JP2021180258A5 - - Google Patents

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Publication number
JP2021180258A5
JP2021180258A5 JP2020084828A JP2020084828A JP2021180258A5 JP 2021180258 A5 JP2021180258 A5 JP 2021180258A5 JP 2020084828 A JP2020084828 A JP 2020084828A JP 2020084828 A JP2020084828 A JP 2020084828A JP 2021180258 A5 JP2021180258 A5 JP 2021180258A5
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JP
Japan
Prior art keywords
protection circuit
photoelectric conversion
conversion device
pad
wiring
Prior art date
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Application number
JP2020084828A
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English (en)
Japanese (ja)
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JP7618392B2 (ja
JP2021180258A (ja
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Priority to JP2020084828A priority Critical patent/JP7618392B2/ja
Priority claimed from JP2020084828A external-priority patent/JP7618392B2/ja
Priority to US17/317,605 priority patent/US12176340B2/en
Priority to CN202110521172.3A priority patent/CN113675186B/zh
Publication of JP2021180258A publication Critical patent/JP2021180258A/ja
Publication of JP2021180258A5 publication Critical patent/JP2021180258A5/ja
Application granted granted Critical
Publication of JP7618392B2 publication Critical patent/JP7618392B2/ja
Active legal-status Critical Current
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JP2020084828A 2020-05-14 2020-05-14 光電変換装置、撮像システム、移動体 Active JP7618392B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2020084828A JP7618392B2 (ja) 2020-05-14 2020-05-14 光電変換装置、撮像システム、移動体
US17/317,605 US12176340B2 (en) 2020-05-14 2021-05-11 Photoelectric conversion apparatus having semiconductor substrates and protection circuits
CN202110521172.3A CN113675186B (zh) 2020-05-14 2021-05-13 光电转换装置、光电转换系统和可移动体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020084828A JP7618392B2 (ja) 2020-05-14 2020-05-14 光電変換装置、撮像システム、移動体

Publications (3)

Publication Number Publication Date
JP2021180258A JP2021180258A (ja) 2021-11-18
JP2021180258A5 true JP2021180258A5 (https=) 2023-05-18
JP7618392B2 JP7618392B2 (ja) 2025-01-21

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ID=78510396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020084828A Active JP7618392B2 (ja) 2020-05-14 2020-05-14 光電変換装置、撮像システム、移動体

Country Status (3)

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US (1) US12176340B2 (https=)
JP (1) JP7618392B2 (https=)
CN (1) CN113675186B (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023120317A1 (ja) * 2021-12-22 2023-06-29 キヤノン株式会社 半導体デバイス、光電変換システム、移動体
WO2024160459A1 (en) * 2023-01-31 2024-08-08 Ams-Osram Ag Wafer structure, optical sensor, and corresponding method of production
CN120813084B (zh) * 2025-09-05 2026-01-06 荣芯半导体(宁波)有限公司 一种图像传感器及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08317288A (ja) * 1995-05-19 1996-11-29 Sony Corp ゲート電極の駆動回路
JP4495512B2 (ja) * 2004-05-11 2010-07-07 パナソニック株式会社 固体撮像装置
JP2010021238A (ja) * 2008-07-09 2010-01-28 Sony Corp 半導体装置およびその製造方法
JP5843475B2 (ja) 2010-06-30 2016-01-13 キヤノン株式会社 固体撮像装置および固体撮像装置の製造方法
JP2012033894A (ja) * 2010-06-30 2012-02-16 Canon Inc 固体撮像装置
JP5693060B2 (ja) * 2010-06-30 2015-04-01 キヤノン株式会社 固体撮像装置、及び撮像システム
JP5451547B2 (ja) * 2010-07-09 2014-03-26 キヤノン株式会社 固体撮像装置
JP6124502B2 (ja) 2012-02-29 2017-05-10 キヤノン株式会社 固体撮像装置およびその製造方法
WO2016174758A1 (ja) * 2015-04-30 2016-11-03 オリンパス株式会社 固体撮像装置および撮像システム
US11373990B2 (en) * 2016-02-29 2022-06-28 Semtech Corporation Semiconductor device and method of stacking semiconductor die for system-level ESD protection
JP6755679B2 (ja) * 2016-03-04 2020-09-16 キヤノン株式会社 撮像装置
JP2019046864A (ja) 2017-08-30 2019-03-22 ソニーセミコンダクタソリューションズ株式会社 半導体装置及び電子機器

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