JP3429964B2 - Substrate processing equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus having a plurality of processing units for performing a predetermined process on a substrate.

[0002]

2. Description of the Related Art A substrate processing apparatus is used to perform various processes on substrates such as semiconductor wafers, glass substrates for liquid crystal display devices, glass substrates for photomasks, and glass substrates for optical disks. For example, in a semiconductor device manufacturing process, a substrate processing apparatus in which each of a series of processing is unitized and a plurality of processing units are integrated is used in order to improve production efficiency.

FIG. 7 is a perspective view showing an example of a conventional substrate processing apparatus. The substrate processing apparatus of FIG. 7 has processing areas A and B and a transfer area C.

In the processing region A, a rotary coating unit (spin coater) 2a for coating a substrate with a processing liquid and a rotary developing unit (spin developer) 2b for developing a substrate are juxtaposed. Further, in the processing region B, a heating unit (hot plate) HP for performing heat treatment on the substrate and a cooling unit CP for performing cooling treatment on the substrate.
Are arranged in multiple stages. In the transfer area C, a transfer unit 5 that transfers a substrate is provided.

These processing areas A and B and the transfer area C
The substrate 100 is accommodated at one end side of the substrate 1 and
A loading / unloading device (indexer) 6 for loading and unloading 00 is arranged. The loading / unloading device 6 includes a substrate 10
A plurality of cassettes 61 for storing 0 and a transfer robot 62 for loading and unloading the substrate 100 are provided. The transfer robot 62 of the carry-in / carry-out device 6 moves in the direction of the arrow U, takes out the substrate 100 from the cassette 61 and transfers it to the transport unit 5, receives the substrate 100 which has been subjected to a series of processing from the transport unit 5, and receives the substrate 100. Return to 61.

The transfer unit 5 is arranged so that the substrate 1 is located within the transfer area C.
00 is carried in the direction of arrow S, and the substrate 100 is loaded into and unloaded from each of the processing units described above.
Moreover, the substrate 100 is transferred to and from the transfer robot 62.

[0007]

In the above conventional substrate processing apparatus, a plurality of processing units having different types of functions are arranged in a plane, and processing units having the same type of functions are vertically arranged in a plurality of stages. It is located in.

In recent years, the diameter of the substrate has been increasing in order to improve the productivity, and the size of each processing unit also increases as the diameter of the substrate increases. As a result, the substrate processing apparatus that integrates a plurality of processing units also becomes large, and its footprint (installation area) becomes large. Therefore, a substrate processing apparatus that can effectively use the space in the clean room is desired.

An object of the present invention is to provide a substrate processing apparatus capable of reducing the installation area.

[0010]

A substrate processing apparatus according to a first aspect of the present invention includes a plurality of layers arranged in a vertical direction, and each layer has one or a plurality of processing units. In the apparatus, the plurality of layers includes a first layer and a second layer arranged above the first layer, and the first layer is a first layer for processing a substrate using a predetermined processing liquid. The first processing unit is provided, and the second layer is provided with the second processing unit that performs the temperature processing on the substrate.

In the substrate processing apparatus according to the present invention, the first processing section of the first layer processes the substrate using the predetermined processing liquid, and the second layer is disposed above the first layer. Second
The temperature processing is performed on the substrate in the processing section. Therefore,
Since the plurality of processing units are hierarchically arranged for each processing function, the installation area can be reduced.

A substrate processing apparatus according to a second invention is the substrate processing apparatus according to the first invention, wherein the plurality of layers are the first
And a third layer arranged between the second layer and the second layer, and the third layer includes a third processing unit for adjusting the atmosphere of the first processing unit.

In the substrate processing apparatus according to the present invention, the atmosphere of the first processing section is adjusted by the third processing section of the third hierarchy arranged between the first hierarchy and the second hierarchy. Therefore, the atmosphere of the treatment using the treatment liquid in the first treatment section can be efficiently adjusted.

Further, since the first processing unit for performing processing using the processing liquid is arranged in the same layer as the first layer, when a liquid leak occurs, the influence on other processing units is small. Also, the state of treatment can be visually confirmed.

Further, since the second processing section for performing the temperature processing is arranged above the first processing section for performing the processing using the processing liquid via the third processing section for adjusting the atmosphere, 1
The processing section and the second processing section are unlikely to be affected by heat and atmosphere from the other side.

A substrate processing apparatus according to a third aspect of the present invention is the substrate processing apparatus according to the first or second aspect of the present invention, wherein transfer areas are arranged on the sides of a plurality of layers and each processing section is provided in the transfer area. A transport means for transporting the substrate is provided.

In the substrate processing apparatus according to the present invention, the transfer means provided in the transfer area can efficiently transfer the substrate between the processing units of different layers and between the processing units of the same layer.

A substrate processing apparatus according to a fourth invention is the substrate processing apparatus according to the first invention, the second invention or the third invention, above the transfer area, and in another area adjacent to the transfer area. It is provided with a separation plate that separates from.

In the substrate processing apparatus according to the present invention, since only the downward flow from above the transfer area can flow into the transfer area, the downward flow around the transfer area can flow into the transfer area. Concentration of downward flow is prevented. Therefore, the transport area can be kept in a good atmosphere.

[0020]

1 is a perspective view of a substrate processing apparatus according to an embodiment of the present invention, FIG. 2 is a front view of the substrate processing apparatus of FIG. 1, and FIG. 3 is a transfer area of the substrate processing apparatus of FIG. It is a front view of the main part seen. Further, FIG. 4 shows XX in FIG.
FIG. 5 is a sectional view taken along the line YY in FIG.
Further, FIG. 6 is a sectional view taken along line ZZ in FIGS. 4 and 5.

The substrate processing apparatus of FIG. 1 has processing regions A, B,
It has a carrying area C and a carrying-in / carrying-out area D. The processing areas A and B are arranged on both sides of the transfer area C, and are loaded and unloaded in the transfer area D.
Are arranged on one end side of the processing areas A, B and the transfer area C.

The processing area A includes a first layer A1, a second layer A2, a third layer A3 and a fourth layer A4 which are arranged in order from bottom to top. Similarly, the processing area B includes a first layer B1 and a second layer B arranged in order from bottom to top.
2, including a third layer B3 and a fourth layer B4.

The chemical system unit 1 is arranged in the first layer A1 of the processing area A. The chemical system unit 1 stores various processing liquids (chemical liquids), waste liquids, pumps, and exhaust systems. In the second layer A2, a plurality of rotary processing system units are arranged, and in the present embodiment, a plurality of rotary coating units (spin coaters) 2a for coating the substrate with the processing liquid are arranged.

At the third layer A3, ULPA (Ultra
a Low Penetration Air) filter, filter 31 such as chemical adsorption filter, and fan 3
A plurality of air conditioning units 3 consisting of two are arranged (see FIG. 6). A plurality of heat treatment units are arranged in the fourth layer A4. In the present embodiment, a plurality of cooling units (cooling plates) CP for cooling the substrate and a plurality of heating units (hot) for heating the substrate are used. Plates) HP are arranged in a plurality of stages.

The chemical system unit 1 supplies the treatment liquid, discharges the waste liquid, and exhausts the waste liquid to the upper rotary coating unit 2a. Further, the air conditioning unit 3 supplies clean air whose temperature and humidity are regulated to the lower rotary coating unit 2a to regulate the atmosphere of the rotary coating unit 2a.

In the first layer B1 of the processing area B, the chemical system unit 1 is arranged. In the second layer B2, a plurality of rotation processing system units are arranged, and in the present embodiment, a plurality of rotation type developing units (spin developers) 2b for developing the substrate are arranged. A plurality of air conditioning units 3 are arranged on the third layer B3. Fourth
A plurality of heat treatment system units are arranged in the layer B4 of
In this embodiment, the plurality of cooling units CP and the plurality of heating units HP are arranged in a plurality of stages.

The chemical system unit 1 supplies the processing liquid, discharges the waste liquid, and exhausts it to the upper rotary developing unit 2b. Further, the air adjusting unit 3 supplies clean air, the temperature and humidity of which are adjusted, to the lower rotary developing unit 2b to adjust the atmosphere of the rotary developing unit 2b.

In the transfer area C, a transfer unit 5 for transferring a substrate is provided so as to be movable along the processing areas A and B in the direction of arrow S and vertically movable in the direction of arrow W (see FIG. 6). There is.

The carry-in / carry-out area D includes a first floor D1, a second floor D2 and a third floor D3 which are arranged in order from bottom to top. In the first layer D1 of the carry-in / carry-out area D, a carry-in / carry-out device (indexer) 6 for storing the board and carrying in and carrying out the board is arranged. The loading / unloading device 6 includes a plurality of cassettes 61 for housing the substrates 100 and a transfer robot 62 for loading / unloading the substrates. An air conditioning unit 7 including a filter and a fan is arranged on the second floor D2. The electric control unit 8 is arranged in the third layer D3.

The transfer robot 62 of the carry-in / carry-out device 6 takes out the substrate 100 from the cassette 61, and transfers it to the carrying unit 5.
The substrate 100 that has been subjected to a series of processing is received from the transport unit 5 and returned to the cassette 61. The transport unit 5 transports the substrate 100 in the direction of the arrow S and the direction of the arrow W in the transport region C, carries in and out the substrate 100 with respect to each processing unit in the processing regions A and B, and The substrate 100 is transferred to and from the transfer robot 62.

On the upper part of the transfer area C, a separation plate 51 for separating the processing areas A and B adjacent to the transfer area C and the loading / unloading area D is provided so as to surround the transfer area C.
As a result, only the downward flow (downflow) from above the transfer area C can flow into the transfer area C, and the downward flow that hits the upper surfaces of the processing units in the processing areas A and B and the carry-in / out area D is transferred to the transfer area C. The downward flow is prevented from concentrating in the transfer area C by flowing into the inside. On the other end side of the processing areas A, B and the transfer area C, a manual power handling section 9 is provided.

In this embodiment, the chemical system unit 1, the rotary coating unit 2a, the rotary developing unit 2b, the air conditioning unit 3, the cooling unit CP and the heating unit HP.
Corresponds to the processing unit. The transport unit 5 corresponds to the transport means.

In the substrate processing apparatus of this embodiment, since the plurality of processing units are arranged hierarchically by function, the footprint (installation area) can be reduced. Also,
Since the processing units having different types of functions are arranged above and below, the transfer time of the substrate between the processing units of different types is shortened. Thereby, the processing efficiency is improved.

In particular, since the air adjusting unit 3 is arranged immediately above the rotary coating unit 2a and the rotary developing unit 2b, the atmosphere of the rotary coating process and the rotary developing process can be efficiently and favorably maintained. it can. Further, since the chemical system unit 1 is arranged immediately below the rotary coating unit 2a and the rotary developing unit 2b, it is possible to efficiently supply the processing liquid, discharge the waste liquid, and exhaust the liquid with a simple piping structure. .

Further, since the rotary coating unit 2a and the rotary developing unit 2b are arranged in the intermediate layer, the states of the rotary coating process and the rotary developing process can be easily visually checked.

Further, since the cooling unit CP and the heating unit HP are arranged above the rotary coating unit 2a and the rotary developing unit 2b via the air adjusting unit 3, the lower rotary coating unit 2a and the rotary coating unit 2b. The developing unit 2b and the upper cooling unit CP and heating unit HP are less susceptible to the heat and atmosphere from the other.

Moreover, since the rotary coating unit 2a and the rotary developing unit 2b are arranged in a plane in the same lower layer, the influence on other processing units is small when liquid leakage occurs.

Further, since the downward flow is not concentrated in the transfer area C by the separating plate 51, the substrate can be transferred in a good atmosphere.

In the loading / unloading area D, the loading / unloading device 6
Since the air conditioning unit 7 is arranged above the substrate, the substrates can be loaded and unloaded in a good atmosphere. Further, since the electrical control unit 8 is arranged at the uppermost part of the carry-in / carry-out area D, the installation area is reduced.

In the above embodiment, the second layer A2,
Although a rotary coating device 2a and a rotary developing device 2b are arranged in B2 as a rotary processing system unit, a rotary cleaning device, a peripheral portion instead of or in addition to the rotary coating device 2a or the rotary developing device 2b. You may arrange | position other rotation processing system units, such as an exposure apparatus.

In the above embodiment, the fourth layer A4,
Although the cooling unit CP and the heating unit HP are arranged in B4 as the heat treatment system unit, the cooling unit C
Instead of or in addition to P or the heating unit HP, another heat treatment system unit such as an adhesion strengthening unit that performs an adhesion strengthening process may be arranged.

Further, in the above embodiment, the loading / unloading area D
The loading / unloading device 6 is arranged in the first layer D1 of the interface device. However, instead of or in addition to the loading / unloading device 6, an interface device for transferring a substrate to / from another substrate processing device such as an exposure device. May be arranged, and the loading / unloading area D
The carry-in / carry-out device or the interface device may be disposed on the end side opposite to the side.

In the above embodiment, the processing areas A and B include a plurality of layers arranged vertically, and the processing units having the same kind of function are arranged in each layer. A plurality of processing units having different kinds of functions may be arranged on one side of B in a plane. In this case, since the plurality of processing units are arranged in a plurality of layers by function and the plurality of processing units having different types of functions are arranged in a plane, the installation area is reduced and a series of processing is performed. It is possible to efficiently carry the substrate between the processing units of different types according to the procedure.

[Brief description of drawings]

FIG. 1 is a perspective view of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a front view of the substrate processing apparatus of FIG.

FIG. 3 is a front view of a main part of the substrate processing apparatus of FIG. 1 viewed from a transfer area.

FIG. 4 is a sectional view taken along line XX in FIG.

5 is a cross-sectional view taken along the line YY in FIG.

FIG. 6 is a sectional view taken along line ZZ in FIGS. 4 and 5.

FIG. 7 is a perspective view showing an example of a conventional substrate processing apparatus.

[Explanation of symbols]

1 Chemical system unit 2a Rotary coating unit 2b Rotating developing unit 3,7 Air conditioning unit 5 Transport unit 6 Loading / unloading unit 8 Electric control unit 51 Separation plate A, B processing area C transport area D loading / unloading area A1, B1, D1 First level A2, B2, D2 Second level A3, B3, D3 Third level A4, B4 Fourth level CP cooling unit HP heating unit

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI H01L 21/30 569C 569D (72) Inventor Tsutomu Ueyama 322 Hazushi Furukawa-cho, Fushimi-ku, Kyoto Dai-Nippon Screen Mfg. Co., Ltd. (72) Inventor Ryuji, 322, Hazushi, Furukawa-cho, Fushimi-ku, Kyoto City, Daikoku Screen Manufacturing Co., Ltd., Rakusai Plant No. 1 within Dainippon Screen Mfg. Co., Ltd. (56) Reference JP-A-4-85812 (JP, A) JP-A-2-79413 (JP, A) JP-A-8-274143 (JP, A) JP-A-8-274143 (JP, A) Flat 8-111448 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/027 G03F 7/16 502 G03F 7/30 502 H01L 21/68

Claims (4)

(57) [Claims] 1. A substrate processing apparatus comprising a plurality of layers arranged in a vertical direction, each layer having one or a plurality of processing units, wherein the plurality of layers are a first layer and a first layer. And a second layer disposed above the first layer, the first layer includes a first processing unit that processes a substrate using a predetermined processing liquid, and the second layer is a substrate. A substrate processing apparatus comprising: a second processing unit that performs temperature processing. 2. The substrate processing apparatus according to claim 1, wherein the plurality of layers includes a third layer arranged between the first layer and the second layer, and the third layer. The substrate processing apparatus, wherein the third layer is provided with a third processing section for adjusting the atmosphere of the first processing section. 3. The substrate processing apparatus according to claim 1, wherein a transfer area is arranged at a side of each of the plurality of layers, and the transfer area transfers the substrate to each processing section. A substrate processing apparatus comprising means. 4. The substrate processing apparatus according to claim 1, 2, or 3, wherein a separation plate that separates from another area adjacent to the transfer area is provided above the transfer area. And a substrate processing apparatus.