KR102765100B1 - 3차원 정보의 결정 - Google Patents

3차원 정보의 결정 Download PDF

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KR102765100B1
KR102765100B1 KR1020210034550A KR20210034550A KR102765100B1 KR 102765100 B1 KR102765100 B1 KR 102765100B1 KR 1020210034550 A KR1020210034550 A KR 1020210034550A KR 20210034550 A KR20210034550 A KR 20210034550A KR 102765100 B1 KR102765100 B1 KR 102765100B1
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KR20210117195A (ko
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안나 레반트
라파엘 비스트리처
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어플라이드 머티리얼즈 이스라엘 리미티드
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/97—Determining parameters from multiple pictures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
    • G01B15/04—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring contours or curvatures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/24—Classification techniques
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T17/00—Three dimensional [3D] modelling, e.g. data description of 3D objects
    • G06T17/20—Finite element generation, e.g. wire-frame surface description, tesselation
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0012—Biomedical image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/50—Depth or shape recovery
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/77—Processing image or video features in feature spaces; using data integration or data reduction, e.g. principal component analysis [PCA] or independent component analysis [ICA] or self-organising maps [SOM]; Blind source separation
    • G06V10/774—Generating sets of training patterns; Bootstrap methods, e.g. bagging or boosting
    • G06V10/7747—Organisation of the process, e.g. bagging or boosting
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V20/00—Scenes; Scene-specific elements
    • G06V20/60—Type of objects
    • G06V20/64—Three-dimensional objects
    • G06V20/653—Three-dimensional objects by matching three-dimensional models, e.g. conformal mapping of Riemann surfaces
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20081—Training; Learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20084—Artificial neural networks [ANN]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V2201/00—Indexing scheme relating to image or video recognition or understanding
    • G06V2201/06—Recognition of objects for industrial automation
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V2201/00—Indexing scheme relating to image or video recognition or understanding
    • G06V2201/12—Acquisition of 3D measurements of objects

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Software Systems (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Computation (AREA)
  • Artificial Intelligence (AREA)
  • Multimedia (AREA)
  • Medical Informatics (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Quality & Reliability (AREA)
  • Evolutionary Biology (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Computing Systems (AREA)
  • Databases & Information Systems (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
  • Computer Graphics (AREA)
  • Geometry (AREA)
  • Electromagnetism (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
KR1020210034550A 2020-03-17 2021-03-17 3차원 정보의 결정 Active KR102765100B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/821,831 2020-03-17
US16/821,831 US11321835B2 (en) 2020-03-17 2020-03-17 Determining three dimensional information

Publications (2)

Publication Number Publication Date
KR20210117195A KR20210117195A (ko) 2021-09-28
KR102765100B1 true KR102765100B1 (ko) 2025-02-11

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US (1) US11321835B2 (enExample)
JP (1) JP7648410B2 (enExample)
KR (1) KR102765100B1 (enExample)
CN (1) CN113405493B (enExample)
TW (1) TWI859429B (enExample)

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US11288174B2 (en) 2020-02-19 2022-03-29 Applied Materials Israel Ltd. Testing a code using real time analysis
US11443420B2 (en) * 2020-12-28 2022-09-13 Applied Materials Israel Ltd. Generating a metrology recipe usable for examination of a semiconductor specimen
US12480898B2 (en) 2022-09-01 2025-11-25 Applied Materials Israel Ltd. Z-profiling of wafers based on X-ray measurements
JP7754058B2 (ja) * 2022-11-11 2025-10-15 トヨタ自動車株式会社 情報処理装置、情報処理方法、及び情報処理プログラム

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US20190310554A1 (en) 2016-12-16 2019-10-10 Asml Netherlands B.V. Method and apparatus for image analysis

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US6246787B1 (en) * 1996-05-31 2001-06-12 Texas Instruments Incorporated System and method for knowledgebase generation and management
JP3961657B2 (ja) * 1998-03-03 2007-08-22 株式会社東芝 パターン寸法測定方法
US6670610B2 (en) 2001-11-26 2003-12-30 Applied Materials, Inc. System and method for directing a miller
US7764824B2 (en) * 2003-07-18 2010-07-27 Applied Materials Israel, Ltd. Method for defect detection and process monitoring based on SEM images
KR101128558B1 (ko) * 2003-10-08 2012-03-26 어플라이드 머티리얼즈 이스라엘 리미티드 측정 시스템 및 방법
US8098926B2 (en) * 2007-01-10 2012-01-17 Applied Materials Israel, Ltd. Method and system for evaluating an evaluated pattern of a mask
US7667858B2 (en) * 2007-01-12 2010-02-23 Tokyo Electron Limited Automated process control using optical metrology and a correlation between profile models and key profile shape variables
US7511835B2 (en) * 2007-04-12 2009-03-31 Tokyo Electron Limited Optical metrology using a support vector machine with simulated diffraction signal inputs
US8709269B2 (en) 2007-08-22 2014-04-29 Applied Materials Israel, Ltd. Method and system for imaging a cross section of a specimen
KR101286240B1 (ko) * 2007-10-23 2013-07-15 삼성전자주식회사 반도체 구조물의 형상을 예정하는 공정 파라 메타의 예측시스템, 상기 공정 파라 메타의 예측 시스템을 가지는반도체 제조 장비 및 그 장비의 사용방법
US20090296073A1 (en) 2008-05-28 2009-12-03 Lam Research Corporation Method to create three-dimensional images of semiconductor structures using a focused ion beam device and a scanning electron microscope
JP5479782B2 (ja) * 2009-06-02 2014-04-23 株式会社日立ハイテクノロジーズ 欠陥画像処理装置、欠陥画像処理方法、半導体欠陥分類装置および半導体欠陥分類方法
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TWI694537B (zh) * 2018-07-08 2020-05-21 香港商康代影像技術方案香港有限公司 用於失準補償之系統及方法
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US20190310554A1 (en) 2016-12-16 2019-10-10 Asml Netherlands B.V. Method and apparatus for image analysis

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Publication number Publication date
TWI859429B (zh) 2024-10-21
KR20210117195A (ko) 2021-09-28
CN113405493B (zh) 2023-10-24
JP7648410B2 (ja) 2025-03-18
US11321835B2 (en) 2022-05-03
US20210295499A1 (en) 2021-09-23
JP2021166284A (ja) 2021-10-14
CN113405493A (zh) 2021-09-17
TW202207160A (zh) 2022-02-16

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