JP2021184434A5 - - Google Patents
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- JP2021184434A5 JP2021184434A5 JP2020089495A JP2020089495A JP2021184434A5 JP 2021184434 A5 JP2021184434 A5 JP 2021184434A5 JP 2020089495 A JP2020089495 A JP 2020089495A JP 2020089495 A JP2020089495 A JP 2020089495A JP 2021184434 A5 JP2021184434 A5 JP 2021184434A5
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- JP
- Japan
- Prior art keywords
- thermal conductivity
- lumirror
- thermal
- measured
- pet38
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920002799 BoPET Polymers 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000011549 displacement method Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012926 reference standard material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Description
＜熱伝導率評価＞
作製直後の熱伝導性シートの一方の離型フィルム（ＲＦ１・ＰＥＴ３８－ＣＳ００１）を剥離し、露出した粘着層表面に７５μｍ厚みルミラー（登録商標）Ｕ３４（東レ（株）製ＰＥＴフィルム）を貼合し、続いて反対面の離型フィルム（ＲＦ１・ＰＥＴ３８－ＣＳ００３）を剥離し、同じくルミラーＵ３４を貼合した。熱伝導率測定装置ａｉ－Ｐｈａｓｅ Ｍｏｂｉｌｅ３（（株）アイフェイズ製）を用いて、厚み方向の熱拡散率を測定した。また熱容量が既知である参照標準物質との比較からサンプルの比熱を算出した。さらに別途水上置換法により測定した密度とから、次式により厚み方向の熱伝導率を算出し、表１に記載した。
〔熱伝導率〕＝〔熱拡散率〕×〔密度〕×〔比熱〕
さらにルミラーＵ３４貼合済熱伝導性シートを８５℃８５％Ｒ．Ｈ．下で１０日間保管し、保管後に再び熱拡散率を測定して、熱伝導率を算出した。この結果も表１に記載する。
<Thermal conductivity evaluation>
One release film (RF1/PET38-CS001) of the thermally conductive sheet immediately after production is peeled off, and a 75 μm thick Lumirror (registered trademark) U34 (PET film manufactured by Toray Industries, Inc.) is attached to the exposed adhesive layer surface. Then, the release film (RF1/PET38-CS003) on the opposite surface was peeled off, and similarly Lumirror U34 was adhered. The thermal diffusivity in the thickness direction was measured using a thermal conductivity measuring device ai-Phase Mobile 3 (manufactured by i-Phase Co., Ltd.). The specific heat of the sample was also calculated by comparison with a reference standard material of known heat capacity. Furthermore, the thermal conductivity in the thickness direction was calculated by the following equation from the density separately measured by the water displacement method, and is shown in Table 1.
[Thermal conductivity] = [Thermal diffusivity] x [Density] x [Specific heat]
Furthermore, the Lumirror U34 bonded thermally conductive sheet was heated at 85°C and 85%R. H. After storage for 10 days, the thermal diffusivity was measured again to calculate the thermal conductivity. The results are also listed in Table 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020089495A JP7341947B2 (en) | 2020-05-22 | 2020-05-22 | thermal conductive sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020089495A JP7341947B2 (en) | 2020-05-22 | 2020-05-22 | thermal conductive sheet |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021184434A JP2021184434A (en) | 2021-12-02 |
| JP2021184434A5 true JP2021184434A5 (en) | 2022-10-05 |
| JP7341947B2 JP7341947B2 (en) | 2023-09-11 |
Family
ID=78767542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020089495A Active JP7341947B2 (en) | 2020-05-22 | 2020-05-22 | thermal conductive sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7341947B2 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3313685B2 (en) | 1999-12-28 | 2002-08-12 | 北川工業株式会社 | Heat radiator for electronic components |
| JP5999769B2 (en) | 2013-01-07 | 2016-09-28 | 大王製紙株式会社 | Thermally conductive adhesive composition and thermally conductive adhesive sheet |
| JP6300004B2 (en) | 2013-12-06 | 2018-03-28 | Dic株式会社 | Thermal conductive sheet, article and electronic member |
| JP7387315B2 (en) | 2018-07-27 | 2023-11-28 | 日東電工株式会社 | thermal conductive sheet |
| JP7170476B2 (en) | 2018-09-14 | 2022-11-14 | リンテック株式会社 | Composition for Forming Heat Dissipating Member, Heat Dissipating Member, and Method for Producing Same |
-
2020
- 2020-05-22 JP JP2020089495A patent/JP7341947B2/en active Active
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