JP2021172708A - 密着性組成物、被覆基材および硬化物 - Google Patents
密着性組成物、被覆基材および硬化物 Download PDFInfo
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- JP2021172708A JP2021172708A JP2020075977A JP2020075977A JP2021172708A JP 2021172708 A JP2021172708 A JP 2021172708A JP 2020075977 A JP2020075977 A JP 2020075977A JP 2020075977 A JP2020075977 A JP 2020075977A JP 2021172708 A JP2021172708 A JP 2021172708A
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- 239000000853 adhesive Substances 0.000 title claims abstract description 36
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- 150000001875 compounds Chemical class 0.000 claims abstract description 81
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 52
- 150000002430 hydrocarbons Chemical group 0.000 claims abstract description 32
- 125000004122 cyclic group Chemical group 0.000 claims abstract description 21
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- 125000004430 oxygen atom Chemical group O* 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 21
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- 150000002736 metal compounds Chemical class 0.000 claims description 10
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052757 nitrogen Inorganic materials 0.000 claims description 8
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 229910052717 sulfur Inorganic materials 0.000 claims description 4
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 13
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- 230000009257 reactivity Effects 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
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- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
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- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 125000006294 amino alkylene group Chemical group 0.000 description 2
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- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
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- SKTCDJAMAYNROS-UHFFFAOYSA-N methoxycyclopentane Chemical compound COC1CCCC1 SKTCDJAMAYNROS-UHFFFAOYSA-N 0.000 description 2
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- KQAHMVLQCSALSX-UHFFFAOYSA-N decyl(trimethoxy)silane Chemical compound CCCCCCCCCC[Si](OC)(OC)OC KQAHMVLQCSALSX-UHFFFAOYSA-N 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- JWCYDYZLEAQGJJ-UHFFFAOYSA-N dicyclopentyl(dimethoxy)silane Chemical compound C1CCCC1[Si](OC)(OC)C1CCCC1 JWCYDYZLEAQGJJ-UHFFFAOYSA-N 0.000 description 1
- ZZNQQQWFKKTOSD-UHFFFAOYSA-N diethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OCC)(OCC)C1=CC=CC=C1 ZZNQQQWFKKTOSD-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 1
- LMZWUHSJGKPLLJ-UHFFFAOYSA-N dimethoxy-methyl-(2-trimethoxysilylethyl)silane Chemical compound CO[Si](C)(OC)CC[Si](OC)(OC)OC LMZWUHSJGKPLLJ-UHFFFAOYSA-N 0.000 description 1
- JVSWJIKNEAIKJW-UHFFFAOYSA-N dimethyl-hexane Natural products CCCCCC(C)C JVSWJIKNEAIKJW-UHFFFAOYSA-N 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- HGQSXVKHVMGQRG-UHFFFAOYSA-N dioctyltin Chemical compound CCCCCCCC[Sn]CCCCCCCC HGQSXVKHVMGQRG-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000005745 ethoxymethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])* 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 description 1
- 229910000042 hydrogen bromide Inorganic materials 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 229910000043 hydrogen iodide Inorganic materials 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- VKPSKYDESGTTFR-UHFFFAOYSA-N isododecane Natural products CC(C)(C)CC(C)CC(C)(C)C VKPSKYDESGTTFR-UHFFFAOYSA-N 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- XPMZASMGMPTBMA-UHFFFAOYSA-N methoxy-[2-[methoxy(dimethyl)silyl]ethyl]-dimethylsilane Chemical compound CO[Si](C)(C)CC[Si](C)(C)OC XPMZASMGMPTBMA-UHFFFAOYSA-N 0.000 description 1
- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 description 1
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- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 1
- AICOOMRHRUFYCM-ZRRPKQBOSA-N oxazine, 1 Chemical compound C([C@@H]1[C@H](C(C[C@]2(C)[C@@H]([C@H](C)N(C)C)[C@H](O)C[C@]21C)=O)CC1=CC2)C[C@H]1[C@@]1(C)[C@H]2N=C(C(C)C)OC1 AICOOMRHRUFYCM-ZRRPKQBOSA-N 0.000 description 1
- 125000005702 oxyalkylene group Chemical group 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- WHFQAROQMWLMEY-UHFFFAOYSA-N propylene dimer Chemical compound CC=C.CC=C WHFQAROQMWLMEY-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000003586 protic polar solvent Substances 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- LFXJGGDONSCPOF-UHFFFAOYSA-N trichloro(hexyl)silane Chemical compound CCCCCC[Si](Cl)(Cl)Cl LFXJGGDONSCPOF-UHFFFAOYSA-N 0.000 description 1
- NRYWFNLVRORSCA-UHFFFAOYSA-N triethoxy(6-triethoxysilylhexyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCCCC[Si](OCC)(OCC)OCC NRYWFNLVRORSCA-UHFFFAOYSA-N 0.000 description 1
- OSAJVUUALHWJEM-UHFFFAOYSA-N triethoxy(8-triethoxysilyloctyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCCCCCC[Si](OCC)(OCC)OCC OSAJVUUALHWJEM-UHFFFAOYSA-N 0.000 description 1
- SSJKCXJGZQPERR-UHFFFAOYSA-N triethoxy(ethoxymethyl)silane Chemical compound CCOC[Si](OCC)(OCC)OCC SSJKCXJGZQPERR-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- WUMSTCDLAYQDNO-UHFFFAOYSA-N triethoxy(hexyl)silane Chemical compound CCCCCC[Si](OCC)(OCC)OCC WUMSTCDLAYQDNO-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- CLNINTYKLBFSMM-UHFFFAOYSA-N triethoxy-(3,3,4,4-tetrafluoro-6-triethoxysilylhexyl)silane Chemical compound CCO[Si](OCC)(OCC)CCC(F)(F)C(F)(F)CC[Si](OCC)(OCC)OCC CLNINTYKLBFSMM-UHFFFAOYSA-N 0.000 description 1
- PAPVOVTVLRZQTM-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCCC[Si](OCC)(OCC)OCC PAPVOVTVLRZQTM-UHFFFAOYSA-N 0.000 description 1
- ZRKGYQLXOAHRRN-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropylsulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSCCC[Si](OCC)(OCC)OCC ZRKGYQLXOAHRRN-UHFFFAOYSA-N 0.000 description 1
- JCGDCINCKDQXDX-UHFFFAOYSA-N trimethoxy(2-trimethoxysilylethyl)silane Chemical compound CO[Si](OC)(OC)CC[Si](OC)(OC)OC JCGDCINCKDQXDX-UHFFFAOYSA-N 0.000 description 1
- IBMUMCCOQRVIMN-UHFFFAOYSA-N trimethoxy(methoxymethyl)silane Chemical compound COC[Si](OC)(OC)OC IBMUMCCOQRVIMN-UHFFFAOYSA-N 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- DFYXKQJTECUXCG-UHFFFAOYSA-N trimethoxy-(3,3,4,4,5,5,6,6-octafluoro-8-trimethoxysilyloctyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)C(F)(F)C(F)(F)C(F)(F)CC[Si](OC)(OC)OC DFYXKQJTECUXCG-UHFFFAOYSA-N 0.000 description 1
- MAFQBSQRZKWGGE-UHFFFAOYSA-N trimethoxy-[2-[4-(2-trimethoxysilylethyl)phenyl]ethyl]silane Chemical compound CO[Si](OC)(OC)CCC1=CC=C(CC[Si](OC)(OC)OC)C=C1 MAFQBSQRZKWGGE-UHFFFAOYSA-N 0.000 description 1
- MOHLXQASCNXZBW-UHFFFAOYSA-N trimethoxy-[2-[methoxy(dimethyl)silyl]ethyl]silane Chemical compound CO[Si](C)(C)CC[Si](OC)(OC)OC MOHLXQASCNXZBW-UHFFFAOYSA-N 0.000 description 1
- XOBUQYHVNGUALV-UHFFFAOYSA-N trimethoxy-[3-(3-trimethoxysilylpropoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCCC[Si](OC)(OC)OC XOBUQYHVNGUALV-UHFFFAOYSA-N 0.000 description 1
- VEOWZIOSKBEQFI-UHFFFAOYSA-N trimethoxy-[3-(3-trimethoxysilylpropylsulfanyl)propyl]silane Chemical compound CO[Si](OC)(OC)CCCSCCC[Si](OC)(OC)OC VEOWZIOSKBEQFI-UHFFFAOYSA-N 0.000 description 1
- PZJJKWKADRNWSW-UHFFFAOYSA-N trimethoxysilicon Chemical group CO[Si](OC)OC PZJJKWKADRNWSW-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- IFNXAMCERSVZCV-UHFFFAOYSA-L zinc;2-ethylhexanoate Chemical compound [Zn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O IFNXAMCERSVZCV-UHFFFAOYSA-L 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/16—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0803—Compounds with Si-C or Si-Si linkages
- C07F7/0805—Compounds with Si-C or Si-Si linkages comprising only Si, C or H atoms
- C07F7/0807—Compounds with Si-C or Si-Si linkages comprising only Si, C or H atoms comprising Si as a ring atom
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0834—Compounds having one or more O-Si linkage
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/10—Compounds having one or more C—Si linkages containing nitrogen having a Si-N linkage
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
- C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/60—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/62—Nitrogen atoms
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Paints Or Removers (AREA)
Abstract
Description
特許文献1では、パーヒドロポリシラザンからなる硬化被膜が、有機材料であるポリイミド樹脂に対して良好な密着性を示すことが報告されている。
特許文献2では、パーヒドロポリシラザンと金属粉末からなる組成物が、SUS基板に対して良好な密着性を示すことが報告されている。
特許文献3では、アミノ基を有するオルガノポリシラザン化合物とジメチルシロキサン化合物からなる組成物が、スライドガラスに対して良好な密着性を示すことが報告されている。
特許文献2の組成物でも、硬化被膜形成に高温条件が用いられており、特許文献1と同様の問題がある。
特許文献3の組成物は、密着が容易なスライドガラスに対する密着性は有しているものの、有機材料に対する密着性は不明である。
1. 下記一般式(1)
で示される環状オルガノシラザン化合物と、下記一般式(2)
で示されるアルコキシシラン化合物および/またはその部分加水分解縮合物を含む加水分解性基含有有機ケイ素化合物とを含む密着性組成物、
2. さらに、下記一般式(3)
で示されるビスアルコキシシラン化合物またはその部分加水分解縮合物を含む1の密着性組成物、
3. さらに、溶剤を含む1または2の密着性組成物、
4. 前記溶剤が、イソパラフィン化合物またはケイ素原子数2〜8のシリコーン化合物である1〜3のいずれかの密着性組成物、
5. さらに、チタン、アルミニウム、亜鉛およびスズからなる群より選ばれる少なくとも1種の金属化合物を含む1〜4のいずれかの密着性組成物、
6. 1〜5のいずれかの密着性組成物が硬化した硬化物、
7. 基材と、その上に形成された被膜とを有する被覆基材であって、
前記被膜が、1〜5のいずれかの密着性組成物から形成されたものである被覆基材、
8. 前記基材が、アクリル樹脂である7の被覆基材
を提供する。
[1]密着性組成物
本発明の密着性組成物は、下記一般式(1)で示される環状オルガノシラザン化合物(以下、環状オルガノシラザン化合物(1)という。)と、下記一般式(2)で示されるアルコキシシラン化合物(以下、アルコキシシラン化合物(2)という。)および/またはその部分加水分解縮合物を含む加水分解性基含有有機ケイ素化合物を含む。
R1の1価炭化水素基の具体例としては、メチル、エチル、n−プロピル、n−ブチル、n−ペンチル、n−ヘキシル、n−へプチル、n−オクチル、デシル基等の炭素数1〜10、好ましくは炭素数1〜6の直鎖状のアルキル基;イソプロピル、イソブチル、sec−ブチル、tert−ブチル、ネオペンチル、テキシル、2−エチルヘキシル基等の炭素数3〜10、好ましくは炭素数3〜8の分岐鎖状のアルキル基;シクロペンチル、シクロヘキシル基等の炭素数3〜10、好ましくは炭素数5〜6の環状アルキル基;ビニル、アリル(2−プロペニル)、1−プロペニル、ブテニル、ペンテニル等の炭素数2〜10、好ましくは炭素数2〜5のアルケニル基;フェニル、トリル基等の炭素数6〜10、好ましくは炭素数6〜7のアリール基;ベンジル、フェネチル基等の炭素数7〜10、好ましくは炭素数7〜8のアラルキル基等が挙げられる。
R2およびR3の1価炭化水素基の具体例としては、R1と同様の置換基が挙げられる。
R2が酸素原子を含む場合の1価炭化水素基の具体例としては、メトキシメチル、エトキシメチル、メトキシプロピル基等のアルキルオキシアルキル基等が挙げられる。
加水分解縮合に伴い対応するアルコールが生じるため、必要に応じてそれを加熱留去し、部分加水分解縮合物である加水分解性基含有シリコーン化合物を得ることができる。
水を加える場合は、メタノール、エタノール等のプロトン性極性溶媒、アセトニトリル、テトラヒドロフラン、ジメチルホルムアミド等の非プロトン性極性溶媒との混合物として加えてもよい。
加水分解縮合反応における反応温度は特に限定されないが、好ましくは0〜100℃、より好ましくは23〜70℃である。
R6は、O、S、NまたはSiを含んでいてもよい置換または非置換の炭素数1〜50、好ましくは1〜20、より好ましくは1〜8の2価炭化水素基を表す。
mおよびnは、それぞれ独立して、0、1または2の整数を表す。
qは、0〜20、好ましくは0〜15、より好ましくは0〜8の整数を表す。
このような炭素数2〜10の2価炭化水素基としては、上記R6で例示した置換基と同様の置換基が挙げられる。
溶剤の具体例としては、ペンタン、ヘキサン、シクロヘキサン、オクタン、イソオクタン、ノナン、デカン、ドデカン、イソドデカン等の炭素数5〜20の脂肪族炭化水素化合物;ベンゼン、トルエン、キシレン等の炭素数6〜10芳香族炭化水素化合物;ジエチルエーテル、テトラヒドロフラン、4−メチルテトラヒドロピラン、シクロペンチルメチルエーテル、ジオキサン等のエーテル化合物;酢酸エチル、酢酸イソプロピル、酢酸ブチル等のエステル化合物;アセトニトリル、N,N−ジメチルホルムアミド等の非プロトン性極性化合物;ジクロロメタン、クロロホルム等の塩素化炭化水素化合物;ヘキサメチルジシロキサン、トリス(トリメチルシロキシ)メチルシラン、オクタメチルシクロテトラシロキサン、デカメチルシクロペンタシロキサン等のケイ素数2〜10のシロキサン化合物等が挙げられ、これらの溶剤は、単独で用いても、2種以上を混合して用いてもよい。
これらの中でも、特に、安全性の点から、炭素数8〜12の脂肪族炭化水素化合物やケイ素数2〜8のシロキサン化合物が好ましい。
チタン化合物の具体例としては、オルトチタン酸テトラブチル、オルトチタン酸テトラメチル、オルトチタン酸テトラエチル、オルトチタン酸テトラプロピル、オルトチタン酸テトライソプロピル等のオルトチタン酸テトラアルキル、それらの部分加水分解縮合物、チタニウムアシレート等が挙げられる。
アルミ化合物の具体例としては、三水酸化アルミニウム、アルミニウムアルコラート、アルミニウムアシレート、アルミニウムアシレートの塩、アルミノシロキシ化合物、アルミニウム金属キレート化合物等が挙げられる。
亜鉛化合物の具体例としては、オクチル酸亜鉛、2−エチルヘキサン酸亜鉛等が挙げられる。
スズ化合物の具体例としては、ジオクチルチンジオクテート、ジオクチルチンジラウレート等が挙げられる。
金属化合物の使用量は特に限定されないが、触媒の効果を発揮させる観点から、組成物の質量に対して、好ましくは0.01〜10質量%、より好ましくは0.1〜5質量%である。
各成分の添加順序に制限はないが、加水分解の進行を極力少なくするという観点から、金属化合物は最後に加えることが好ましい。
次に、上記密着性組成物が硬化した硬化物および密着性組成物から得られた被膜を有する被覆基材について説明する。
上記密着性組成物は、通常、空気中の水分と反応して硬化して硬化物を与える。密着性組成物が溶媒を含む場合、硬化の際に予め溶媒を揮発させても、揮発させなくてもよく、揮発させながら硬化させてもよい。
硬化時の温度は、常温から加熱下が採用できる。この際の温度は基材に悪影響を与えない限り特に制限はないが、反応性を保つために通常0〜200℃、好ましくは0〜100℃、より好ましくは25〜50℃である。
ガラスとしては、Eガラス、Cガラス、石英ガラス等の一般的に用いられる種類のガラスを用いることができ、またガラス繊維でもよい。ガラス繊維はその集合物でもよく、例えば、繊維径が3〜30μmのガラス系(フィラメント)の繊維束、撚糸、織物等でもよい。
なお、基材の形状は、特に限定されないが、板状、シート状、繊維状または粉末状のいずれでもよい。
また、シリカ、アルミナ、タルク、炭酸カルシウム等の粉末状の材料においては、基材とともに上記密着性組成物を直接ミキサーやミルで混合する混合法を採用してもよい。
得られたろ液を濃縮して、蒸留精製を行ったところ、100℃/1kPaの留分として、2,4,6−トリメチル−2,4,6−トリビニルシクロトリシラザン(環状オルガノシラザン化合物1)を29.4g得た(収率57%)。
得られたろ液を濃縮し、環状オルガノシラザン化合物の混合物を123.1g得た。ガスクロマトグラフィーでの分析の結果、p=3の化合物が81質量%、p=4の化合物が16質量%、p=5の化合物が2質量%及びp=6の化合物が1質量%含まれていた。
この反応液にイソパラフィン溶剤105gを加え、無色透明溶液の組成物(濃度50質量%)210.0gを得た。
得られた組成物をIR分析に供したところ、Si−N−Si構造に由来するピーク922cm-1、NHに由来するピーク3,370cm-1が観測された。また、下記の条件でGPC分析を行ったところ、重量平均分子量2,700であり、目的のポリシラザン1の生成が支持された。
実施例および比較例で使用した化合物を下記に示す。
(1)オルガノシラザン化合物
環状オルガノシラザン化合物1:合成例1
環状オルガノシラザン化合物2:合成例2
ポリシラザン化合物1:比較合成例1で得られた下記式で示される化合物
KC−89S:R2=メチル基、R3=メチル基(信越化学工業(株)製)
KR−401N:R2=メチル基、フェニル基;R3=メチル基(信越化学工業(株)製)
X−40−9250:R2=メチル基;R3=メチル基(信越化学工業(株)製)
KR−510:R2=メチル基、フェニル基;R3=メチル基(信越化学工業(株)製)
KR−400:R2=メチル基;R3=メチル基(金属化合物内添型)(信越化学工業(株)製)
KBM−13:R2=メチル基、R3=メチル基(信越化学工業(株)製、メチルトリメトキシシラン)
ビスアルコキシシラン化合物1:1,8−ビストリメトキシシリルオクタン(下記式)
溶媒1:イソパラフィン溶剤(メルベイユ30、東亜石油(株)製)
溶媒2:シリコーン溶剤(KF−96−1CS、信越化学工業(株)製)
金属化合物1:アルコキシチタン化合物(D−25、信越化学工業(株)製)
金属化合物2:アルミキレート化合物(DX−9740、信越化学工業(株)製)
調製した組成物を磨き鋼板(10cm×15cm)上にバーコーターでウエット厚さ30μとなるように塗布した後、25℃、50%相対湿度の環境下で硬化させた。その後、30分おきに試験片の塗布面に指を押し当て、指の跡が付かなくなるまでの時間(指触乾燥時間、タックフリータイム)を測定し、下記基準により評価した。結果を表1に併せて示す。
◎:30分未満内に指の跡が付かなくなる。
○:30分以上1時間未満内に指の跡が付かなくなる。
△:1時間以上3時間未満内に指の跡が付かなくなる。
×:指の跡が付かなくなるまで到達するのに5時間以上必要または硬化しない。
調製した組成物を、アルミ板(Al5052、アズワン(株)製)、SUS板(SUS304、アズワン(株)製)、アクリル板(PMMA、アズワン(株)製)のそれぞれにスポンジで塗布した後、50℃、50%相対湿度で2時間硬化させた。得られた試験片をさらに室温で2日間放置し、作製した塗膜に対してクロスカット試験(JIS K 5600に準拠)を実施し、テープ剥離後の塗膜の残存の程度を下記基準により評価した。結果を表1に併せて示す。
◎:ほとんど塗膜が剥がれていない。
○:塗膜が70%以上残存している。
△:塗膜の残存率が30%以上70%未満である。
×:塗膜の残存率が30%未満である。
一方、環状オルガノシラザン化合物を含まない比較例の組成物では、一部の金属に対してしか密着性を示さず、加水分解性基含有シリコーン樹脂とポリシラザン化合物からなる組成物は、金属には密着するものの、ポリメチルメタクリレートには全く密着しないことがわかる。
Claims (8)
- さらに、溶剤を含む請求項1または2記載の密着性組成物。
- 前記溶剤が、イソパラフィン化合物またはケイ素原子数2〜8のシリコーン化合物である請求項1〜3のいずれか1項記載の密着性組成物。
- さらに、チタン、アルミニウム、亜鉛およびスズからなる群より選ばれる少なくとも1種の金属化合物を含む請求項1〜4いずれか1項記載の密着性組成物。
- 請求項1〜5のいずれか1項記載の密着性組成物が硬化した硬化物。
- 基材と、その上に形成された被膜とを有する被覆基材であって、
前記被膜が、請求項1〜5のいずれか1項記載の密着性組成物から形成されたものである被覆基材。 - 前記基材が、アクリル樹脂である請求項7記載の被覆基材。
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