 such as the LSD described above on a flat surface portion of the light distribution portion 89.

FIG. 9 is a perspective view of the self-luminous light emitting pin 97. In the first embodiment, the light emitting pin may be a self-luminous type light emitting pin as shown in FIG. The self-luminous light emitting pin is referred to as a self-luminous light emitting pin 97. In the self-luminous light emitting pin 97, the light emitting unit 63 has a self-luminous light source 99. The self-luminous light emitting pin 97 diffuses the light from the self-luminous light source 99 and illuminates the lower surface of the specific region 67 of the substrate 11.

The light emitting unit 63 is made of, for example, a flat cylindrical transparent resin material containing a self-luminous source 99. The light emitting unit 63 may be provided with a diffusion plate 91 such as an LSD on the flat surface portion at the upper end. The light emitting unit 63 may have an inverted conical shape (see FIG. 10).

The lower surface of the light emitting portion 63 is supported by the support 65. The support 65 has a cylindrical portion 81. The cylindrical portion 81 is made of, for example, a metal material, and supports the light emitting portion 63 coaxially. The support 65 has a base column portion 83 having a diameter larger than that of the column portion 81 at the other end portion 71 of the column portion 81. The base pillar portion 83 is made of, for example, a metal material, and its lower surface can be freely mounted on the table 59.

In the self-luminous light emitting pin 97, the fitting shaft 85 is vertically installed on the lower surface of the base pillar portion 83. The self-luminous light emitting pin 97 is arranged at a predetermined position of the table 59 corresponding to the specific area 67 of the substrate 11 by fitting the fitting shaft 85 of the base pillar portion 83 into the hole 75 of the table 59. ..

10A and 10B are cross-sectional views of a substrate 11 in which the lower surface of a specific region 67 is illuminated by a self-luminous light emitting pin 97. The light distribution unit of FIG. 10A has an inverted conical shape similar to that of the light distribution unit 89 of FIG. 8A, and the light distribution unit of FIG. 10B has a cylindrical shape similar to that of the light distribution unit 89 of FIG. 8B. As described above, the outer shape of the light distribution portion may be an inverted conical shape that spreads in the light emitting direction, or may be a cylindrical shape. When the self-luminous light emitting pin 97 is supplied with power to the terminal portion 101 and the self-luminous light source 99 is driven, the self-luminous light emitting pin 97 emits light upward from the flat portion at the upper end. The self-luminous light emitting pin 97 is provided with a diffusion plate 91 such as the LSD described above on a flat surface portion of the light emitting portion 63. As a result, the self-luminous light emitting pin 97 can locally irradiate the specific region 67 of the substrate 11 with the light emitted by the self-luminous light source 99 from below.

The self-luminous light emitting pin 97 is provided with terminal portions 101 of a positive electrode and a negative electrode exposed on the lower surface of the table 59 at the lower end of the fitting shaft 85. The terminal portion 101 is electrically connected to the self-luminous source 99 via an insulating wiring or the like inserted inside the cylindrical portion 81. In the self-luminous light emitting pin 97, the self-luminous light source 99 is emitted by supplying power for lighting from the apparatus to the terminal portion 101 exposed on the lower surface of the table 59. More specifically, in the self-luminous light emitting pin 97, for example, a positive electrode power supply (+) is connected to the outer periphery of the fitting shaft 85 via a hole 75 of the table 59, and a terminal 103 is connected to the lower end surface of the fitting shaft 85. The negative electrode power supply (-) is connected via the negative electrode power supply (-).

Next, the operation of the component mounting device 100 according to the first embodiment will be described.

When the component 15 is mounted on the substrate 11 positioned by the substrate transport unit 19 by the component mounting device 100, first, the transfer head 25 is operated, and each component feeder 43 constituting the component supply unit 21 operates. The component 15 supplied to the component supply port 45 is picked up. Here, it is assumed that the transfer head 25 has, for example, 16 nozzles 53, and each nozzle 53 sucks and picks up 16 parts 15.

After the transfer head 25 picks up the 16 parts 15 by the 16 nozzles 53, the transfer head 25 moves above the temporary placement stage 31 and places the picked up 16 parts 15 on the temporary placement stage 31.

The component mounting device 100 is provided on the mounting head 27 by moving the mounting head 27 above the temporary mounting stage 31 after the component 15 is mounted on the component mounting portion of the temporary mounting stage 31 by the transfer head 25. The recognition camera 55 images (recognizes) each component 15 from above.

When the recognition camera 55 finishes recognizing the parts 15 on the temporary placement stage, the mounting head 27 uses the plurality of (16) nozzles 53 to attach the plurality of (16) parts 15 mounted on the temporary placement stage 31. Adsorb and pick up.

The mounting head 27 picks up a plurality of parts 15 by the plurality of nozzles 53, and then moves to the upper part of the parts camera 29, so that each of the 16 picked up parts 15 is imaged by the parts camera 29. After each component 15 is imaged by the component camera 29 and each component 15 is recognized, the mounting head 27 moves above the substrate transport unit 19. Then, the light source 61 provided on the table 59 below the substrate 11 is turned on, and the light from the light source 61 is irradiated from below to the specific region 67 of the substrate 11 by the reflective light emitting pin 35. As a result, the contour shape of each substrate hole 13 provided in the substrate 11 is brightly illuminated. On the other hand, the upper surface of the substrate 11 becomes dark because it is shaded by the light. As a result, the recognition camera 55 can recognize the peripheral edge of each substrate hole 13 with high contrast.

Next, the operation of the component mounting device 100 according to the first embodiment will be described.

The component mounting device 100 according to the first embodiment has a substrate transport unit 19 that holds and transports the substrate 11, a table 59 that is arranged below the substrate transport unit 19, and a board transport unit that is arranged above the table 59. A light emitting unit 63 that locally irradiates a specific region 67 of the substrate 11 carried in by the unit 19 from below, and one end portion 69 that supports the light emitting unit 63 from below and the other end portion 71 that is detachably attached to the table 59. A support 65 to be mounted is provided.

In the component mounting device 100 according to the first embodiment, the light emitting unit 63 is arranged on the table 59 arranged below the substrate transport unit 19. The light emitting unit 63 can reflect light from a mirror or the like. The light emitting unit 63 may be one that transmits light or one that diffuses while transmitting light. Further, the light emitting unit 63 can emit light by itself. Here, the reflection includes a normal reflection by a mirror (specular reflection) and a diffuse reflection by a diffuser plate (diffuse reflection).

The light emitting portion 63 is supported from below by one end portion 69 of the support 65. In the support 65, the other end 71 opposite to the one end 69 is detachably attached to the table 59. That is, the light emitting unit 63 is detachably attached to the upper part of the table 59 via the other end 71 of the support 65. The light emitting unit 63 locally irradiates a specific region 67 of the substrate 11 carried in by the substrate transport unit 19 from below. As a result, the component mounting device 100 can clearly recognize the specific area 67 of the board 11 with high contrast, and the component mounting work of mounting the component 15 on the board 11 with reference to the specific area 67 can be performed with high accuracy. Can be done.

The light emitting unit 63 changes the light source size each time, even if the substrate size changes, in each of the case of reflecting the light from the light source 61, guiding and diffusing the light from the light source 61, and the case of having the self-luminous source 99. No need to change. That is, the light emitting unit 63 does not deteriorate the model switchability in any case.

In the support 65, one end 69 supports the light emitting portion 63 from below, and the other end 71 opposite to the one end 69 is mounted on the table 59. That is, the light emitting unit 63 is arranged at the upper end portion of the vertically elongated support 65. The light emitting unit 63 has a sufficiently small area as compared with the area of the substrate 11, and can be arranged upright from the table 59. The light emitting unit 63 can be arranged at each position of the table 59 according to the specific region 67 on the substrate 11. Therefore, the light emitting unit 63 can be arranged on the table 59 with the minimum required mounting area, for example, when transporting a small substrate.

Further, in the component mounting device 100, the light emitting unit 63 includes a light guide body 77 that guides the light from the light source 61 upward.

In the component mounting device 100, the light emitting unit 63 includes the light guide body 77. The light guide body 77 is formed in an inverted conical shape, for example, and guides the light from the light source 61 upward by reflection or diffusion. Of course, the light guide 77 may be a rod-shaped or linear medium (widge path) made of a transparent substance having a substantially uniform cross section and confining and propagating light. In this case, the light guide 77 may be an optical fiber having a core clad structure. Further, the light guide body 77 may have a diffuser plate 91 for diffusing light in addition to the waveguide. That is, the diffuser plate 91 can be provided at the light emitting end of the waveguide.

As the diffuser plate 91, for example, a lens diffuser plate can be preferably used. As a result, the diffuser plate 91 diffuses and shapes the light, eliminates uneven illumination, and enables efficient illumination. As a result, the light emitting unit 63 can efficiently guide the light from the light source 61 upward in an arbitrary direction by the light guide body 77.

For the light distribution of the light emitting unit 63, an optical element such as a general concave lens or a convex lens may be used in addition to the diffuser plate 91 such as LSD, and further, these optical elements and LSD may be used in combination to emit light. Diffusion shaping may be used.

Further, in the component mounting device 100, the light guide body 77 guides the light from the light source 61 to the lower surface of the specific region 67 of the substrate 11.

In this component mounting device 100, the light guide body 77 guides the light from the light source 61 upward by reflection or diffusion, and efficiently irradiates the lower surface of the specific region 67 of the substrate 11 arranged above. .. As a result, the light emitting unit 63 can irradiate the specific region 67 of the substrate 11 locally and efficiently from below, as compared with irradiating the entire lower surface of the substrate 11.

Further, in the component mounting device 100, the specific region 67 includes the substrate hole 13 penetrating in the thickness direction of the substrate 11, and the light emitting portion 63 is arranged so as to face the substrate hole 13.

In this component mounting device 100, the target to be irradiated with light by the light emitting unit 63 is the substrate hole 13 penetrating in the thickness direction of the substrate 11. By arranging the light emitting unit 63 so as to face the substrate hole 13, it is possible to locally and efficiently irradiate the substrate hole 13 with light. By locally irradiating the light from the light emitting unit 63, the inside of the substrate hole 13 is brightly illuminated. On the other hand, the substrate 11 becomes dark because it is shaded by the light that has passed through the substrate hole 13 on the surface opposite to the light emitting portion 63. As a result, the substrate 11 can recognize the peripheral edge of the substrate hole 13 with high contrast.

Further, in the component mounting device 100, the substrate transport unit 19 supports and transports a pair of parallel both end edges of the substrate 11 from below by a pair of conveyors 39.

In this component mounting device 100, a pair of conveyors 39 support and convey a pair of parallel both end edges of the substrate 11 from below. In the substrate 11, for example, the distance between a pair of parallel edge edges is set in the width direction. In the pair of conveyors 39, the interval in the width direction of the substrate 11 can be freely changed by the width adjusting mechanism 41 according to the dimension in the width direction (Y-axis direction) of the substrate 11 to be carried in. Therefore, even if the size of the substrate 11 changes, the substrate transport unit 19 automatically supports and transports the substrate 11 of the new size by changing the distance between the pair of conveyors 39 by the width adjusting mechanism 41. can do.

Further, in the component mounting device 100, the light emitting unit 63 and the support 65 have a pin shape along the direction perpendicular to the surface direction of the substrate 11 and are integrated.

In this component mounting device 100, the light emitting unit 63 and the support 65 are integrated into a vertically long pin shape. Here, the light emitting unit 63 integrated into a vertically long pin shape and the support 65 form a light emitting pin. The light emitting pin stands up with the support 65 mounted on the table 59. A light emitting unit 63 is arranged at the upper end of the standing light emitting pin. That is, the light emitting pin stands up with the support 65 mounted on the table 59, and the light emitting portion 63 at the upper end locally irradiates the specific region 67 of the substrate 11 from the lower surface.

The position and quantity of the light emitting pins can be freely changed according to the position and number of the substrate holes 13. As a result, the component mounting device 100 is provided with a light emitting pin, so that the model switchability is greatly improved. That is, the light emitting pin can be freely arranged according to the substrate hole 13 of the switched substrate 11. If the number of board holes 13 is small, the minimum number of light emitting pins required can be installed. Further, the light emitting pin can be automatically arranged at a predetermined position on the table by the mounting head 27 or the like as a basic functional unit provided in the component mounting device 100. As a result, the component mounting device 100 can reduce the burden of the worker 37 for changing the lighting position, which occurs when the model is switched. It can also contribute to the automation of equipment.

Further, since the light emitting pin is arranged only in the specific region 67 of the substrate 11, it is possible to suppress heat buildup due to the large light source when a large light source capable of irradiating the entire surface of the substrate 11 is installed.

Further, the component mounting device 100 further includes a light source 61 that irradiates (an example of supply) light toward the light emitting unit 63.

In this component mounting device 100, the light emitting unit 63 locally irradiates a specific region 67 of the substrate 11 in response to light from a separately provided light source 61. Therefore, the light emitting pin irradiates the specific region 67 of the substrate 11 by reflecting or guiding the light from the light source 61. The light from these reflections and light guides is further diffused and shaped by a diffuser plate 91 or the like and irradiated.

Further, in the component mounting device 100, the light emitting unit 63 is a reflected light type light emitting pin that reflects the light from the light source 61 and illuminates the lower surface of the specific region 67 of the substrate 11.

In this component mounting device 100, the light emitting pin may be a reflective light emitting pin 35. The reflection type light emitting pin 35 is provided with a light receiving unit 79 in the light emitting unit 63. The light receiving portion 79 is made of an inverted conical transparent resin material or the like. Since the conical surface of the light receiving unit 79 faces downward, for example, the light receiving unit 79 can efficiently receive light from the light source 61 installed on the table 59.

When the light from the light source 61 is incident on the conical surface of the light receiving portion 79, the reflective light emitting pin 35 emits the light from the flat portion at the upper end. The reflective light emitting pin 35 is provided with a diffusing portion by a diffusing plate 91 or the like on the flat surface portion of the light receiving portion 79. As a result, the reflective light emitting pin 35 can locally irradiate the specific region 67 of the substrate 11 with the light received by the light receiving unit 79 from below.

Further, in the component mounting device 100, the light emitting unit 63 is a light guide diffusion type light emitting pin that guides and diffuses the light from the light source 61 to irradiate the lower surface of the specific region 67 of the substrate 11.

In this component mounting device 100, the light emitting pin may be a light guide diffusion type light emitting pin 87. The light guide diffusion type light emitting pin 87 is provided with a light distribution unit 89 in the light emitting unit 63. The light distribution unit 89 is provided with a diffusion plate 91 such as an LSD on the flat surface portion at the upper end.

In the light guide diffusion type light emitting pin 87, a fitting shaft 85 extending from the light guide portion 93 is vertically installed on the lower surface of the base pillar portion 83. The light guide diffusion type light emitting pin 87 is arranged at a predetermined position of the table 59 corresponding to the specific region 67 of the substrate 11 by fitting the fitting shaft 85 of the base pillar portion 83 into the hole 75 of the table 59. To.

In the light guide diffusion type light emitting pin 87, the light collecting portion 95 projects below the lower surface of the table 59. A base 17 and the like are arranged below the table 59. A light source 61 is installed on the base 17. The light guide diffusion type light emitting pin 87 receives the light from the light source 61 by the light condensing unit 95 protruding from the lower surface of the table 59, and propagates the captured light to the light distribution unit 89 by the light guide unit 93. .. The light guide diffusion type light emitting pin 87 is provided with a diffusion plate 91 such as the LSD described above on a flat surface portion of the light distribution portion 89. As a result, the light guide diffusion type light emitting pin 87 can locally irradiate the specific region 67 of the substrate 11 with the light emitted from the light distribution unit 89 from below.

Further, the light source 61 can be installed at the lower part of the table 59 on which the light emitting pin is mounted. When the light source 61 is installed on the table 59, the component mounting device 100 causes a connector attachment / detachment process between the table 59 and the light source 61 when the table is attached / detached. On the other hand, if the light source 61 is installed on the base 17 or the like below the table 59, the connector attachment / detachment process at the time of attaching / detaching the table becomes unnecessary. As a result, the component mounting device 100 is further improved in model switchability.

Further, in the component mounting device 100, the light emitting unit 63 is a self-luminous type light emitting pin having a self-luminous source 99 and diffusing the light from the self-luminous source 99 to illuminate the lower surface of a specific region 67 of the substrate 11. ..

In this component mounting device 100, the light emitting pin may be a self-luminous light emitting pin 97. In the self-luminous light emitting pin 97, a self-luminous light source 99 such as an LED is provided in the light emitting unit 63. The light emitting unit 63 is made of a transparent resin material or the like containing a self-luminous source 99. The light emitting unit 63 may be provided with a diffusion plate 91 such as an LSD on the flat surface portion at the upper end.

The self-luminous light emitting pin 97 is provided with terminal portions 101 of a positive electrode and a negative electrode exposed on the lower surface of the table 59 at the lower end of the fitting shaft 85. The terminal portion 101 is electrically connected to the self-luminous source 99 via an insulating wiring or the like. In the self-luminous light emitting pin 97, the self-luminous light source 99 is emitted by supplying power for lighting from the apparatus to the terminal portion 101 exposed on the lower surface of the table 59.

Further, in the component mounting device 100, one or more support pins 33 that support the lower surface of the substrate 11 are arranged on the upper part of the table 59, and the light emitting unit 63 has a self-luminous source 99, and the light from the self-luminous source 99 is provided. It is a self-luminous type light emitting pin that diffuses and illuminates the lower surface of a specific region 67 of the substrate 11.

In this component mounting device 100, the reflection type light emitting pin 35, the light guide diffusion type light emitting pin 87, and the self-luminous light emitting pin 97 are vertically elongated and become a compact light emitting pin standing on the table 59. As a result, the range in which the support pin 33 can be installed can be significantly expanded as compared with the case where a surface-shaped lighting unit that illuminates the entire substrate is installed.

Further, in the component mounting device 100, a plurality of holes 75 are provided in the table 59, and the other end 71 of the support 65 or the base end 73 of the support pin 33 is inserted into any of the holes 75.

In the component mounting device 100, the other end 71 of the support 65 and the base end 73 of the support pin 33 are inserted into the table 59 into any of the plurality of holes 75 provided in the table 59. More specifically, the base pillar portion 83 is provided at the other end 71 of the support 65, and the fitting shaft 85 hangs down from the base pillar portion 83. The support 65 is mounted on the table 59 by inserting the fitting shaft 85 into the hole 75. The support pin 33 also has a fitting shaft 85 at the lower end, and the fitting shaft 85 is inserted into the hole 75 and mounted on the table 59. The light emitting pin and the support pin 33 having the support 65 are attracted by the nozzle 53 provided on the mounting head 27, and can be automatically arranged in the hole 75 of the table 59 corresponding to the specific region 67 of the substrate 11. As a result, the component mounting device 100 can reduce the burden of the worker 37 for changing the lighting position, which occurs when the model is switched. It can also contribute to the automation of equipment.

(Embodiment 2)
Next, the component mounting device according to the second embodiment will be described.

FIG. 11 is a cross-sectional view of the substrate 11 in which the lower surface of the specific region 67 is irradiated by the reflective light emitting pin 105 in the component mounting device 200 according to the second embodiment. In the second embodiment, the same reference numerals are given to the members / parts equivalent to the members / parts described with reference to FIGS. 1 to 10 in the first embodiment, and the overlapping description is simplified or omitted. And explain the different contents.

In the component mounting device 200 according to the second embodiment, the light source 61 is arranged on each of the pair of conveyors 39 constituting the substrate transport unit 19. That is, they are arranged along each pair of parallel sides of the table 107 (for example, the long side when the table 107 has a rectangular shape) (see FIGS. 13 and 20).

The light source 61 is configured by, for example, arranging a plurality of LEDs linearly along the above-mentioned side of the table 107. These LEDs are covered by a diffuser 91. The light source 61 optimally corrects the amount of light and the distribution of light by passing light from a plurality of LEDs arranged in a straight line through the diffuser plate 91. As a result, the light sources 61 arranged on the facing surfaces of the pair of conveyors 39 are directed to the facing surfaces in the direction in which the emitted light is parallel to the table 107.

In the component mounting device 200, the table 107 is formed of, for example, a magnetic material. A reflective light emitting pin 105, which is a light emitting pin, is mounted on the table 107. In the reflective light emitting pin 105, the other end 71 of the support 65 is fixed to an arbitrary position on the table 107 by a magnet 109. Similarly, the base end portion 73 of the support pin 111 is fixed to an arbitrary position on the table 107 by a magnet 109. The component mounting device 200 may not use a magnetic material for the table 107, but may fit the fitting shaft 85 into the hole 75 and mount the light emitting pin or the like as in the first embodiment.

FIG. 12 is a perspective view of the reflective light emitting pin 105 shown in FIG. In the reflective light emitting pin 105, the reflective portion 113 is formed in a columnar shape, for example, and the lower surface thereof is supported by the support 65. The reflecting unit 113 includes, for example, a rectangular mirror 115 that reflects light in the horizontal direction upward at an angle inclined by 45 ° from the z-axis direction toward the x-axis direction or the y-axis direction. The mirror 115 can be mounted with angle correction so as to have the highest reflection efficiency. Since the mirror 115 is tilted at an angle of approximately 45 °, the reflecting portion 113 efficiently receives light from the side by the light source 61 provided on the conveyor 39, and locally covers a specific region 67 of the substrate 11 from below. Can be irradiated to.

The support 65 has a cylindrical portion 81 having a diameter smaller than that of the reflective portion 113. The cylindrical portion 81 is made of a metal material or the like, and supports the reflective portion 113 coaxially. The support 65 has a base column portion 83 having a diameter larger than that of the column portion 81 at the other end portion 71 of the column portion 81. The base pillar portion 83 is made of, for example, a metal material, and rotatably supports the cylinder portion 81. As a result, the reflecting unit 113 is adapted to direct the light capturing direction of the mirror 115 to an arbitrary direction of 360 °. By accommodating the magnet 109 inside the base pillar portion 83, the lower surface thereof can be freely mounted on the table 59. It is desirable that the base pillar portion 83 be provided with an attractive force releasing mechanism capable of releasing the attractive force of the magnet 109 when the arrangement is changed.

FIG. 13 is a plan view of the reflective light emitting pin 105 and the support pin 111 arranged on the table 107. In the component mounting device 200, the reflective light emitting pin 105 is mounted on the upper surface of the table 107 located below the substrate 11 so that the reflecting portion 113 is arranged directly under the substrate hole 13. The reflective light emitting pin 105 having the reflecting portion 113 reflects the light emitted in the horizontal direction upward. The reflective light emitting pin 105 can be attached to and detached from any place on the table 107 by fixing the base pillar portion 83 by the magnet 109.

In the component mounting device 200, the reflective light emitting pin 105 is attracted and held by the nozzle 53 of the mounting head 27, and is arranged at a predetermined coordinate of the table 107. At that time, the angle is corrected so that the light emitted from the nearest light source 61 is perpendicular to the mirror 115, and the light is placed. If there is an obstacle such as a support pin 111 between the reflective light emitting pin 105 and the nearest light source 61, the light receiving direction of the reflecting unit 113 is adjusted so as to select another light source 61.

FIG. 14 is a perspective view of the reflective light emitting pin 117. In the component mounting device 200, the light emitting pin may be a reflective light emitting pin 117 having a light emitting unit 63 similar to the reflective light emitting pin 35 shown in the first embodiment. As an example of the reflector, the reflective light emitting pin 117 has a light receiving portion 79 made of an inverted conical transparent resin material or the like. Since the conical surface of the light receiving unit 79 faces downward, for example, the light receiving unit 79 can efficiently receive light from the lateral light source 61 installed on the conveyor 39.

FIG. 15 is a perspective view of the reflective light emitting pin 119 according to the modified example. In the component mounting device 200, the light emitting pin may be a reflective light emitting pin 119 having a conical mirror 121. The conical surface of the conical mirror 121 is a mirror surface. Further, in the reflective light emitting pin 119, a circular diffuser plate 91 is coaxially fixed to the top of the conical mirror 121. Since the light receiving portion 79 of the reflective light emitting pin 119 has a conical mirror 121, for example, the light emitting pin 119 receives light from a lateral light source 61 installed on the conveyor 39 and reflects it upward. At this time, the reflected light passes through the diffuser plate 91, so that the amount of light and the distribution of light are optimally corrected.

FIG. 16 is a side view of the reflective light emitting pin 117 and the reflective pin 123 arranged on the table 107. The component mounting device 200 may include a reflective pin 123 located at the top of the table 107. The reflection pin 123 has a reflector 125 that reflects light from a light source 61 to a light emitting portion 63 such as a reflective light emitting pin 117, and one end 69 supports the reflector 125 from below and the other end 71 is on a table 107. It is configured to have a support 65 that is detachably mounted.

FIG. 17 is a perspective view of the reflection pin 123. The reflective pin 123 can form the reflector 125 with a polyhedron having a plurality of surfaces as mirrors 115. The polyhedron can be a polyhedron mirror 127 having a plurality of square mirrors having adjacent generatrix on the outer peripheral surface of the cylinder and having adjacent generatrix on two sides.

FIG. 18 is a perspective view of the reflection pin 129 according to the modified example. The reflection pin 129 may include a reflector 125 having a cylindrical reflection surface 131 having a mirror 115 on the outer peripheral surface of the cylinder.

FIG. 19 is a perspective view of the reflective light emitting pin 119, the reflective pin 123, and the reflective pin 129 arranged on the table 107. In the component mounting device 200, for example, a reflective light emitting pin 117 having an inverted conical light receiving portion 79, a reflective pin 123, a reflective pin 129, and the like can be used in combination. The combination of the light emitting pin and the reflective pin shown in FIG. 19 is an example, and any combination of the reflective light emitting pin 105, the reflective light emitting pin 117, the reflective light emitting pin 119, the reflective pin 123, and the reflective pin 129 can be used. May be used.

FIG. 20 is a plan view of the reflective light emitting pin 117 and the reflective pin 123 arranged on the table 107. In the component mounting device 200, by mounting the reflective light emitting pin 117 on the table 107, the light from the light source 61 is locally irradiated to the lower surface of the specific region 67 of the substrate 11 by the light emitting unit 63 of the reflective light emitting pin 117. Will be done. In addition to this, the amount of light incident on the reflective light emitting pin 117 can be increased by arranging the reflective pin 123 at an optimum position in consideration of the positions of the reflective light emitting pin 117 and the light source 61. As a result, the reflective light emitting pin 117 can irradiate the specific region 67 with a stronger light intensity.

Further, when the reflection type light emitting pin 117 is installed, the component mounting device 200 can be mounted without correcting the rotation angle around the Z axis of the light emitting unit 63. That is, since the light emitting unit 63 has an inverted conical shape, the light from the light source 61 can be received from the direction of 360 °. Since the reflective light emitting pin 117 and the reflective pin 123 can be automatically arranged by the equipment, the burden on the operator 37 is reduced.

Next, the operation of the component mounting device 200 according to the second embodiment will be described.

In the component mounting device 200, the light source 61 is arranged in a substrate transfer unit 19 provided with a pair of conveyors 39.

In the component mounting device 200, the light source 61 is arranged on the facing surface of the substrate transport section 19 provided with the pair of conveyors 39. In the reflection type light emitting pin 35, light is incident on the light receiving portion 79 from the side from the light source 61 provided in the substrate transport portion 19. In this component mounting device 200, since the light source 61 is not installed on the table 107, the width of the board 11 is changed (in other words, when the model is switched to a board having a different width (size)). There is no need to increase or decrease the light source 61. Further, when the model is switched, the light source 61 moves with the width adjustment operation of the conveyor 39, so that the light source 61 does not need to be attached or detached, and the model switchability is improved. Further, since the light source 61 does not exist on the table 107, the range in which the support pin 111 and the light emitting pin can be installed is not limited. That is, the light source 61 does not interfere with the installation of the support pin 111 and the light emitting pin.

Further, the component mounting device 200 is arranged on the upper part of the table 107, and has a reflector 125 that reflects the light from the light source 61 to the light emitting portion 63, and one end portion 69 that supports the reflector 125 from below and the other end portion 71. Further comprises a support 65 that is detachably mounted on the table 107 and a reflective pin 123 configured with the support 65.

In this component mounting device 200, a reflection pin 123 dedicated to reflection is provided on the upper part of the table 107 so as to be displaceable. The reflection pin 123 has a reflector 125 that reflects the light from the light source 61 to the light emitting portion 63 of the reflection type light emitting pin 35. The reflector 125 is supported from below by one end 69 of the support 65. The other end 71 of the support 65 is detachably attached to the table 107. The reflection pin 123 can be arranged on the upper part of the table 107 in the same manner as the light emitting pin.

The reflection pin 123 is arranged so that the light receiving portion 79 having a conical shape of the reflection type light emitting pin 35 is evenly irradiated with light. Thereby, the reflection pin 123 can correct the light amount and the light distribution of the reflection type light emitting pin 35. The reflection pin 123 is automatically arranged at an optimum position in consideration of the reflection type light emitting pin 35 and the position of the light source.

Further, in the component mounting device 200, the table 107 is formed of a magnetic material, and the other end 71 of the support 65 or the base end 73 of the support pin 111 is fixed to an arbitrary position of the table 107 by a magnet 109.

In this component mounting device 200, the other end 71 of the support 65 and the base end 73 of the support pin 111 are mounted on the table 107 by a magnet 109. When a plurality of holes 75 are formed vertically and horizontally in the table 107, the fixed positions of the light emitting pin and the support pin 111 having the other end 71 are restricted to the arrangement position of the holes 75. On the other hand, in the light emitting pin and the support pin 111 having the magnet 109 on the support 65 and the base end portion 73, any optimum position where support is required on the substrate 11 without being restricted by the arrangement position of the holes 75. Can be placed in.

The light emitting pin having the magnet 109 on the support 65 and the support pin 111 having the magnet 109 on the base end portion 73 are attracted by the nozzle 53 provided on the mounting head 27, and the table 107 corresponding to the specific region 67 of the substrate 11 is attracted. It can be automatically placed in the hole 75 of. It is desirable that the light emitting pin and the support pin 111 be provided with an attractive force releasing mechanism capable of releasing the attractive force of the magnet 109 when the arrangement is changed. As a result, the component mounting device 200 can reduce the burden of the worker 37 for changing the lighting position, which occurs when the model is switched. It can also contribute to the automation of equipment.

Therefore, according to the component mounting devices 100 and 200 according to the present embodiment, the specific area 67 (that is, the component mounting position) provided on the substrate 11 can be clearly recognized with high contrast, and the model switchability is ensured. At the same time, the component mounting work for mounting the component 15 on the substrate 11 can be performed with high accuracy.

Although various embodiments have been described above with reference to the drawings, it goes without saying that the present disclosure is not limited to such examples. It is clear that a person skilled in the art can come up with various modifications, modifications, substitutions, additions, deletions, and even examples within the scope of the claims. It is naturally understood that it belongs to the technical scope of the present disclosure. Further, each component in the various embodiments described above may be arbitrarily combined as long as the gist of the invention is not deviated.

The present disclosure is useful as a component mounting device that clearly recognizes the mounting position of a component on a board with high contrast and performs component mounting processing on the board with high accuracy while ensuring model switchability.

11 Board 13 Board hole 19 Board carrier 33 Support pin 35 Reflective light emitting pin 39 Conveyor 59 Table 61 Light source 63 Light source 65 Support 67 Specific area 69 One end 71 One end 75 Hole 77 Light guide 87 Light guide diffusion Type light emitting pin 97 Self-luminous light emitting pin 99 Self-luminous light source 100, 200 Parts mounting device 105 Reflective light emitting pin 107 Table 109 Magnet 111 Support pin 113 Reflecting part 117 Reflecting light emitting pin 119 Reflecting light emitting pin 123 Reflecting pin 129 Reflecting pin 129 Reflecting pin

Claims (15)

A board transport section that holds and transports the board,
A table arranged below the substrate transfer section and
A light emitting unit arranged on the upper part of the table and locally irradiating a specific area of the substrate carried in by the substrate transporting unit from below.
One end thereof supports the light emitting portion from below, and the other end thereof includes a support that is detachably attached to the table.
Parts mounting device. The light emitting unit includes a light guide body that guides light from a light source upward.
The component mounting device according to claim 1. The light guide guides the light from the light source to the lower surface of the specific region of the substrate.
The component mounting device according to claim 2. The specific region includes a substrate hole penetrating in the thickness direction of the substrate.
The light emitting portion is arranged so as to face the substrate hole.
The component mounting device according to any one of claims 1 to 3. The substrate transport unit supports and transports a pair of parallel both end edges of the substrate from below by a pair of conveyors.
The component mounting device according to claim 2 or 3. The light emitting portion and the support have a pin shape along a direction perpendicular to the surface direction of the substrate and are integrated.
The component mounting device according to claim 5. A light source that supplies light to the light emitting unit is further provided.
The component mounting device according to claim 6. The light emitting unit is a light emitting pin that reflects light from the light source and illuminates the lower surface of the specific region of the substrate.
The component mounting device according to claim 7. The light emitting unit is a light emitting pin that guides and diffuses light from the light source to irradiate the lower surface of the specific region of the substrate.
The component mounting device according to claim 7. The light emitting unit is a light emitting pin having a self-luminous source and diffusing light from the self-luminous source to irradiate the lower surface of the specific region of the substrate.
The component mounting device according to claim 6. The light source is arranged in the substrate carrier.
The component mounting device according to claim 8. A reflector which is arranged on the upper part of the table and reflects light from the light source to the light emitting portion, and one end of which supports the reflector from below and the other end of which is detachably attached to the table. Further comprising a support and a reflective pin configured with the support.
The component mounting device according to claim 11. At the top of the table, one or more support pins that support the lower surface of the substrate are arranged.
The component mounting device according to any one of claims 8, 9, 10 and 12. A plurality of holes are provided in the table, and the other end of the support or the base end of the support pin is inserted into any of the holes.
The component mounting device according to claim 13. The table is formed of a magnetic material, and the other end of the support or the base end of the support pin is fixed by a magnet at an arbitrary position on the table.
The component mounting device according to claim 13.

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