JP2021180268A - Substrate processing apparatus - Google Patents

Abstract

To improve throughput of a substrate processing apparatus.SOLUTION: A substrate processing apparatus comprises: a substrate inlet/outlet unit; a first group processing unit that performs a series of processing, for a first state substrate; a second group processing unit that performs a series of processing being the same as the series of processing performed by the first group processing unit, for the first state substrate; a first conveyance unit that conveys the first state substrate from the substrate inlet/outlet unit to the first group processing unit, and that conveys the substrate which was made to be in a second state by the first group processing unit from the first group processing unit to the substrate inlet/outlet unit; and a second conveyance unit that conveys the first state substrate from the substrate inlet/outlet unit to the second group processing unit, and that conveys the substrate which was made to be in the second state by the second group processing unit from the second group processing unit to the substrate inlet/outlet unit.SELECTED DRAWING: Figure 3

Description

The present disclosure relates to a substrate processing apparatus.

Patent Document 1 discloses a substrate processing apparatus having a plurality of layers arranged in the vertical direction. In this substrate processing apparatus, the first layer includes a first processing unit that processes a substrate using a predetermined processing liquid, and the second layer is a second processing that performs temperature treatment on the substrate. It has a part.

Japanese Unexamined Patent Publication No. 10-189420

The present disclosure provides a substrate processing apparatus effective for improving throughput.

The substrate processing apparatus according to one aspect of the present disclosure includes a substrate input / output unit that receives a substrate in the first state from the outside and sends the substrate in the second state to the outside, and two processing units that perform different processing. The processing unit of the first group includes a processing unit of the first group that performs a series of processing for changing one state to the second state and two processing units that perform different processing from each other. The same series of processing as the series of processing performed by the above is carried out to the processing unit of the second group that performs the same series of processing on the substrate in the first state and the substrate in the first state from the substrate inlet / output unit to the processing unit of the first group. The first transport section that transports the substrate in the second state by the processing section of the first group from the processing section of the first group to the board entry / exit section, and the processing section of the second group that transports the substrate in the first state from the substrate entry / exit section to the second group processing section. It is provided with a second transport section for transporting the substrate, which has been brought into the second state by the processing section of the second group, from the processing section of the second group to the substrate entry / exit section.

According to the present disclosure, a substrate processing apparatus effective for improving throughput is provided.

FIG. 1 is a perspective view schematically showing an example of a substrate processing apparatus according to the first embodiment. FIG. 2 is a side view schematically showing an example of a substrate processing apparatus. FIG. 3 is a plan view schematically showing an example of a substrate processing apparatus. FIG. 4 is a plan view schematically showing an example of the substrate processing apparatus. FIG. 5A is a plan view schematically showing an example of the transport unit. FIG. 5B is a side view schematically showing an example of the transport unit. FIG. 6 is a block diagram showing an example of the hardware configuration of the control device. FIG. 7 is a flowchart showing an example of the substrate processing method. FIG. 8 is a side view schematically showing an example of the substrate processing apparatus according to the second embodiment. FIG. 9 is a plan view schematically showing an example of the substrate processing apparatus. FIG. 10 is a side view schematically showing an example of the substrate processing apparatus according to the third embodiment. FIG. 11 is a plan view schematically showing an example of the substrate processing apparatus. FIG. 12 is a side view schematically showing an example of the substrate processing apparatus. FIG. 13 is a side view schematically showing an example of the substrate processing apparatus according to the fourth embodiment. FIG. 14 is a plan view schematically showing an example of the substrate processing apparatus. FIG. 15 is a flowchart showing an example of the substrate processing method. FIG. 16 is a side view schematically showing an example of the substrate processing apparatus.

Hereinafter, embodiments will be described with reference to the drawings. In the description, the same elements or elements having the same function are designated by the same reference numerals, and duplicate description will be omitted. Some drawings show a Cartesian coordinate system defined by the X, Y and Z axes. In the following embodiments, the Z-axis corresponds to the vertical direction, and the X-axis and the Y-axis correspond to the horizontal direction.

[First Embodiment]
First, the substrate processing apparatus 1 according to the first embodiment will be described as an example of the substrate processing apparatus with reference to FIGS. 1 to 5. The substrate processing device 1 shown in FIG. 1 is a device that performs a predetermined series of processing on a plurality of work Ws. The work W to be processed is, for example, a substrate or a substrate in which a film, a circuit, or the like is formed by being subjected to a predetermined treatment. The substrate included in the work W is, for example, a wafer containing silicon. The work W (substrate) may be formed in a circular shape. The work W to be processed may be a glass substrate, a mask substrate, an FPD (Flat Panel Display), or the like, or may be an intermediate obtained by subjecting these substrates or the like to a predetermined treatment.

The series of treatments by the substrate processing apparatus 1 includes, for example, a series of treatments for forming a coating film such as a photosensitive film, an upper layer film, an lower layer film, or a hard mask, and development of the photosensitive film after the exposure treatment. A series of processing of. When forming a film, the substrate processing apparatus 1 may form one type of film on the surface Wa of the work W, or may form two or more types of film. The substrate processing apparatus 1 may form a film without performing the development process, or may perform the development process without forming the film.

The substrate processing apparatus 1 accepts a plurality of work Ws in a state before a series of processes (hereinafter referred to as "first state") from the outside, and performs a series of processes for each of the received plurality of work Ws in the first state. Give. The substrate processing apparatus 1 sends out a plurality of work Ws in a state after processing (hereinafter, referred to as “second state”) obtained by performing a series of processing to the outside. When forming one type of film, in the work W in the first state, the film is not formed on the surface Wa of the work W, and in the work W in the second state, the film is formed on the surface Wa. Has been done. When forming two or more types of multilayer coatings, the multilayer coating is not formed on the surface Wa of the work W in the first state, and on the surface Wa in the work W in the second state. The above-mentioned multilayer film is formed on the surface. In the following description of the first embodiment, the substrate processing apparatus 1 for forming one type of coating film is illustrated.

As shown in FIG. 1, the substrate processing device 1 includes, for example, an entry / exit block 2 (board entry / exit section), a processing block 4, and a control device 100. The entry / exit block 2 accepts the plurality of work Ws in the first state from the outside of the substrate processing device 1, and sends the plurality of work Ws in the second state to the outside of the substrate processing device 1. The loading / unloading block 2 has, for example, a carrier station 6, a loading / unloading section 8, and a housing section 12, as shown in FIG.

The carrier station 6 supports a plurality of carriers C for the work W. The carrier C accommodates, for example, a plurality of circular workpieces W. An opening / closing door (not shown) for loading / unloading the work W is provided on one side surface of the carrier C. The carrier C is detachably installed on the carrier station 6 so that the side surface provided with the opening / closing door faces the carry-in / carry-out portion 8. As shown in FIG. 3, the carrier station 6 may support a plurality of (four) carriers C so as to be aligned along one horizontal direction (X-axis direction in the figure).

As shown in FIG. 1, the carry-in / carry-out unit 8 is located between the carrier station 6 and the processing block 4. The carry-in / carry-out unit 8 has a plurality of opening / closing doors 8a. When the carrier C is placed on the carrier station 6, the opening / closing door of the carrier C is in a state of facing the opening / closing door 8a. By opening the opening / closing door 8a and the opening / closing door of the carrier C at the same time, the inside of the carrier C and the loading / unloading section 8 communicate with each other. As shown in FIGS. 2 and 3, the carry-in / carry-out unit 8 has a built-in carry-in / carry-out unit 10.

The carry-in / out unit 10 takes out the work W in the first state (for example, the work W before the film is formed) from the carrier C and conveys it to the accommodating portion 12, and the work W in the second state (for example, the film W). The work W) after the formation is taken out from the accommodating portion 12 and returned to the carrier C. As a result, the work W in the first state is received in the substrate processing apparatus 1, and the work W in the second state is sent out of the substrate processing apparatus 1. The loading / unloading unit 10 has, for example, a holding arm 10a for holding the work W, and a holding arm 10a for transporting the work W between each of the four carriers C arranged along the X-axis direction and the accommodating portion 12. It has a drive mechanism 10b for moving.

The accommodating unit 12 temporarily accommodates the plurality of work Ws in the first state, and temporarily accommodates the plurality of work Ws in the second state. The accommodating portion 12 has, for example, a plurality of cells on which a plurality of work Ws are respectively placed, and the plurality of cells are arranged side by side in the vertical direction (Z-axis direction in the drawing). .. The work W in the first state is carried into one cell of the accommodating unit 12 by the loading / unloading unit 10, and the work W in the second state accommodated in one cell of the accommodating unit 12 is carried in by the loading / unloading unit 10. It is carried out. As shown in FIG. 3, the accommodating unit 12 is located between the loading / unloading unit 8 and the processing block 4, and is arranged substantially in the center of the loading / unloading block 2 (board processing device 1) in the X-axis direction. There is.

As shown in FIG. 3, the processing block 4 performs a series of processing on each of the transport unit 20A (first transport unit), the transport unit 20B (second transport unit), and the plurality of workpieces W in the first state. A substrate processing unit 16 is provided. The transport unit 20A transports a part of the plurality of works W. The transport unit 20B transports the remaining part of the plurality of work Ws. For example, the plurality of work Ws to be transported by the transport unit 20A are not transported by the transport unit 20B, and the plurality of work Ws to be transported by the transport unit 20B are not transported by the transport unit 20A.

The transport unit 20A and the transport unit 20B are arranged at different positions in one horizontal direction (X-axis direction in the figure), and the positions of the accommodating unit 12 in the X-axis direction are the positions of the transport unit 20A and the transport unit 20B. It is located between the positions in the X-axis direction. The transport unit 20A transports the work W in the first state housed in the storage unit 12 to the substrate processing unit 16. The transport unit 20A transports the work W in the second state from the substrate processing unit 16 to the accommodating unit 12. The transport unit 20B transports the work W housed in the storage unit 12 to the substrate processing unit 16. The transport unit 20B transports the work W in the second state from the substrate processing unit 16 to the accommodating unit 12. Details of the transport units 20A and 20B will be described later.

(Board processing unit)
The substrate processing unit 16 has a plurality of processing units that sequentially perform a predetermined series of processing on each of the plurality of work Ws. The plurality of processing units included in the substrate processing unit 16 include a plurality of processing units that perform a series of processes on the work W conveyed by the transfer unit 20A, and a plurality of processing units that perform a series of processes on the work W conveyed by the transfer unit 20B. It can be divided into the processing unit of. Hereinafter, a plurality of processing units that perform a series of processing on the work W transported by the transport unit 20A will be referred to as a “first group processing unit”, and a plurality of processes that perform a series of processing on the work W transported by the transport unit 20B. The section is referred to as a "second group processing section". When the substrate processing unit 16 performs a series of processes for forming a predetermined film, the film on the work W in the second state obtained by performing the series of processes by the processing unit of the second group is the first group. It becomes the same as the coating film on the work W in the second state obtained by performing a series of treatments by the processing unit of.

The plurality of processing units may include processing units that belong to both the processing unit of the first group and the processing unit of the second group. In this case, the plurality of processing units included in the substrate processing unit 16 do not belong to the common processing unit belonging to both the processing unit of the first group and the processing unit of the second group and the processing unit of the second group. It can be classified into an individual processing unit that belongs to one group of processing units and an individual processing unit that does not belong to the processing unit of the first group but belongs to the processing unit of the second group. In the present disclosure, a processing unit commonly used for the above-mentioned two series of processing for at least a part of the members is referred to as a common processing unit. The substrate processing unit 16 performs a series of treatments including, for example, a liquid treatment using a treatment liquid, a heat treatment, and an inspection treatment on each of the plurality of workpieces W. Hereinafter, the unit that performs each process included in the series of processes will be described.

The substrate processing unit 16 has a plurality of liquid treatment units 40 that perform liquid treatment on the work W. As shown in FIG. 2, the plurality of liquid treatment units 40 are arranged so as to be stacked (for example, in three layers) with each other in the vertical direction. As shown in FIG. 3, the liquid treatment unit 40 is arranged so as to sandwich the transport units 20A and 20B with the accommodating unit 12 in the Y-axis direction. The central portion of the liquid treatment unit 40 in the X-axis direction faces the accommodating portion 12 in the Y-axis direction.

The liquid treatment unit 40 forms a coating film of the treatment liquid by supplying the treatment liquid (for example, the treatment liquid for forming a film) to the surface Wa of the work W in a rotated state. The liquid treatment unit 40 includes, for example, as shown in FIG. 3, a rotation holding unit 42A (first holding unit), a rotation holding unit 42B (second holding unit), and a liquid supply unit 44 (liquid supply unit). Has.

The rotation holding unit 42A holds the work W transported by the transport unit 20A. The rotation holding portion 42A rotates the work W around a vertical axis while holding the work W, for example. The rotation holding unit 42B holds the work W transported by the transport unit 20B. The rotation holding portion 42B, for example, rotates the work W around a vertical axis while holding the work W. The work W transported by the transport unit 20A is not held by the rotation holding unit 42B but is held by the rotation holding unit 42A. The work W transported by the transport unit 20B is not held by the rotation holding unit 42A but is held by the rotation holding unit 42B.

The rotation holding portion 42A and the rotation holding portion 42B are arranged at different positions in the horizontal direction (X-axis direction in the drawing), and are arranged at intervals from each other. The rotation holding portion 42A is arranged so as to face the transport portion 20A in the Y-axis direction, and the rotation holding portion 42B is arranged so as to face the transport portion 20B in the Y-axis direction. On the outer wall of the housing of the liquid treatment unit 40 facing the transport portions 20A and 20B, a carry-in / out port for loading / unloading the work W to the rotation holding portion 42A and a loading / unloading of the work W to the rotation holding portion 42B are performed. A carry-in / exit port for the purpose may be formed.

The liquid supply unit 44 can supply the processing liquid to the work W held by the rotation holding unit 42A, and can supply the processing liquid to the work W held by the rotation holding unit 42B. The liquid supply unit 44 has, for example, a nozzle 46, a holding arm 48a, and a drive unit 48b.

The nozzle 46 discharges the processing liquid toward the work W held by the rotation holding portion 42A or the rotation holding portion 42B. For example, the nozzle 46 discharges the processing liquid from above to the work W held by the rotation holding portions 42A and 42B in a state where the discharge port faces downward. The holding arm 48a is a member that holds the nozzle 46. The holding arm 48a is formed so as to extend in a direction perpendicular to the direction in which the rotation holding portions 42A and 42B are arranged (Y-axis direction in the drawing), and a nozzle 46 is provided at one end of the holding arm 48a in the Y-axis direction. .. The other end of the holding arm 48a in the Y-axis direction is connected to the driving unit 48b.

The drive unit 48b is configured to move the holding arm 48a (nozzle 46) along the direction in which the rotation holding units 42A and 42B are lined up. The drive unit 48b arranges the nozzle 46 above the rotation holding unit 42A when supplying the processing liquid to the work W held by the rotation holding unit 42A, and processes the work W held by the rotation holding unit 42B. When supplying the liquid, the nozzle 46 is arranged above the rotation holding portion 42B. As a result, the liquid supply unit 44 can supply the processing liquid to both the work W on the rotation holding unit 42A and the work W on the rotation holding unit 42B.

As described above, the liquid supply unit 44 is commonly used for the liquid treatment of the work W to be transported by the transport unit 20A and the liquid treatment of the work W to be transported by the transport unit 20B. In the liquid treatment in the liquid treatment unit 40, the ratio of the time for supplying the treatment liquid to the work W held in the rotation holding portion 42A or the rotation holding portion 42B occupies the total processing time for one work W. Since it is small, the liquid supply unit 44 is commonly used. In the liquid treatment unit 40, since the liquid supply unit 44 that supplies the treatment liquid to the work W is commonly used, the liquid treatment unit 40 is classified into a common treatment unit (first common treatment unit).

The substrate processing unit 16 further includes a plurality of heat treatment units 50 that heat-treat the work W. As shown in FIG. 3, the substrate processing unit 16 includes, for example, a plurality of heat treatment units 50 arranged at one end in the processing block 4 in the direction in which the transport units 20A and 20B are arranged (X-axis direction in the drawing). , A plurality of heat treatment units 50 arranged at the other end of the processing block 4 in the X-axis direction. In the following, the heat treatment unit 50 arranged at one end of the processing block 4 near the transport unit 20A is referred to as a “heat treatment unit 50A”, and is arranged at the other end of the processing block 4 near the transport unit 20B. The heat treatment unit 50 is referred to as a "heat treatment unit 50B".

As shown in FIG. 2, the plurality of heat treatment units 50A are stacked and arranged in the vertical direction (for example, in four layers), and the plurality of heat treatment units 50B are stacked in the vertical direction (for example, 4). (In layers) are arranged. The height positions of the heat treatment units 50A and 50B of each layer are substantially the same as each other, and the height positions of the heat treatment units 50A of the first to third layers counting from the bottom of the plurality of heat treatment units 50A are the liquids of the three layers. It may correspond to (substantially match) the height position of the processing unit 40. As shown in FIG. 3, the heat treatment unit 50A and the heat treatment unit 50B are arranged so as to sandwich the transport units 20A and 20B and the liquid treatment unit 40 in between.

The heat treatment unit 50 (each of the heat treatment units 50A and 50B) may cool the work W and heat the coating film of the treatment liquid formed on the surface Wa of the work W. By performing the heat treatment by the heat treatment unit 50, the coating film of the treatment liquid formed on the surface Wa of the work W is solidified (a film is formed). The heat treatment unit 50 has, for example, a loading / unloading section 52, a heating section 54, and a driving section 56. The loading / unloading section 52 transfers the work W to and from the transporting sections 20A and 20B. The loading / unloading section 52 includes, for example, a plate on which the work W is placed (holds the work W). The loading / unloading section 52 may include a cooling plate for cooling the work W.

The heating unit 54 is arranged side by side with the loading / unloading unit 52 in the longitudinal direction of the heat treatment unit 50. The heating unit 54 includes a hot plate, and heats the work W with the work W placed on the hot plate. The drive unit 56 moves the plate (work W on the plate) of the carry-in / out unit 52 in the longitudinal direction of the heat treatment unit 50, thereby enabling the work W to be transferred between the plate and the heating unit 54. ..

In order to carry in and out the work W to the heat treatment unit 50A (carry-in / out part 52) on the outer wall of the heat treatment unit 50A facing the transport part 20A (the part of the outer wall facing the transport part 20A). The carry-in / exit port may be formed. The work W is carried in and out of the heat treatment unit 50B (carry-in / out part 52) on the outer wall of the heat treatment unit 50B facing the transport part 20B (the part of the outer wall facing the transport part 20B). An inlet / outlet for the heat treatment may be formed.

The longitudinal direction of each of the heat treatment units 50A and 50B (the direction in which the loading / unloading section 52 and the driving section 56 are lined up) is perpendicular to the direction in which the rotation holding portions 42A and 42B of the liquid treatment unit 40 are lined up (Y-axis in the figure). It is arranged along the direction). Each of the heat treatment units 50A and 50B is arranged so as to project horizontally from the loading / unloading section 52 in one direction. For example, each of the heat treatment units 50A and 50B projects from the loading / unloading section 52 located near the loading / unloading port in a direction away from the accommodating section 12 along the Y-axis direction (Y-axis positive direction). The positions of at least a part of the heat treatment units 50A and 50B in the Y-axis direction overlap with the positions of the liquid treatment unit 40 in the Y-axis direction. For example, the heating unit 54 of the heat treatment unit 50A and the heating unit 54 of the heat treatment unit 50B sandwich the liquid treatment unit 40 in the direction (X-axis direction) in which the rotation holding portions 42A and 42B are arranged.

As described above, each of the heat treatment units 50A and 50B does not have a member commonly used, and is therefore classified as an individual processing unit. The heat treatment unit 50A is included in the processing unit of the first group because it receives the work W from the transport unit 20A, and the heat treatment unit 50B is included in the processing unit of the second group because it receives the work W from the transport unit 20B.

As shown in FIGS. 2 and 4, the substrate processing unit 16 further includes a plurality of (for example, two) inspection units 60 for inspecting the work W. Note that FIG. 4 shows a plan view including the inspection unit 60, and FIG. 3 used in the above description shows a plan view in a state excluding the inspection unit 60. There is. Each of the plurality of inspection units 60 performs both an inspection of the work W conveyed by the transfer unit 20A and an inspection of the work W conveyed by the transfer unit 20B.

The plurality of inspection units 60 are arranged so as to be laminated on each other, and may be arranged above or below the plurality of liquid treatment units 40. For example, as shown in FIG. 2, the plurality of inspection units 60 are arranged in order on the uppermost liquid treatment unit 40. In this case, the height positions of the plurality of inspection units 60 correspond to (substantially match) the height positions of the heat treatment unit 50 in the uppermost layer. At least a portion of the inspection unit 60 is above or below (eg, above) the liquid treatment unit 40 at a position between the rotation holding portion 42A and the rotation holding portion 42B of the liquid treatment unit 40, as shown in FIG. ) May overlap. The inspection unit 60 may be formed so as to extend along a direction perpendicular to the direction in which the rotation holding portions 42A and 42B are arranged (Y-axis direction in the figure).

The inspection unit 60 may inspect the work W by taking an image of the work W. The inspection unit 60 includes, for example, a rotation holding unit 62, a horizontal driving unit 64, and an imaging unit 66. The rotation holding unit 62 rotates the work W around a vertical rotation axis while holding the work W. The horizontal drive unit 64 moves the rotation holding unit 62 in a state of holding the work W along the longitudinal direction (Y-axis direction in the figure) of the inspection unit 60.

The image pickup unit 66 is configured to be able to image the work W. The image pickup unit 66 may include, for example, a line sensor capable of imaging the work W on the rotation holding unit 62 moved by the horizontal drive unit 64. The image pickup unit 66 is a work W rotated by the rotation holding unit 62 in a state where the rotation holding unit 62 is arranged at one end portion (the end portion far from the accommodating unit 12) in the longitudinal direction in the inspection unit 60. It may include a camera capable of imaging the periphery. On the outer wall located at one end (the end closer to the accommodating portion 12) in the longitudinal direction of the housing of the inspection unit 60, a loading / unloading outlet for loading / unloading the work W to the inspection unit 60 is formed. May be.

As described above, in the inspection unit 60, the delivery position where the work W is delivered to and from the transport units 20A and 20B via the carry-in port and the inspection position where the inspection (imaging) is performed are the longitudinal lengths of the inspection unit 60. They are lined up along the direction. Then, the delivery position and the inspection position may be arranged so that the distance between the delivery position and the accommodating portion 12 is shorter than the distance between the inspection position and the accommodating portion 12. Since the entire inspection unit 60 is used in common, the inspection unit 60 is classified into a common processing unit (second common processing unit). The throughput of the inspection unit 60 (the number of workpieces processed per unit time) is larger than the throughput of the heat treatment unit 50. Therefore, even if the inspection unit 60 is used in common, the influence on the throughput of the entire substrate processing apparatus 1 is small.

In the above-mentioned example of the substrate processing unit 16, the processing unit of the first group includes the liquid processing unit 40, the heat treatment unit 50A, and the inspection unit 60, and the processing unit of the second group includes the liquid processing unit 40 and the liquid processing unit 40. The heat treatment unit 50B and the inspection unit 60 are included. The substrate processing unit 16 may include a processing unit that performs processing other than inspection of the work W as a processing unit belonging to both the processing units of the first group and the second group. The substrate processing unit 16 may include a liquid processing unit that does not belong to the second group and belongs to the processing unit of the first group, and another liquid processing unit that does not belong to the first group and belongs to the processing unit of the second group. good.

(Transport section)
Here, an example of the transport units 20A and 20B will be described in detail with reference to FIGS. 5 (a) and 5 (b). The transport unit 20A and the transport unit 20B are configured in the same manner as each other. As shown in FIG. 5A, the transport units 20A and 20B have, for example, a holding arm 22, a horizontal drive unit 24, a rotation drive unit 26, a base 28, and an elevating drive unit 30.

The holding arm 22 is configured to hold the work W. The holding arm 22 holds the work W so that the surface Wa faces upward, for example. The holding arm 22 may be formed so as to support the peripheral edge portion of the back surface Wb on the side opposite to the front surface Wa of the work W. The transport units 20A and 20B transport the work W by moving the holding arm 22.

The horizontal drive unit 24 is a horizontal actuator that reciprocates the holding arm 22 along one horizontal direction by a power source such as a motor. The horizontal drive unit 24 may be formed so as to extend along the direction in which the holding arm 22 is moved (the extending direction of the holding arm 22). As shown in FIG. 5B, the horizontal drive unit 24 is supported by the base 28 via the rotary drive unit 26. Since the horizontal drive unit 24 supports the holding arm 22, the holding arm 22 is also supported by the base 28. The rotary drive unit 26 is a rotary actuator configured to rotate the horizontal drive unit 24 around a vertical rotation axis by a power source such as a motor.

When the rotation drive unit 26 rotates the horizontal drive unit 24 around a vertical rotation axis, the movement direction of the holding arm 22 by the horizontal drive unit 24 (inclination of the base 28 with respect to the longitudinal direction) changes. When the horizontal drive unit 24 moves the holding arm 22, the position of the holding arm 22 (work W) with respect to the base 28 changes. In one example, the horizontal drive unit 24 is located between a position where the tip of the holding arm 22 (a portion holding the work W) overlaps the base 28 and a position where the tip of the holding arm 22 does not overlap the base 28. The holding arm 22 is moved. An elevating drive unit 30 is connected to one end of the base 28 in the X-axis direction.

The elevating drive unit 30 is an elevating actuator that moves the base 28 along the vertical direction by a power source such as a motor. The elevating drive unit 30 is formed so as to extend along the vertical direction, for example, and its lower end portion is fixed to the bottom surface of the processing block 4. Therefore, the positions of the elevating drive unit 30 and the base 28 are constant in the top view. As the base 28 moves in the vertical direction by the elevating drive unit 30, the holding arm 22 (work W) also moves in the vertical direction.

As shown in FIG. 4, the outer edge of the region where the work W is transported by the transport unit 20A configured as described above (hereinafter referred to as “transport region RA”) is the rotation of the transport unit 20A. It becomes an annular shape centered on the rotation axis of the drive unit 26. The outer edge of the region where the work W is transported by the transport unit 20B (hereinafter, referred to as “transport region RB”) is an annular shape centered on the rotation axis of the rotation drive unit 26 of the transport unit 20B. In a top view, along the annular outer edge of the transport region RA of the transport unit 20A, the accommodating unit 12, the heat treatment unit 50A (carry-in / out unit 52), the liquid treatment unit 40 (rotational holding unit 42A), and the inspection unit 60 (accommodation). One end closer to the part 12) is lined up. Along the outer edge of the annular shape of the transport area RB of the transport unit 20B, the accommodating unit 12, the heat treatment unit 50B (carry-in / out unit 52), the liquid treatment unit 40 (rotation holding unit 42B), and the inspection unit 60 (close to the accommodating unit 12). One end) is lined up.

(Control device)
Subsequently, an example of the control device 100 will be described with reference to FIGS. 4 and 6. The control device 100 controls the substrate processing device 1. As shown in FIG. 4, the control device 100 has, as a functional configuration (hereinafter, referred to as “functional module”), for example, an acceptance control unit 102, a first processing control unit 104, and a second processing control unit. It has 106 and a transmission control unit 108.

The acceptance control unit 102 controls the entry / exit block 2 so as to accept the work W in the first state before the processing by the substrate processing apparatus 1 from the outside. The acceptance control unit 102 controls the carry-in / out unit 10 so as to take out the work W from any carrier C on the carrier station 6, for example. The acceptance control unit 102 controls the carry-in / out unit 10 so that the work W taken out from the carrier C and held by the holding arm 10a is accommodated in any cell of the accommodating unit 12. As a result, the work W is accepted into the substrate processing apparatus 1 from the inside of the carrier C (outside the substrate processing apparatus 1).

The first processing control unit 104 includes the transport unit 20A and the substrate processing unit 16 (the first) so that the work W in the first state accommodated in the accommodating unit 12 is subjected to a series of processing by the substrate processing apparatus 1. 1 group of processing units) is controlled. The first processing control unit 104 controls the transport unit 20A so as to transport the work W in the first state housed in the accommodating unit 12 to the processing unit of the first group. The first processing control unit 104 is a processing unit (liquid treatment unit 40, heat treatment unit 50A) of the first group so as to perform a series of processing including liquid treatment, heat treatment and inspection treatment on the work W in the first state. , And the inspection unit 60) and the transport unit 20A are controlled. The first processing control unit 104 controls the transport unit 20A so as to transport the work W in the second state by the processing unit of the first group from the processing unit of the first group to the accommodating unit 12.

The second processing control unit 106 includes a transport unit 20B and a substrate processing unit 16 (second) so that a series of processing by the substrate processing apparatus 1 is performed on the work W in the first state accommodated in the accommodating unit 12. 2 groups of processing units) are controlled. The second processing control unit 106 controls the transport unit 20B so as to transport the work W in the first state housed in the accommodating unit 12 to the processing unit of the second group. The second processing control unit 106 performs a series of processing including liquid treatment, heat treatment, and inspection treatment on the work W in the first state, so that the processing unit (liquid treatment unit 40, heat treatment unit 50B) of the second group is performed. , And the inspection unit 60) and the transport unit 20B. The second processing control unit 106 controls the transport unit 20B so as to transport the work W in the second state by the processing unit of the second group from the processing unit of the second group to the accommodating unit 12.

The transmission control unit 108 controls the input / output block 2 so as to send the work W in the second state after processing by the substrate processing device 1 to the outside. The transmission control unit 108 is set to the second state by, for example, the processing unit of the first group or the processing unit of the second group, and controls the loading / unloading unit 10 so as to take out the work W accommodated in the accommodating unit 12. The delivery control unit 108 controls the carry-in / out unit 10 so that the work W taken out from the accommodating unit 12 and held by the holding arm 10a is carried into any carrier C on the carrier station 6. As a result, the work W is sent out from the inside of the substrate processing apparatus 1 into the carrier C (outside the substrate processing apparatus 1).

The control device 100 is composed of one or a plurality of control computers. For example, the control device 100 has a circuit 120 shown in FIG. The circuit 120 has one or more processors 122, a memory 124, a storage 126, and an input / output port 128. The storage 126 has a storage medium that can be read by a computer, such as a hard disk. The storage medium stores a program for causing the control device 100 to execute the substrate processing method described later. The storage medium may be a removable medium such as a non-volatile semiconductor memory, a magnetic disk, or an optical disk. The memory 124 temporarily stores the program loaded from the storage medium of the storage 126 and the calculation result by the processor 122.

The processor 122 executes the above program in cooperation with the memory 124. The input / output port 128 inputs / outputs an electric signal to / from the input / output block 2, the transport units 20A and 20B, the liquid processing unit 40, the heat treatment unit 50, the inspection unit 60, and the like according to a command from the processor 122. The hardware configuration of the control device 100 may be configured by a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) in which the logic circuit is integrated.

(Board processing method)
Subsequently, with reference to FIG. 7, a film forming process executed in the substrate processing apparatus 1 will be described as an example of the substrate processing method. FIG. 7 is a flowchart showing an example of a film forming process for one work W.

As shown in FIG. 7, the control device 100 first executes step S11. In step S11, for example, the acceptance control unit 102 controls the carry-in / out unit 10 so as to take out the work W from any carrier C on the carrier station 6. Then, the acceptance control unit 102 controls the carry-in / out unit 10 so that the work W taken out from the carrier C and held by the holding arm 10a is accommodated in any cell of the accommodating unit 12.

Next, the control device 100 executes step S12. In step S12, for example, the control device 100 selects whether the work W to be processed is processed by the processing unit of the first group or the processing unit of the second group. When the processing unit of the first group is selected, the control device 100 selects the transport unit 20A as the transport unit for transporting the work W to be processed, and when the processing unit of the second group is selected, the control device 100 processes. The transport unit 20B is selected as the transport unit for transporting the target work W.

For example, the control device 100 selects a group for processing the work W to be processed and a transport unit for transporting based on a predetermined operation schedule. Alternatively, the control device 100 may select a group according to the processing status of the processing unit of the first group and the processing unit of the second group. For example, when the number of work W being processed by the processing unit of the first group is larger than the number of work W being processed by the processing unit of the second group, the control device 100 may use the processing unit of the second group ( Select the transport unit 20B). On the other hand, when the number of works W being processed by the processing unit of the first group is smaller than the number of works W being processed by the processing unit of the second group, the control device 100 is the processing unit of the first group ( Select the transport unit 20A). Hereinafter, the processing unit and the transport unit of the group selected in step S02 will be referred to as a “selection group processing unit” and a “selective transport unit”, respectively. The processing control unit that controls the processing unit and the selective transport unit of the selection group among the first processing control unit 104 and the second processing control unit 106 is referred to as a “selection processing control unit”.

Next, the control device 100 executes steps S13 and S14. In step S13, for example, the selection processing control unit controls the selection transfer unit so that the work W in the first state housed in the storage unit 12 is transported to one of the inspection units 60. In step S15, the selection processing control unit controls the inspection unit 60 so as to inspect the work W in the first state carried into the inspection unit 60. In one example, the selection processing control unit causes the inspection unit 60 to inspect the work W by having the image pickup unit 66 take an image of the entire surface Wa of the work W in the first state.

Next, the control device 100 executes step S15. In step S15, for example, the selection processing control unit controls the selection processing unit so that the work W after the inspection by the inspection unit 60 is transferred from the inspection unit 60 to the liquid processing unit 40. At this time, the selection processing control unit has the selection transfer unit and the liquid processing unit 40 so that the work W after the inspection is placed on the rotation holding unit belonging to the processing unit of the selection group among the rotation holding units 42A and 42B. To control.

Next, the control device 100 executes step S16. In step S16, for example, the selective transfer unit controls the liquid treatment unit 40 so as to form a coating film of the treatment liquid on the surface Wa of the work W placed on the rotation holding unit in step S15. In one example, the selection processing control unit causes the liquid supply unit 44 to supply the processing liquid to the surface Wa of the work W rotating by the rotation holding unit. Then, the selection processing control unit rotates the work W for a predetermined time by the rotation holding unit in a state where the supply of the processing liquid by the liquid supply unit 44 is stopped. As a result, a coating film of the treatment liquid is formed on the surface Wa of the work W.

Next, the control device 100 executes step S17. In step S17, for example, the selection processing control unit controls the selection processing unit so that the work W on which the coating film of the treatment liquid is formed is transferred from the liquid treatment unit 40 to the heat treatment unit 50 belonging to the treatment unit of the selection group. do. At this time, the selective processing control unit controls the selective transfer unit and the heat treatment unit 50 so that the work W after the formation of the coating film is arranged on the carry-in / out unit 52 (for example, a cooling plate) of the heat treatment unit 50.

Next, the control device 100 executes step S18. In step S18, for example, the selection processing control unit controls the heat treatment unit 50 into which the work W is carried in step S17 so that the work W on which the coating film of the treatment liquid is formed is heat-treated. In one example, the selection process control unit heats the coating film on the surface Wa of the work W by the heating unit 54, and after the heating, the work W is cooled by the loading / unloading unit 52. As a result, a film is formed on the surface Wa of the work W.

Next, the control device 100 executes steps S19 and S20. In step S19, for example, the selection processing control unit controls the selection transfer unit so that the work W after film formation is transferred from the heat treatment unit 50 to the inspection unit 60. In step S19, for example, the selection processing control unit controls the inspection unit 60 so as to inspect the work W after the film formation carried into the inspection unit 60. In one example, the selection processing control unit causes the inspection unit 60 to inspect the work W (state of the coating film on the surface Wa) by making the entire surface Wa of the work W imaged by the image pickup unit 66. By executing the series of processes included in the processes up to step S20, the work W in the second state in which the film is formed can be obtained.

Next, the control device 100 executes steps S21 and S22. In step S21, for example, the selection processing control unit controls the selection processing unit so that the work W in the second state by the processing unit of the selection group is transferred from the inspection unit 60 to any cell of the accommodation unit 12. .. In step S22, for example, the transmission control unit 108 controls the loading / unloading unit 10 so as to take out the work W in the second state by the processing unit of the selection group from the accommodating unit 12. Then, the delivery control unit 108 controls the carry-in / out unit 10 so that the work W taken out from the accommodating unit 12 and held by the holding arm 10a is carried into any carrier C on the carrier station 6. As a result, the film forming process for one work W is completed. In the film forming process for this one work W, the work W is not transported by the unselected transport unit, and the work W is not processed by the process unit of the unselected group.

The control device 100 may control the substrate processing device 1 so as to perform a film forming process on each of the plurality of work Ws, as in steps S11 to S22 described above. In this case, the control device 100 may cause each of a part of the plurality of work Ws to execute a series of processes by the transport unit 20A and the processing unit of the first group. The transport unit 20A and the processing unit of the first group may perform a series of processing for one work W and a series of processing for another work W in parallel. For example, while the liquid treatment for one work W is being performed in step S16, the control device 100 causes the transport unit 20A and the processing unit of the first group to process the other work W in steps S13 and S14. May be executed.

The control device 100 uses the transport unit 20B and the processing unit of the second group for each of the plurality of work Ws other than the plurality of work Ws to be transported / processed by the transport unit 20A and the processing unit of the first group. Execute a series of processes. The control device 100 includes a series of processing by the transport unit 20A and the processing unit of the first group for the work W of one group, and a series of processing by the transport unit 20B and the processing unit of the second group for the work W of another group. Is executed by the substrate processing device 1 in parallel.

In step S16 regarding a series of processing by the transport unit 20B and the processing unit of the second group, the second processing control unit 106 uses the liquid supply unit 44 to supply the processing liquid to the surface Wa of the work W rotated by the rotation holding unit 42B. To supply. The supply of the processing liquid to the work W on the rotation holding unit 42B is performed during a period overlapping with at least a part of the period during which the first processing control unit 104 rotates the work W by the rotation holding unit 42A after the processing liquid is supplied. You may be broken.

The above-mentioned film forming treatment is an example and can be changed as appropriate. For example, some of the steps (processes) described above may be omitted, or the steps may be executed in a different order. Further, any two or more steps among the above-mentioned steps may be combined, or a part of the steps may be modified or deleted. Alternatively, other steps may be performed in addition to each of the above steps. As an example, either the process of steps S13 and S14 and the process of steps S19 and S20 may be omitted. The processing of steps S13 and S14 and the processing of steps S19 and S20 may be omitted. In this case, the substrate processing unit 16 does not have to include a plurality of inspection units 60.

(Effect of the first embodiment)
The substrate processing apparatus 1 described above includes an input / output block 2 that receives the work W in the first state from the outside and sends the work W in the second state to the outside, and two processing units that perform different processes. The processing of the first group includes a processing unit of the first group that performs a series of processing for changing one state to the second state for the work W of the first state and two processing units that perform processing different from each other. The same series of processing as the series of processing performed by the unit is performed on the work W in the first state in the processing unit of the second group, and the work W in the first state is transferred from the entry / exit block 2 to the processing unit in the first group. The transport unit 20A that transports and transports the work W in the second state by the processing unit of the first group from the processing unit of the first group to the input / output block 2, and the work W in the first state are transferred from the input / output block 2 to the second. It is provided with a transport unit 20B that transports the work W to the processing unit of the group and is in the second state by the processing unit of the second group from the processing unit of the second group to the input / output block 2.

In this substrate processing apparatus 1, a series of processing for the work W can be performed in parallel by the processing unit of the first group and the processing unit of the second group. Then, a transport unit 20A for transporting the work W between the processing unit of the first group and the input / output block 2 is provided, and the transport unit 20B for transporting the work W between the processing unit of the second group and the input / output block 2 is provided. (A transport unit 20B different from the transport unit 20A) is provided. Therefore, the transfer processing associated with the series of processing can be performed in parallel, which is effective in improving the throughput of the substrate processing apparatus 1.

In the above-mentioned substrate processing apparatus 1, the processing unit of the first group may include a common processing unit that also belongs to the processing unit of the second group and an individual processing unit that does not belong to the processing unit of the second group. The throughput of the common processing unit may be larger than the throughput of the individual processing unit. Even if a part of the series of processing by the processing unit of the first group and a part of the series of processing by the processing unit of the second group are performed in the common processing unit, the throughput of the common processing unit is large, so that the throughput of the common processing unit is large. The effect on the throughput of the entire substrate processing device 1 is small. Therefore, it is effective in achieving both improvement in throughput and simplification of the substrate processing apparatus 1.

In the above-mentioned substrate processing apparatus 1, the common processing unit may include an inspection unit that inspects the work W conveyed by the transfer unit 20A and the work W conveyed by the transfer unit 20B. In this case, the common use of inspection units is effective in suppressing variations in inspection results between devices.

In the above-mentioned substrate processing apparatus 1, the processing unit of the first group may include the first common processing unit that also belongs to the processing unit of the second group. The first common processing unit is arranged at a position different from the rotation holding unit 42A in the horizontal direction and holds the work W conveyed by the conveying unit 20A and the rotation holding unit 42A that holds the work W conveyed by the conveying unit 20A. The rotation holding portion 42B, the work W held by the rotation holding portion 42A, and the liquid supply unit 44 capable of supplying the processing liquid to the work W held by the rotation holding portion 42B may be included. In this case, the liquid supply unit 44, which is a part of the first common processing unit, is commonly used. Therefore, it is effective to improve the throughput by parallel processing and to simplify the processing unit that performs a part of the series of processing.

In the above-mentioned substrate processing apparatus 1, the processing unit of the first group may further include a second common processing unit that also belongs to the processing unit of the second group. At least a part of the second common processing unit may overlap above or below the first common processing unit at a position between the rotation holding unit 42A and the rotation holding unit 42B. If the rotation holding portions 42A and 42B are to be used for the processing in the first group and the processing in the second group, respectively, a certain area may be required between the rotation holding portions 42A and 42B. In the above configuration, by superimposing at least a part of the second common processing unit on the region generated between the rotation holding portions 42A and 42B, the region is effectively used in the top view. Therefore, it is useful for suppressing an increase in the installation area of the substrate processing apparatus 1.

[Second Embodiment]
The loading / unloading block (board loading / unloading section) of the board processing device is provided with two housing sections and two loading / unloading units corresponding to the two storage sections in place of one storage section and one loading / unloading unit. You may. 8 and 9 show the substrate processing apparatus 1A according to the second embodiment. The board processing device 1A is different from the board processing device 1 in that the input / output block 2A (board input / output section) is provided in place of the input / output block 2 and the processing block 4A is provided in place of the processing block 4.

The loading / unloading block 2A differs from the loading / unloading block 2 in that it has a loading / unloading unit 10A and a loading / unloading unit 10B instead of the loading / unloading unit 10, and has a housing section 12A and a housing section 12B instead of the housing section 12. do. As shown in FIG. 9, the accommodating portions 12A and the accommodating portions 12B are arranged at different positions from each other in the direction (X-axis direction) in which the plurality of carriers C supported by the carrier station 6 are arranged. The accommodating unit 12A is arranged between the loading / unloading unit 10A and the transport unit 20A, and the accommodating unit 12B is arranged between the loading / unloading unit 10B and the transport unit 20B.

The loading / unloading units 10A and 10B are configured in the same manner as the loading / unloading unit 10, but are loaded / unloaded at a point where the work W is taken out from a part (for example, two) of the plurality of carriers C on the carrier station 6. Different from unit 10. In one example, the loading / unloading unit 10A takes out the work W in the first state from the two carriers C located at the first and second positions counted from one end in the X-axis direction of the carrier station 6, and the loading / unloading unit 10B takes out the work W in the first state. The work W in the first state is taken out from the two carriers C located at the third and fourth positions.

The carry-in / out unit 10A accommodates (carries in) the work W taken out from the carrier C in the accommodating portion 12A. The carry-in / out unit 10B accommodates (carries in) the work W taken out from the carrier C in the accommodating portion 12B. The loading / unloading unit 10A and the loading / unloading unit 10B distribute the plurality of work Ws in the first state into the accommodating portion 12A and the accommodating portion 12B. As described above, the carry-in / out unit 10A and the carry-in / out unit 10B function as a substrate distribution unit for accommodating the work W in the first state in either the accommodating portion 12A or the accommodating portion 12B. The carry-in / out unit 10A carries out the work W in the second state from the accommodating portion 12A, and carries the work W in the second state carried out into the corresponding carrier C. The carry-in / out unit 10B carries out the work W in the second state from the accommodating portion 12B, and carries the work W in the second state carried out into the corresponding carrier C.

Each of the accommodating portions 12A and 12B has a plurality of cells arranged in the vertical direction, similarly to the accommodating portion 12. In the top view, the accommodating portion 12A is arranged between one end of the substrate processing apparatus 1A in the X-axis direction and the center of the substrate processing apparatus 1A in the X-axis direction, and is arranged closer to the center in the X-axis direction. ing. In the top view, the accommodating portion 12B is arranged between the other end of the substrate processing apparatus 1A in the X-axis direction and the center of the substrate processing apparatus 1A in the X-axis direction, and is arranged closer to the center in the X-axis direction. Has been done. In one example, in the X-axis direction, the position of the accommodating portion 12A corresponds to the transport portion 20A (substantially coincides), and the position of the accommodating portion 12B corresponds to the transport portion 20B (substantially coincides).

The accommodating portion 12A includes an inspection unit 60A (first inspection unit) that inspects at least one of the work W in the first state and the work W in the second state. The inspection unit 60A may be arranged in one of a plurality of cells included in the accommodating portion 12A. In this case, the inspection unit 60A may be arranged so that the longitudinal direction is along the direction in which the accommodating portion 12A and the accommodating portion 12B are aligned (X-axis direction), and the portion that does not overlap the accommodating portion 12A is larger than the accommodating portion 12A. It may be located on the outside in the X-axis direction. The inspection unit 60A may have a work W loading / unloading port at a portion overlapping the cell of the accommodating portion 12A. It is not necessary that the delivery position for delivering the work W in the inspection unit 60A overlaps with the accommodating portion 12A, and the inspection position located at the back of the inspection unit 60A with respect to the carry-in / exit port does not overlap with the accommodating portion 12A.

The accommodating portion 12B includes an inspection unit 60B (second inspection unit) that inspects at least one of the work W in the first state and the work W in the second state. The inspection unit 60B may be arranged in one of a plurality of cells included in the accommodating portion 12B. In this case, the inspection unit 60B may be arranged so that its longitudinal direction is along the X-axis direction, and the portion that does not overlap the accommodating portion 12B may be located outside the accommodating portion 12B in the X-axis direction. .. The distance between the inspection unit 60A and the inspection unit 60B may be substantially the same as the distance between the accommodation unit 12A and the accommodation unit 12B. The inspection unit 60B may have an inlet / outlet for the work W at a portion overlapping the cell of the accommodating portion 12B. It is not necessary that the delivery position for delivering the work W in the inspection unit 60B overlaps with the accommodating portion 12B, and the inspection position located at the back of the inspection unit 60B with respect to the carry-in / exit port does not overlap with the accommodating portion 12B.

The loading / unloading unit 10A may transport the work W in the first state or the second state between the cell of the accommodating portion 12A and the inspection unit 60A, and the work W in the first state may be transported from the carrier C to the inspection unit 60A. The work W in the second state may be transported from the inspection unit 60A to the carrier C. The loading / unloading unit 10B may transport the work W in the first state or the second state between the cell of the accommodating portion 12B and the inspection unit 60B, and the work W in the first state may be transported from the carrier C to the inspection unit 60B. The work W in the second state may be transported from the inspection unit 60B to the carrier C.

The processing block 4A differs from the processing block 4 in that it further has one liquid processing unit 40 arranged so as to be superposed on the three-layer liquid processing unit 40 instead of the plurality of inspection units 60. In the treatment block 4A, the treatment unit of the first group includes the heat treatment unit 50A and the liquid treatment unit 40, and the treatment unit of the second group includes the heat treatment unit 50B and the liquid treatment unit 40. The transport section 20A of the treatment block 4A transports the work W between the accommodating section 12A, the liquid treatment unit 40, and the heat treatment unit 50A. In the top view, the accommodating portion 12A, the heat treatment unit 50A, and the liquid treatment unit 40 (rotation holding portion 42A) are lined up along the outer edge of the transport region RA of the transport unit 20A.

The transport section 20B of the treatment block 4A transports the work W between the accommodating section 12B, the liquid treatment unit 40, and the heat treatment unit 50B. In the top view, the accommodating portion 12B, the heat treatment unit 50B, and the liquid treatment unit 40 (rotation holding portion 42B) are lined up along the outer edge of the transport region RB of the transport unit 20B. In the X-axis direction, the elevating drive unit 30 (first elevating actuator) of the transport unit 20A, the base 28 (first base) of the transport unit 20A, the base 28 (second base) of the transport unit 20B, and the transport. The elevating drive unit 30 (second elevating actuator) of the unit 20B may be arranged in this order. The base 28 of the transport unit 20A and the base 28 of the transport unit 20B may be arranged at intervals from each other in the X-axis direction.

The transport unit 20A carries out the work W in the first state from the storage unit 12A, and carries the work W in the second state by the processing unit (liquid treatment unit 40 and heat treatment unit 50A) of the first group into the storage unit 12A. do. When the work W in the first state is carried out from the accommodating unit 12A, the transport unit 20A may carry out the work W from the cell of the accommodating unit 12A, or may carry out the work W from the inspection unit 60A. .. When the work W in the second state is carried into the accommodating unit 12A, the transport unit 20A may carry the work W into the cell of the accommodating unit 12A, or may carry the work W into the inspection unit 60A. ..

The transport unit 20B carries out the work W in the first state from the storage unit 12B, and carries the work W in the second state by the processing unit (liquid treatment unit 40 and heat treatment unit 50B) of the second group into the storage unit 12B. do. When the work W in the first state is carried out from the accommodation unit 12B, the transport unit 20B may carry out the work W from the cell of the accommodation unit 12B, or may carry out the work W from the inspection unit 60B. .. When the work W in the second state is carried into the accommodating unit 12B, the transport unit 20B may carry the work W into the cell of the accommodating unit 12B, or may carry the work W into the inspection unit 60B. ..

In the film forming process executed by the substrate processing apparatus 1A, the inspection units 60A and 60B may inspect the work W in the first state during the process of receiving the work W from the outside. For example, the control device 100 (acceptance control unit 102) controls the loading / unloading unit 10A so as to transport the work W in the first state from the carrier C to the inspection unit 60A, and inspects the loaded work W in the inspection unit 60A. May be executed. The receiving control unit 102 controls the loading / unloading unit 10B so as to transport the work W in the first state different from the work W to be transported by the loading / unloading unit 10A from the carrier C to the inspection unit 60B, and the loaded work. The inspection of W may be performed by the inspection unit 60B.

In the film forming process executed by the substrate processing apparatus 1A, the inspection units 60A and 60B may inspect the work W in the second state during the process of sending the work W to the outside. For example, the control device 100 (delivery control unit 108) may cause the inspection unit 60A to inspect the work W in the second state carried into the inspection unit 60A by the transport unit 20A. The transmission control unit 108 may cause the inspection unit 60B to inspect the work W in the second state carried into the inspection unit 60B by the transport unit 20B.

(Effect of the second embodiment)
In the substrate processing apparatus 1A described above, similarly to the substrate processing apparatus 1, a series of processing by the processing unit of the first group and a series of processing by the processing unit of the second group are performed in parallel. It is possible to improve the throughput.

In the above-mentioned substrate processing apparatus 1A, the entry / exit block 2 has either the accommodating portion 12A and the accommodating portion 12B arranged at different positions in the horizontal direction, and the work W in the first state as either the accommodating portion 12A or the accommodating portion 12B. It may have a substrate distribution unit to be accommodated on one side. The transport unit 20A may carry out the work W in the first state from the accommodating unit 12A and carry the work W in the second state into the accommodating unit 12A. The transport unit 20B may carry out the work W in the first state from the accommodating unit 12B and carry the work W in the second state into the accommodating unit 12B. In this case, as compared with the case where one accommodating portion is provided, the loading / unloading operation of the work W by the transporting unit 20A and the transporting unit 20B with respect to the accommodating unit can be performed without being influenced by each other.

In the above-mentioned substrate processing apparatus 1A, the loading / unloading block 2 has a loading / unloading unit 10A for loading the work W in the first state into the accommodating portion 12A and unloading the work W in the second state from the accommodating portion 12A, and the loading / unloading unit 10A in the first state. It may have a loading / unloading unit 10B in which the work W is carried into the accommodating portion 12B and the work W in the second state is carried out from the accommodating portion 12B. Since a series of processes including the transfer operation are performed in parallel, the receiving and sending operation (input / output operation) of the work W may become a bottleneck. In the above configuration, the entry / exit operations can be performed in parallel, which is further effective in improving the throughput of the substrate processing apparatus.

In the above-mentioned substrate processing apparatus 1A, the accommodating portion 12A may include an inspection unit 60A that inspects at least one of the work W in the first state and the work W in the second state. The accommodating portion 12B may include an inspection unit 60B that inspects at least one of the work W in the first state and the work W in the second state. In this case, the work W can be inspected by taking advantage of the opportunity to temporarily make the work W stand by in the accommodating portion. Therefore, it is further effective in improving the throughput of the substrate processing apparatus.

In the above-mentioned substrate processing apparatus 1A, the transport unit 20A includes a first holding arm for holding the work W, a first base for supporting the first holding arm, and a first elevating actuator for raising and lowering the first base. You may have. The transport unit 20B may have a second holding arm for holding the work W, a second base for supporting the second holding arm, and a second lifting actuator for raising and lowering the second base. In one horizontal direction, the first elevating actuator, the first base, the second base, and the second elevating actuator are arranged in this order, and the first base and the second base are spaced apart from each other. May be arranged. In this case, the area between the first base and the second base can be used to perform maintenance of the transport units 20A and 20B.

Some elements of the substrate processing apparatus 1 according to the first embodiment may be applied to the above substrate processing apparatus 1A. For example, the loading / unloading block 2A of the substrate processing device 1A may have one loading / unloading unit 10 instead of the loading / unloading units 10A and 10B. In this case, the loading / unloading unit 10 functions as a substrate distribution unit that distributes the work W to the accommodating unit 12A or the accommodating unit 12B.

Some elements of the substrate processing apparatus 1A according to the second embodiment may be applied to the substrate processing apparatus 1 according to the first embodiment. For example, the loading / unloading block 2 of the substrate processing device 1 may include loading / unloading units 10A and 10B instead of one loading / unloading unit 10. The loading / unloading block 2 may include a loading / unloading unit 10 and may include housing units 12A and 12B instead of one storage unit 12.

[Third Embodiment]
In the substrate processing apparatus, the transport unit corresponding to the processing unit of the first group and the processing unit of the first group and the transport unit corresponding to the processing unit of the second group and the processing unit of the second group are mutually in the vertical direction. It may be arranged in different positions. 10 and 11 show the substrate processing apparatus 1B according to the third embodiment. The substrate processing apparatus 1B is different from the substrate processing apparatus 1A in that the entry / exit block 2B (board entry / exit portion) is provided in place of the entry / exit block 2A and the processing block 4B is provided in place of the processing block 4A. The processing block 4A has processing modules 78A to 78D. The processing modules 78A to 78D are stacked in this order from the top. An example of the processing modules 78A to 78D will be described later.

The entry / exit block 2B is an apparatus with the entry / exit block 2A in that it has the accommodation units 18A and 18B and the accommodation unit 68 in place of the accommodation units 12A and 12B, and further has the loading / unloading units 14A and 14B. As shown in FIG. 11, the accommodating unit 18A (third accommodating unit) is arranged side by side with the loading / unloading unit 10A in the Y-axis direction, and the accommodating unit 18B (fourth accommodating unit) is loaded / unloaded in the Y-axis direction. They are arranged side by side in the unit 10B. The accommodating portion 18A and the accommodating portion 18B are arranged at different positions in the X-axis direction.

The accommodating portion 18A may include a plurality of inspection units 60A (first inspection units) that inspect at least one of the work W in the first state and the work W in the second state. The plurality of inspection units 60A are arranged side by side in the vertical direction. The accommodating unit 18B may include a plurality of inspection units 60B (second inspection units) that inspect at least one of the work W in the first state and the work W in the second state. The plurality of inspection units 60B are arranged side by side in the vertical direction. The inspection units 60A and 60B are arranged so that their longitudinal directions are along the X-axis direction.

The loading / unloading unit 10A (third loading / unloading unit) located between the inspection unit 60A and the carrier station 6 takes out the work W in the first state before processing by the substrate processing device 1B from the carrier C and takes it out. The work W in one state is carried into the accommodating portion 18A (inspection unit 60A). The carry-in / out unit 10A carries out the work W in the second state after processing by the substrate processing device 1B from the accommodating unit 18A (inspection unit 60A), and carries in the work W in the second state carried out to the carrier C. The loading / unloading unit 10B (fourth loading / unloading unit) located between the inspection unit 60B and the carrier station 6 takes out the work W in the first state from the carrier C and takes out the work W in the first state in the accommodating portion 18B. Carry it into (inspection unit 60B). The carry-in / out unit 10B carries out the work W in the second state from the accommodating portion 18B (inspection unit 60B), and carries in the work W in the second state carried out into the carrier C.

The accommodating portion 68 is arranged between the accommodating portions 18A and 18B in the Y-axis direction and the processing block 4B, and is arranged between the accommodating portions 18A and 18B in the X-axis direction. The accommodating portion 68 includes accommodating portions 68A to 68D, as shown in FIG. Each of the accommodating portions 68A to 68D temporarily accommodates a plurality of work Ws in the first state, and temporarily accommodates a plurality of work Ws in the second state. Each of the accommodating portions 68A to 68D has, for example, a plurality of cells on which a plurality of work Ws are respectively placed, and the plurality of cells are arranged side by side in the vertical direction. The accommodating portions 68A to 68D are laminated in this order from the top. The height position of the accommodating portion 68A corresponds to (substantially matches) the height position of the processing module 78A. The height positions of the accommodating portions 68B to 68D correspond to (substantially match) the height positions of the processing modules 78B to 78D, as in the relationship between the height positions of the accommodating portions 68A and the processing modules 78A.

The carry-in / out unit 14A (first carry-in / out unit) is arranged so as to sandwich the accommodating portion 18A with the carry-in / out unit 10A in the Y-axis direction. The carry-in / out unit 14B (second carry-in / out unit) is arranged so as to sandwich the accommodating portion 18B with the carry-in / out unit 10B in the Y-axis direction. The carry-in / out unit 14A and the carry-in / out unit 14B are arranged at different positions in the X-axis direction. The loading / unloading unit 14A and the loading / unloading unit 14B sandwich the accommodating portion 68 in between.

The carry-in / out unit 14A has, for example, a holding arm 14a for holding the work W and a drive mechanism 14b for moving the holding arm 14a so as to convey the work W between the accommodating portion 18A and the accommodating portion 68. The carry-in / out unit 14B has, for example, a holding arm 14a for holding the work W and a drive mechanism 14b for moving the holding arm 14a so as to convey the work W between the accommodating portion 18B and the accommodating portion 68.

The carry-in / out unit 14A transports the work W in the first state from the accommodating portion 18A to any one of the accommodating portions 68A to 68D. The loading / unloading unit 14A transports the work W in the second state from the accommodating portion 68 (accommodating portions 68A to 68D) to the accommodating portion 18A. The carry-in / out unit 14B transports the work W in the first state from the accommodating portion 18B to any one of the accommodating portions 68A to 68D. The carry-in / out unit 14B conveys the work W in the second state from the accommodating portion 68 (accommodating portions 68A to 68D) to the accommodating portion 18B. The loading / unloading unit 14A and the loading / unloading unit 14B distribute the plurality of work Ws in the first state received in the substrate processing device 1B to the accommodating portions 68A to 68D. As described above, the carry-in / out unit 14A and the carry-in / out unit 14B function as a substrate distribution unit for accommodating the work W in the first state in any one of the accommodating units 68A to 68D.

The plurality of work Ws in the first state distributed to the accommodating portions 68A to 68D are subjected to a series of processing by the processing modules 78A to 78D. The processing modules 78A to 78D are configured in the same manner as each other, and the work W is subjected to the same series of processing (for example, the same processing for forming the same film) for changing the first state to the second state.

The processing module 78A has a plurality of processing units that perform a series of processing on the work W in the first state distributed to the accommodating unit 68A (first accommodating unit). The treatment module 78A has, for example, a liquid treatment unit 40 and a plurality of heat treatment units 50. The liquid treatment unit 40 and the plurality of heat treatment units 50 are arranged at the same height position as each other. The processing module 78A further includes a transport unit 70 (first transport unit) for transporting the work W between the accommodating portion 68A, the liquid treatment unit 40, and the heat treatment unit 50. In a top view, the transport unit 70 is arranged between the heat treatment unit 50 and the liquid treatment unit 40 in a direction orthogonal to the direction in which the plurality of heat treatment units 50 are arranged (X-axis direction in the figure).

The transport unit 70 transports the work W in a transport region located between the liquid treatment unit 40 and the plurality of heat treatment units 50. The transport area in which the work W is transported by the transport unit 70 extends in the direction in which the plurality of heat treatment units 50 are lined up (Y-axis direction in the figure). The transport unit 70 is different from the transport units 20A and 20B in that, for example, it further has a horizontal drive unit 72 and the elevating drive unit 30 is supported by the horizontal drive unit 72. The horizontal drive unit 72 is a horizontal actuator configured to move the elevating drive unit 30 along the Y-axis direction by a driving force of a motor or the like. The above-mentioned transport unit 70 transports the work W in the first state from the accommodating unit 68A to the liquid treatment unit 40, and accommodates the work W in the second state by the liquid treatment unit 40 and the heat treatment unit 50 of the processing module 78A. Transport up to 68A.

The processing module 78B has a plurality of processing units that perform the same series of processing as the series of processing by the processing module 78A on the work W in the first state distributed to the accommodating unit 68B (second accommodating unit). The treatment module 78B has, for example, a liquid treatment unit 40, a plurality of heat treatment units 50, and a transport unit 70 (second transport unit), similarly to the treatment module 78A. In the processing module 78B, the arrangement of the liquid processing unit 40, the heat treatment unit 50, and the transport unit 70 is the same as the arrangement of the corresponding members in the processing module 78A. The transport unit 70 of the processing module 78B transports the work W in the second state from the accommodating unit 68B to the liquid treatment unit 40, and the work W in the second state by the liquid treatment unit 40 and the heat treatment unit 50 of the treatment module 78B is transferred. Transport to the accommodating section 68B.

Similar to the processing modules 78A and 78B, the processing modules 78C and 78D also have a work W between the liquid treatment unit 40 and the heat treatment unit 50 for performing a series of treatments and the plurality of processing units and the accommodating units 68C and 68D. It has a transport unit 70 for transport. In the following, a plurality of processing units of the processing module 78A that performs a series of processing on the work W in the first state will be referred to as a “processing unit of the first group”, and the above series of processing will be performed on the work W in the first state. A plurality of processing units of the processing module 78B that performs the same series of processing are referred to as "second group processing units". In the substrate processing apparatus 1B, the processing unit of the first group includes the liquid processing unit 40 and the heat treatment unit 50 of the processing module 78A, and the processing unit of the second group includes the liquid processing unit 40 of the processing module 78B. It includes a heat treatment unit 50. Since the height positions of the processing module 78A and the processing module 78B are different from each other, the height positions of the processing unit of the first group and the processing unit of the second group are also different from each other.

The carry-in / out unit 14A and the carry-in / take-out unit 14B, which function as the board distribution unit, contain the work W in the first state, which is the processing target of the processing unit of the first group and the processing unit of the second group, in the accommodating unit 68A and the accommodating unit. It is housed in one of 68B (sorted). The loading / unloading unit 14A transports the work W in the first state to be processed by the processing unit of the first group and the processing unit of the second group from the accommodating unit 18A to either the accommodating unit 68A or the accommodating unit 68B. .. The carry-in / out unit 14B transports the work W in the first state to be processed by the processing unit of the first group and the processing unit of the second group from the accommodating unit 18B to either the accommodating unit 68A or the accommodating unit 68B. ..

In accepting the work W of the film forming process executed in the substrate processing apparatus 1B, the acceptance control unit 102 controls the carry-in / out unit 10A so as to transport the work W in the first state from the carrier C to the inspection unit 60A. The loading / unloading unit 10B is controlled so that the work W in the first state different from the transport target of the loading / unloading unit 10A is transported from the carrier C to the inspection unit 60B. The acceptance control unit 102 causes the inspection unit 60A to inspect the work W in the first state carried in by the carry-in / out unit 10A, and inspects the work W in the first state carried in by the carry-in / out unit 10B in the inspection unit 60B. To execute. The acceptance control unit 102 controls the carry-in / out unit 14A so as to transport the work W in the first state after inspection from the inspection unit 60A to any of the accommodating units 68A to 68D, and the work W in the first state after inspection. Is controlled from the inspection unit 60B to the loading / unloading unit 14B so as to be transported to any of the accommodating units 68A to 68D.

In a series of processing of the film forming process executed in the substrate processing apparatus 1B, the first processing control unit 104 performs a series of processing on the work W in the first state by the processing unit of the first group, and the second state. The processing module 78A is controlled so that the work W of the above is carried into the accommodating portion 68A. The second processing control unit 106 controls the processing module 78B so that the processing unit of the second group performs a series of processing on the work W in the first state and carries the work W in the second state into the accommodating unit 68B. ..

In the delivery of the work W for the film forming process executed in the substrate processing apparatus 1B, the delivery control unit 108 controls the loading / unloading unit 14A so as to transport the work W in the second state from the accommodating unit 68 to the inspection unit 60A. do. Further, the delivery control unit 108 controls the carry-in / out unit 10B so that the work W in the second state different from the carry target of the carry-in / out unit 14A is carried from the accommodating unit 68 to the inspection unit 60B. The delivery control unit 108 causes the inspection unit 60A to inspect the work W in the second state carried in by the carry-in / out unit 14A, and inspects the work W in the second state carried in by the carry-in / out unit 14B in the inspection unit 60B. To execute. The transmission control unit 108 controls the loading / unloading unit 10A so as to transport the work W in the second state after inspection from the inspection unit 60A to the carrier C, and the work W in the second state after inspection is carried from the inspection unit 60B to the carrier. The loading / unloading unit 10B is controlled so as to transport to C.

(Modification example)
The substrate processing apparatus includes an accepting block that accepts the work W in the first state from the outside and a sending block that sends the work W in the second state to the outside, instead of the input / output block that accepts and sends out the work W. May be good. FIG. 12 shows a substrate processing device 1C according to a modified example, in which the substrate processing device 1C includes a receiving block 2C and a sending block 80 instead of the input / output block 2B, and processing instead of the processing block 4B. It differs from the substrate processing apparatus 1B in that it includes the block 4C. The processing block 4C differs from the processing block 4B in that it does not have the processing modules 78C and 78D.

The receiving block 2C differs from the receiving block 2B in that it does not have a function of sending the work W in the second state out of the substrate processing apparatus and that the accommodating portion 68 does not include the accommodating portions 68C and 68D. The control device 100 (acceptance control unit 102) controls the acceptance block 2C so as to accept a plurality of work Ws from the outside, similar to the control to the substrate processing apparatus 1B. The loading / unloading block 2B and the receiving / loading block 2C have the loading / unloading unit 10 in place of the loading / unloading units 10A and 10B, and do not have the housing unit 18B and the loading / unloading unit 14B, but the storage unit 18A and the loading / unloading unit 14A. You may have.

The transmission block 80 is connected to the exposure device 86, and sends the work W in the second state by the processing modules 78A and 78B to the exposure device 86 (outside the substrate processing device 1C). The delivery block 80 is arranged under the processing modules 78A and 78B, for example, and has a storage unit 82 and a loading / unloading unit 84. The accommodating unit 82 temporarily accommodates the work W in the second state carried in by the loading / unloading units 14A and 14B. The carry-in / out unit 84 takes out the work W in the second state from the accommodating portion 82 and sends it out to the exposure apparatus 86. In the board processing apparatus 1C, the receiving block 2C and the sending block 80 function as a board input / output unit that receives the work W in the first state from the outside and sends the work W in the second state to the outside.

In the substrate processing devices 1B and 1C described above, as in the case of the substrate processing device 1, the transfer processing associated with the series of processing by the processing unit of the first group and the series of processing by the processing unit of the second group are performed in parallel. This can be done and is effective in improving throughput.

In the above substrate processing devices 1B and 1C, the processing unit of the first group and the processing unit of the second group may be arranged at different height positions from each other. The board entry / exit section is a storage section 68A arranged so as to correspond to the height position of the processing section of the first group, and a storage section arranged to correspond to the height position of the processing section of the second group. It may have a 68B and a substrate distribution unit for accommodating the work W in the first state in either the accommodating portion 68A or the accommodating portion 68B. In this case, in the top view, the processing unit of one group that performs the same series of processing and the processing unit of another group can be arranged in the same area, so that two or more groups that perform a series of processing in parallel can be arranged. It is effective in suppressing the increase in the installation area due to the processing unit.

In the above-mentioned substrate processing devices 1B and 1C, the substrate distribution unit may have an carry-in / out unit 14A and a carry-in / out unit 14B. The substrate loading / unloading portions are the accommodating portions 18A and accommodating portions 18B arranged at different positions in the horizontal direction, the loading / unloading unit 10A for loading the work W in the first state into the accommodating portion 18A, and the first accommodating portion 18B. It may further have a loading / unloading unit 10B for loading and unloading the work W in the state. The carry-in / out unit 14A may transport the work W in the first state from the accommodating portion 18A to either the accommodating portion 68A or the accommodating portion 68B. The carry-in / out unit 14B may transport the work W in the first state from the accommodating portion 18B to either the accommodating portion 68A or the accommodating portion 68B. In this case, since it is possible to perform two operations of distributing the horizontally distributed work Ws of two groups to different groups in the vertical direction in parallel, it is effective in improving the processing speed in the distribution of the work Ws in the vertical direction. Is.

The accommodating portion 18A may include an inspection unit 60A that inspects at least one of the work W in the first state and the work W in the second state. The accommodating portion 18B may include an inspection unit 60B that inspects at least one of the work W in the first state and the work W in the second state. In this case, the work W can be inspected by taking advantage of the opportunity to temporarily make the work W stand by in the accommodating portion. Therefore, it is further effective in improving the throughput of the substrate processing apparatus.

[Fourth Embodiment]
The substrate processing apparatus may perform a process of forming two or more types of films including a photosensitive film (for example, a resist film) and a process of developing the photosensitive film after the exposure process. 13 and 14 show the substrate processing apparatus 200 according to the fourth embodiment. The substrate processing apparatus 200 performs a series of treatments including the formation treatment of a plurality of coating films including a resist film on the work W in the first state before the treatment. The substrate processing apparatus 200 sends the work W in the second state obtained by performing a series of processes to an external exposure apparatus, and receives the work W after the exposure process. The substrate processing apparatus 200 applies a development process to the work W after the exposure process, and sends the work W after the development process to the outside.

The board processing device 200 includes, for example, an entry / exit block 202, a processing block 204, and an interface block 206. The entry / exit block 202 accepts a plurality of work Ws in the first state from the outside, and sends out the work Ws after the development process to the outside. The processing block 204 includes processing modules 220A to 220C for forming a plurality of coating films, and processing modules 220D for performing development processing. The processing modules 220A to 220D are stacked in this order from the bottom. Details of these processing modules will be described later.

The loading / unloading block 202 has, for example, a carrier station 6, a loading / unloading section 8, and a housing section 216. The accommodating portion 216 includes accommodating portions 216A to 216D, as shown in FIG. Each of the accommodating portions 216A to 216C temporarily accommodates the plurality of work Ws in the first state, and the accommodating portions 216D temporarily accommodates the plurality of work Ws after the development process. Each of the accommodating portions 68A to 68D has, for example, a plurality of cells on which a plurality of work Ws are respectively placed, and the plurality of cells are arranged side by side in the vertical direction.

The accommodating portions 216A to 216D are stacked in this order from the bottom. The height position of the accommodating portion 216A corresponds to (substantially matches) the height position of the processing module 220A. The height positions of the accommodating portions 216B to 216D correspond to (substantially match) the height positions of the processing modules 220B to 220D, as in the relationship between the height positions of the accommodating portions 216A and the processing module 220A. The carry-in / carry-out unit 10 of the carry-in / carry-out unit 8 transports (sorts) the work W in the first state from the carrier C to any of the accommodating units 216A to 216C. The carry-in / out unit 10 transports the work W after the development process from the accommodating portion 216D to the carrier C.

The plurality of work W conveyed to the accommodating portions 216A to 216C are subjected to a series of processing by the processing modules 220A to 220C. The processing modules 220A to 220C are configured in the same manner as each other, and perform the same series of processing on the work W. Each of the treatment modules 220A to 220C, for example, performs the formation of the lower layer film, the resist film, and the upper layer film and the cleaning treatment of the work W as a series of treatments.

The processing module 220A has a plurality of processing units that perform a series of processing on the work W in the first state conveyed (distributed) to the accommodating unit 216A (first accommodating unit). The treatment module 220A has, for example, as shown in FIG. 14, a liquid treatment unit U11, U12, U13, a plurality of cleaning treatment units U14, and a plurality of heat treatment units U2. These plurality of processing units are arranged at the same height position as each other.

The liquid treatment unit U11 supplies a treatment liquid for forming an underlayer film to the surface Wa of the work W in the first state. One of the heat treatment units U2 heat-treats the work W on which the coating film of the treatment liquid for forming the lower layer film is formed. The liquid treatment unit U12 supplies a treatment liquid (for example, resist) for forming a resist film to the surface Wa of the work W after forming the lower layer film. One of the heat treatment units U2 heat-treats the work W on which the resist coating film is formed. The liquid treatment unit U13 supplies a treatment liquid for forming an upper layer film to the surface Wa of the work W after forming the resist film. One of the heat treatment units U2 heat-treats the work W on which the coating film of the treatment liquid for forming the upper layer film is formed. The cleaning treatment unit U14 performs a cleaning treatment using a cleaning liquid on the back surface Wb of the work W after the upper layer film is formed.

The processing module 220A further includes a transport unit 230. The transport unit 230 transports the work W between the accommodating section 216A, the plurality of processing units described above, and the interface block 206.

The processing module 220A further includes an intermediate accommodating unit 240 that temporarily accommodates the work W to be processed in the middle of performing a series of processing. By accommodating the work W in the middle of a series of processes in the intermediate accommodating portion 240, the series of processes can be divided into "pre-stage process" and "post-stage process". In the following, one or a plurality of processing units that perform the processing of the previous stage before being accommodated by the intermediate accommodation unit 240 in the series of processing will be referred to as a “pre-stage processing unit”. One or a plurality of processing units that perform the subsequent processing after being accommodated by the intermediate storage unit 240 in the series of processing is referred to as a "post-stage processing unit". For example, the front-stage treatment unit includes liquid treatment units U11, U12, U13 and a plurality of heat treatment units U2, and the rear-stage treatment unit includes at least one cleaning treatment unit U14 (two cleaning units in the example shown in FIG. 14). The processing unit U14) is included.

The transport unit 230 includes a transport arm 232 (first transport arm) corresponding to the front-stage processing unit and a transport arm 234 (second transport arm) corresponding to the rear-stage processing unit. The transport arm 232 transports the work W housed in the accommodating portion 216A to the pre-stage processing unit, and transports the work W associated with the processing of the pre-stage processing unit. The transfer arm 232 carries the work W after the pre-stage processing by the pre-stage processing unit into the intermediate accommodating unit 240. The transport arm 234 transports the work W carried into the intermediate accommodating portion 240 by the transport arm 232 from the intermediate accommodating portion 240 to the subsequent processing unit. The transport arm 234 transports the work W after the post-processing by the post-processing unit (work W in the second state after a series of processing) to the interface block 206.

The processing module 220A includes a transfer area TR in which the work W is transferred by the transfer unit 230. The transport region TR is located at the central portion of the processing module 220A in the X-axis direction and extends in the Y-axis direction. The processing module 220A further includes a first processing region PR1 and a second processing region PR2 sandwiching the transport region TR in a direction perpendicular to the direction in which the transport region TR extends and the vertical direction (X-axis direction). .. In the first treatment region PR1, a plurality of heat treatment units U2 and one cleaning treatment unit U14 (a plurality of first treatment units) are arranged side by side in the Y-axis direction. In the second treatment region PR2, the liquid treatment units U11, U12, U13 and one cleaning treatment unit U14 (a plurality of second treatment units) are arranged side by side in the Y-axis direction.

When viewed from the vertical direction, at least a part of the intermediate accommodating portion 240 overlaps with the second processing region PR2. For example, the intermediate accommodating portion 240 is arranged so as to straddle the transport area TR and the second processing area PR2. The intermediate accommodating portion 240 faces a part of a plurality of first processing portions arranged in the first processing region PR1 in the X-axis direction. For example, the intermediate accommodating unit 240 faces the heat treatment unit U2, which is the farthest from the accommodating unit 216 among the plurality of heat treatment units U2, with a part of the member of the transport arm 232 interposed therebetween. In the example shown in FIG. 14, the ratio of the total width of the plurality of first treatment units (five heat treatment units U2 and cleaning treatment unit U14) to the width of the first treatment region PR1 in the Y-axis direction. In comparison, the ratio of the total width of the plurality of second treatment units (liquid treatment units U11, U12, U13 and cleaning treatment unit U14) to the width of the second treatment region PR2 in the Y-axis direction is small.

The processing module 220B stacked on the processing module 220A performs the same series of processing as the series of processing by the processing module 220A on the work W in the first state carried into the accommodating portion 216B (second accommodating portion). It has a plurality of processing units. Similar to the processing module 220A, the processing module 220B includes, for example, liquid processing units U11, U12, U13, a plurality of cleaning processing units U14, a plurality of heat treatment units U2, a transport unit 230, and an intermediate accommodating unit 240. Have. In the processing module 220B, the arrangement of these plurality of processing units and the like is the same as the arrangement of the corresponding processing units and the like in the processing module 220A. The transport unit 230 (conveyor arm 232, 234) of the processing module 220B transports the work W between the accommodating unit 216B, the plurality of processing units, the intermediate accommodating unit 240, and the interface block 206.

Similar to the processing modules 220A and 220B, the processing module 220C also has a plurality of processing units that perform a series of processes from the formation of the underlayer film to the cleaning process, a transport unit 230, and an intermediate accommodating unit 240. The processing module 220D includes a development processing unit U15 that performs development processing, a heat treatment unit U2 that performs heat treatment associated with the development processing, and a transport unit 238 that conveys the work W in the processing module 220D. In the following, a plurality of processing units of the processing module 220A that performs a series of processing on the work W in the first state will be referred to as a "processing unit of the first group", and the above series of processing will be performed on the work W in the first state. A plurality of processing units of the processing module 220B that performs the same series of processing are referred to as "second group processing units". A plurality of processing units of the processing module 220C that performs the same series of processing as the above series of processing on the work W in the first state is referred to as a “third group processing unit”.

The work W to be processed by the processing unit of the first group is not processed by the processing unit of the second group and the processing unit of the third group. Further, the work W to be processed by the processing unit of the second group is not processed by the processing unit of the second group and the processing unit of the third group. The work W to be transported by the transport unit 230 of the processing module 220A is not transported by the transport unit 230 of the other processing modules 220B and 220C. The work W to be transported by the transport unit 230 of the processing module 220B is not transported by the transport unit 230 of the other processing modules 220A and 220C.

The interface block 206 is connected to the exposure apparatus and has, for example, a storage unit 262 and a loading / unloading unit 264 as shown in FIG. A part of the accommodating unit 262 accommodates the work W in the second state by the processing unit of the first group and the processing unit of the second group of the processing modules 220A and 220B, and the remaining part of the accommodating unit 262 is. The work W after the exposure process is accommodated. The carry-in / out unit 264 sends the work W in the second state from the accommodating portion 262 to the exposure apparatus (outside of the substrate processing apparatus 200). The carry-in / out unit 264 receives the work W after the exposure process from the exposure apparatus and conveys the work W to the portion of the accommodating section 262 corresponding to the process module 220D. In the board processing apparatus 200, the entry / exit block 202 and the interface block 206 function as a board entry / exit section that receives the work W in the first state from the outside and sends the work W in the second state to the outside.

Subsequently, with reference to FIG. 15, the coating and developing process executed in the substrate processing apparatus 200 will be described as an example of the substrate processing method. FIG. 15 is a flowchart showing an example of a coating development process for one work W. In the following, as in the description of the film forming process shown in FIG. 7, the process section of the first group, the process section of the second group, and the process section of the third group (processing modules 78A to 78C) are selected. The group is used as the processing unit of the selected group. Among the transport units 70 of the processing modules 78A to 78C, the transport unit that performs transport associated with a series of processes by the processing unit of the selection group is designated as the selection transport unit, and the processing control unit that controls the processing unit and the selection transport unit of the selection group is designated. It is a selection processing control unit.

As shown in FIG. 15, the control device 100 first executes step S31. In step S31, for example, the control device 100 determines whether the work W to be processed is processed by the processing unit of the first group, the processing unit of the second group, or the processing unit of the third group. select. When the control device 100 selects the processing unit of the first group, it selects the transport unit 230 of the processing module 78A as the selective transport unit, and when the processing unit of the second group is selected, it serves as the selective transport unit. Select the transport unit 230 of the processing module 78B. When the control device 100 selects the processing unit of the third group, the control device 100 selects the transport unit 230 of the processing module 78C as the selective transport unit. The control device 100 selects a group for processing the work W to be processed and a transport unit for transport based on a predetermined operation schedule or according to the processing status of the processing unit of each group. May be good.

Next, the control device 100 executes step S32. In step S32, for example, the acceptance control unit 102 controls the carry-in / out unit 10 so as to take out the work W from any carrier C on the carrier station 6. Then, the acceptance control unit 102 controls the carry-in / out unit 10 so that the work W taken out from the carrier C is accommodated in the accommodation unit corresponding to the processing unit of the selection group among the accommodation units 216A to 216C.

Next, the control device 100 executes step S33. In step S33, for example, the selection processing control unit controls the processing unit and the selection transfer unit of the selection group so as to form a lower layer film on the surface Wa of the work W in the first state. In one example, the selection processing control unit transfers the transport arm 232 of the transport unit 230 so as to transport the work W in the first state from the storage unit corresponding to the selection group among the storage units 216A to 216C to the liquid processing unit U11. Control. Then, the selection processing control unit controls the liquid treatment unit U11 so as to form a coating film of the treatment liquid for forming the lower layer film on the surface Wa of the work W. After that, the selection process control unit controls the transfer arm 232 so as to transfer the work W on which the coating film is formed from the liquid treatment unit U11 to any heat treatment unit U2, and heat-treats the work W. The heat treatment unit U2 is controlled.

Next, the control device 100 executes step S34. In step S34, for example, the selection processing control unit controls the processing unit and the selection transfer unit of the selection group so as to form a resist film on the surface Wa of the work W after the lower layer film is formed. In one example, the selection process control unit controls the transfer arm 232 so that the work W after forming the lower layer film is transferred from the heat treatment unit U2 to the liquid treatment unit U12. Then, the selection processing control unit controls the liquid treatment unit U12 so as to form a resist coating film on the surface Wa of the work W. After that, the selection process control unit controls the transfer arm 232 so as to transfer the work W on which the resist coating film is formed from the liquid treatment unit U12 to any heat treatment unit U2, and heat-treats the work W. The heat treatment unit U2 is controlled.

Next, the control device 100 executes step S35. In step S35, for example, the selection processing control unit controls the processing unit and the selection transfer unit of the selection group so as to form an upper layer film on the surface Wa of the work W after forming the resist film. In one example, the selection process control unit controls the transfer arm 232 so that the work W after forming the resist film is transferred from the heat treatment unit U2 to the liquid treatment unit U13. Then, the selection processing control unit controls the liquid treatment unit U13 so as to form a coating film of the treatment liquid for forming the upper layer film on the surface Wa of the work W. After that, the selection process control unit controls the transfer arm 232 so as to transfer the work W on which the coating film is formed from the liquid treatment unit U12 to one of the heat treatment units U2, and heat-treats the work W. The heat treatment unit U2 is controlled.

Next, the control device 100 executes steps S36 and S37. In step S36, for example, the selection process control unit controls the transfer arm 232 so that the work W after the upper layer film is formed (work W on which the previous stage process has been performed) is transferred from the heat treatment unit U2 to the intermediate accommodating unit 240. .. In step S37, for example, the selection processing control unit controls the transfer arm 234 so that the work W accommodated in the intermediate accommodating unit 240 is transferred to one of the cleaning processing units U14 by the transfer arm 232. Then, the selection process control unit controls the cleaning process unit U14 so as to perform a cleaning process using the cleaning liquid on the back surface Wb of the work W. After that, the selection process control unit controls the transfer arm 234 so as to transfer the work W after the cleaning process (work W in the second state) to the accommodating unit 262 of the interface block 206.

Next, the control device 100 executes steps S38 and S39. In step S38, for example, the delivery control unit 108 controls the carry-in / out unit 264 so as to send the work W in the second state housed in the storage unit 262 to the exposure apparatus. In step S39, for example, the control device 100 receives the work W after the exposure process and controls the carry-in / out unit 264 so as to transfer the work W to the cell for the processing module 220D in the accommodating unit 262. Then, the control device 100 applies the development treatment and the heat treatment to the work W after the exposure treatment, and the development processing unit U15, the heat treatment unit U2, and the transport unit 238 so as to transport the work W after the development treatment to the accommodating portion 216D. To control.

Next, the control device 100 executes step S40. In step S40, for example, the control device 100 controls the loading / unloading unit 10 so as to transport the work W after the development process from the accommodating unit 12 to the carrier C. As a result, the coating and developing process for one work W is completed. In the coating development process for one work W described above, a series of processes (processes from the formation of the underlayer film to the cleaning process) for the work W to be processed are not performed by the processing unit of the unselected group, but are selected. Not transported by the transport section that is not.

The control device 100 includes a series of processing by the transport unit 230 of the processing module 220A for one group of work W and the processing unit of the first group, and the transport unit 230 and the second group of the processing module 220B for the work W of another group. The board processing apparatus 200 is made to execute a series of processing by the processing unit of the above in parallel. In the control device 100, a series of processing of the transport unit 230 of the processing module 220C and the processing unit of the third group for the work W of yet another group is also a series of processing by the processing unit of the first group and the processing unit of the second group. In parallel with this, the board processing apparatus 200 is made to execute.

(Modification example)
The arrangement of the intermediate accommodating portion 240 is not limited to the above example. The intermediate accommodating portion 240 may be arranged so as to overlap the first processing area PR1 and the transfer area TR, and may be arranged in the transfer area TR without overlapping the first processing area PR1 and the second processing area PR2. May be.

The intermediate accommodating portion 240 may be arranged between the liquid treatment units U11 and U12 and the liquid treatment unit U13 in the Y-axis direction. In this case, the pre-stage processing unit that performs the pre-stage processing in the series of processing includes the liquid treatment units U11 and U12, and the post-stage processing unit that performs the post-stage processing includes the liquid treatment unit U13 and the cleaning processing unit U14. May include. In this configuration, the number of processing units (including the cleaning processing unit U14) for carrying in and out the work W is substantially equal between the transfer arm 232 and the transfer arm 234 in one processing module, and the transfer arm The burden is distributed and the operating rate is further optimized. In the substrate processing method performed in this configuration, steps S35 and S36 shown in FIG. 15 are executed in the reverse order of these steps. That is, the work W is accommodated in the intermediate accommodating portion 240, and after being carried out from the intermediate accommodating portion 240, the work W is subjected to a treatment for forming an upper layer film.

As shown in FIG. 16, the floor (at least a part of the floor) separating the processing module 220A and the processing module 220B may be removed. In this case, in the processing module 220A and the processing module 220B, the processing block 204 may be configured so as to share one transfer arm 232A, one transfer arm 234A, and one intermediate accommodating portion 240A. This simplifies the device configuration. In the processing module 220A and the processing module 220B, the two liquid processing units U11 may be arranged in the vertical direction as in the example shown in FIG. 13, and the two liquid processing units are the same as the two liquid processing units U11. U12, U13 and two cleaning processing units U14 may be arranged in the vertical direction.

The transfer arm 232A is configured in the same manner as the transfer arm 232 except that it further has an elevating mechanism, and the transfer arm 234A is configured in the same manner as the transfer arm 234 except that it further has an elevating mechanism. The transfer arm 232A is provided for two liquid treatment units U11 and two liquid treatment units U12 arranged across the treatment module 220A and the treatment module 220B, and a heat treatment unit facing these liquid treatment units in the X-axis direction. The work W may be carried in and out. The transfer arm 234A is provided for two liquid treatment units U13 and two cleaning treatment units U14 arranged across the treatment module 220A and the treatment module 220B, and a heat treatment unit facing these treatment units in the X-axis direction. The work W may be carried in and out. The intermediate accommodating unit 240A differs from the intermediate accommodating unit 240 in that it has a plurality of accommodating cells corresponding to the height positions of both the processing module 220A and the processing module 220B. The number of accommodation cells in the intermediate accommodation unit 240A may be larger than the number of accommodation cells in one intermediate accommodation unit 240. Since the operating rate of the transfer arm 232A is lower than that of the transfer arm 232 in the example shown in FIG. 13, the above configuration can be easily realized.

In the above configuration in which the floor (a part of the floor) between the processing modules 220A and 220B is removed, the processing units that perform the same type of processing are arranged vertically (multiple processing units of different types are arranged along the Y-axis direction). Although they are arranged in order), it is not necessary that a plurality of processing units performing the same type of processing are arranged one above the other. Since the transfer arms 232A and 234A are shared by the processing modules 220A and 220B and both the transfer arms are accessible to both the processing modules 220A and 220B arranged vertically, a plurality of processing units performing the same type of processing can be arranged in the horizontal direction. They may be arranged side by side along (for example, in the Y-axis direction). For example, as shown in FIG. 16, two liquid treatment units U11 are arranged side by side in the treatment module 220A, and two liquid treatment units U12 are above the two liquid treatment units U11 (inside the treatment module 220B). They may be arranged side by side.

In the above configuration, the liquid supply equipment such as the pump and the liquid supply nozzle shared between the units performing the same type of processing are arranged in common or unified in the area having the same height as the target processing module. You may. The area having the same height as the target processing module is, for example, an empty space adjacent to the liquid processing unit in the processing module, or a space adjacent to the target processing module in the entry / exit block 202. By configuring as described above, the internal configuration of the device can be made more compact. Further, since a plurality of units of the same type are arranged side by side, it is possible to supply a more even treatment liquid in which the lift difference is suppressed between the units.

When the same type of liquid treatment units are arranged side by side, the two liquid treatment units may be integrated and some members may be shared as in the case of the liquid treatment units U1 in the first embodiment and the second embodiment. .. For example, instead of the two liquid treatment units U11, one liquid treatment unit U11 has two rotation holding portions arranged at the same height position, and the work W is held by each of the two rotation holding portions. On the other hand, it may have one liquid supply unit including one supply nozzle and one drive unit capable of supplying the processing liquid.

In the above example, among the plurality of processing modules, the transfer arm 232A and the transfer arm 234A are shared by the processing modules 220A and 220B that are adjacent to each other in the vertical direction. The processing block 204 may further have a processing module of the same type in order to further increase the processing efficiency. For example, another processing module may be provided on the processing module 220C, and the processing module 220C and another processing module may be configured in the same manner as the combination of the processing modules 220A and 220B.

The entry / exit block 202 may be configured in the same manner as the entry / exit block 2B of the substrate processing apparatus 1B according to the third embodiment. The processing block 204 may not include the processing module 78C, and may further include one or more processing modules configured in the same manner as the processing module 78A. In one processing module, each processing unit may be stacked in two or more layers in the vertical direction.

The processing block 204 may further include another processing module 220D that performs the same series of processing as the series of processing including the development processing performed in the processing module 220D. In this case, the first state before the series of treatments is the state before the exposure treatment is applied after the formation of the plurality of films and the development treatment is performed, and the second state after the series of treatments is the state after the exposure treatment and development. This is the state after processing. One processing module 220D has a developing processing unit U15 and a heat treatment unit U2 as a plurality of processing units (processing units of the first group) that perform a series of processing, and another processing module 220D performs a series of processing. It has a developing processing unit U15 and a heat treatment unit U2 as a plurality of processing units (processing units of the second group).

(Effect of Fourth Embodiment)
In the substrate processing apparatus 200 described above, similarly to the substrate processing apparatus 1, a series of processing by the processing unit of the first group and a series of processing by the processing unit of the second group are performed in parallel. This is effective in improving the throughput of the substrate processing apparatus.

In the above-mentioned substrate processing apparatus 200, the series of processing performed by each of the processing unit of the first group and the processing unit of the second group may include two or more liquid treatments using different treatment liquids. In this case, the transfer operation associated with two or more liquid treatments can be performed in parallel, and the throughput of each of the processing unit of the first group and the processing unit of the second group is improved. Therefore, it is effective in improving the throughput of the substrate processing apparatus that performs a series of processing including two or more liquid treatments.

In the above-mentioned substrate processing apparatus 200, the processing unit of the first group includes the intermediate accommodating unit 240, the pre-stage processing unit that performs the pre-stage processing of the series of processing for setting the second state, and the processing unit of the series. It may include a post-stage processing unit that performs post-stage processing. The transport unit 230 has a transport arm 232 that carries the work W processed by the front stage processing unit into the intermediate storage unit 240, and a work W that has been carried into the intermediate storage unit 240 by the transport arm 232 from the intermediate storage unit 240 to the rear stage. It has a transport arm 234 for transporting to the processing unit. In this case, since the transfer operation associated with the series of processes can be shared by the two transfer arms, the transfer unit can be simplified as compared with the case where the transfer operation associated with the series of processes is performed by one transfer arm. can.

In the above-mentioned substrate processing apparatus 200, the post-stage processing unit includes a cleaning processing unit U14 that cleans the work W with a cleaning liquid. In this case, since the transport arm corresponding to the post-stage processing portion is less likely to be contaminated due to the pre-stage processing portion, it is effective in preventing the adhesion of dirt to the back surface Wb of the work W after cleaning via the transport portion.

In the above-mentioned substrate processing apparatus 200, the work W is conveyed by the transfer unit 230, and the transfer area TR is sandwiched between the transfer area TR extending in the horizontal first direction and the transfer area TR in the first direction and the second direction perpendicular to the vertical direction. The first processing area PR1 and the second processing area PR2 to be sandwiched may be further provided. The processing unit of the first group may include a plurality of first processing units arranged in the first direction in the first processing area PR1 and a plurality of second processing units arranged in the first direction in the second processing area PR2. When viewed from the vertical direction, at least a part of the intermediate accommodating portion 240 overlaps with the second processing region PR2, and a part of the plurality of first processing portions sandwiches the transport region TR in the second direction. It may face the intermediate accommodating portion 240. In this case, the dead space that may occur due to the difference between the total width of the plurality of first processing units and the total width of the plurality of second processing units can be effectively used.

In the above-mentioned substrate processing apparatus 200, the intermediate accommodating unit 240 may be arranged between the pre-stage processing unit and the post-stage processing unit in the second processing area PR2. In this case, the overlapping portion between the transport area of the transport arm corresponding to the front-stage processing unit and the transport area of the transport arm corresponding to the rear-stage processing unit can be reduced. Therefore, it is more useful for simplifying the transport unit.

1,1A, 1B, 1C, 200 ... Board processing device, 2,2A, 2B, 202 ... In / out block, 10,10A, 10B ... Import / export unit, 14A, 14B ... Import / export unit, 12, 12A, 12B, 68 , 216 ... Accommodating section, 18A, 18B ... Accommodating section, 20A, 20B, 70, 230 ... Conveying section, 22 ... Holding arm, 28 ... Base, 30 ... Elevating drive section, 232,234 ... Conveying arm, 40, U11 , U12, U13 ... Liquid treatment unit, 42A, 42B ... Rotation holding unit, 44 ... Liquid supply unit, 50, 50A, 50B, U2 ... Heat treatment unit, 60, 60A, 60B ... Inspection unit, 80 ... Sending block, 206 ... Interface block.

Claims (17)

A board inlet / output section that accepts the board in the first state from the outside and sends the board in the second state to the outside.
A processing unit of a first group that includes two processing units that perform different processing from each other and performs a series of processing for changing the first state to the second state on the substrate of the first state.
A second group processing unit that includes two processing units that perform different processing from each other and performs the same series of processing as the series of processing performed by the first group processing unit on the substrate in the first state.
The substrate in the first state is transported from the substrate entry / exit section to the processing section of the first group, and the substrate in the second state by the processing section of the first group is transferred from the processing section of the first group to the substrate. The first transport section that transports to the input / output section and
The substrate in the first state is transported from the substrate entry / exit section to the processing section of the second group, and the substrate in the second state by the processing section of the second group is transferred from the processing section of the second group to the substrate. A substrate processing device including a second transport section for transporting to the input / output section. The processing unit of the first group includes a common processing unit that also belongs to the processing unit of the second group and an individual processing unit that does not belong to the processing unit of the second group.
The substrate processing apparatus according to claim 1, wherein the throughput of the common processing unit is larger than the throughput of the individual processing unit. The substrate processing apparatus according to claim 2, wherein the common processing unit includes an inspection unit that inspects a substrate conveyed by the first transfer unit and a substrate conveyed by the second transfer unit. The processing unit of the first group includes a first common processing unit that also belongs to the processing unit of the second group.
The first common processing unit is
A first holding unit that holds the substrate transported by the first transport unit, and
A second holding unit, which is arranged at a position different from that of the first holding unit in the horizontal direction and holds a substrate transported by the second transport unit, and a second holding unit.
The substrate processing apparatus according to claim 1, further comprising a substrate held in the first holding unit and a liquid supply unit capable of supplying the processing liquid to the substrate held in the second holding unit. The processing unit of the first group further includes a second common processing unit that also belongs to the processing unit of the second group.
The substrate according to claim 4, wherein at least a part of the second common processing unit overlaps above or below the first common processing unit at a position between the first holding unit and the second holding unit. Processing equipment. The board entry / exit section is
The first and second accommodations, which are arranged at different positions in the horizontal direction,
It has a substrate distribution unit for accommodating the substrate in the first state in either the first accommodating portion or the second accommodating portion.
The first transport unit carries out the substrate in the first state from the first storage unit, and carries the substrate in the second state into the first storage unit.
13. Board processing equipment. The substrate distribution unit is
A first loading / unloading unit that carries the substrate in the first state into the first accommodating portion and carries out the substrate in the second state from the first accommodating portion.
The substrate processing apparatus according to claim 6, further comprising a second loading / unloading unit that carries the substrate in the first state into the second accommodating portion and carries out the substrate in the second state from the second accommodating portion. The first accommodating unit includes a first inspection unit that inspects at least one of the substrate in the first state and the substrate in the second state.
The substrate processing apparatus according to claim 6 or 7, wherein the second accommodating portion includes a second inspection unit that inspects at least one of the substrate in the first state and the substrate in the second state. The first transport unit has a first holding arm for holding a substrate, a first base for supporting the first holding arm, and a first elevating actuator for raising and lowering the first base.
The second transport unit has a second holding arm for holding the substrate, a second base for supporting the second holding arm, and a second elevating actuator for raising and lowering the second base.
The first elevating actuator, the first base, the second base, and the second elevating actuator are arranged in this order in one horizontal direction, and the first base and the second base are arranged in this order. Is a substrate processing apparatus according to any one of claims 1 to 8, which is arranged at intervals from each other. The processing unit of the first group and the processing unit of the second group are arranged at different height positions.
The board entry / exit section is
The first accommodating portion arranged so as to correspond to the height position of the processing unit of the first group,
A second accommodating unit arranged so as to correspond to the height position of the processing unit of the second group,
The substrate processing apparatus according to claim 1 or 2, further comprising a substrate distribution portion for accommodating the substrate in the first state in either the first accommodating portion or the second accommodating portion. The board distribution unit has a first loading / unloading unit and a second loading / unloading unit.
The board entry / exit section is
The third and fourth accommodations, which are arranged at different positions in the horizontal direction,
A third loading / unloading unit for loading the substrate in the first state into the third housing unit, and a third loading / unloading unit.
The fourth accommodating portion further has a fourth loading / unloading unit for loading the substrate in the first state.
The first loading / unloading unit transports the substrate in the first state from the third accommodating portion to either the first accommodating portion or the second accommodating portion.
The substrate processing device according to claim 10, wherein the second loading / unloading unit conveys the substrate in the first state from the fourth accommodating portion to either the first accommodating portion or the second accommodating portion. The third accommodating unit includes a first inspection unit that inspects at least one of the substrate in the first state and the substrate in the second state.
The substrate processing apparatus according to claim 11, wherein the fourth accommodating portion includes a second inspection unit that inspects at least one of the substrate in the first state and the substrate in the second state. The one according to any one of claims 10 to 12, wherein the series of treatments performed by the processing unit of the first group and the processing unit of the second group each includes two or more liquid treatments using different treatment liquids. Board processing equipment. The processing unit of the first group performs the intermediate accommodating unit, the pre-stage processing unit that performs the pre-stage processing in the series of processing for setting the second state, and the post-stage processing in the series of processing. Including the post-stage processing unit
The first transport unit is
A first transfer arm that carries the substrate processed by the pre-stage processing unit into the intermediate storage unit, and
The substrate processing according to any one of claims 10 to 13, further comprising a second transport arm for transporting the substrate carried into the intermediate accommodating portion by the first transport arm from the intermediate accommodating portion to the post-stage processing unit. Device. The substrate processing apparatus according to claim 14, wherein the post-stage processing unit includes a cleaning processing unit that cleans the substrate after being carried out from the intermediate storage unit using a cleaning liquid. A transport area in which the substrate is transported by the first transport unit and extends in the horizontal first direction, and
Further, a first processing region and a second processing region sandwiching the transport region are provided in the first direction and the second direction perpendicular to the vertical direction.
The processing unit of the first group includes a plurality of first processing units arranged in the first direction in the first processing area, and a plurality of second processing units arranged in the first direction in the second processing area. ,
When viewed from the vertical direction, at least a part of the intermediate accommodating portion overlaps with the second processing region.
The substrate processing apparatus according to claim 14 or 15, wherein a part of the plurality of first processing units faces the intermediate storage unit with the transport region interposed therebetween in the second direction. The substrate processing apparatus according to claim 16, wherein the intermediate accommodating portion is arranged between the pre-stage processing unit and the post-stage processing unit in the second processing region.

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