JP2021177561A5 - - Google Patents

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Publication number
JP2021177561A5
JP2021177561A5 JP2021111563A JP2021111563A JP2021177561A5 JP 2021177561 A5 JP2021177561 A5 JP 2021177561A5 JP 2021111563 A JP2021111563 A JP 2021111563A JP 2021111563 A JP2021111563 A JP 2021111563A JP 2021177561 A5 JP2021177561 A5 JP 2021177561A5
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JP
Japan
Prior art keywords
heat conductive
resin layer
conductive resin
electromagnetic wave
wave shielding
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Application number
JP2021111563A
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Japanese (ja)
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JP2021177561A (en
JP7351874B2 (en
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Priority claimed from JP2020145961A external-priority patent/JP2021005715A/en
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Publication of JP2021177561A publication Critical patent/JP2021177561A/en
Publication of JP2021177561A5 publication Critical patent/JP2021177561A5/ja
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Claims (4)

第１の熱伝導性樹脂層と、導電層と、第２の熱伝導性樹脂層とをこの順に備え、
前記第１の熱伝導性樹脂層及び前記第２の熱伝導性樹脂層が、それぞれ、シリコーン樹脂及び熱伝導性フィラーを含み、
前記熱伝導性フィラーは、粒度分布において、粒径１０μｍ以上１００μｍ以下の範囲に極大値を有する熱伝導性フィラー（Ｂ－１）と、粒径１μｍ以上１０μｍ未満の範囲に極大値を有する熱伝導性フィラー（Ｂ－２）と、粒径１μｍ未満の範囲に極大値を有する熱伝導性フィラー（Ｂ－３）と、を含む、
電磁波シールド性放熱シート。 A first heat conductive resin layer, a conductive layer, and a second heat conductive resin layer are provided in this order.
The first heat conductive resin layer and the second heat conductive resin layer contain a silicone resin and a heat conductive filler, respectively.
The heat conductive filler has a heat conductive filler (B-1) having a maximum value in a particle size range of 10 μm or more and 100 μm or less, and a heat conductive filler having a maximum value in a particle size range of 1 μm or more and less than 10 μm. Includes a sex filler (B-2) and a thermally conductive filler (B-3) having a maximum value in the range of particle size less than 1 μm.
Electromagnetic wave shielding heat dissipation sheet. 前記第１の熱伝導性樹脂層及び前記第２の熱伝導性樹脂層の厚さが、それぞれ、３ｍｍ以上である、請求項１に記載の電磁波シールド性放熱シート。The electromagnetic wave shielding heat dissipation sheet according to claim 1, wherein the thickness of the first heat conductive resin layer and the second heat conductive resin layer are 3 mm or more, respectively. 前記第１の熱伝導性樹脂層及び前記第２の熱伝導性樹脂層の少なくとも一方に複数の切り込みが形成されている、請求項１又は２に記載の電磁波シールド性放熱シート。 The electromagnetic wave shielding heat dissipation sheet according to claim 1 or 2 , wherein a plurality of notches are formed in at least one of the first heat conductive resin layer and the second heat conductive resin layer. 電子部品と、
請求項１～３のいずれか一項に記載の電磁波シールド性放熱シートと、
前記電子部品及び前記電磁波シールド性放熱シートを収容する筐体と、を備え、
前記電磁波シールド性放熱シートは、前記第１の熱伝導性樹脂層が前記電子部品に接触し、前記第２の熱伝導性樹脂層が前記筐体に接触するように配置されている、電子機器。 With electronic components
The electromagnetic wave shielding heat dissipation sheet according to any one of claims 1 to 3 and
A housing for accommodating the electronic component and the electromagnetic wave shielding heat dissipation sheet is provided.
In the electromagnetic wave shielding heat dissipation sheet , the first heat conductive resin layer is in contact with the electronic component, and the second heat conductive resin layer is in contact with the housing. machine.
JP2021111563A 2018-05-29 2021-07-05 Electronic equipment and electromagnetic shielding heat dissipation sheet Active JP7351874B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018102144 2018-05-29
JP2018102144 2018-05-29
JP2020145961A JP2021005715A (en) 2018-05-29 2020-08-31 Electronic apparatus and electromagnetic wave shielding heat dissipation sheet

Related Parent Applications (1)

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JP2020145961A Division JP2021005715A (en) 2018-05-29 2020-08-31 Electronic apparatus and electromagnetic wave shielding heat dissipation sheet

Publications (3)

Publication Number Publication Date
JP2021177561A JP2021177561A (en) 2021-11-11
JP2021177561A5 true JP2021177561A5 (en) 2022-05-31
JP7351874B2 JP7351874B2 (en) 2023-09-27

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ID=68697002

Family Applications (3)

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JP2020511834A Pending JPWO2019230607A1 (en) 2018-05-29 2019-05-24 Electronic equipment and electromagnetic radiation shielding heat radiation sheet
JP2020145961A Pending JP2021005715A (en) 2018-05-29 2020-08-31 Electronic apparatus and electromagnetic wave shielding heat dissipation sheet
JP2021111563A Active JP7351874B2 (en) 2018-05-29 2021-07-05 Electronic equipment and electromagnetic shielding heat dissipation sheet

Family Applications Before (2)

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JP2020511834A Pending JPWO2019230607A1 (en) 2018-05-29 2019-05-24 Electronic equipment and electromagnetic radiation shielding heat radiation sheet
JP2020145961A Pending JP2021005715A (en) 2018-05-29 2020-08-31 Electronic apparatus and electromagnetic wave shielding heat dissipation sheet

Country Status (3)

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JP (3) JPWO2019230607A1 (en)
TW (1) TW202003236A (en)
WO (1) WO2019230607A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111136851B (en) * 2019-12-31 2021-10-26 九牧厨卫股份有限公司 High-strength corrosion-resistant product and preparation method thereof
JP6805382B1 (en) * 2020-03-30 2020-12-23 Ｊｘ金属株式会社 Electromagnetic wave shield material
CN111315197A (en) * 2020-04-02 2020-06-19 深圳市龙航科技有限公司 Vehicle-mounted navigator with heat radiation structure
WO2023008538A1 (en) * 2021-07-29 2023-02-02 積水ポリマテック株式会社 Thermally conductive composition and cured product
JP2023087808A (en) * 2021-12-14 2023-06-26 オムロン株式会社 Mounting substrate and electric device mounted with mounting substrate
CN114628368B (en) * 2022-03-10 2022-11-11 深圳市赛元微电子股份有限公司 Electromagnetic shielding device of chip circuit module

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
JPH02102452U (en) * 1989-02-02 1990-08-15
JP3498823B2 (en) * 1996-04-30 2004-02-23 電気化学工業株式会社 Heat radiation spacer and its use
JP3372462B2 (en) * 1997-11-27 2003-02-04 電気化学工業株式会社 Rubber sheet manufacturing method
JPH11317591A (en) * 1998-05-07 1999-11-16 Porimatec Kk Thermally conductive electromagnetic shielding sheet
JP3313685B2 (en) * 1999-12-28 2002-08-12 北川工業株式会社 Heat radiator for electronic components
JP2002194306A (en) * 2000-12-26 2002-07-10 Sekisui Chem Co Ltd Heat-conductive sheet
JP2003224386A (en) * 2002-01-31 2003-08-08 Toyota Motor Corp Electronic device for automobile and housing for electronic device of vehicle
JP2005228955A (en) 2004-02-13 2005-08-25 Denki Kagaku Kogyo Kk Heat dissipation member, its manufacturing method and application
JP4798629B2 (en) * 2006-11-13 2011-10-19 北川工業株式会社 Thermally conductive electromagnetic shielding sheet and electromagnetic shielding structure
JP2012059811A (en) 2010-09-07 2012-03-22 Mochida Shoko Kk Heat dissipation sheet
JP5749536B2 (en) * 2011-03-28 2015-07-15 電気化学工業株式会社 Thermally conductive moldings and their applications
JP2015153743A (en) * 2014-02-19 2015-08-24 日立建機株式会社 Power storage device, and work machine mounting the same
JP2016186972A (en) * 2015-03-27 2016-10-27 東レ株式会社 Electromagnetic wave shield sheet, cured film formed by curing the same, method for producing metal foil-laminated electromagnetic wave shield sheet, laminate, and semiconductor device
JP2017112144A (en) 2015-12-14 2017-06-22 富士通株式会社 Electronic device, heat conduction member, and manufacturing method of electronic device

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