JP2021166284A5 - - Google Patents
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- JP2021166284A5 JP2021166284A5 JP2021043156A JP2021043156A JP2021166284A5 JP 2021166284 A5 JP2021166284 A5 JP 2021166284A5 JP 2021043156 A JP2021043156 A JP 2021043156A JP 2021043156 A JP2021043156 A JP 2021043156A JP 2021166284 A5 JP2021166284 A5 JP 2021166284A5
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- 239000000758 substrate Substances 0.000 claims 51
- 238000000034 method Methods 0.000 claims 23
- 238000001878 scanning electron micrograph Methods 0.000 claims 5
- 238000010801 machine learning Methods 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 2
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/821,831 | 2020-03-17 | ||
| US16/821,831 US11321835B2 (en) | 2020-03-17 | 2020-03-17 | Determining three dimensional information |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021166284A JP2021166284A (ja) | 2021-10-14 |
| JP2021166284A5 true JP2021166284A5 (enExample) | 2024-03-27 |
| JP7648410B2 JP7648410B2 (ja) | 2025-03-18 |
Family
ID=77677735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021043156A Active JP7648410B2 (ja) | 2020-03-17 | 2021-03-17 | 3次元情報の決定 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US11321835B2 (enExample) |
| JP (1) | JP7648410B2 (enExample) |
| KR (1) | KR102765100B1 (enExample) |
| CN (1) | CN113405493B (enExample) |
| TW (1) | TWI859429B (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11288174B2 (en) | 2020-02-19 | 2022-03-29 | Applied Materials Israel Ltd. | Testing a code using real time analysis |
| US11443420B2 (en) * | 2020-12-28 | 2022-09-13 | Applied Materials Israel Ltd. | Generating a metrology recipe usable for examination of a semiconductor specimen |
| US12480898B2 (en) | 2022-09-01 | 2025-11-25 | Applied Materials Israel Ltd. | Z-profiling of wafers based on X-ray measurements |
| JP7754058B2 (ja) * | 2022-11-11 | 2025-10-15 | トヨタ自動車株式会社 | 情報処理装置、情報処理方法、及び情報処理プログラム |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3490490B2 (ja) * | 1994-01-28 | 2004-01-26 | 株式会社東芝 | パターン画像処理装置及び画像処理方法 |
| US6246787B1 (en) * | 1996-05-31 | 2001-06-12 | Texas Instruments Incorporated | System and method for knowledgebase generation and management |
| JP3961657B2 (ja) * | 1998-03-03 | 2007-08-22 | 株式会社東芝 | パターン寸法測定方法 |
| US6670610B2 (en) | 2001-11-26 | 2003-12-30 | Applied Materials, Inc. | System and method for directing a miller |
| WO2005008223A2 (en) * | 2003-07-18 | 2005-01-27 | Applied Materials Israel, Ltd. | Methods for defect detection and process monitoring based on sem images |
| CN1947149B (zh) * | 2003-10-08 | 2016-06-08 | 应用材料以色列公司 | 校准系统及校准方法 |
| US8392418B2 (en) * | 2009-06-25 | 2013-03-05 | University Of Tennessee Research Foundation | Method and apparatus for predicting object properties and events using similarity-based information retrieval and model |
| US8098926B2 (en) * | 2007-01-10 | 2012-01-17 | Applied Materials Israel, Ltd. | Method and system for evaluating an evaluated pattern of a mask |
| US7667858B2 (en) * | 2007-01-12 | 2010-02-23 | Tokyo Electron Limited | Automated process control using optical metrology and a correlation between profile models and key profile shape variables |
| US7511835B2 (en) * | 2007-04-12 | 2009-03-31 | Tokyo Electron Limited | Optical metrology using a support vector machine with simulated diffraction signal inputs |
| US8709269B2 (en) | 2007-08-22 | 2014-04-29 | Applied Materials Israel, Ltd. | Method and system for imaging a cross section of a specimen |
| KR101286240B1 (ko) * | 2007-10-23 | 2013-07-15 | 삼성전자주식회사 | 반도체 구조물의 형상을 예정하는 공정 파라 메타의 예측시스템, 상기 공정 파라 메타의 예측 시스템을 가지는반도체 제조 장비 및 그 장비의 사용방법 |
| US20090296073A1 (en) | 2008-05-28 | 2009-12-03 | Lam Research Corporation | Method to create three-dimensional images of semiconductor structures using a focused ion beam device and a scanning electron microscope |
| JP5479782B2 (ja) | 2009-06-02 | 2014-04-23 | 株式会社日立ハイテクノロジーズ | 欠陥画像処理装置、欠陥画像処理方法、半導体欠陥分類装置および半導体欠陥分類方法 |
| JP2011027461A (ja) * | 2009-07-22 | 2011-02-10 | Renesas Electronics Corp | パターン形状計測方法、半導体装置の製造方法、およびプロセス制御システム |
| CA2850799C (en) * | 2011-10-14 | 2016-11-15 | Ingrain, Inc. | Dual image method and system for generating a multi-dimensional image of a sample |
| US8838422B2 (en) * | 2011-12-11 | 2014-09-16 | Tokyo Electron Limited | Process control using ray tracing-based libraries and machine learning systems |
| EP3336608A1 (en) * | 2016-12-16 | 2018-06-20 | ASML Netherlands B.V. | Method and apparatus for image analysis |
| WO2019006222A1 (en) * | 2017-06-30 | 2019-01-03 | Kla-Tencor Corporation | SYSTEMS AND METHODS FOR PREDICTING DEFECTS AND CRITICAL DIMENSION USING DEEP LEARNING IN A SEMICONDUCTOR MANUFACTURING PROCESS |
| EP3451061A1 (en) * | 2017-09-04 | 2019-03-06 | ASML Netherlands B.V. | Method for monitoring a manufacturing process |
| CA3076181A1 (en) * | 2017-09-15 | 2019-03-21 | Saudi Arabian Oil Company | Inferring petrophysical properties of hydrocarbon reservoirs using a neural network |
| JP6937254B2 (ja) * | 2018-02-08 | 2021-09-22 | 株式会社日立ハイテク | 検査システム、画像処理装置、および検査方法 |
| US11393084B2 (en) * | 2018-04-10 | 2022-07-19 | Hitachi, Ltd. | Processing recipe generation device |
| TWI694537B (zh) * | 2018-07-08 | 2020-05-21 | 香港商康代影像技術方案香港有限公司 | 用於失準補償之系統及方法 |
| US10811219B2 (en) | 2018-08-07 | 2020-10-20 | Applied Materials Israel Ltd. | Method for evaluating a region of an object |
| US20200027021A1 (en) * | 2019-09-27 | 2020-01-23 | Kumara Sastry | Reinforcement learning for multi-domain problems |
-
2020
- 2020-03-17 US US16/821,831 patent/US11321835B2/en active Active
-
2021
- 2021-03-15 TW TW110109090A patent/TWI859429B/zh active
- 2021-03-17 KR KR1020210034550A patent/KR102765100B1/ko active Active
- 2021-03-17 JP JP2021043156A patent/JP7648410B2/ja active Active
- 2021-03-17 CN CN202110287046.6A patent/CN113405493B/zh active Active
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